CN105813447B - 安装系统、安装装置以及安装方法 - Google Patents

安装系统、安装装置以及安装方法 Download PDF

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Publication number
CN105813447B
CN105813447B CN201610037144.3A CN201610037144A CN105813447B CN 105813447 B CN105813447 B CN 105813447B CN 201610037144 A CN201610037144 A CN 201610037144A CN 105813447 B CN105813447 B CN 105813447B
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substrate
mounting device
count value
installation
buffer
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Chinese (zh)
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CN105813447A (zh
Inventor
佐藤祐太
吉田优一
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Juki Corp
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Juki Corp
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Labeling Devices (AREA)
CN201610037144.3A 2015-01-20 2016-01-20 安装系统、安装装置以及安装方法 Active CN105813447B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-008726 2015-01-20
JP2015008726A JP6407040B2 (ja) 2015-01-20 2015-01-20 実装システム、実装装置及び実装システムで用いられるプログラム

Publications (2)

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CN105813447A CN105813447A (zh) 2016-07-27
CN105813447B true CN105813447B (zh) 2019-11-22

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JP (1) JP6407040B2 (ja)
CN (1) CN105813447B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3557348B1 (en) * 2016-12-16 2024-09-04 Fuji Corporation Substrate production line
JP6837145B2 (ja) * 2017-07-10 2021-03-03 株式会社Fuji 基板生産ライン
JP7164319B2 (ja) * 2018-05-10 2022-11-01 Juki株式会社 搬送装置、実装装置、搬送方法
JP7142463B2 (ja) * 2018-05-15 2022-09-27 Juki株式会社 生産システム、実装装置、生産方法
JP7316072B2 (ja) * 2019-03-22 2023-07-27 Juki株式会社 生産システム、及び生産方法
KR102375629B1 (ko) * 2020-03-30 2022-03-16 김종렬 Smt 설비 라인 내 pcb 위치추적 시스템

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012028655A (ja) * 2010-07-26 2012-02-09 Hitachi High-Tech Instruments Co Ltd 電子部品実装ラインの管理方法及びその管理システム
JP2012119551A (ja) * 2010-12-02 2012-06-21 Panasonic Corp 電子部品実装システムおよび電子部品実装方法
CN103997883A (zh) * 2013-02-18 2014-08-20 松下电器产业株式会社 基板定位方法
CN104039124A (zh) * 2013-03-05 2014-09-10 松下电器产业株式会社 元件安装装置和元件安装系统
CN104137666A (zh) * 2012-02-21 2014-11-05 富士机械制造株式会社 基板搬运装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06132696A (ja) * 1992-10-20 1994-05-13 Tokico Ltd 基板搬送装置
JP2005072317A (ja) * 2003-08-26 2005-03-17 Matsushita Electric Ind Co Ltd 実装方法及び装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012028655A (ja) * 2010-07-26 2012-02-09 Hitachi High-Tech Instruments Co Ltd 電子部品実装ラインの管理方法及びその管理システム
JP2012119551A (ja) * 2010-12-02 2012-06-21 Panasonic Corp 電子部品実装システムおよび電子部品実装方法
CN104137666A (zh) * 2012-02-21 2014-11-05 富士机械制造株式会社 基板搬运装置
CN103997883A (zh) * 2013-02-18 2014-08-20 松下电器产业株式会社 基板定位方法
CN104039124A (zh) * 2013-03-05 2014-09-10 松下电器产业株式会社 元件安装装置和元件安装系统

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Publication number Publication date
JP2016134521A (ja) 2016-07-25
JP6407040B2 (ja) 2018-10-17
CN105813447A (zh) 2016-07-27

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