CN105810802A - Light emitting diode package structure - Google Patents
Light emitting diode package structure Download PDFInfo
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- CN105810802A CN105810802A CN201410825198.7A CN201410825198A CN105810802A CN 105810802 A CN105810802 A CN 105810802A CN 201410825198 A CN201410825198 A CN 201410825198A CN 105810802 A CN105810802 A CN 105810802A
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- Prior art keywords
- substrate
- led
- package structure
- light
- emitting diode
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Abstract
The invention provides a light emitting diode package structure which comprises a substrate, a light-emitting diode arranged at one side surface of the substrate, a first electrode, and a second electrode. The substrate comprises an upper surface, a lower surface opposite to the upper surface, a first side surface and a second side surface. The first side surface and the second side surface are connected to an upper surface edge and a lower surface edge. The light-emitting diode is arranged at the upper surface of the substrate, and the lower surface of the substrate is provided with a microstructure for increasing the light out amount of the substrate.
Description
Technical field
The present invention relates to a kind of light-emitting device, particularly to a kind of package structure for LED.
Background technology
LED, as a kind of high efficiency light source, has the various features such as environmental protection, power saving, life-span length and has been widely applied to various field.
LED chip structure is fixed on base plate for packaging by traditional LED package, then forms reflector at LED periphery and fills encapsulating material and fluorescent material in reflector and regulate LED and go out light light efficiency.Self-reflection cup top outgoing after the encapsulated material of light of LED chip generation and fluorescent material.But most of LED package only has one side and goes out light, the stop of all packed absorbed of the light of its lap and substrate and reduce the light extraction efficiency of LED package.
Summary of the invention
In view of this, it is necessary to the package structure for LED that a kind of smooth extraction efficiency is high is provided.
A kind of package structure for LED, including substrate, it is arranged on the light emitting diode of substrate one side surface, one first electrode and one second electrode, described substrate includes the lower surface that a upper surface is relative with upper surface, and the first side being connected with top surface edge and lower surface edge and the second side, described light emitting diode is arranged on the upper surface of substrate, and the lower surface of described substrate is provided with micro structure for improving the amount of light of substrate.
The light of LED bottom outgoing enters substrate, it is incident to the light of lower surface 102 by forming outgoing after micro structure on the lower surface, described micro structure to the multiple reflections of light, refraction action thus adding the light lower surface light emission rate from substrate, add the amount of light of base lower surface, add the light extraction efficiency of package structure for LED simultaneously.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of the package structure for LED of first embodiment of the invention.
Fig. 2 is the sectional view along II-II direction of package structure for LED described in Fig. 1.
Fig. 3 is the sectional view of package structure for LED described in second embodiment of the invention.
Fig. 4 is the sectional view of package structure for LED described in third embodiment of the invention.
Fig. 5 is the sectional view of package structure for LED described in fourth embodiment of the invention.
Main element symbol description
| Package structure for LED | 100、100a、100b、100c |
| Substrate | 10 |
| Upper surface | 101 |
| Lower surface | 102 |
| First side | 103 |
| Second side | 104 |
| Light emitting diode | 20 |
| First electrode | 21 |
| Second electrode | 22 |
| Phosphor powder layer | 30 |
| Micro structure | 110、110a |
| Protruding | 112 |
| Gap | 111 |
| Groove | 113 |
| Stop part | 114 |
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
First embodiment
As it is shown in figure 1, the package structure for LED 100 shown in first embodiment of the invention includes a substrate 10, it is arranged on the light emitting diode (LED) 20 of substrate 10 1 side surface and one first electrode 21 and the second electrode 22.
Described substrate 10 is the transparent pane body material of light-permeable, and by such as glass, the material such as sapphire is made.Described substrate adopts following size in the present embodiment: long: 30 millimeters；Wide: 0.8 millimeter；High 0.4 millimeter.
Described substrate 10 includes what a upper surface 101, lower surface 102 relative with upper surface 101 was connected the first side 103 and the second side 104 with upper surface 101 edge, lower surface 102 edge.Described first side 103 is relative and parallel with the second side 104.
Please join Fig. 2 simultaneously, the lower surface 102 of described substrate 10 is formed with micro structure 110.Described micro structure 110 forms from the vertical outward of lower surface 102.In the present embodiment, described micro structure 110 includes the projection 112 at multiple intervals of the vertical outward of lower surface 102 from substrate 10.Gap 111 is formed between adjacent projection 112.In the present embodiment, the described longitudinal section of protruding 112 is substantially square, and the end face parallel co-planar of these projections 112, described protruding 112 lower surfaces 102 being distributed in described substrate 10 uniformly, understandable, the described cross section of protruding 112 is spheroidal, other shapes such as hemispherical, trapezoidal, and the lower surface 102 being distributed in substrate 10 that described projection is random.
In the present embodiment, the mode forming described micro structure 110 is the modes such as dry ecthing, wet etching, laser processing, grinding, sandblasting.
Described first electrode 21 and the second electrode 22 are separately fixed at both ends and and light emitting diode 20 interval of the upper surface 101 of substrate 10.
Described light emitting diode 20 is fixed on the upper surface 101 of substrate 10 and between the first electrode 21 and the second electrode 22.When described light emitting diode 20 is single, the N electrode of the plurality of light emitting diode 20 and P electrode directly electrically connect with the first electrode 21 and second electrode 22 of substrate 10.When the quantity of described light emitting diode 20 is multiple time, electrically connected with the first electrode 21 and the second electrode 22 respectively by the two ends of its extraction rear connected in series between described light emitting diode 20.
In the present embodiment, the light portion that described light emitting diode 20 sends penetrates directly from the upper surface 101 of substrate 10, and another part light carries out outgoing after multiple reflections, refraction through the light of the lower surface 102 of substrate 10 through micro structure 110.Described micro structure 110 light is carried out multiple reflections, refraction action and increase light lower surface 102 amount of light from substrate 10.Decrease substrate 10 to the stop of light, absorption and the lower surface 102 total reflection to light, thus adding the light extraction efficiency of package structure for LED 100.
Second embodiment
As shown in Figure 3, described in second embodiment of the invention, package structure for LED 100a is similar to package structure for LED described in first embodiment 100, and its difference is in that: the first side 103 of described substrate 10 and the second side 104 have been respectively formed on micro structure 110.
In the present embodiment, after the light of described light emitting diode 20 bottom outlet enters substrate 10, described lower surface the 102, first side 103 and the second side 104 add the amount of light from the 103, second side 104, the first side after the reflection of micro structure 110 and refraction action, make substrate 10 multiaspect go out light, improve amount of light and the practicality of package structure for LED 100a.
3rd embodiment
As shown in Figure 4, package structure for LED 100b described in third embodiment of the invention and package structure for LED 100a described in the second embodiment is similar, its difference is in that: described micro structure 110a includes the multiple spaced groove 113 formed from the lower surface 102 of substrate 10 towards upper surface 101 indent, forms stop part 114 between adjacent groove 113.The cross section of described depression 113 is substantially u-shaped.
4th embodiment
As shown in Figure 5, package structure for LED 100c described in fourth embodiment of the invention and package structure for LED 100a described in the second embodiment or package structure for LED 100b described in the 3rd embodiment is similar, it is different in that: described package structure for LED 100c also includes a phosphor powder layer 30, described phosphor powder layer 30 is formed and covers described light emitting diode 20 on the upper surface 101 of substrate 10, and is formed on lower surface 102, first side 103 of substrate 10 and the second side 104 and is coated with described micro structure 110(110a).In the present embodiment, described phosphor powder layer 30 includes yellow fluorescent powder, and described light emitting diode 20 includes blue chip.
Understandable, in other embodiments, described phosphor powder layer 30 can be only arranged at as required and wrap up described light emitting diode 20 on the upper surface 101 of substrate 10, it is also possible to is only arranged at the lower surface 102 of substrate 10 or the first side and the second side 104 and wraps up described micro structure 110(110a).
In the present embodiment, after the blue light outgoing that described light emitting diode 20 produces, excite described phosphor powder layer 30 to produce gold-tinted, described in excite the gold-tinted of generation and unexcited blue light to produce white light outgoing.What described phosphor powder layer 30 regulated package structure for LED 100 further goes out light color, can improve outgoing light homogeneity and the colour temperature of light emitting diode 20 further by changing the shape of described fluorescence coating 30.
Claims (10)
1. a package structure for LED, including substrate, it is arranged on the light emitting diode of substrate one side surface, one first electrode and one second electrode, described substrate includes the lower surface that a upper surface is relative with upper surface, and the first side being connected with top surface edge and lower surface edge and the second side, it is characterized in that: described light emitting diode is arranged on the upper surface of substrate, the lower surface of described substrate is provided with micro structure for improving the amount of light of substrate.
2. package structure for LED as claimed in claim 1, it is characterised in that: the first side of described substrate and the second side are also formed with micro structure.
3. package structure for LED as claimed in claim 1, it is characterised in that: described micro structure is formed from the lower surface outward of substrate.
4. package structure for LED as claimed in claim 3, it is characterised in that: described micro structure includes the projection at the multiple intervals from the vertical outward of the lower surface of substrate, forms gap between adjacent projection.
5. package structure for LED as claimed in claim 4, it is characterised in that: the end face of described projection is coplanar.
6. package structure for LED as claimed in claim 1, it is characterised in that: described micro structure is formed from base lower surface indent.
7. package structure for LED as claimed in claim 6, it is characterised in that: described micro structure includes multiple spaced groove, forms stop part between adjacent groove.
8. package structure for LED as claimed in claim 1, it is characterised in that: described substrate is made up of the material of light-permeable.
9. package structure for LED as claimed in claim 1, it is characterised in that: also including a phosphor powder layer, described phosphor powder layer covers described micro structure.
10. package structure for LED as claimed in claim 9, it is characterised in that: described phosphor powder layer covers described light emitting diode.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410825198.7A CN105810802A (en) | 2014-12-27 | 2014-12-27 | Light emitting diode package structure |
| TW104100621A TWI560910B (en) | 2014-12-27 | 2015-01-09 | Light emitting diode packaging stucture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410825198.7A CN105810802A (en) | 2014-12-27 | 2014-12-27 | Light emitting diode package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105810802A true CN105810802A (en) | 2016-07-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410825198.7A Pending CN105810802A (en) | 2014-12-27 | 2014-12-27 | Light emitting diode package structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105810802A (en) |
| TW (1) | TWI560910B (en) |
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| CN103456758A (en) * | 2012-05-30 | 2013-12-18 | 展晶科技(深圳)有限公司 | Light-emitting diode module and manufacturing method thereof |
| CN103474550A (en) * | 2012-06-05 | 2013-12-25 | 光海科技股份有限公司 | Light emitting diode packaging structure and manufacturing method thereof |
| CN203466188U (en) * | 2013-08-23 | 2014-03-05 | 佛山市国星光电股份有限公司 | Novel bar-shaped COB device |
| TWM478913U (en) * | 2013-07-02 | 2014-05-21 | Genesis Photonics Inc | Semiconductor structure |
| CN104091869A (en) * | 2014-07-31 | 2014-10-08 | 湘能华磊光电股份有限公司 | Light emitting diode chip and manufacturing method thereof |
| CN104157640A (en) * | 2014-08-29 | 2014-11-19 | 王维昀 | Omni-directional LED light source |
| TW201448266A (en) * | 2013-06-11 | 2014-12-16 | Easy Epi Photoelectronics Inc | Method of fabricating light emitting diode chip |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200951359A (en) * | 2008-06-06 | 2009-12-16 | Taiwan Solutions Systems Corp | LED lamp module and its fabricating method |
| TWM467186U (en) * | 2013-05-29 | 2013-12-01 | Ligitek Electronics Co Ltd | Flexible led module |
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2014
- 2014-12-27 CN CN201410825198.7A patent/CN105810802A/en active Pending
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2015
- 2015-01-09 TW TW104100621A patent/TWI560910B/en active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006294907A (en) * | 2005-04-12 | 2006-10-26 | Showa Denko Kk | Nitride gallium based compound semiconductor luminous element |
| CN102347416A (en) * | 2010-08-02 | 2012-02-08 | 亚威朗光电(中国)有限公司 | Light emitting diode |
| CN103180974A (en) * | 2011-06-27 | 2013-06-26 | 松下电器产业株式会社 | Nitride-based semiconductor light-emitting element |
| CN103456758A (en) * | 2012-05-30 | 2013-12-18 | 展晶科技(深圳)有限公司 | Light-emitting diode module and manufacturing method thereof |
| CN103474550A (en) * | 2012-06-05 | 2013-12-25 | 光海科技股份有限公司 | Light emitting diode packaging structure and manufacturing method thereof |
| TW201448266A (en) * | 2013-06-11 | 2014-12-16 | Easy Epi Photoelectronics Inc | Method of fabricating light emitting diode chip |
| TWM478913U (en) * | 2013-07-02 | 2014-05-21 | Genesis Photonics Inc | Semiconductor structure |
| CN203466188U (en) * | 2013-08-23 | 2014-03-05 | 佛山市国星光电股份有限公司 | Novel bar-shaped COB device |
| CN104091869A (en) * | 2014-07-31 | 2014-10-08 | 湘能华磊光电股份有限公司 | Light emitting diode chip and manufacturing method thereof |
| CN104157640A (en) * | 2014-08-29 | 2014-11-19 | 王维昀 | Omni-directional LED light source |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201624770A (en) | 2016-07-01 |
| TWI560910B (en) | 2016-12-01 |
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Application publication date: 20160727 |