TW201624770A - Light emitting diode packaging structure - Google Patents

Abstract

A light emitting diode packaging structure includes a substrate, a light emitting diode, a first electrode and a second electrode mounted on a side of the substrate. The substrate further includes a top surface, a bottom surface located at opposite side of the top surface, a first lateral surface and a second lateral surface connecting edges of the top surface and the bottom surface. The light emitting diode is mounted on the top surface of the substrate. A microstructure is formed on the bottom surface of the substrate to improve the luminous efficiency of the substrate.

Description

Light emitting diode package structure

The present invention relates to a light emitting device, and more particularly to a light emitting diode package structure.

As a high-efficiency light source, LED has been widely used in various fields due to its environmental protection, power saving and long life.

The conventional LED package fixes the LED wafer structure on the package substrate, and then forms a reflective cup at the periphery of the LED and fills the reflective cup with the encapsulating material and the phosphor powder to adjust the LED light-emitting effect. The light generated by the LED wafer is emitted from the top of the reflective cup through the encapsulating material and the phosphor powder. However, most of the LED packages emit light only on one side, and the remaining light is absorbed by the package material and blocked by the substrate, which reduces the light extraction efficiency of the LED package.

In view of the above, it is necessary to provide a light emitting diode package structure with high light extraction efficiency.

A light emitting diode package structure includes a substrate, a light emitting diode disposed on one surface of the substrate, a first electrode and a second electrode, the substrate including an upper surface, a lower surface opposite to the upper surface, and The first side surface and the second side surface connected to the upper surface edge and the lower surface edge are disposed on the upper surface of the substrate, and the lower surface of the substrate is provided with a microstructure for increasing the amount of light emitted from the substrate.

The light emitted from the bottom of the light-emitting diode enters the substrate, and the light incident on the lower surface 102 is emitted by the microstructure formed on the lower surface, and the microstructure has multiple reflections and refractions on the light, thereby increasing the light from the substrate. The light output rate of the lower surface increases the amount of light emitted from the lower surface of the substrate, and at the same time increases the light-emitting efficiency of the light-emitting diode package structure.

1 is a perspective view of a light emitting diode package structure according to a first embodiment of the present invention.

2 is a cross-sectional view of the light emitting diode package structure of FIG. 1 taken along line II-II.

3 is a cross-sectional view showing a light emitting diode package structure according to a second embodiment of the present invention.

4 is a cross-sectional view showing a light emitting diode package structure according to a third embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a light emitting diode package structure according to a fourth embodiment of the present invention.

First embodiment

As shown in FIG. 1 , a light emitting diode package structure 100 according to a first embodiment of the present invention includes a substrate 10 , a light emitting diode ( LED ) 20 disposed on a surface of one side of the substrate 10 , and a first electrode 21 . And the second electrode 22.

The substrate 10 is a light transmissive transparent cuboid material made of a material such as glass or sapphire. In the present embodiment, the substrate is of the following dimensions: length: 30 mm; width: 0.8 mm; height 0.4 mm.

The substrate 10 includes an upper surface 101, a lower surface 102 opposite the upper surface 101, a first side 103 and a second side 104 joined to the edge of the upper surface 101 and the edge of the lower surface 102. The first side 103 and the second side 104 are opposite and parallel.

Referring to FIG. 2 simultaneously, the microstructure 110 is formed on the lower surface 102 of the substrate 10. The microstructures 110 are formed by projecting perpendicularly outward from the lower surface 102. In the present embodiment, the microstructures 110 include a plurality of spaced apart protrusions 112 that project perpendicularly outward from the lower surface 102 of the substrate 10. A gap 111 is formed between adjacent protrusions 112. In this embodiment, the longitudinal section of the protrusion 112 is substantially square, and the top surfaces of the protrusions 112 are parallel and coplanar, and the protrusions 112 are evenly distributed on the lower surface 102 of the substrate 10. The protrusions 112 have other shapes such as a spherical shape, a hemispherical shape, a trapezoidal shape, and the like, and the protrusions are randomly distributed on the lower surface 102 of the substrate 10.

In this embodiment, the manner of forming the microstructures 110 is dry etching, wet etching, laser processing, grinding, sand blasting, and the like.

The first electrode 21 and the second electrode 22 are respectively fixed to both end portions of the upper surface 101 of the substrate 10 and spaced apart from the light emitting diode 20 .

The light emitting diode 20 is fixed on the upper surface 101 of the substrate 10 and located between the first electrode 21 and the second electrode 22. When the light emitting diodes 20 are single, the N electrodes and the P electrodes of the plurality of light emitting diodes 20 are directly electrically connected to the first electrode 21 and the second electrode 22 of the substrate 10. When the number of the light emitting diodes 20 is plural, the two ends of the light emitting diodes 20 are electrically connected to the first electrode 21 and the second electrode 22 by being connected in series.

In this embodiment, the light emitted by the LED 20 is directly emitted from the upper surface 101 of the substrate 10, and another portion of the light passing through the lower surface 102 of the substrate 10 is reflected by the microstructure 110 multiple times. After refraction, it is emitted. The microstructures 110 reflect and refract light multiple times to increase the amount of light emitted from the lower surface 102 of the substrate 10. The light blocking and absorption of the substrate 10 and the total reflection of the light by the lower surface 102 are reduced, thereby increasing the light extraction efficiency of the LED package structure 100.

Second embodiment

As shown in FIG. 3, the LED package structure 100a of the second embodiment of the present invention is similar to the LED package structure 100 of the first embodiment, and the difference is that the first side of the substrate 10 is A microstructure 110 is formed on both the 103 and the second side 104.

In this embodiment, after the light emitted from the bottom of the light-emitting diode 20 enters the substrate 10, the reflection and refraction of the microstructures 110 on the lower surface 102, the first side 103, and the second side 104 are increased. The amount of light emitted from the first side surface 103 and the second side surface 104 causes the substrate 10 to emit light on multiple sides, thereby improving the light output amount and practicality of the light emitting diode package structure 100a.

Third embodiment

As shown in FIG. 4, the LED package structure 100b according to the third embodiment of the present invention is similar to the LED package structure 100a of the second embodiment, except that the microstructure 110a includes a self-substrate. The lower surface 102 of the 10 is formed with a plurality of spaced-apart grooves 113 recessed toward the upper surface 101, and a barrier portion 114 is formed between the adjacent grooves 113. The recess 113 has a substantially U-shaped cross section.

Fourth embodiment

As shown in FIG. 5, the LED package structure 100c according to the fourth embodiment of the present invention is similar to the LED package structure 100a of the second embodiment or the LED package structure 100b of the third embodiment. The difference is that the LED package 100c further includes a phosphor layer 30, and the phosphor layer 30 is formed on the upper surface 101 of the substrate 10 to cover the LEDs 20, And forming the microstructures 110 (110a) on the lower surface 102, the first side 103, and the second side 104 of the substrate 10. In the embodiment, the phosphor powder layer 30 includes yellow phosphor powder, and the light emitting diode 20 includes a blue light wafer.

It can be understood that, in other embodiments, the phosphor layer 30 may be disposed on the upper surface 101 of the substrate 10 to wrap the LEDs 20 as needed, or may be disposed only on the lower surface of the substrate 10. The microstructures 110 (110a) are wrapped by 102 or a first side and a second side 104.

In this embodiment, the blue light generated by the light-emitting diode 20 emits the phosphor powder layer 30 to generate yellow light, and the yellow light generated by the excitation is mixed with the unexcited blue light to generate white light. The phosphor layer 30 further adjusts the color of the light emitted by the LED package structure 100. By changing the shape of the phosphor layer 30, the uniformity and color temperature of the light emitting diode 20 can be further improved.

100, 100a, 100b, 100c‧‧‧Light emitting diode package structure

10‧‧‧Substrate

101‧‧‧ upper surface

102‧‧‧lower surface

103‧‧‧ first side

104‧‧‧ second side

20‧‧‧Lighting diode

21‧‧‧First electrode

22‧‧‧second electrode

30‧‧‧Fluorescent powder layer

110, 110a‧‧‧Microstructure

112‧‧‧ bumps

111‧‧‧ gap

113‧‧‧ Groove

114‧‧‧Block

no

100‧‧‧Light emitting diode package structure

10‧‧‧Substrate

101‧‧‧ upper surface

102‧‧‧lower surface

103‧‧‧ first side

104‧‧‧ second side

20‧‧‧Lighting diode

22‧‧‧second electrode

110‧‧‧Microstructure

112‧‧‧ bumps

111‧‧‧ gap

Claims (10)

A light emitting diode package structure includes a substrate, a light emitting diode disposed on one surface of the substrate, a first electrode and a second electrode, the substrate including an upper surface, a lower surface opposite to the upper surface, and The first side surface and the second side surface connected to the upper surface edge and the lower surface edge are improved in that the light emitting diode is disposed on an upper surface of the substrate, and the lower surface of the substrate is provided with a microstructure for improving the substrate The amount of light emitted. The light emitting diode package structure of claim 1, wherein the first side surface and the second side surface of the substrate are also formed with a microstructure. The light emitting diode package structure of claim 1, wherein the microstructure is formed to protrude outward from a lower surface of the substrate. The light emitting diode package structure of claim 3, wherein the microstructure comprises a plurality of spaced protrusions protruding perpendicularly outward from a lower surface of the substrate, and a gap is formed between the adjacent protrusions. . The light emitting diode package structure according to claim 4, wherein the top surface of the protrusion is coplanar. The light emitting diode package structure according to claim 1, wherein the microstructure is concavely formed from a lower surface of the substrate. The light emitting diode package structure of claim 6, wherein the microstructure comprises a plurality of spaced apart grooves, and a barrier portion is formed between the adjacent grooves. The light emitting diode package structure of claim 1, wherein the substrate is made of a light transmissive material. The light emitting diode package structure of claim 1, wherein: further comprising a phosphor powder layer, the phosphor powder layer covering the microstructure. The light emitting diode package structure according to claim 9, wherein the phosphor powder layer covers the light emitting diode.