TW201304202A - LED package structure - Google Patents
LED package structure Download PDFInfo
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- TW201304202A TW201304202A TW100125380A TW100125380A TW201304202A TW 201304202 A TW201304202 A TW 201304202A TW 100125380 A TW100125380 A TW 100125380A TW 100125380 A TW100125380 A TW 100125380A TW 201304202 A TW201304202 A TW 201304202A
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- emitting diode
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- retaining wall
- light emitting
- package structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Led Device Packages (AREA)
Abstract
Description
本發明涉及一種發光二極體封裝結構。The invention relates to a light emitting diode package structure.
發光二極體是一種節能、環保、長壽命之固體光源,因此近十幾年來對發光二極體技術之研究一直非常活躍,發光二極體也有漸漸取代日光燈、白熾燈等傳統光源之趨勢。在先前技術中,若要實現特定之照明要求,一般需將多個發光二極體封裝體進行混合搭配,藉由各個發光二極體封裝體之間之距離及排布之設置來實現特定之照明需要,這樣之結構雖然具有一定靈活性,但也存在集成度差,成本高之問題。另外,在應用當中,也多會使用多晶片型發光二極體封裝構造,其具體結構是將多個性能指標不同之發光二極體晶片集成封裝,來實現多波段或者高演色性之照明要求,但是各個發光二極體晶片所發出之光線會出現彼此干擾,難以控制其整體出光效果。無法滿足實際應用之需求。The light-emitting diode is a kind of solid light source with energy saving, environmental protection and long life. Therefore, the research on the light-emitting diode technology has been very active in the past decade, and the light-emitting diode has gradually replaced the traditional light source such as fluorescent lamp and incandescent lamp. In the prior art, in order to achieve specific illumination requirements, it is generally required to mix and match a plurality of LED packages, and the specific distance between the LED packages and the arrangement of the LEDs is achieved. Lighting needs, although this structure has a certain flexibility, but also has the problem of poor integration and high cost. In addition, in the application, multi-wafer type light-emitting diode package structure is also used, and the specific structure is to integrate a plurality of light-emitting diode chips with different performance indexes to realize multi-band or high color rendering illumination requirements. However, the light emitted by each of the light-emitting diode chips may interfere with each other, and it is difficult to control the overall light-emitting effect. Can not meet the needs of the actual application.
有鑒於此,本發明旨在提供一種可減少各發光二極體光線干擾,實現特定照明要求之發光二極體封裝結構。In view of the above, the present invention aims to provide a light emitting diode package structure that can reduce light interference of each light emitting diode and achieve specific illumination requirements.
一種發光二極體封裝結構,其包括基座、第一發光二極體以及第二發光二極體。基座上開設形成一容置杯,該置杯之底面凸起形成至少一擋牆,該擋牆將容置杯分割為第一區域和第二區域。一發光二極體和第二發光二極體分別設置在第一區域和第二區域中,並由擋牆相互隔開。A light emitting diode package structure includes a base, a first light emitting diode, and a second light emitting diode. A receiving cup is formed on the base, and the bottom surface of the cup protrudes to form at least one retaining wall, and the retaining wall divides the receiving cup into the first area and the second area. A light emitting diode and a second light emitting diode are respectively disposed in the first region and the second region, and are separated from each other by a retaining wall.
上述之發光二極體封裝結構藉由擋牆將第一發光二極體以及第二發光二極體相互隔開,可減少第一發光二極體以及第二發光二極體發出之光線之相互干擾,另外還可根據實際之照明需要設定擋牆之高度、角度或者形狀,實現發光二極體封裝結構整體出光效果之控制。The light-emitting diode package structure is configured to separate the first light-emitting diode and the second light-emitting diode from each other by a retaining wall, thereby reducing mutual light emitted by the first light-emitting diode and the second light-emitting diode Interference, in addition, according to the actual lighting needs to set the height, angle or shape of the retaining wall, to achieve the control of the overall light-emitting effect of the LED package structure.
以下將結合附圖對本發明作進一步之詳細說明。The invention will be further described in detail below with reference to the accompanying drawings.
請請參閱圖1以及圖2,本發明一較佳實施方式提供之一種發光二極體封裝結構100包括基座10、設置在該基座10中之第一發光二極體20和第二發光二極體30。Please refer to FIG. 1 and FIG. 2 , a light emitting diode package structure 100 according to a preferred embodiment of the present invention includes a susceptor 10 , a first light emitting diode 20 and a second light emitting diode disposed in the pedestal 10 . Polar body 30.
所述基座10包括頂面11以及底面12,基座10從頂面11沿底面12方向開設形成一容置杯13,該容置杯13之內表面為傾斜面,該傾斜面自頂面11向底面12方向延伸並沿容置杯13之徑向向內傾斜,使整個容置杯13上寬下窄,呈一漏斗狀。優選地,容置杯13內表面還塗敷有反光材料。容置杯13之底面上凸起形成有一擋牆14,該擋牆14將容置杯13成兩個區域。擋牆14之截面為一梯形,其上表面寬度小於下表面之寬度,兩個側表面141、142為傾斜面,該傾斜面塗敷有反光材料,用於反射第一發光二極體20和第二發光二極體30發出之光,提高出光效率。基座10還包括有第一電極15以及第二電極16,該第一電極15和第二電極16分別位於擋牆14之兩側,彼此分離,其中該第一電極15和第二電極16之一端分別形成在容置杯13之底面並 伸至擋牆14,另一端分別從基座10之端面延伸到基座10之底面12上,用於與外部電路連接。The pedestal 10 includes a top surface 11 and a bottom surface 12, and the pedestal 10 defines a receiving cup 13 from the top surface 11 along the bottom surface 12. The inner surface of the accommodating cup 13 is an inclined surface, and the inclined surface is from the top surface. 11 extends in the direction of the bottom surface 12 and is inclined inward in the radial direction of the accommodating cup 13, so that the entire accommodating cup 13 is wide and narrow, and has a funnel shape. Preferably, the inner surface of the receiving cup 13 is also coated with a reflective material. A retaining wall 14 is formed on the bottom surface of the receiving cup 13, and the retaining wall 14 will accommodate the cup 13 in two regions. The cross-section of the retaining wall 14 has a trapezoidal shape, and the upper surface has a width smaller than the width of the lower surface, and the two side surfaces 141 and 142 are inclined surfaces, and the inclined surface is coated with a reflective material for reflecting the first light-emitting diode 20 and The light emitted by the second light-emitting diode 30 increases the light-emitting efficiency. The susceptor 10 further includes a first electrode 15 and a second electrode 16 respectively located on opposite sides of the retaining wall 14 and separated from each other, wherein the first electrode 15 and the second electrode 16 are One end is formed on the bottom surface of the receiving cup 13 and extends to the retaining wall 14, and the other end extends from the end surface of the base 10 to the bottom surface 12 of the base 10 for connection with an external circuit.
所述第一發光二極體20位於容置杯13之底面、容置杯13之內表面以及擋牆14之側表面141構成之第一區域中,並設置在第一電極15上。該第一發光二極體20發出之光線經過容置杯13之內表面和擋牆14之側表面141之反射,射出至發光二極體封裝結構100外。該第一發光二極體20一端藉由導線與第一電極15電連接,另一端藉由導線越過擋牆14與第二電極16電連接。該第一區域中還填充有第一螢光粉40,該第一螢光粉40包覆第一發光二極體20,該第一螢光粉40可選自釔鋁石榴石、鋱釔鋁石榴石及矽酸鹽中之一種或幾種之組合。第一發光二極體20發出第一種波長之光線,並激發第一螢光粉40產生第一種顏色之光。The first LED body 20 is disposed in a first region formed by the bottom surface of the receiving cup 13 , the inner surface of the receiving cup 13 , and the side surface 141 of the retaining wall 14 , and is disposed on the first electrode 15 . The light emitted by the first light-emitting diode 20 is reflected by the inner surface of the receiving cup 13 and the side surface 141 of the retaining wall 14 and is emitted outside the light-emitting diode package 100. One end of the first LED body 20 is electrically connected to the first electrode 15 by a wire, and the other end is electrically connected to the second electrode 16 by a wire crossing the retaining wall 14. The first phosphor powder 40 is further filled with the first phosphor powder 40, and the first phosphor powder 40 is selected from the group consisting of yttrium aluminum garnet and yttrium aluminum. A combination of one or more of garnet and citrate. The first LED 20 emits light of a first wavelength and excites the first phosphor 40 to produce light of a first color.
所述第二發光二極體30位於容置杯13之底面、容置杯13之內表面以及擋牆14之側表面142構成之第二區域中,並設置在第二電極16上。該第二發光二極體30發出之光線經過容置杯13之內表面和擋牆14之側表面142之反射,射出至發光二極體封裝結構100外。該第二發光二極體30一端藉由導線與第二電極16電連接,另一端藉由導線越過擋牆14與第一電極15電連接。該第二區域中還填充有第二螢光粉50,該第二螢光粉50包覆第二發光二極體30,第二螢光粉50可選自釔鋁石榴石、鋱釔鋁石榴石及矽酸鹽中之一種或幾種之組合。第二發光二極體30發出第二種波長之光線,並激發第二螢光粉50產生第二種顏色之光。The second LED assembly 30 is disposed in a second region of the bottom surface of the receiving cup 13 , the inner surface of the receiving cup 13 , and the side surface 142 of the retaining wall 14 , and is disposed on the second electrode 16 . The light emitted by the second LEDs 30 is reflected by the inner surface of the receiving cup 13 and the side surface 142 of the retaining wall 14 and is emitted outside the LED package 100. One end of the second LED body 30 is electrically connected to the second electrode 16 by a wire, and the other end is electrically connected to the first electrode 15 by a wire crossing the retaining wall 14. The second phosphor powder 50 is further filled in the second region, and the second phosphor powder 50 is coated with the second light emitting diode 30. The second phosphor powder 50 may be selected from the group consisting of yttrium aluminum garnet and yttrium aluminum pomegranate. A combination of one or more of stone and citrate. The second LED 30 emits light of a second wavelength and excites the second phosphor 50 to produce light of a second color.
所述基座10之容置杯13中還填充有一封裝層60,該封裝層60包覆第一發光二極體20、第二發光二極體30、擋牆14、第一螢光粉40以及第二螢光粉50,用於保護第一發光二極體和第二發光二極體30免受灰塵、水氣等影響。在本實施方式中,該封裝層60為一透明封膠樹脂。The accommodating cup 13 of the susceptor 10 is further filled with an encapsulation layer 60 covering the first illuminating diode 20, the second illuminating diode 30, the retaining wall 14, and the first phosphor 40. And a second phosphor 50 for protecting the first and second light emitting diodes 30 from dust, moisture, and the like. In the embodiment, the encapsulation layer 60 is a transparent encapsulant.
可以理解之是,所述容置杯13之底面並不限定於本實施方式中之一條擋牆,還可以形成多條擋牆,該多條擋牆可以是平行之或者相互交錯,從而可以將容置杯13分割成多個區域,多個發光二極體分別設置在各個區域中,由擋牆相互隔開。另外,所述擋牆14並不限定於本發明所述之構造,還可以根據實際之照明需要設定擋牆14之高度、角度或者形狀,實現發光二極體封裝結構100整體出光效果之控制。It can be understood that the bottom surface of the receiving cup 13 is not limited to one of the retaining walls in the embodiment, and a plurality of retaining walls may be formed, and the plurality of retaining walls may be parallel or mutually staggered so that The receiving cup 13 is divided into a plurality of regions, and the plurality of light emitting diodes are respectively disposed in the respective regions, and are separated from each other by the retaining wall. In addition, the retaining wall 14 is not limited to the structure described in the present invention, and the height, angle or shape of the retaining wall 14 can be set according to actual lighting requirements to control the overall light-emitting effect of the LED package structure 100.
在使用時,第一發光二極體20發出之光線經過容置杯13之內表面以及擋牆14之側表面141反射至發光二極體封裝結構100外,而第二發光二極體30經過容置杯13之內表面以及擋牆14之側表面142反射至發光二極體封裝結構100外,第一發光二極體20和第二發光二極體30由於擋牆14隔離,因此可以減少第一發光二極體20和第二發光二極體30彼此發出之光線之互相干擾,從而能夠實現較好之照明效果。另外,由於在容置杯13之由擋牆14分割之兩個區域中分別填充有不同之螢光粉,可以實現發光二極體封裝結構100之多波段或者高顯色性發光。再者,由於擋牆14位於第一電極15和第二電極16之間,增加了與封裝層60之間之接觸面積,從而可以增加發光二極體封裝結構100之氣密性。In use, the light emitted by the first light-emitting diode 20 passes through the inner surface of the receiving cup 13 and the side surface 141 of the retaining wall 14 is reflected outside the light-emitting diode package 100, and the second light-emitting diode 30 passes through. The inner surface of the receiving cup 13 and the side surface 142 of the retaining wall 14 are reflected outside the light emitting diode package structure 100, and the first light emitting diode 20 and the second light emitting diode 30 are separated by the retaining wall 14, thereby reducing The light emitted from each other by the first light-emitting diode 20 and the second light-emitting diode 30 interfere with each other, so that a better illumination effect can be achieved. In addition, since two different regions of the accommodating cup 13 divided by the retaining wall 14 are filled with different phosphor powders, multi-band or high color rendering light emission of the LED package structure 100 can be achieved. Moreover, since the retaining wall 14 is located between the first electrode 15 and the second electrode 16, the contact area with the encapsulating layer 60 is increased, so that the airtightness of the light emitting diode package structure 100 can be increased.
相較於先前技術,本發明之發光二極體封裝結構藉由擋牆將第一發光二極體以及第二發光二極體相互隔開,可減少第一發光二極體以及第二發光二極體發出之光線之相互干擾,另外還可根據實際之照明需要設定擋牆之高度、角度或者形狀,實現發光二極體封裝結構整體出光效果之控制。Compared with the prior art, the LED package structure of the present invention can reduce the first LED and the second LED by separating the first LED and the second LED from each other by a retaining wall. The mutual interference of the light emitted by the polar body, in addition, the height, angle or shape of the retaining wall can be set according to the actual lighting needs, so as to realize the control of the overall light-emitting effect of the light-emitting diode package structure.
另外,本領域技術人員還可在本發明精神內做其他變化,當然,這些依據本發明精神所做之變化,都應包含在本發明所要求保護之範圍之內。In addition, those skilled in the art can make other changes in the spirit of the present invention. Of course, the changes made in accordance with the spirit of the present invention should be included in the scope of the present invention.
100...發光二極體封裝結構100. . . Light emitting diode package structure
10...基座10. . . Pedestal
20...第一發光二極體20. . . First light emitting diode
30...第二發光二極體30. . . Second light emitting diode
40...第一螢光粉40. . . First phosphor
50...第二螢光粉50. . . Second phosphor
60...封裝層60. . . Encapsulation layer
11...頂面11. . . Top surface
12...底面12. . . Bottom
13...容置杯13. . . Holding cup
14...擋牆14. . . Retaining wall
15...第一電極15. . . First electrode
16...第二電極16. . . Second electrode
141、142...側表面141, 142. . . Side surface
圖1為本發明實施方式中發光二極體封裝結構俯視圖。1 is a top plan view of a light emitting diode package structure according to an embodiment of the present invention.
圖2為圖1中之發光二極體封裝結構之剖面示意圖。2 is a schematic cross-sectional view of the light emitting diode package structure of FIG. 1.
100...發光二極體封裝結構100. . . Light emitting diode package structure
10...基座10. . . Pedestal
20...第一發光二極體20. . . First light emitting diode
30...第二發光二極體30. . . Second light emitting diode
40...第一螢光粉40. . . First phosphor
50...第二螢光粉50. . . Second phosphor
60...封裝層60. . . Encapsulation layer
11...頂面11. . . Top surface
12...底面12. . . Bottom
13...容置杯13. . . Holding cup
14...擋牆14. . . Retaining wall
15...第一電極15. . . First electrode
16...第二電極16. . . Second electrode
141、142...側表面141, 142. . . Side surface
Claims (8)
Applications Claiming Priority (1)
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CN201110191110.7A CN102867820B (en) | 2011-07-08 | 2011-07-08 | Package structure for LED |
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CN104425677B (en) * | 2013-08-27 | 2017-08-29 | 浙江亮尔丽光电科技有限公司 | Light emitting diode |
CN106935578A (en) * | 2017-05-08 | 2017-07-07 | 合肥市华达半导体有限公司 | A kind of encapsulating structure of light emitting diode |
CN107479252B (en) * | 2017-08-31 | 2020-11-13 | 深圳市华星光电技术有限公司 | LED lamp bead, backlight source and backlight module |
CN108565324B (en) * | 2018-01-05 | 2019-11-08 | 苏州芯脉智能电子科技有限公司 | A kind of production method and LED light of LED light |
CN111834510A (en) * | 2019-04-17 | 2020-10-27 | 深圳市明格科技有限公司 | Light emitting diode packaging support |
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US20060056203A1 (en) * | 2004-09-10 | 2006-03-16 | Taiwan Oasis Technology Co., Ltd. | LED luminance enhancing construction |
KR20090044306A (en) * | 2007-10-31 | 2009-05-07 | 서울반도체 주식회사 | Light emitting diode package |
TWI378573B (en) * | 2007-10-31 | 2012-12-01 | Young Lighting Technology Corp | Light emitting diode package |
TWI389357B (en) * | 2009-08-04 | 2013-03-11 | Advanced Optoelectronic Tech | Smd-led component and led module with waterproof function, and manufacturing method thereof |
CN102074638B (en) * | 2009-11-25 | 2013-01-16 | 亿光电子工业股份有限公司 | Light-emitting diode package and manufacturing method thereof |
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CN102867820B (en) | 2016-01-06 |
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