TWM467186U - Flexible led module - Google Patents

Flexible led module Download PDF

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Publication number
TWM467186U
TWM467186U TW102210010U TW102210010U TWM467186U TW M467186 U TWM467186 U TW M467186U TW 102210010 U TW102210010 U TW 102210010U TW 102210010 U TW102210010 U TW 102210010U TW M467186 U TWM467186 U TW M467186U
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Taiwan
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flexible
light source
source module
led light
flexible transparent
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TW102210010U
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Chinese (zh)
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xiao-wen Li
xin-yi Xie
yi-xing Tong
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Ligitek Electronics Co Ltd
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Priority to TW102210010U priority Critical patent/TWM467186U/en
Publication of TWM467186U publication Critical patent/TWM467186U/en

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Description

軟性LED光源模組 Soft LED light source module

本創作在於提供一種LED封裝結構,且特別是有關一種具可撓且可單面或雙面發光之薄型化軟性LED光源模組。 The present invention is to provide an LED package structure, and more particularly to a thin flexible LED light source module with flexible and single-sided or double-sided illumination.

按,發光二極體(light emitting diode;LED)具有省電、使用壽命長、體積小、可平面封裝等優點,目前已逐漸取代傳統光源應用於汽車、通訊、消費性電子產品、工業儀表等各種不同領域。隨著LED的應用範圍持續擴大,現今對於LED的發展有兩大方向,其一是提供高均勻度的光源,另一則是提供高亮度的光源,由於單顆LED晶片的亮度無法符合一般照明需求,故期望藉由封裝技術的改良以提高外部光取出率及光電轉換效率。 According to the light emitting diode (LED), it has the advantages of power saving, long service life, small size, and planar packaging. It has gradually replaced traditional light sources for automotive, communication, consumer electronics, industrial instrumentation, etc. Various fields. As the application range of LED continues to expand, there are two major directions for the development of LEDs today, one is to provide a high uniformity light source, and the other is to provide a high-brightness light source, because the brightness of a single LED chip cannot meet the general lighting needs. Therefore, it is desirable to improve the external light extraction rate and photoelectric conversion efficiency by the improvement of the packaging technology.

在照明領域中,單一LED光源可通過連續排列的方式組構成一光源模組,並加以可撓曲之設計以應用於建築裝飾或是一般的照明用途。舉例來說,我國第M316972號專利揭露了一種發光燈條,包括一內層固定座、一LED燈串組及一外層固定體的LED發光燈條,其中LED發光體單元係連接於導線組,並透過軟性印刷電路板(FPC)達到可撓之特性。 In the field of illumination, a single LED light source can be assembled into a light source module in a continuous arrangement and flexibly designed for architectural decoration or general lighting purposes. For example, the Chinese Patent No. M316972 discloses an illuminating light bar comprising an inner layer fixing seat, an LED light string group and an outer layer fixing body LED illuminating light bar, wherein the LED illuminating unit is connected to the wire group. And through the flexible printed circuit board (FPC) to achieve flexible characteristics.

另外,我國專利第558803及558804號揭露了一種可撓性發光體裝置及其製造方法,係將複數個LED、電阻與導線銲接後,固定於一預先成型的內層固定座,並與其內的主線達成電性連通。上述可撓之光源模組大多是採用LED元件經SMD程序與軟 性基板結合;惟,此種安裝、固定方式限制了應用LED產品的大小、尺寸、發光角度與透視之應用,無法達成單、雙面發光之均勻面光源效果。 In addition, Chinese Patent Nos. 558803 and 558804 disclose a flexible illuminator device and a method of manufacturing the same, which are obtained by soldering a plurality of LEDs, resistors and wires to a pre-formed inner layer mount and The main line is electrically connected. Most of the above flexible light source modules use LED components through SMD programs and soft The combination of the substrate; however, the installation and fixing methods limit the application of the size, size, illumination angle and perspective of the LED product, and the uniform surface light source effect of single and double-sided illumination cannot be achieved.

本創作之主要目的,在於提供一種利用封裝方式成型的軟性LED光源模組,用以解決傳統可撓之LED光源模組無法達到薄型化之產品需求,及無法達成單、雙面發光之均勻面光源效果。 The main purpose of this creation is to provide a flexible LED light source module formed by using a package method, which can solve the problem that the traditional flexible LED light source module cannot be thinned, and can not achieve the uniform surface of single and double-sided illumination. Light source effect.

根據本創作之一實施例,所述軟性LED光源模組包括一軟性透光基板、一可彎折之驅動線路、至少一發光二極體及一軟性透光蓋板,其中,該軟性透光基板具有一上表面及一下表面,該可彎折之驅動線路設置於該軟性透光基板之該上表面,該發光二極體設置於該軟性透光基板之該上表面並連接該可彎折之驅動線路,該軟性透光蓋板包覆該發光二極體及該可彎折之驅動線路。 According to an embodiment of the present invention, the flexible LED light source module includes a flexible transparent substrate, a bendable driving circuit, at least one light emitting diode, and a soft transparent cover, wherein the soft light transmitting The substrate has an upper surface and a lower surface, the bendable driving circuit is disposed on the upper surface of the flexible transparent substrate, and the light emitting diode is disposed on the upper surface of the flexible transparent substrate and is connected to the bendable The driving transparent circuit covers the light emitting diode and the bendable driving circuit.

在本創作之一實施例中,該軟性透光基板內包括複數均勻分布或非均勻分布之擴散粒子。 In an embodiment of the present invention, the flexible transparent substrate includes a plurality of uniformly distributed or non-uniformly distributed diffusion particles.

在本創作之一實施例中,該發光二極體之外表面包覆一螢光層。 In an embodiment of the present invention, the outer surface of the light emitting diode is coated with a phosphor layer.

在本創作之一實施例中,該軟性透光基板內包括複數均勻分布或非均勻分布之擴散粒子及螢光粉料。 In an embodiment of the present invention, the flexible transparent substrate includes a plurality of uniformly distributed or non-uniformly distributed diffusion particles and a fluorescent powder.

在本創作之一實施例中,更包括一反射層,該反射層覆蓋該軟性透光蓋板。 In an embodiment of the present invention, a reflective layer is further included, and the reflective layer covers the flexible transparent cover.

在本創作之一實施例中,該軟性透光蓋板內包括複數均勻分布或非均勻分布之擴散粒子。 In an embodiment of the present invention, the flexible transparent cover plate includes a plurality of uniformly distributed or non-uniformly distributed diffusion particles.

在本創作之一實施例中,該發光二極體之外表面包覆一螢光層。 In an embodiment of the present invention, the outer surface of the light emitting diode is coated with a phosphor layer.

在本創作之一實施例中,該軟性透光蓋板內包括複數均勻分布或非均勻分布之擴散粒子及螢光粉料。 In an embodiment of the present invention, the flexible transparent cover plate includes a plurality of uniformly distributed or non-uniformly distributed diffusion particles and a fluorescent powder.

在本創作之一實施例中,該軟性透光基板為一塑膠基板。In an embodiment of the present invention, the flexible transparent substrate is a plastic substrate.

在本創作之一實施例中,該軟性透光蓋板為一高透光塑膠蓋板。In an embodiment of the present invention, the flexible transparent cover is a high transparent plastic cover.

本創作至少具有下列的優點:This creation has at least the following advantages:

一、本創作之軟性LED光源模組係利用可撓且透光之上下基板將薄型光源、電路封裝成型,除了可符合薄型化之產品需求外,其可撓之特性更可用於各種照明、背光或其他適用範圍。1. The soft LED light source module of this creation uses a flexible and transparent upper and lower substrate to form a thin light source and circuit package. In addition to meeting the requirements of thin products, its flexible characteristics can be used for various illuminations and backlights. Or other scope of application.

二、本創作之軟性LED光源模組可進一步添加擴散劑於軟性透光基板或軟性透光蓋板中,並選擇性增設一反射層於軟性透光蓋板上,以達成單面或雙面均勻發光之功效。Second, the soft LED light source module of the present invention can further add a diffusing agent in the soft transparent substrate or the soft transparent cover plate, and selectively add a reflective layer on the soft transparent cover plate to achieve one-sided or double-sided The effect of uniform illumination.

以上關於本創作內容的說明以及以下實施方式的說明係用以舉例並解釋本創作的原理,並且提供本創作之專利申請範圍進一步的解釋。The above description of the present invention and the following description of the embodiments are provided to illustrate and explain the principles of the present invention, and to provide further explanation of the scope of the patent application of the present invention.

100、100a、100b、100c‧‧‧軟性LED光源模組 100, 100a, 100b, 100c‧‧‧soft LED light source module

1、1’‧‧‧軟性透光基板 1, 1'‧‧‧Soft transparent substrate

11‧‧‧上表面 11‧‧‧ upper surface

2‧‧‧可彎折之驅動線路 2‧‧‧Flexible drive lines

3‧‧‧發光二極體 3‧‧‧Lighting diode

31‧‧‧螢光層 31‧‧‧Fluorescent layer

4、4’‧‧‧軟性透光蓋板 4, 4'‧‧‧Soft translucent cover

5‧‧‧擴散粒子 5‧‧‧Diffusion particles

6‧‧‧螢光粉料 6‧‧‧Fluorescent powder

7‧‧‧反射層 7‧‧‧reflective layer

8‧‧‧鋁擠型框架 8‧‧‧Aluminum extruded frame

L1‧‧‧入射光 L1‧‧‧ incident light

L2‧‧‧穿透光 L2‧‧‧ penetrating light

L3‧‧‧反射光 L3‧‧‧ reflected light

圖1為本創作之第一實施例之軟性LED光源模組之剖面示意圖。1 is a schematic cross-sectional view of a soft LED light source module according to a first embodiment of the present invention.

圖2為本創作之第二實施例之軟性LED光源模組之剖面示意圖。2 is a cross-sectional view showing a soft LED light source module according to a second embodiment of the present invention.

圖3為本創作之第三實施例之軟性LED光源模組之剖面示意圖。3 is a cross-sectional view showing a soft LED light source module according to a third embodiment of the present invention.

圖4為本創作之第四實施例之軟性LED光源模組之剖面示意圖。4 is a cross-sectional view showing a soft LED light source module according to a fourth embodiment of the present invention.

圖5為本創作之平面燈具之剖面示意圖。Figure 5 is a schematic cross-sectional view of the planar light fixture of the present invention.

本創作「軟性LED光源模組」主要是利用可撓且透光材質之上下基板結合薄型發光源與電路所封裝成型,可達到薄型化之功能,以及達成單面或雙面發光之均勻面光源效果,適用於照明、背光等範圍。以下,將詳細介紹本創作之具體實施方式。The "soft LED light source module" of the present invention is mainly formed by using a flexible and transparent material upper and lower substrate combined with a thin light source and a circuit to form a thinned function, and a uniform surface light source for single or double-sided illumination. The effect is suitable for lighting, backlight and other areas. Hereinafter, the specific implementation of the present creation will be described in detail.

[第一實施例][First Embodiment]

請參考圖1,為本創作第一實施例之軟性LED光源模組之剖 面示意圖。本實施例之軟性LED光源模組100包括一軟性透光基板1、一可彎折之驅動線路2、至少一發光二極體3及一軟性透光蓋板4。Please refer to FIG. 1 , which is a cross section of the soft LED light source module according to the first embodiment of the present invention. Schematic diagram. The flexible LED light source module 100 of the present embodiment includes a flexible transparent substrate 1, a bendable driving circuit 2, at least one light emitting diode 3, and a flexible transparent cover 4.

具體地說,軟性透光基板1為可撓且可供光線穿透之材料所製成,例如是聚對酞酸乙二酯(PET)、聚氯乙烯(PVC)、聚乙烯(PE)、聚亞醯胺(PI)等材料所製成的塑膠基板,但本創作不以此為限。在本實施例中,軟性透光基板1為透明材質,並且軟性透光基板1的厚度較佳小於1mm。Specifically, the flexible transparent substrate 1 is made of a material that is flexible and transparent to light, such as polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyethylene (PE), A plastic substrate made of materials such as polyamine (PI), but this creation is not limited to this. In the present embodiment, the flexible transparent substrate 1 is made of a transparent material, and the thickness of the flexible transparent substrate 1 is preferably less than 1 mm.

驅動線路2係利用可彎折之導電材料印刷於軟性透光基板1(具有上下表面)之上表面11所成型,所選用的導電材料可以是銀漿(含有銀、filler),但不限制於此;如此,軟性透光基板1在彎折時不會造成驅動線路2斷路。The driving circuit 2 is formed by printing a bendable conductive material on the upper surface 11 of the flexible transparent substrate 1 (having upper and lower surfaces). The selected conductive material may be silver paste (including silver, filler), but is not limited thereto. Thus, the flexible transparent substrate 1 does not cause the drive line 2 to open when bent.

發光二極體3設置於軟性透光基板1之上表面11且電性連接於驅動線路2,發光二極體3為透明基板之發光二極體,例如藍寶石(sapphire)或碳化矽(Sic)基板之發光二極體,但不限制於此,發光二極體3之外表面還包覆有螢光層31,可提供不同色光之光源。The light emitting diode 3 is disposed on the upper surface 11 of the flexible transparent substrate 1 and electrically connected to the driving circuit 2, and the light emitting diode 3 is a light emitting diode of the transparent substrate, such as sapphire or tantalum carbide (Sic). The light-emitting diode of the substrate is not limited thereto, and the outer surface of the light-emitting diode 3 is further covered with a fluorescent layer 31, which can provide a light source of different color lights.

在本實施例中,發光二極體3的數量為三個,但不限制於此,其數量可根據實際應用需求而有所調整;該些發光二極體3係間隔地設置於驅動線路2上,並利用其正、負極與驅動線路2相連接而達成電性連通。或者,在一變化實態樣中,可於軟性透光基板1之上表面11布設數個金屬墊(圖未顯示),其數量需與發光二極體的數量相同,所述發光二極體3則分別設置於該些金屬墊上;又或者,可在軟性透光基板1的邊緣設置有多個導電連接墊(圖未顯示),所述發光二極體3可經由多條銲線(圖未顯示)分別連接其正、負極與該些導電連接墊而達成電性連通。In this embodiment, the number of the light-emitting diodes 3 is three, but is not limited thereto, and the number thereof may be adjusted according to actual application requirements; the light-emitting diodes 3 are disposed at intervals on the driving circuit 2 In addition, the positive and negative electrodes are connected to the drive line 2 to achieve electrical communication. Alternatively, in a modified real state, a plurality of metal pads (not shown) may be disposed on the upper surface 11 of the flexible transparent substrate 1 in the same number as the number of the light emitting diodes. 3, respectively, disposed on the metal pads; or alternatively, a plurality of conductive connection pads (not shown) may be disposed on the edge of the flexible transparent substrate 1, and the LEDs 3 may pass through a plurality of bonding wires (Fig. Not shown) the positive and negative electrodes are respectively connected to the conductive connection pads to achieve electrical communication.

軟性透光蓋板4設置於軟性透光基板1之上表面11並包覆發光二極體3及驅動線路2,軟性透光蓋板4之材質為高透光性塑膠,例如熱固型或熱塑型塑膠,其至少包含環氧樹脂(Epoxy)、聚 苯乙烯(Polystyrene,PS)、丙烯晴-丁二烯-苯乙烯之共聚物(Acrylonitrile-Butadene-Styrene,ABS)、聚甲基丙烯酸甲酯(Polymetyl methacrylate,PMMA)、壓克力(Acrylic resin)、矽膠(Silicon)或其組合,但不限制於此,本實施例軟性透光蓋板4之材質可根據產品需求而有所調整。 The flexible transparent cover 4 is disposed on the upper surface 11 of the flexible transparent substrate 1 and covers the LED 3 and the driving circuit 2, and the material of the flexible transparent cover 4 is a high translucent plastic, such as a thermosetting type or Thermoplastic plastic, which contains at least epoxy resin (Epoxy), poly Polystyrene (PS), Acrylonitrile-Butadene-Styrene (ABS), Polymethyl methacrylate (PMMA), Acrylic resin , but not limited to this, the material of the flexible transparent cover 4 of the embodiment can be adjusted according to product requirements.

再者,本實施例之軟性透光蓋板4可進一步包含有複數均勻分布或非均勻分布之擴散粒子5,其可於製造過程中把高折射率的粒子或高反射率的不透明粒子混入高透光樹脂所形成,可使光線以擴散方式射出,增加了光源之均勻度。值得注意的是,軟性透光基板1與軟性透光蓋板4的折射率越接近越好,可減少光在本實施例之軟性LED光源模組100內的損耗,以提高外部光取出效率。 Furthermore, the flexible transparent cover 4 of the embodiment may further comprise a plurality of uniformly distributed or non-uniformly distributed diffusion particles 5, which can mix high refractive index particles or high reflectivity opaque particles into the manufacturing process. The light-transmissive resin is formed to allow light to be emitted in a diffused manner, which increases the uniformity of the light source. It should be noted that the closer the refractive index of the flexible transparent substrate 1 and the flexible transparent cover 4 is, the better the loss of light in the flexible LED light source module 100 of the embodiment can be improved to improve the external light extraction efficiency.

如此,部分發光二極體3發出的光L1可向外穿透軟性透光蓋板4而形成出射光L2,另一部分的光L1則是經由反射層7之金屬反射效果而形成反射光L3,並經由軟性透光基板1向外部射出,因此本實施例之軟性LED光源模組100可提供薄型化且雙面均勻發光之功效。 In this way, the light L1 emitted by the partial light-emitting diodes 3 can penetrate the flexible transparent cover 4 to form the outgoing light L2, and the other part of the light L1 forms the reflected light L3 through the metal reflective effect of the reflective layer 7. The flexible LED light source module 100 of the present embodiment can provide a thinned and uniform illumination on both sides.

[第二實施例] [Second embodiment]

請參考圖2,為本創作第二實施例之軟性LED光源模組之剖面示意圖。與第一實施例的不同之處在於,本實施例之軟性LED光源模組100a係通過混入各色螢光粉料6於軟性透光蓋板4’來調整發出之色光。換言之,本實施例之軟性透光蓋板4’內包含均勻分布或非均勻分布的擴散粒子5及螢光粉料6;如此,發光二極體3之外表面則不需包覆有螢光層31。 Please refer to FIG. 2 , which is a cross-sectional view of a soft LED light source module according to a second embodiment of the present invention. The difference from the first embodiment is that the soft LED light source module 100a of the present embodiment adjusts the emitted color light by mixing the phosphor powders 6 of the respective colors on the flexible transparent cover 4'. In other words, the flexible transparent cover 4' of the embodiment includes uniformly or non-uniformly distributed diffusion particles 5 and phosphor powder 6; thus, the outer surface of the LED 3 does not need to be covered with fluorescent light. Layer 31.

[第三實施例] [Third embodiment]

請參考圖3,所繪示為本創作第三實施例之軟性LED光源模組之剖面示意圖。與第一實施例的不同之處在於,本實施例之軟性LED光源模組100b更包括一反射層7,並且所述擴散粒子5係 布設於軟性透光基板1內;換言之,本實施例之軟性透光基板1內包含有均勻分布或非均勻分布的擴散粒子5。 Please refer to FIG. 3 , which is a cross-sectional view of a soft LED light source module according to a third embodiment of the present invention. The difference from the first embodiment is that the flexible LED light source module 100b of the embodiment further includes a reflective layer 7, and the diffusion particles 5 are The flexible transparent substrate 1 of the present embodiment includes diffused particles 5 uniformly distributed or non-uniformly distributed.

具體地說,反射層7係於軟性透光蓋板4外以貼合、塗覆或濺鍍的方式所形成的高反射率材料層,然本創作非對反射層7的形成方式加以限制。據此,少部分發光二極體3發出的光L1可向外穿透軟性透光蓋板4而形成出射光L2,絕大部分的光L1則是通過反射層7之金屬反射效果而形成反射光L3,並經由軟性透光基板1向外部射出,因此本實施例之性光源模組100b可提供薄型化且單面均勻發光之功效。值得一提的是,本實施例可通過調整反射層7的厚度來控制光線穿透、反射的比例。 Specifically, the reflective layer 7 is a layer of high reflectivity material formed by lamination, coating or sputtering outside the flexible translucent cover 4, but the creation of the reflective layer 7 is not limited. Accordingly, the light L1 emitted by a small portion of the light-emitting diodes 3 can penetrate the soft transparent cover 4 to form the outgoing light L2, and most of the light L1 is reflected by the metal reflection effect of the reflective layer 7. Since the light L3 is emitted to the outside through the flexible transparent substrate 1, the light source module 100b of the present embodiment can provide a thinned and uniform illumination on one side. It is worth mentioning that this embodiment can control the ratio of light penetration and reflection by adjusting the thickness of the reflective layer 7.

[第四實施例] [Fourth embodiment]

請參考圖4,所繪示為本創作第四實施例之軟性LED光源模組之剖面示意圖。與前一實施例的不同之處在於,本實施例之軟性LED光源模組100c係通過混入各色螢光粉料6於軟性透光基板1’來調整發出之色光。換言之,本實施例之軟性透光基板1’內包含均勻分布或非均勻分布的擴散粒子5及螢光粉料6;如此,發光二極體3之外表面則不需包覆有螢光層31。 Please refer to FIG. 4 , which is a cross-sectional view of a soft LED light source module according to a fourth embodiment of the present invention. The difference from the previous embodiment is that the soft LED light source module 100c of the present embodiment adjusts the emitted color light by mixing the phosphor powders 6 of the respective colors on the flexible transparent substrate 1'. In other words, the flexible transparent substrate 1' of the present embodiment includes the uniformly distributed or non-uniformly distributed diffusing particles 5 and the phosphor powder 6; thus, the outer surface of the light emitting diode 3 does not need to be coated with the fluorescent layer. 31.

[第五實施例] [Fifth Embodiment]

請參考圖5,所繪示為應用本創作軟性LED光源模組之平面燈具之剖面示意圖。本實施例之平面燈具係將一鋁擠型框架8設置於軟性LED光源模組100的最外緣,並包覆住部分軟性透光基板1與部分軟性透光基板4;具體地說,所述鋁擠型框架8係包覆住軟性LED光源模組100之非光學面,以構成本創作雙面均勻發光型之平面燈具;此外,所述平面燈具可進一步包括至少一導光板,係設置於軟性LED光源模組100之光學面,以賦予平面燈具不同的光學效果。 Please refer to FIG. 5 , which is a schematic cross-sectional view of a planar luminaire to which the soft LED light source module of the present invention is applied. In the planar light fixture of the embodiment, an aluminum extruded frame 8 is disposed on the outermost edge of the flexible LED light source module 100, and covers a portion of the flexible transparent substrate 1 and a portion of the flexible transparent substrate 4; The aluminum extruded frame 8 covers the non-optical surface of the flexible LED light source module 100 to form a planar light fixture of the present double-sided uniform illumination type; in addition, the planar light fixture may further include at least one light guide plate, which is provided The optical surface of the flexible LED light source module 100 is used to impart different optical effects to the planar light fixture.

是以,相較於傳統可撓之LED發光模組,本創作具有如下述之特點及功能: Therefore, compared with the traditional flexible LED lighting module, the creation has the following features and functions:

一、本創作之軟性LED光源模組係利用可撓且透光之上下基板將薄型光源、電路封裝成型,除了可符合薄型化之產品需求外,其可撓之特性更可用於各種照明、背光或其他適用範圍。 1. The soft LED light source module of this creation uses a flexible and transparent upper and lower substrate to form a thin light source and circuit package. In addition to meeting the requirements of thin products, its flexible characteristics can be used for various illuminations and backlights. Or other scope of application.

二、本創作之軟性LED光源模組可進一步添加擴散劑於軟性透光基板或軟性透光蓋板中,並選擇性增設一反射層於軟性透光蓋板上,以達成單面或雙面均勻發光之功效。 Second, the soft LED light source module of the present invention can further add a diffusing agent in the soft transparent substrate or the soft transparent cover plate, and selectively add a reflective layer on the soft transparent cover plate to achieve one-sided or double-sided The effect of uniform illumination.

三、本創作之軟性LED光源模組可通過調整反射層的厚度來控制光線穿透、反射的比例,以增加軟性LED光源模組的應用性。 Third, the soft LED light source module of the present invention can control the ratio of light penetration and reflection by adjusting the thickness of the reflective layer to increase the applicability of the soft LED light source module.

綜上所述,本創作實已符合新型專利之要件,依法提出申請。惟以上所揭露者,僅為本創作較佳實施例而已,自不能以此限定本案的權利範圍,因此依本案申請範圍所做的均等變化或修飾,仍屬本案所涵蓋的範圍。 In summary, this creation has already met the requirements of the new patent and applied in accordance with the law. However, the above disclosures are only preferred embodiments of the present invention, and the scope of rights of the present invention cannot be limited thereto. Therefore, the equal changes or modifications made according to the scope of the application of the present application are still covered by the present application.

100‧‧‧軟性LED光源模組 100‧‧‧Soft LED light source module

1‧‧‧軟性透光基板 1‧‧‧Soft transparent substrate

11‧‧‧上表面 11‧‧‧ upper surface

2‧‧‧可彎折之驅動線路 2‧‧‧Flexible drive lines

3‧‧‧發光二極體 3‧‧‧Lighting diode

31‧‧‧螢光層 31‧‧‧Fluorescent layer

4‧‧‧軟性透光蓋板 4‧‧‧Soft transparent cover

5‧‧‧擴散粒子 5‧‧‧Diffusion particles

L1‧‧‧入射光 L1‧‧‧ incident light

L2‧‧‧穿透光 L2‧‧‧ penetrating light

L3‧‧‧反射光 L3‧‧‧ reflected light

Claims (10)

一種軟性LED光源模組,包括:一軟性透光基板,具有一上表面及一下表面;一可彎折之驅動線路,設置於該軟性透光基板之該上表面;至少一發光二極體,設置於該軟性透光基板之該上表面並連接該可彎折之驅動線路;及一軟性透光蓋板,包覆該發光二極體及該可彎折之驅動線路。 A flexible LED light source module comprises: a flexible transparent substrate having an upper surface and a lower surface; a bendable driving circuit disposed on the upper surface of the flexible transparent substrate; at least one light emitting diode, And disposed on the upper surface of the flexible transparent substrate and connected to the bendable driving circuit; and a flexible transparent cover plate covering the light emitting diode and the bendable driving circuit. 如申請專利範圍第1項所述之軟性LED光源模組,其中該軟性透光基板內包括複數均勻分布或非均勻分布之擴散粒子。 The flexible LED light source module of claim 1, wherein the flexible transparent substrate comprises a plurality of uniformly distributed or non-uniformly distributed diffusion particles. 如申請專利範圍第2項所述之軟性LED光源模組,其中該發光二極體之外表面包覆一螢光層。 The soft LED light source module of claim 2, wherein the outer surface of the light emitting diode is coated with a phosphor layer. 如申請專利範圍第2項所述之軟性LED光源模組,其中該軟性透光基板內包括複數均勻分布或非均勻分布之擴散粒子及螢光粉料。 The flexible LED light source module of claim 2, wherein the flexible transparent substrate comprises a plurality of uniformly distributed or non-uniformly distributed diffusion particles and a fluorescent powder. 如申請專利範圍第1項所述之軟性LED光源模組,更包括一反射層,該反射層覆蓋該軟性透光蓋板。 The flexible LED light source module of claim 1, further comprising a reflective layer covering the flexible transparent cover. 如申請專利範圍第5項所述之軟性LED光源模組,其中該軟性透光蓋板內包括複數均勻分布或非均勻分布之擴散粒子。 The flexible LED light source module of claim 5, wherein the flexible transparent cover plate comprises a plurality of uniformly distributed or non-uniformly distributed diffusion particles. 如申請專利範圍第6項所述之軟性LED光源模組,其中該發光二極體之外表面包覆一螢光層。 The soft LED light source module of claim 6, wherein the outer surface of the light emitting diode is coated with a phosphor layer. 如申請專利範圍第6項所述之軟性LED光源模組,其中該軟性透光蓋板內包括複數均勻分布或非均勻分布之擴散粒子及螢光粉料。 The flexible LED light source module of claim 6, wherein the flexible transparent cover comprises a plurality of uniformly distributed or non-uniformly distributed diffusion particles and a fluorescent powder. 如申請專利範圍第1項所述之軟性LED光源模組,其中該軟性透光基板為一塑膠基板。 The flexible LED light source module of claim 1, wherein the flexible transparent substrate is a plastic substrate. 如申請專利範圍第1項所述之軟性LED光源模組,其中該軟性透光蓋板為一高透光塑膠蓋板。The soft LED light source module of claim 1, wherein the flexible transparent cover is a high transparent plastic cover.
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Cited By (9)

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TWI560910B (en) * 2014-12-27 2016-12-01 Advanced Optoelectronic Tech Light emitting diode packaging stucture
TWI651993B (en) * 2014-03-06 2019-02-21 塔克圖科技有限公司 Method, related configuration and product for manufacturing electronic products
CN109377894A (en) * 2018-11-14 2019-02-22 陈晓锋 A kind of ultra-thin soft display module of Fast Installation modularization
TWI679371B (en) * 2015-06-25 2019-12-11 荷蘭商皇家飛利浦有限公司 An led module and light directing method
US10950585B2 (en) 2019-03-18 2021-03-16 Intematix Corporation Tunable LED-filaments and tunable LED-filament lamps
TWI730680B (en) * 2019-03-18 2021-06-11 美商英特曼帝克司公司 Tunable led-filaments and tunable led-filament lamps
US11050003B2 (en) 2017-01-13 2021-06-29 Intematix Corporation Narrow-band red phosphors for LED lamps
TWI741532B (en) * 2019-03-18 2021-10-01 美商英特曼帝克司公司 Led-filaments and led-filament lamps
US11781714B2 (en) 2019-03-18 2023-10-10 Bridgelux, Inc. LED-filaments and LED-filament lamps

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI651993B (en) * 2014-03-06 2019-02-21 塔克圖科技有限公司 Method, related configuration and product for manufacturing electronic products
TWI560910B (en) * 2014-12-27 2016-12-01 Advanced Optoelectronic Tech Light emitting diode packaging stucture
TWI679371B (en) * 2015-06-25 2019-12-11 荷蘭商皇家飛利浦有限公司 An led module and light directing method
US11050003B2 (en) 2017-01-13 2021-06-29 Intematix Corporation Narrow-band red phosphors for LED lamps
CN109377894A (en) * 2018-11-14 2019-02-22 陈晓锋 A kind of ultra-thin soft display module of Fast Installation modularization
US10950585B2 (en) 2019-03-18 2021-03-16 Intematix Corporation Tunable LED-filaments and tunable LED-filament lamps
TWI730680B (en) * 2019-03-18 2021-06-11 美商英特曼帝克司公司 Tunable led-filaments and tunable led-filament lamps
TWI741532B (en) * 2019-03-18 2021-10-01 美商英特曼帝克司公司 Led-filaments and led-filament lamps
US11781714B2 (en) 2019-03-18 2023-10-10 Bridgelux, Inc. LED-filaments and LED-filament lamps
US12062644B2 (en) 2019-03-18 2024-08-13 Intematix Corporation LED-filaments and LED-filament lamps

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