CN105810798B - EMC upside-down mounting supports add package lens structure and preparation method thereof - Google Patents
EMC upside-down mounting supports add package lens structure and preparation method thereof Download PDFInfo
- Publication number
- CN105810798B CN105810798B CN201610352249.8A CN201610352249A CN105810798B CN 105810798 B CN105810798 B CN 105810798B CN 201610352249 A CN201610352249 A CN 201610352249A CN 105810798 B CN105810798 B CN 105810798B
- Authority
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- China
- Prior art keywords
- emc
- bisque
- white point
- supports
- chip
- Prior art date
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- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 229910002114 biscuit porcelain Inorganic materials 0.000 claims abstract description 29
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000000741 silica gel Substances 0.000 claims abstract description 27
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 27
- 229960001866 silicon dioxide Drugs 0.000 claims abstract description 27
- 239000000853 adhesive Substances 0.000 claims abstract description 23
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 19
- 238000004806 packaging method and process Methods 0.000 claims abstract description 19
- 239000006071 cream Substances 0.000 claims abstract description 18
- 238000005476 soldering Methods 0.000 claims abstract description 10
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims description 33
- 238000000465 moulding Methods 0.000 claims description 21
- 239000011265 semifinished product Substances 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- 239000000428 dust Substances 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- 238000010410 dusting Methods 0.000 claims description 4
- 238000000748 compression moulding Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000011112 process operation Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 10
- 238000009826 distribution Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract 1
- 229920006336 epoxy molding compound Polymers 0.000 description 38
- 238000005538 encapsulation Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of EMC upside-down mountings support to add package lens structure and preparation method thereof, the structure includes EMC supports and chip, chip is inverted on EMC supports by tin cream, white point bisque is provided with above chip, white point bisque is externally provided with a layer self-adhered adhesive, is once encapsulated by silica-gel lens outside self-adhesive；This method includes the process of die bond, Reflow Soldering, dehumidifying, coating white point bisque and package lens.The present invention can overcome because planar package total reflection and caused by light efficiency it is not high the defects of, compared to plane packaging structure lifting light efficiency about 8% 12%, easy secondary light-distribution design, cost is lower.
Description
Technical field
The present invention relates to LED encapsulation technologies field, is to be related to a kind of EMC upside-down mountings support to add once encapsulation saturating specifically
Mirror structure and preparation method thereof.
Background technology
SMD-LED technologies are maked rapid progress, and existing 1-3W SMD pasters are currently without corresponding product, traditional ceramics
3535th, 3030 and imitative lumen series of products in, imitate lumen support and ceramic series of products finished product it is too high, room for price-cut is simultaneously little.
The manufacturing process technique of the supporting structures such as existing imitative lumen is complex, and the consumption of raw materials in whole encapsulation process is larger, raw
Dead lamp rate is high when it is high to produce cost, and using.
In addition, be planar package using the encapsulation of EMC supports its exiting surface now, fluorescent material is stimulated the big angle of outgoing
Degree light is easily totally reflected when package surface projects, and such structure light efficiency is not high, and is difficult to do secondary light-distribution.
Drawbacks described above, it is worth solving.
The content of the invention
In order to overcome the shortcomings of existing technology, the present invention provides a kind of EMC upside-down mountings support and adds a package lens structure
And preparation method thereof.
Technical solution of the present invention is as described below：
EMC upside-down mounting supports add a package lens structure, it is characterised in that including EMC supports and chip,
The chip is inverted on the EMC supports by tin cream, and white point bisque is provided with above the chip, described white
Luminous point bisque is externally provided with a layer self-adhered adhesive, is once encapsulated by silica-gel lens outside the self-adhesive.
According to the present invention of such scheme, it is characterised in that the EMC supports be 3.0mm*3.0mm*0.52mm justify cup or
Person 3.5*3.5*0.7mm justifies cup.
According to the present invention of such scheme, it is characterised in that the tin cream is unleaded noresidue tin cream.
According to the present invention of such scheme, it is characterised in that passed through Reflow Soldering company between the chip and the tin cream
Connect.
According to the present invention of such scheme, it is characterised in that the self-adhesive is the silica gel of one-component, and its thickness is
0.003mm。
According to the present invention of such scheme, it is characterised in that be provided with the bowl of the fixed chip in the EMC supports.
According to the present invention of such scheme, it is characterised in that the refractive index of the white point bisque is 1.5.
According to the present invention of such scheme, it is characterised in that the white point bisque is the glue that dusts, and the glue that dusts is uniform
It is layed on the chip, the bowl is interior and the upper surface of the EMC supports.
According to the present invention of such scheme, it is characterised in that the thickness of the glue that dusts is 0.05um.
According to the present invention of such scheme, it is characterised in that the self-adhesive is coated on the surface of the glue that dusts.
According to the present invention of such scheme, it is characterised in that the white point bisque is white light packaging plastic, the white light envelope
Dress glue is filled in the bowl.
According to the present invention of such scheme, it is characterised in that the self-adhesive is coated on the white light packaging plastic and described
The upper surface of EMC supports.
The preparation method that a kind of EMC upside-down mountings support adds a package lens structure, it is characterised in that comprise the following steps：
S1：Die bond operation；
S2：Reflow Soldering operation is carried out by eight warm area Reflow Soldering boards；
S3：Dehumidify and be coated with white point bisque；
S4：Package lens Molding process operations of silica gel.
According to the present invention of such scheme, it is characterised in that in the step S1, specifically include following steps：
S11：Toasted 2 hours in 150 degree of horizontal oven, EMC supports are dehumidified；
S12：Using plane stencil printer and 3D printed steel mesh in EMC support bowls print solder paste, the plane tin
Cream printing machine is high accuracy prints machine, and its positional precision is 0.05um；
S13：The EMC supports printed are subjected to die bond operation in LED bonders, pass through camera on die bond board
Determine that accurate die bond is identified in tin cream position.
According to the present invention of such scheme, it is characterised in that in the step S3, white point bisque is the glue that dusts, and is passed through
The good glue that dusts of trial is carried out operation of dusting by duster in a manner of Pulse Spraying, and the thickness that dusts is 0.05um, after the completion of dusting
Stand or toast, sealing semi-finished product are made.
According to the present invention of such scheme, it is characterised in that in the step S3, white point bisque is white light packaging plastic,
By the good white light packaging plastic of trial by encapsulate white light point gum machine mix vacuumize after carry out dispensing, toasted after dispensing, make
Into sealing semi-finished product.
According to the present invention of such scheme, it is characterised in that in the step S4, specifically include following steps：
S41：EMC support semi-finished product after coating white point bisque are dehumidified；
S42：A layer self-adhered adhesive is sprayed on EMC support semi-finished product, normal temperature is stood；
S43：After with special molding, AB silica gel is mixed, molded on compression molding forming machine by mould heating Molding
Package lens, the demoulding；
S44：Package lens length of silica gel is roasting, and Molding semi-finished product are made；
S45：Divide the cutting of Molding semi-finished product to single, and package handling.
According to the present invention of such scheme, its advantage is：
1st, for the present invention using EMC supports as substrate carrier, cost is low；
2nd, flip chip tin cream die bond, thermal impedance is small, and whole lamp thermal impedance is small；
3rd, package lens of silica gel, luminance raising, light extraction carry better than the imitative lumen structure of tradition compared to plane packaging structure
Light efficiency about 8%-12% is risen, light efficiency is higher；
4th, lens angle can be changed and meet that different secondary luminous intensity distribution designs；
5th, volume is smaller, and application space is wider.
Brief description of the drawings
Fig. 1 is the outline structural diagram of the present invention；
Fig. 2 is the top view of EMC supports of the present invention；
Fig. 3 is the top view of EMC upside-down mountings support of the present invention and chip；
Fig. 4 is the distributed architecture schematic diagram of glue of being dusted in the embodiment of the present invention one；
Fig. 5 is the side sectional view after the embodiment of the present invention one encapsulates；
Fig. 6 is the distributed architecture schematic diagram of white light packaging plastic in the embodiment of the present invention two；
Fig. 7 is the side sectional view after the embodiment of the present invention two encapsulates.
In figure, 10, EMC supports；11st, bowl；20th, tin cream；30th, chip；41st, dust glue；42nd, white light packaging plastic；50、
Self-adhesive；60th, silica-gel lens.
Embodiment
Below in conjunction with the accompanying drawings and the present invention is further described embodiment：
As Figure 1-3, a kind of EMC upside-down mountings support adds a package lens structure, including EMC supports 10 and chip 30.
Chip 30 is inverted on EMC supports 10 by tin cream 20, and Reflow Soldering connection was passed through between chip 30 and tin cream 20.EMC supports
The bowl 11 of fixed wafer is provided with 10.
Wherein, tin cream 20 is unleaded noresidue tin cream.
EMC (Epoxy Molding Compound) is in Molding equipment using new Epoxy materials and etching technique
Encapsulation under a kind of Highgrade integration frame form.The specification of EMC supports 10 be 3.0mm*3.0mm*0.52mm justify cup or
3.5*3.5*0.7mm circle cup etc..EMC supports 10 are that one kind is full wafer support, and a point single mode, which need to be cut, just to be completed, and need to be used molten
Tin residual is few, good fluidity, the small tin cream of particle diameter, is printed on 3D steel meshes in EMC3030 carrier cups, then carries out Reflow Soldering work
Industry.
Embodiment one
As illustrated in figures 4-5, the top of chip 30 is provided with white point bisque, and white point bisque is the silicon of refractive index 1.5 and the above
Glue and fluorescent material (the different colours phosphor combination of the mixing containing ratio) composition.
In the present embodiment, white point bisque is the glue 41 that dusts, and the thickness for the glue 41 that dusts is 0.05um, and the glue 41 that dusts is uniform
It is layed on chip 30, bowl 11 is interior and the upper surface of EMC supports 11.The glue 41 that dusts is externally provided with a layer self-adhered adhesive 50, self-adhesion
Once encapsulated by silica-gel lens 60 outside glue 50, the thickness of self-adhesive 50 is 0.003mm, and self-adhesive 50, which is coated on, to dust
The surface of glue 41.
Self-adhesive 50 is the silica gel content of one pack system, for being bonded support, white light glue and a molding silica-gel lens.
Silica-gel lens 60 are that liquid A glue and B glue mix, at high temperature (130-150 DEG C is in solid-state) by mould to be molded
(molding) mode, silica-gel lens are bonded on EMC supports 10.
Embodiment two
As shown in fig. 6-7, unlike embodiment one, in the present embodiment, the top of chip 30 is provided with white point bisque, in vain
Luminous point bisque is silica gel and fluorescent material (the different colours phosphor combination of the mixing containing ratio) composition of refractive index 1.5 and the above.
In the present embodiment, white point bisque is white light packaging plastic 42, is filled in from light packaging plastic 42 in bowl 11.White light
Packaging plastic 42 is externally provided with a layer self-adhered adhesive 50, is once encapsulated by silica-gel lens 60 outside self-adhesive 50, self-adhesive 50 applies
It is distributed in the upper surface of white light packaging plastic 42 and EMC supports 10.
Self-adhesive 50 is the silica gel content of one pack system, for being bonded support, white light glue and a molding silica-gel lens.
Silica-gel lens 60 are that liquid A glue and B glue mix, at high temperature (130-150 DEG C is in solid-state) by mould to be molded
(molding) mode, silica-gel lens are bonded on EMC supports 10.
The preparation method that a kind of EMC upside-down mountings support adds a package lens structure, it is characterised in that comprise the following steps：
1st, die bond operation.Specifically：
EMC supports are dehumidified under the conditions of 150 degree/1H；Using plane stencil printer and 3D printed steel mesh in EMC
Print solder paste in support bowl, plane stencil printer are high accuracy prints machine, and its positional precision is 0.05um3D printed steel mesh
For external import tool.The EMC supports printed are subjected to die bond operation in LED bonders, are identified with PR accurate solid
It is brilliant.
2nd, Reflow Soldering operation is carried out by eight warm area Reflow Soldering boards, temperature requirement is accurate, actual temperature and setting in stove
Temperature is related to be no more than 10 degree, and actual temp curve is set according to tin cream.
3rd, dehumidify and be coated with white point bisque.
White point bisque is dust glue or white light packaging plastic.Wherein, glue operation of dusting is a kind of new LED points powder side
Formula, it is realized by duster, and by the good fluorescent material of trial and Prima proportioning mixing, the work that dusts is carried out in a manner of Pulse Spraying
Industry, dust thickness about 0.05um.Operation is stood or toasted, sealing semi-finished product are made；In white light packaging plastic encapsulation process, with encapsulation
White light point gum machine carries out dispensing, and white light glue is fluorescent material+silica gel etc., is carried out a little after being vacuumized with the good white light glue mixing of trial
Glue, operation is toasted, sealing semi-finished product are made.
S4：Package lens Molding process operations of silica gel.
Molding specifications：The present invention uses plus the procedure for producing mode of a package lens is silica gel Molding
Processing procedure, production procedure are as follows：
(1) the EMC support semi-finished product after coating white point bisque are dehumidified；
(2) a layer self-adhered adhesive PRIMA is sprayed on support, normal temperature is stood；
(3) with liquid A/B moulds top glue, once encapsulation is molded thoroughly by mould heating Molding on compression molding forming machine
Mirror, the demoulding；
(4) package lens length of silica gel is roasting, and Molding semi-finished product are made；
(5) by Molding semi-finished product single/package handling of cutting point.
It should be appreciated that for those of ordinary skills, can according to the above description be improved or converted,
And all these modifications and variations should all belong to the protection domain of appended claims of the present invention.
Exemplary description has been carried out to patent of the present invention above in conjunction with accompanying drawing, it is clear that the realization of patent of the present invention not by
The limitation of aforesaid way, if the various improvement that the methodology of patent of the present invention and technical scheme are carried out are employed, or without
Improve and the design of patent of the present invention and technical scheme are directly applied into other occasions, within the scope of the present invention.
Claims (4)
- The preparation method that 1.EMC upside-down mounting supports add a package lens structure, it is characterised in thatThe bowl of the fixed chip is provided with including EMC supports and chip, in the EMC supports, the chip is fallen by tin cream On the EMC supports, white point bisque is provided with above the chip, the white point bisque is externally provided with a layer self-adhered adhesive, Once encapsulated by silica-gel lens outside the self-adhesive, the white point bisque is the glue that dusts, and the glue that dusts is uniform Be layed on the chip, in the bowl and the EMC supports upper surface, the self-adhesive is coated on the glue that dusts Surface, the white point bisque is white light packaging plastic, and the white light packaging plastic is filled in the bowl, and the self-adhesive applies The upper surface of the white light packaging plastic and the EMC supports is distributed in,Comprise the following steps：S1：Die bond operation；S2：Reflow Soldering operation is carried out by eight warm area Reflow Soldering boards；S3：Dehumidify and be coated with white point bisque；S4：Package lens Molding process operations of silica gel,In the step S1, following steps are specifically included：S11：EMC supports are dehumidified in horizontal oven；S12：Using plane stencil printer and 3D printed steel mesh, print solder paste, the plane tin cream print in EMC support bowls Brush machine is high accuracy prints machine, and its positional precision is 0.05um；S13：The EMC supports printed are subjected to die bond operation in LED bonders, determined on die bond board by camera Accurate die bond is identified in tin cream position.
- 2. the preparation method that EMC upside-down mountings support according to claim 1 adds a package lens structure, it is characterised in that In the step S3, white point bisque is the glue that dusts, and is carried out the good glue that dusts of trial in a manner of Pulse Spraying by duster Dust operation, stand or toast after the completion of dusting, sealing semi-finished product are made.
- 3. the preparation method that EMC upside-down mountings support according to claim 1 adds a package lens structure, it is characterised in that In the step S3, white point bisque is white light packaging plastic, and the good white light packaging plastic of trial is mixed by encapsulating white light point gum machine Conjunction carries out dispensing after vacuumizing, toasted after dispensing, and sealing semi-finished product are made.
- 4. the preparation method that EMC upside-down mountings support according to claim 1 adds a package lens structure, it is characterised in that In the step S4, following steps are specifically included：S41：EMC support semi-finished product after coating white point bisque are dehumidified；S42：A layer self-adhered adhesive is sprayed on EMC support semi-finished product, normal temperature is stood；S43：After with special molding, AB silica gel is mixed, molded once by mould heating Molding on compression molding forming machine Package lens, the demoulding；S44：Package lens length of silica gel is roasting, and Molding semi-finished product are made；S45：Divide the cutting of Molding semi-finished product to single, and package handling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610352249.8A CN105810798B (en) | 2016-05-26 | 2016-05-26 | EMC upside-down mounting supports add package lens structure and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610352249.8A CN105810798B (en) | 2016-05-26 | 2016-05-26 | EMC upside-down mounting supports add package lens structure and preparation method thereof |
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| CN105810798B true CN105810798B (en) | 2018-03-02 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106252243A (en) * | 2016-09-09 | 2016-12-21 | 深圳连硕三悠自动化科技有限公司 | A kind of device and method for the encapsulation of bulb-shaped semiconductor components and devices |
| CN107726074A (en) * | 2017-12-02 | 2018-02-23 | 唐先成 | A kind of new E MC supports carry the LED lamp bead of angle control lens |
| CN109411587B (en) * | 2018-12-10 | 2020-11-27 | 浙江单色电子科技有限公司 | Production method of purple light LED containing silica gel lens and purple light LED |
| CN109411459B (en) * | 2018-12-10 | 2023-12-29 | 浙江单色电子科技有限公司 | High-light-power ultraviolet LED lamp tube containing silica gel lens |
| CN110931625A (en) * | 2019-12-24 | 2020-03-27 | 厦门多彩光电子科技有限公司 | LED packaging method |
| CN113451158A (en) * | 2021-04-25 | 2021-09-28 | 福建天电光电有限公司 | Flip chip package structure and manufacturing process thereof |
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Patent Citations (5)
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| CN102185083A (en) * | 2011-04-20 | 2011-09-14 | 莱芜市凤凰新能源科技集团有限公司 | Illuminating light emitting diode (LED) and manufacturing method thereof |
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| CN105810798A (en) | 2016-07-27 |
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