CN203883042U - White LED packaging structure capable of reducing color temperature drifting - Google Patents
White LED packaging structure capable of reducing color temperature drifting Download PDFInfo
- Publication number
- CN203883042U CN203883042U CN201420199055.5U CN201420199055U CN203883042U CN 203883042 U CN203883042 U CN 203883042U CN 201420199055 U CN201420199055 U CN 201420199055U CN 203883042 U CN203883042 U CN 203883042U
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- led chip
- type support
- transparent
- cup type
- glue
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
The utility model discloses a white LED packaging structure capable of reducing color temperature drifting. The white LED packaging structure comprises a cup type support and an LED chip fixed to the support, wherein the LED chip is coated with transparent packaging glue and provided with a transparent sheet, and fluorescent powder glue is packaged above the transparent sheet. According to the packaging structure of the utility model, the LED chip is fixed to the cup type support, the packaging glue coats the LED chip, the transparent sheet is fixed to the LED chip, and the fluorescent powder glue is then packaged on the transparent sheet. The transparent sheet is made of transparent silicon resin or silicone rubber or epoxy resin. The transparent sheet is arranged above the LED chip, and therefore the phenomenon that fluorescent powder is unevenly distributed due to fluorescent powder sedimentation and the thickness of the chip in the white LED packaging process can be eliminated, the color temperature consistency of a white LED is effectively improved, the yield of the white LED is increased, and the process is easy, convenient and easy to achieve.
Description
Technical field
The utility model belongs to photoelectron technology field, relates to a kind of White-light LED package structure.
Background technology
Common white light LEDs technology at present, is that the optical excitation fluorescent material that uses blue chip to produce sends green-yellow light, produces white light with the blue light collocation of LED chip.Fluorescent material generally uses gluing process to be coated on blue-light LED chip, then curing molding.
In solidification process, because fluorescent material proportion is larger, in liquid-packing glue, can there is sedimentation, great changes will take place to the absorption and scattering properties meeting of blue light for phosphor powder layer, and occur white light LED color temperature drift phenomenon.For avoiding colour temperature drift, in the production process of existing surface attaching type (SMD) LED and integrated form (COB) LED, the general method of controlling each technological parameter that adopts, as the standing time after the glue of strict control point, accurately controls curing temperature and curing time etc.But the fluorescent material sedimentation degree of these methods in still can not every batch of white light LEDs product of fine control is consistent, also cannot effectively solve colour temperature drifting problem.Particularly packaging plastic be heated after viscosity diminish suddenly, the sinking speed of fluorescent material is sudden change thereupon also, the color temperature uniformity of white light LEDs is difficult to ensure.
We study discovery, and SMD type is relevant with LED chip thickness with the colour temperature drift phenomenon of COB type LED.LED chip thickness is generally 100 microns to 300 microns left and right, and while solidifying, part fluorescent powder grain can be deposited to the below of chip surface, and the fluorescent powder grain that blue light that chip sides is sent runs into is tailed off, and blue light outgoing increases, and causes colour temperature to raise.If use five surface-emitting type LED chips, this problem is especially outstanding.This phenomenon will cause that the photochromic consistency of white light LEDs product is poor, colour temperature deviation is large, have a strong impact on white light LEDs rate of finished products and photochromic quality.
If phosphor powder layer is made to fluorescent powder membrane, then fluorescent powder membrane is encapsulated together with LED chip, although can avoid the fluorescent material sedimentation phenomenon in solidification process, evenly the complex manufacturing technology of fluorescent powder membrane, can cause again the waste of phosphor material powder when cutting.
Around LED chip, first apply transparent enclosure glue, highly exceed LED chip, packaging plastic applies phosphor powder layer after solidifying again, can avoid fluorescent material to be deposited to the below on LED chip surface.But because the inner chamber of cup type support is little, liquid-packing glue is spill liquid level under capillary effect, after solidifying, can not form horizontal surface.After liquid-packing adhesive curing, volume has contraction, can make surface further recessed.In addition, under capillary effect, after the solder joint on LED chip and connecting line can cause packaging plastic to solidify, surface configuration is out-of-flatness further equally.Apply phosphor gel on out-of-level packaging plastic surface after, fluorescent material skewness and uncontrollable, the illuminant colour coordinate of the white light LEDs encapsulating and the consistency of colour temperature are also very poor.
Utility model content
technical problem:the utility model provides a kind of can eliminate the colour temperature rising problem causing due to fluorescent material sedimentation and LED chip thickness, improves white light LEDs rate of finished products, improves the conforming White-light LED package structure that reduces colour temperature drift of white light LED color temperature.
technical scheme:the White-light LED package structure that reduces colour temperature drift of the present utility model, comprise a glass type support, be fixed on the LED chip of the bottom surface upside of glass type support, cover the transparent sheet and the fluorescent glue that is encapsulated in transparent sheet top of LED chip top, the positive and negative electrode of LED chip is respectively by wire and the corresponding connection of cup type support positive and negative electrode, and LED chip is blue chip.
In the preferred version of the utility model White-light LED package structure, be also coated with transparent packaging plastic between LED chip and transparent sheet, wherein packaging plastic adopts silicones, silicon rubber or epoxy resin.
In the preferred version of the utility model White-light LED package structure, transparent sheet is made by silicones, silicon rubber or epoxy resin.
In the preferred version of the utility model White-light LED package structure, fluorescent glue is made up of fluorescent material and silicones, or is made up of fluorescent material and silicon rubber, or is made up of fluorescent material and epoxy resin.
The White-light LED package structure that reduces colour temperature drift of the present utility model arranges layer of transparent thin slice above LED chip, and fluorescent glue point is coated in transparent sheet top.This encapsulating structure can stop fluorescent material to be deposited to chip surface below, and the phosphor powder layer of LED chip top keeps being uniformly distributed always, can effectively improve the colour temperature consistency of white light LEDs, improves the rate of finished products of white light LEDs.
White-light LED package structure of the present utility model, prepare according to following steps:
1) LED chip is fixed on to the bottom surface upside of glass type support with crystal-bonding adhesive, and is heating and curing;
2) with wire, the positive and negative electrode of LED chip is welded with cup type support positive and negative electrode respectively;
3) at LED chip surface-coated transparent enclosure glue, then cover layer of transparent thin slice, described transparent enclosure glue is silicones, silicon rubber or epoxy resin;
4) above transparent sheet, apply fluorescent glue;
5) by LED chip, transparent sheet, fluorescent glue together with the moulding that is heating and curing of cup type support.
White-light LED package structure of the present utility model is easy to realize, and only need, on the gluing process basis of the SMD of existing maturation type and COB type white light LEDs, increase the operation of placing together transparent sheet, but can effectively alleviate colour temperature drift phenomenon in white light LEDs production.
beneficial effect:the utility model compared with prior art, has the following advantages:
Existing white light LEDs product mainly adopts dispensing technology to encapsulate, spot printing fluorescent glue above blue-ray LED, the gold-tinted that fluorescent material sends and the blue light of transmission composition white light.The illuminant colour coordinate of white light and colour temperature are determined by the relative scale of gold-tinted and blue light.In a glue and solidification process, fluorescent material can sedimentation in liquid-packing glue.Because LED chip has certain thickness, part fluorescent powder grain can be deposited to the below of chip surface, and the blue light of chip sides outgoing is increased, and causes white light LED color temperature to raise.This phenomenon is ubiquity in surface attaching type (SMD) LED and integrated form (COB) LED, causes that the photochromic consistency of product is poor, colour temperature deviation is large, has a strong impact on white light LEDs rate of finished products and photochromic quality.
The utility model, in the encapsulating structure of existing white light LEDs, increases layer of transparent thin slice above LED chip.This transparent sheet can stop fluorescent material to be deposited to the below of LED chip, makes the no longer acute variation of blue light outgoing intensity of LED chip side.Encapsulating structure after improvement can be eliminated in packaging process of white LED the colour temperature rising problem causing due to fluorescent material sedimentation and chip thickness, improves the rate of finished products of white light LEDs, reduces costs, and improves product benefit.
Transparent sheet of the present utility model is previously prepared, and sheet surface is smooth, and the fluorescent material applying is above it evenly distributed, and the white light LEDs of finally making is photochromic evenly, good product consistency.
The utility model, on the gluing process basis of the SMD of existing maturation type and COB type white light LEDs, only increases the operation of placing together transparent sheet, little to existing technogenic influence, also can not increase too much material cost.Thickness to transparent sheet does not also limit, and only need be easy to make, do not affect fluorescent glue gluing process.
Brief description of the drawings
Fig. 1 is the schematic diagram of the utility model White-light LED package structure.
In figure, have: 1.LED chip, 2. crystal-bonding adhesive, 3. wire, 4. glass type support, 5. glass type rack shell, 6. packaging plastic, 7. transparent sheet, 8. fluorescent glue, 9. glass type stent electrode.
Embodiment
Below in conjunction with embodiment and Figure of description, the utility model is further described in detail.
Embodiment 1:
The present embodiment use transparent silicon resin is made transparent sheet 7, makes fluorescent glue 8 with fluorescent material and silicones, as crystal-bonding adhesive 2, uses silicones as packaging plastic 6 with elargol, and for encapsulating the white light LEDs that can reduce colour temperature drift.
Consult Fig. 1, one is improved the conforming White-light LED package structure of colour temperature, LED chip 1 use elargol 2 is fixed on a glass bottom for type support 4, the corresponding connection of positive and negative electrode with cup type support 4 by wire 3 respectively of the positive and negative electrode of LED chip 1, the positive pole that is LED chip 1 is connected with the positive pole of cup type support 4, the negative pole of LED chip 1 is connected with a negative pole for cup type support 4, silicon-coating resin 6 transparent silicon resin thin slice 7 is set above LED chip 1, and transparent silicon resin thin slice 7 tops arrange fluorescent glue 8.
Method for packing is as follows, comprises the following steps:
1) make transparent silicon resin film by even glue method or pressure sintering, then precast undersized in the transparent silicon resin thin slice 7 of the cavity internal diameter of cup type support 4 by the method such as punching press, shearing;
2) take a certain amount of fluorescent material, be added in liquid silicone, stir, vacuumize removal bubble, be made into fluorescent glue 8;
3) apply elargol 2 in cup type support 4 bottoms, by fixing LED chip 1, be heating and curing;
4) with wire 3 by the positive and negative electrode of LED chip 1 respectively with the corresponding connection of positive and negative electrode of cup type support 4;
5) at LED chip 1 surface-coated liquid-transparent silicones 6, then level covers upper prefabricated transparent silicon resin thin slice 7;
6) above transparent silicon resin thin slice 7, apply fluorescent glue 8, height is concordant with cup type support 4.
7) will put into baking oven together with cup type support 4 by LED chip 1, transparent silicon resin thin slice 7, fluorescent glue 8, moulding is heating and curing.
Embodiment 2:
The present embodiment is that use transparent silicon rubber is made transparent sheet 7, makes fluorescent glue 8 with fluorescent material and silicones, as crystal-bonding adhesive 2, uses silicones as packaging plastic 6 with elargol, and for encapsulating the white light LEDs that can reduce colour temperature drift.
Consult Fig. 1, one is improved the conforming White-light LED package structure of colour temperature, LED chip 1 use elargol 2 is fixed on a glass bottom for type support 4, the corresponding connection of positive and negative electrode with cup type support 4 by wire 3 respectively of the positive and negative electrode of LED chip 1, the positive pole that is LED chip 1 is connected with the positive pole of cup type support 4, the negative pole of LED chip 1 is connected with a negative pole for cup type support 4, silicon-coating resin 6 transparent silicon rubber sheet 7 is set above LED chip 1, and transparent silicon rubber sheet 7 tops arrange fluorescent glue 8.
Method for packing is as follows, comprises the following steps:
1) make transparent silicon rubber film by even glue method or pressure sintering, then precast undersized in the transparent silicon rubber sheet 7 of the cavity internal diameter of cup type support 4 by the method such as punching press, shearing;
2) take a certain amount of fluorescent material, be added in liquid silicone, stir, vacuumize removal bubble, be made into fluorescent glue 8;
3) apply elargol 2 in cup type support 4 bottoms, by fixing LED chip 1, be heating and curing;
4) with wire 3 by the positive and negative electrode of LED chip 1 respectively with the corresponding connection of positive and negative electrode of cup type support 4;
5) at LED chip 1 surface-coated liquid-transparent silicones 6, then level covers upper prefabricated transparent silicon rubber sheet 7;
6) above transparent silicon rubber sheet 7, apply fluorescent glue 8, height is concordant with cup type support 4.
7) will put into baking oven together with cup type support 4 by LED chip 1, transparent silicon rubber sheet 7, fluorescent glue 8, moulding is heating and curing.
Embodiment 3:
The present embodiment is that use transparent epoxy resin is made transparent sheet 7, makes fluorescent glue 8 with fluorescent material and silicones, as crystal-bonding adhesive 2, uses silicones as packaging plastic 6 with elargol, and for encapsulating the white light LEDs that can reduce colour temperature drift.
Consult Fig. 1, one is improved the conforming White-light LED package structure of colour temperature, LED chip 1 use elargol 2 is fixed on a glass bottom for type support 4, the corresponding connection of positive and negative electrode with cup type support 4 by wire 3 respectively of the positive and negative electrode of LED chip 1, the positive pole that is LED chip 1 is connected with the positive pole of cup type support 4, the negative pole of LED chip 1 is connected with the negative pole of cup type support 4, silicon-coating resin 6 transparent epoxy resin thin slice 7 is set above LED chip 1, transparent epoxy resin thin slice 7 tops arrange fluorescent glue 8.
Method for packing is as follows, comprises the following steps:
1) make transparent epoxy resin film by even glue method or pressure sintering, then precast undersized in the transparent epoxy resin thin slice 7 of the cavity internal diameter of cup type support 4 by the method such as punching press, shearing;
2) take a certain amount of fluorescent material, be added in liquid silicone, stir, vacuumize removal bubble, be made into fluorescent glue 8;
3) apply elargol 2 in cup type support 4 bottoms, by fixing LED chip 1, be heating and curing; ;
4) with wire 3 by the positive and negative electrode of LED chip 1 respectively with the corresponding connection of positive and negative electrode of cup type support 4;
5) at LED chip 1 surface-coated liquid-transparent silicones 6, then level covers upper prefabricated transparent epoxy resin thin slice 7;
6) above transparent epoxy resin thin slice 7, apply fluorescent glue 8, height is concordant with cup type support 4.
7) will put into baking oven together with cup type support 4 by LED chip 1, transparent epoxy resin thin slice 7, fluorescent glue 8, moulding is heating and curing.
Embodiment 4:
The present embodiment is that use transparent silicon resin is made transparent sheet 7, makes fluorescent glue 8 with fluorescent material and silicones, as crystal-bonding adhesive 2, uses silicones as packaging plastic 6 with anoxybiotic glue, and for encapsulating the white light LEDs that can reduce colour temperature drift.
Consult Fig. 1, one is improved the conforming White-light LED package structure of colour temperature, LED chip 1 use insulating cement 2 is fixed on a glass bottom for type support 4, the corresponding connection of positive and negative electrode with cup type support 4 by wire 3 respectively of the positive and negative electrode of LED chip 1, the positive pole that is LED chip 1 is connected with the positive pole of cup type support 4, the negative pole of LED chip 1 is connected with the negative pole of cup type support 4, silicon-coating resin 6 transparent silicon resin thin slice 7 is set above LED chip 1, transparent silicon resin thin slice 7 tops arrange fluorescent glue 8.
Method for packing is as follows, comprises the following steps:
1) make transparent silicon resin film by even glue method or pressure sintering, then precast undersized in the transparent silicon resin thin slice 7 of the cavity internal diameter of cup type support 4 by the method such as punching press, shearing;
2) take a certain amount of fluorescent material, be added in liquid silicone, stir, vacuumize removal bubble, be made into fluorescent glue 8;
3) apply insulating cement 2 in cup type support 4 bottoms, by fixing LED chip 1, be heating and curing;
4) with wire 3 by the positive and negative electrode of LED chip 1 respectively with the corresponding connection of positive and negative electrode of cup type support 4;
5) at LED chip 1 surface-coated liquid-transparent silicones 6, then level covers upper prefabricated transparent silicon resin thin slice 7;
6) above transparent silicon resin thin slice 7, apply fluorescent glue 8, height is concordant with cup type support 4.
7) will put into baking oven together with cup type support 4 by LED chip 1, transparent silicon resin thin slice 7, fluorescent glue 8, moulding is heating and curing.
Embodiment 5:
The present embodiment is that use transparent silicon resin is made transparent sheet 7, makes fluorescent glue 8 with fluorescent material and silicon rubber, as crystal-bonding adhesive 2, uses silicones as packaging plastic 6 with anoxybiotic glue, and for encapsulating the white light LEDs that can reduce colour temperature drift.
Consult Fig. 1, one is improved the conforming White-light LED package structure of colour temperature, LED chip 1 use insulating cement 2 is fixed on a glass bottom for type support 4, the corresponding connection of positive and negative electrode with cup type support 4 by wire 3 respectively of the positive and negative electrode of LED chip 1, the positive pole that is LED chip 1 is connected with the positive pole of cup type support 4, the negative pole of LED chip 1 is connected with the negative pole of cup type support 4, silicon-coating resin 6 transparent silicon resin thin slice 7 is set above LED chip 1, transparent silicon resin thin slice 7 tops arrange fluorescent glue 8.
Method for packing is as follows, comprises the following steps:
1) make transparent silicon resin film by even glue method or pressure sintering, then precast undersized in the transparent silicon resin thin slice 7 of the cavity internal diameter of cup type support 4 by the method such as punching press, shearing;
2) take a certain amount of fluorescent material, be added in liquid silastic, stir, vacuumize removal bubble, be made into fluorescent glue 8;
3) apply insulating cement 2 in cup type support 4 bottoms, by fixing LED chip 1, be heating and curing;
4) with wire 3, the positive and negative electrode of LED chip 1 is connect with the corresponding connection of positive and negative electrode of cup type support 4 respectively;
5) at LED chip 1 surface-coated liquid-transparent silicones 6, then level covers upper prefabricated transparent silicon resin thin slice 7;
6) above transparent silicon resin thin slice 7, apply fluorescent glue 8, height is concordant with cup type support 4.
7) will put into baking oven together with cup type support 4 by LED chip 1, transparent silicon resin thin slice 7, fluorescent glue 8, moulding is heating and curing.
Embodiment 6:
The present embodiment is that use transparent silicon resin is made transparent sheet 7, makes fluorescent glue 8 with fluorescent material and epoxy resin, as crystal-bonding adhesive 2, uses silicones as packaging plastic 6 with elargol, and for encapsulating the white light LEDs that can reduce colour temperature drift.
Consult Fig. 1, one is improved the conforming White-light LED package structure of colour temperature, LED chip 1 use elargol 2 is fixed on a glass bottom for type support 4, the corresponding connection of positive and negative electrode with cup type support 4 by wire 3 respectively of the positive and negative electrode of LED chip 1, the positive pole that is LED chip 1 is connected with the positive pole of cup type support 4, the negative pole of LED chip 1 is connected with a negative pole for cup type support 4, silicon-coating resin 6 transparent silicon resin thin slice 7 is set above LED chip 1, and transparent silicon resin thin slice 7 tops arrange fluorescent glue 8.
Method for packing is as follows, comprises the following steps:
1) make transparent silicon resin film by even glue method or pressure sintering, then precast undersized in the transparent silicon resin thin slice 7 of the cavity internal diameter of cup type support 4 by the method such as punching press, shearing;
2) take a certain amount of fluorescent material, be added in liquid epoxies, stir, vacuumize removal bubble, be made into fluorescent glue 8;
3) apply elargol 2 in cup type support 4 bottoms, by fixing LED chip 1, be heating and curing;
4) with wire 3 by the positive and negative electrode of LED chip 1 respectively with the corresponding connection of positive and negative electrode of cup type support 4;
5) at LED chip 1 surface-coated liquid-transparent silicones 6, then level covers upper prefabricated transparent silicon resin thin slice 7;
6) above transparent silicon resin thin slice 7, apply fluorescent glue 8, height is concordant with cup type support 4.
7) will put into baking oven together with cup type support 4 by LED chip 1, transparent silicon resin thin slice 7, fluorescent glue 8, moulding is heating and curing.
Embodiment 7:
The present embodiment is that use transparent silicon resin is made transparent sheet 7, makes fluorescent glue 8 with fluorescent material and silicones, as crystal-bonding adhesive 2, uses silicon rubber as packaging plastic 6 with elargol, and for encapsulating the white light LEDs that can reduce colour temperature drift.
Consult Fig. 1, one is improved the conforming White-light LED package structure of colour temperature, LED chip 1 use elargol 2 is fixed on a glass bottom for type support 4, the corresponding connection of positive and negative electrode with cup type support 4 by wire 3 respectively of the positive and negative electrode of LED chip 1, the positive pole that is LED chip 1 is connected with the positive pole of cup type support 4, the negative pole of LED chip 1 is connected with a negative pole for cup type support 4, silicon-coating resin 6 transparent silicon resin thin slice 7 is set above LED chip 1, and transparent silicon resin thin slice 7 tops arrange fluorescent glue 8.
Method for packing is as follows, comprises the following steps:
1) make transparent silicon resin film by even glue method or pressure sintering, then precast undersized in the transparent silicon resin thin slice 7 of the cavity internal diameter of cup type support 4 by the method such as punching press, shearing;
2) take a certain amount of fluorescent material, be added in liquid silicone, stir, vacuumize removal bubble, be made into fluorescent glue 8;
3) apply elargol 2 in cup type support 4 bottoms, by fixing LED chip 1, be heating and curing;
4) with wire 3 by the positive and negative electrode of LED chip 1 respectively with the corresponding connection of positive and negative electrode of cup type support 4;
5) at LED chip 1 surface-coated liquid-transparent silicon rubber 6, then level covers upper prefabricated transparent silicon resin thin slice 7;
6) above transparent silicon resin thin slice 7, apply fluorescent glue 8, height is concordant with cup type support 4.
7) will put into baking oven together with cup type support 4 by LED chip 1, transparent silicon resin thin slice 7, fluorescent glue 8, moulding is heating and curing.
Embodiment 8:
The present embodiment is that use transparent silicon resin is made transparent sheet 7, makes fluorescent glue 8 with fluorescent material and silicones, as crystal-bonding adhesive 2, uses epoxy resin as packaging plastic 6 with elargol, and for encapsulating the white light LEDs that can reduce colour temperature drift.
Consult Fig. 1, one is improved the conforming White-light LED package structure of colour temperature, LED chip 1 use elargol 2 is fixed on a glass bottom for type support 4, the corresponding connection of positive and negative electrode with cup type support 4 by wire 3 respectively of the positive and negative electrode of LED chip 1, the positive pole that is LED chip 1 is connected with the positive pole of cup type support 4, the negative pole of LED chip 1 is connected with a negative pole for cup type support 4, silicon-coating resin 6 transparent silicon resin thin slice 7 is set above LED chip 1, and transparent silicon resin thin slice 7 tops arrange fluorescent glue 8.
Method for packing is as follows, comprises the following steps:
1) make transparent silicon resin film by even glue method or pressure sintering, then precast undersized in the transparent silicon resin thin slice 7 of the cavity internal diameter of cup type support 4 by the method such as punching press, shearing;
2) take a certain amount of fluorescent material, be added in liquid silicone, stir, vacuumize removal bubble, be made into fluorescent glue 8;
3) apply elargol 2 in cup type support 4 bottoms, by fixing LED chip 1, be heating and curing;
4) with wire 3 by the positive and negative electrode of LED chip 1 respectively with the corresponding connection of positive and negative electrode of cup type support 4;
5) at LED chip 1 surface-coated liquid-transparent epoxy resin 6, then level covers upper prefabricated transparent silicon resin thin slice 7;
6) above transparent silicon resin thin slice 7, apply fluorescent glue 8, height is concordant with cup type support 4.
7) will put into baking oven together with cup type support 4 by LED chip 1, transparent silicon resin thin slice 7, fluorescent glue 8, moulding is heating and curing.
Of the present utility model being suitable for is not limited to above-described embodiment.Transparent sheet 7 can be made by any in transparent silicon resin, silicon rubber or epoxy resin, packaging plastic 6 can be selected any in silicones, silicon rubber or epoxy resin, fluorescent glue 8 is made up of any in fluorescent material and silicones, silicon rubber and epoxy resin, and crystal-bonding adhesive 2 can be selected any in elargol or insulating cement.The different choice of transparent sheet 7, packaging plastic 6, fluorescent glue 8 and crystal-bonding adhesive 2 and all applicable technology of collocation.
Claims (4)
1. one kind can be reduced the White-light LED package structure of colour temperature drift, it is characterized in that, this encapsulating structure comprises a glass type support (4), is fixed on the LED chip (1) of the bottom surface upside of described cup type support (4), cover the transparent sheet (7) of described LED chip (1) top and be encapsulated in the fluorescent glue (8) above described transparent sheet (7), the positive and negative electrode of described LED chip (1) is respectively by wire (3) and the corresponding connection of cup type support positive and negative electrode, and described LED chip (1) is blue chip.
2. a kind of White-light LED package structure that reduces colour temperature drift according to claim 1, it is characterized in that, between described LED chip (1) and transparent sheet (7), be also coated with transparent packaging plastic (6), described packaging plastic (6) adopts silicones, silicon rubber or epoxy resin.
3. a kind of White-light LED package structure that reduces colour temperature drift according to claim 2, described transparent sheet (7) is made by silicones, silicon rubber or epoxy resin.
4. according to a kind of White-light LED package structure that reduces colour temperature drift described in claim 1,2 or 3, it is characterized in that, described fluorescent glue (8) is made up of fluorescent material and silicones, or is made up of fluorescent material and silicon rubber, or is made up of fluorescent material and epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420199055.5U CN203883042U (en) | 2014-04-23 | 2014-04-23 | White LED packaging structure capable of reducing color temperature drifting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420199055.5U CN203883042U (en) | 2014-04-23 | 2014-04-23 | White LED packaging structure capable of reducing color temperature drifting |
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| Publication Number | Publication Date |
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| CN203883042U true CN203883042U (en) | 2014-10-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420199055.5U Expired - Fee Related CN203883042U (en) | 2014-04-23 | 2014-04-23 | White LED packaging structure capable of reducing color temperature drifting |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928592A (en) * | 2014-04-23 | 2014-07-16 | 东南大学 | White LED packaging structure capable of reducing color temperature drifting and manufacturing method of white LED packaging structure |
| WO2016078010A1 (en) * | 2014-11-19 | 2016-05-26 | 史伯梅 | Led support frame and led light-emitting unit |
| CN107859891A (en) * | 2017-10-13 | 2018-03-30 | 深圳市乐的美光电股份有限公司 | One kind is without filament LED bulb |
-
2014
- 2014-04-23 CN CN201420199055.5U patent/CN203883042U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928592A (en) * | 2014-04-23 | 2014-07-16 | 东南大学 | White LED packaging structure capable of reducing color temperature drifting and manufacturing method of white LED packaging structure |
| WO2016078010A1 (en) * | 2014-11-19 | 2016-05-26 | 史伯梅 | Led support frame and led light-emitting unit |
| CN107859891A (en) * | 2017-10-13 | 2018-03-30 | 深圳市乐的美光电股份有限公司 | One kind is without filament LED bulb |
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