CN105789079A - 一种位置辅助芯片晶圆映射方法 - Google Patents
一种位置辅助芯片晶圆映射方法 Download PDFInfo
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- CN105789079A CN105789079A CN201610226898.3A CN201610226898A CN105789079A CN 105789079 A CN105789079 A CN 105789079A CN 201610226898 A CN201610226898 A CN 201610226898A CN 105789079 A CN105789079 A CN 105789079A
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- 238000000034 method Methods 0.000 title claims abstract description 69
- 238000013507 mapping Methods 0.000 title claims abstract description 47
- 238000005259 measurement Methods 0.000 claims abstract description 66
- 238000000605 extraction Methods 0.000 claims abstract description 38
- 238000012360 testing method Methods 0.000 claims description 58
- 239000000523 sample Substances 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract description 15
- 238000012545 processing Methods 0.000 description 12
- 238000002372 labelling Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
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- 238000005520 cutting process Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
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Priority Applications (1)
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CN201610226898.3A CN105789079B (zh) | 2016-04-12 | 2016-04-12 | 一种位置辅助芯片晶圆映射方法 |
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CN201610226898.3A CN105789079B (zh) | 2016-04-12 | 2016-04-12 | 一种位置辅助芯片晶圆映射方法 |
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CN105789079A true CN105789079A (zh) | 2016-07-20 |
CN105789079B CN105789079B (zh) | 2018-04-24 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106783681A (zh) * | 2016-12-12 | 2017-05-31 | 北京中电科电子装备有限公司 | 一种标定映射尺寸的方法及装置 |
CN108693456A (zh) * | 2018-04-09 | 2018-10-23 | 马鞍山杰生半导体有限公司 | 一种晶圆芯片测试方法 |
CN112017990A (zh) * | 2019-05-31 | 2020-12-01 | 云谷(固安)科技有限公司 | 选择性移动led芯片的装置及方法、微发光二极管的转移装置及方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110303125A1 (en) * | 2004-11-09 | 2011-12-15 | Hiroshi Itou | Load port and adaptor |
CN103063185A (zh) * | 2012-12-31 | 2013-04-24 | 中国电子科技集团公司第四十五研究所 | 单点确定晶圆测试范围的方法 |
CN103646377A (zh) * | 2013-12-19 | 2014-03-19 | 北京中电科电子装备有限公司 | 一种坐标转换方法及装置 |
-
2016
- 2016-04-12 CN CN201610226898.3A patent/CN105789079B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110303125A1 (en) * | 2004-11-09 | 2011-12-15 | Hiroshi Itou | Load port and adaptor |
CN103063185A (zh) * | 2012-12-31 | 2013-04-24 | 中国电子科技集团公司第四十五研究所 | 单点确定晶圆测试范围的方法 |
CN103646377A (zh) * | 2013-12-19 | 2014-03-19 | 北京中电科电子装备有限公司 | 一种坐标转换方法及装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106783681A (zh) * | 2016-12-12 | 2017-05-31 | 北京中电科电子装备有限公司 | 一种标定映射尺寸的方法及装置 |
CN106783681B (zh) * | 2016-12-12 | 2019-04-26 | 北京中电科电子装备有限公司 | 一种标定映射尺寸的方法及装置 |
CN108693456A (zh) * | 2018-04-09 | 2018-10-23 | 马鞍山杰生半导体有限公司 | 一种晶圆芯片测试方法 |
CN108693456B (zh) * | 2018-04-09 | 2021-07-20 | 马鞍山杰生半导体有限公司 | 一种晶圆芯片测试方法 |
CN112017990A (zh) * | 2019-05-31 | 2020-12-01 | 云谷(固安)科技有限公司 | 选择性移动led芯片的装置及方法、微发光二极管的转移装置及方法 |
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CN105789079B (zh) | 2018-04-24 |
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