CN105702590B - 树脂密封用模具及其制造方法 - Google Patents
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Abstract
树脂密封用模具及其制造方法、以及半导体装置。为了提供低成本制造的树脂密封用模具,不使用雕模放电加工而通过使用圆形刀具的高速旋转切削加工来进行模具的模腔加工,形成第1模腔和第2模腔,成为阶梯状的模腔。
Description
技术领域
本发明涉及树脂密封用模具及其制造方法、以及使用该模具制造的封装体和使用了该封装体的半导体装置。
背景技术
随着近年来便携式电子设备的小型化,所使用的半导体封装体也需要小型化、薄型化的半导体封装体。半导体封装体为了保护所搭载的半导体芯片远离环境空气而需要通过树脂来密封半导体芯片。并且,由于半导体封装体的小型化、薄型化,半导体封装体用树脂密封模具也需要微细化、薄型化。并且,为了削减半导体封装体的制造成本,在半导体封装体制造中使用的引脚框架也需要高密度布局,从而使高密度布局引脚框架用树脂密封模具也需要微细的高精度的模具。
半导体封装体即使被小型化、薄型化,作为半导体的性能也必须提高,因此需要搭载尽可能大的半导体芯片。
要想在半导体封装体中能够搭载尽可能大的半导体芯片,一般使密封树脂的角部呈直角形状。
要想形成用于形成半导体封装体的树脂密封用模具的模腔形状,一般使用通过放电加工来加工模具模腔的方法,该放电加工是通过雕模放电加工机使用了雕模放电加工用电极而进行的。所述的雕模放电加工一定需要雕模放电加工用电极。雕模放电加工用电极设置在雕模放电加工机上并在煤油等绝缘加工液中对模具材料表面断续地进行电弧放电,从而形成模具的模腔形状。雕模放电加工分为粗加工、中加工和精加工多次来进行加工。因此,也需要制作用于粗加工、中加工和精加工的加工用电极。并且,有时由于加工精度和表面粗糙度的追求,会进一步追加加工。并且,不仅在雕模放电加工机中的雕模放电加工时间,雕模放电加工用电极也需要进一步制作,模具的加工时间也会变长。其结果是制造成本变高。
并且,在雕模放电加工中,由于分为粗加工、中加工和精加工多次来进行加工,因此在雕模放电加工用电极的更换或精度有要求的模具的模腔加工的情况下,有时将加工过程中的模具材料从装置取下,并在计测后修正雕模放电加工用电极位置,使模具的模腔的加工时间进一步变长。其结果是模具的模腔加工费用进一步变高。
并且,为了低成本制造半导体封装体,近年来需要高密度布局的引脚框架。高密度布局的引脚框架所使用的树脂密封加工用模具的模腔加工有时由于模具的模腔之间的间隔变窄,雕模放电加工用电极强度不足而不能制作,所以需要将树脂密封模具的模腔雕模放电加工用电极分为多个来进行分割加工。由此模具的模腔加工时间进一步变长。因此相应地模具的费用也变高。
半导体封装体用模具的模腔的加工为了使在雕模放电加工机中使用了雕模放电用电极的雕模放电加工时间变短,提出了通过切削加工来进行模具的模腔加工的一部分,再使用雕模放电加工机来处理精加工的方案。(例如,参照专利文献1)
专利文献1:日本特开第2000-102929号公报
但是,在通过切削加工来进行一部分的加工再通过雕模放电加工进行最终精加工的情况下,在同一装置中无法进行加工。并且,由于需要制作在雕模放电加工机中使用的雕模放电加工用电极,所以模具加工时间不会变得那么快。并且,在雕模放电加工机使用了雕模放电加工用电极的模具的模腔加工中,在加工面上形成梨纹面,在通过半导体封装体用树脂密封模具的加工之后从模具中取出引脚框架时梨纹面变为锚状,可能产生由于脱模不良而导致的树脂裂纹。
发明内容
本发明的目的在于提供一种模具的模腔制造方法,该模具的模腔制造方法缩短了模具的模腔加工时间,在模具的模腔加工面上不会形成在雕模放电加工中形成的梨纹面那样的锚形状。
为了解决上述课题,本发明使用了以下的手段。
首先,本发明提供了一种树脂密封用模具,该模具是半导体芯片的树脂密封用模具,其特征在于,设置在所述模具中的模腔具有:第1模腔,其形成在所述模具的表面;第2模腔,其重叠设置在所述第1模腔的内侧底面;以及阶梯部,其设置在所述第2模腔的上表面周围,所述第1模腔和所述第2模腔的4个角处还具有规定的曲率半径的角部。
并且,本发明提供了一种树脂密封用模具的制造方法,该制造方法是半导体芯片的树脂密封用模具的制造方法,其特征在于,该制造方法包含如下工序:准备模具材料;通过第1圆形刀具对所述模具材料进行高速旋转切削加工来形成第1模腔,并且在所述第1模腔的4个角处形成第1曲率半径的角部;以及通过第2圆形刀具对所述第1模腔的内侧底面进行高速旋转切削加工来形成第2模腔,并且在所述第2模腔的4个角处形成第2曲率半径的角部。
并且,本发明提供了一种半导体装置,该装置是将半导体芯片树脂密封在半导体封装体中而得到的半导体装置,其特征在于,该半导体装置包含:半导体芯片,其载置在基岛上;引脚,其设置在所述基岛的周围附近;导线,其对所述半导体芯片的电极和所述引脚进行电连接;以及密封体,其对所述半导体芯片、基岛、引脚和导线进行了树脂密封,所述密封体是第1密封体和第2密封体的层叠结构。
由于通过使用了本发明的圆形刀具的高速旋转切削加工的模具制造中的模腔加工是通过使用了圆形刀具的切削加工来进行的,所以不需要在雕模放电加工机所进行的雕模放电加工中所需的雕模放电加工用电极,从而缩短了模具的模腔加工时间,能够大幅削减加工成本。
并且,即使是高密度布局引脚框架用模具的制造中的模腔加工,也不需要分割加工,能够制作高精度的模具。
并且,能够进行不用担心由于在使用了雕模放电加工的情况下产生的模具的模腔加工面的梨纹表面而产生的下部凹陷所引起的从树脂密封后的模具脱模时引起的树脂裂纹的产生的模具制造。
附图说明
图1是本发明的半导体封装体用树脂密封模具的立体图。
图2是本发明的半导体封装体用树脂密封模具的俯视图。
图3是本发明的半导体封装体用树脂密封模具的剖视图。
图4是示出本发明的模具的模腔加工的剖视图。
图5是示出接着图4的本发明的模具的模腔加工的剖视图。
图6是示出比较例的模具的模腔加工的剖视图。
图7是使用本发明的模具而进行树脂密封后的半导体封装体的立体图。
图8是使用本发明的模具而进行树脂密封后的半导体封装体的俯视图。
图9是使用本发明的模具而进行树脂密封后的半导体封装体的透视俯视图。
图10是使用本发明的模具而进行树脂密封后的半导体封装体的透视剖视图。
标号说明
1:模具材料、模具;2:第1模腔;2a:第1模腔的角部;3:第2模腔;3a:第2模腔的角部;4:圆形刀具;5:阶梯部;17:第2密封体;18:第1密封体;19:外部引脚;20:导线;21:半导体芯片;22:基岛;23:树脂阶梯。
具体实施方式
以下,根据附图对本发明进行说明。
图1是本发明的半导体封装体用树脂密封模具的立体图。本图是1个半导体芯片的放大图。
模具1中形成有第1模腔2和第2模腔3,该第1模腔2和第2模腔3的形状为半导体封装体的树脂密封形状,在第1模腔2和第2模腔3的各4个角处形成有具有圆形刀具的刀具半径以上的曲率半径的角部2a、3a。并且,在第1模腔2和第2模腔3的内侧面上形成有锥形形状。
图2是从模腔侧看图1的俯视图。第1模腔2比第2模腔3形成得大,俯视来看在第1模腔2的内侧重叠设有第2模腔3。在第1模腔2的4个角处形成有具有圆角的角部2a,在第2模腔3的4个角处也形成有与具有圆角的角部2a同样的角部3a。
图3是沿着连接图2中矩形的模腔的对角的角部的线切断时的剖视图。从作为模具1的模具材料的表面到某深度为止开孔形成第1模腔2,在第1模腔2的下面开孔形成第2模腔3。图中,在第1模腔2的周围的下表面设有阶梯部5,第1模腔2的开孔下表面的宽度比第2模腔3的开孔上表面的宽度大,且各模腔的深度相同,但是也可以改变第1模腔2的深度与第2模腔3的深度的比。
图4是示出本发明的第1模腔的加工的剖视图。通过使用了圆形刀具4、例如立铣刀的高速旋转切削加工在所准备的作为模具1的模具材料上开孔形成第1模腔2。开孔深度优选从与圆形刀具4的刀具直径相等的深度到刀具直径的2倍。圆形刀具的切削侧面带有锥形,该锥形被转印于作为被切削物的模具1中而形成具有锥形侧面的第1模腔2。并且,在第1模腔2的4个角处形成的角部2a具有规定的曲率半径,但是该曲率半径为圆形刀具的刀具半径以上。另外,刀具半径或刀具直径表示带有锥形的圆形刀具的纵向一半的长度在截面中的半径、直径。
图5是示出接着本发明的第1模腔加工的第2模腔加工的剖视图。使圆形刀具4接触比第1模腔2靠内侧的底面,深入开槽而形成第2模腔3。这里使用的圆形刀具4可以与先前的在第1模腔加工中使用的刀具相同,也可以不同。圆形刀具的切削侧面带有锥形,该锥形被转印于作为被切削物的模具1中而形成具有锥形侧面的第2模腔3。并且,在第2模腔3的4个角处形成的角部3a具有规定的曲率半径,但是该曲率半径为圆形刀具的刀具半径以上。
根据以上的2级的切削加工形成了阶梯状的模腔,但是并不限定于2级,根据需要也可以是设有第3级至第n级模腔的多级模腔。
作为比较例,图6中示出了将使用了圆形刀具的高速切削加工进行了1级加工的例子的剖视图。对于圆形刀具4的刀径,当加工深度为刀径的2倍以上时,则切削加工时会对高速旋转的圆形刀具增加作为模具1的模具材料的切削加工负荷,可能引起圆形刀具的破损。半导体封装体的树脂密封模具的模腔是根据引脚框架的布局而加工多个的。多的情况下也有1000个以上。在多个模具的模腔的加工过程中,在圆形刀具4破损的情况下可能会对模具造成损伤。如果为了避免圆形刀具的破损而使刀具半径变大,则会存在如下的问题:4个角的角部的曲率半径也会变得非常大,相对于半导体芯片的大小,树脂密封后的半导体封装体的大小也会变得非常大。
在使用本发明的圆形刀具的高速旋转切削加工中,当设置了模具的模腔用加工机例如NC铣刀的模具材料时,虽然需要进行由于圆形刀具的磨损而导致的圆形刀具的更换,但是在加工结束之前不需要取出工件。并且,在圆形刀具的更换中由于NC铣刀等的机床上搭载有ATC(Auto tool changer:自动刀具更换装置),所以不需要通过人工的更换作业,如果在装置中设置有模具材料和刀具,则按照NC铣刀等加工机的加工精度例如±0.0002mm(±0.2μm)到精加工为止的加工与在雕模放电加工机上使用了雕模放电加工用电极的雕模放电加工相比,能够在短时间内加工出精度好的模具的模腔。
在使用圆形刀具的高速旋转切削加工中,模具的加工面是切削面,没有在雕模放电加工机中通过使用了雕模放电加工用电极的雕模放电加工而形成的梨纹面,是平滑的,在从树脂密封后的成型模具脱模时也能够进行既没有由像梨纹面那样的凹凸形状所导致的下部凹陷的影响也不用担心树脂裂纹产生的半导体封装体的成型。
图7是被使用本发明的模具而制造的半导体封装体树脂密封而得到的半导体装置的立体图,图8是俯视图。与模具形状相对应,密封树脂是在第1密封体18上纵向层叠了第2密封体17的形状。并且,第2密封体17的截面面积比第1密封体18的截面面积小,第1密封体18的外周上表面采用了具有树脂阶梯23的结构。并且,从第1密封体18的侧面露出有外部引脚19。第1密封体18和第2密封体17的4个角的角部具有带有圆角形状而不容易出缺口的特点。图9是透视俯视图,图10是透视剖视图。引脚框架的基岛22上载置有半导体芯片21,基岛22的周围附近设有具有外部引脚19的引脚。引脚和设置在半导体芯片21的表面上的电极经由导线20电连接。并且,它们被第1密封体18和第2密封体17树脂密封。引脚框架的基岛22和引脚被第1密封体18覆盖,连接半导体芯片21的电极和引脚的导线20被第2密封体17覆盖。因此,即便第2密封体17相对于第1密封体18略小,也对树脂密封性没有影响。
以上对以具有2级密封体的半导体封装体为例进行了说明,但本发明并不限于2级密封体,根据需要也可以是具有多级密封体的半导体封装体。
Claims (2)
1.一种树脂密封用模具,其是半导体芯片的树脂密封用的模具,其特征在于,该树脂密封用模具具有:
第1模腔,其形成在所述模具的表面;
第2模腔,其俯视来看重叠设置在所述第1模腔的内侧底面;以及
阶梯部,其设置在所述第2模腔的上表面周围,
在所述第1模腔的4个角和所述第2模腔的4个角处分别具有角部,该角部具有规定的曲率半径,
所述树脂密封用模具具有重叠地依次设置在所述第2模腔的内侧底面的第3至第n级模腔以及设置在所述第3至第n级模腔各自的上表面周围的阶梯部,
在所述第3至第n级模腔各自的4个角处还分别具有角部,该角部具有规定的曲率半径。
2.一种树脂密封用模具的制造方法,该制造方法是半导体芯片的树脂密封用的模具的制造方法,其特征在于,该制造方法包含以下工序:
准备模具材料;
通过第1圆形刀具对所述模具材料进行高速旋转切削加工来形成第1模腔,并且在所述第1模腔的4个角处形成第1曲率半径的角部;
通过第2圆形刀具对所述第1模腔的内侧底面进行高速旋转切削加工来形成第2模腔,并且在所述第2模腔的4个角处形成第2曲率半径的角部;以及
通过第3至第n级圆形刀具对所述第2模腔的内侧底面进行高速旋转切削加工来分别形成第3至第n级模腔,并且在所述第3至第n级模腔各自的4个角处形成第3至第n级曲率半径的角部。
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