CN105668509B - 一种刻蚀微米硅通孔的方法 - Google Patents
一种刻蚀微米硅通孔的方法 Download PDFInfo
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- CN105668509B CN105668509B CN201610061318.XA CN201610061318A CN105668509B CN 105668509 B CN105668509 B CN 105668509B CN 201610061318 A CN201610061318 A CN 201610061318A CN 105668509 B CN105668509 B CN 105668509B
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- silicon chip
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- hole
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 82
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 82
- 239000010703 silicon Substances 0.000 title claims abstract description 82
- 238000005530 etching Methods 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000001035 drying Methods 0.000 claims abstract description 24
- 239000007788 liquid Substances 0.000 claims abstract description 22
- 238000001259 photo etching Methods 0.000 claims abstract description 14
- 238000000151 deposition Methods 0.000 claims abstract description 12
- 238000006243 chemical reaction Methods 0.000 claims abstract description 10
- 230000009977 dual effect Effects 0.000 claims abstract description 10
- 238000004140 cleaning Methods 0.000 claims abstract description 8
- 229910000510 noble metal Inorganic materials 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 7
- 230000008021 deposition Effects 0.000 claims abstract description 5
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 22
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 20
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 18
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 16
- 239000008367 deionised water Substances 0.000 claims description 14
- 229910021641 deionized water Inorganic materials 0.000 claims description 14
- 229910052709 silver Inorganic materials 0.000 claims description 14
- 239000004332 silver Substances 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 11
- 239000010931 gold Substances 0.000 claims description 11
- 229910052737 gold Inorganic materials 0.000 claims description 11
- 229910052757 nitrogen Inorganic materials 0.000 claims description 10
- 229960002163 hydrogen peroxide Drugs 0.000 claims description 8
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 6
- 238000007654 immersion Methods 0.000 claims description 4
- 230000035484 reaction time Effects 0.000 claims description 4
- 238000000861 blow drying Methods 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims description 2
- 238000001459 lithography Methods 0.000 abstract description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 12
- 239000010410 layer Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000005684 electric field Effects 0.000 description 4
- 238000005566 electron beam evaporation Methods 0.000 description 4
- 230000003628 erosive effect Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000003643 water by type Substances 0.000 description 4
- 238000002161 passivation Methods 0.000 description 3
- 230000003197 catalytic effect Effects 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 239000003513 alkali Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00087—Holes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Weting (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
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CN201610061318.XA CN105668509B (zh) | 2016-01-28 | 2016-01-28 | 一种刻蚀微米硅通孔的方法 |
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CN201610061318.XA CN105668509B (zh) | 2016-01-28 | 2016-01-28 | 一种刻蚀微米硅通孔的方法 |
Publications (2)
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CN105668509A CN105668509A (zh) | 2016-06-15 |
CN105668509B true CN105668509B (zh) | 2017-08-01 |
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CN201610061318.XA Active CN105668509B (zh) | 2016-01-28 | 2016-01-28 | 一种刻蚀微米硅通孔的方法 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107658370B (zh) * | 2017-09-14 | 2019-12-13 | 江苏辉伦太阳能科技有限公司 | 一种黑硅mwt背接触电池的制备方法 |
CN111769076B (zh) * | 2020-06-18 | 2022-04-12 | 复旦大学 | 一种用于2.5d封装的tsv转接板及其制备方法 |
CN111785597A (zh) * | 2020-07-23 | 2020-10-16 | 北方夜视技术股份有限公司 | 用于光电倍增管的硅通道板及其制备方法 |
CN115857073B (zh) * | 2023-02-06 | 2023-05-12 | 中国科学院长春光学精密机械与物理研究所 | 一种多焦距曲面微透镜阵列的光阑阵列及其制备方法 |
CN117658058A (zh) * | 2023-12-04 | 2024-03-08 | 广东工业大学 | 硅基宽阵列纳米通孔的制造方法及硅基宽阵列纳米通孔 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101283207A (zh) * | 2005-08-19 | 2008-10-08 | 霍尼韦尔国际公司 | 利用定向硅衬底的深开槽产生新结构 |
CN101759143A (zh) * | 2010-01-15 | 2010-06-30 | 厦门大学 | 一种在硅表面可控生长微纳孔结构的方法 |
CN102556953A (zh) * | 2012-02-16 | 2012-07-11 | 江苏大学 | 一种双面硅纳米线阵列的制备方法 |
CN102956548A (zh) * | 2012-11-09 | 2013-03-06 | 华中科技大学 | 一种电场辅助的硅通孔刻蚀工艺 |
CN102956543A (zh) * | 2011-08-25 | 2013-03-06 | 上海华虹Nec电子有限公司 | 一种硅通孔的制作方法 |
CN103390581A (zh) * | 2013-07-26 | 2013-11-13 | 中微半导体设备(上海)有限公司 | 硅通孔刻蚀方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102856434B (zh) * | 2012-09-04 | 2015-04-22 | 江苏大学 | 一种正方形硅纳米孔阵列的制备方法 |
JP6094239B2 (ja) * | 2013-02-06 | 2017-03-15 | セイコーエプソン株式会社 | シリコン基板の加工方法 |
US9988263B2 (en) * | 2013-08-30 | 2018-06-05 | Hewlett-Packard Development Company, L.P. | Substrate etch |
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2016
- 2016-01-28 CN CN201610061318.XA patent/CN105668509B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101283207A (zh) * | 2005-08-19 | 2008-10-08 | 霍尼韦尔国际公司 | 利用定向硅衬底的深开槽产生新结构 |
CN101759143A (zh) * | 2010-01-15 | 2010-06-30 | 厦门大学 | 一种在硅表面可控生长微纳孔结构的方法 |
CN102956543A (zh) * | 2011-08-25 | 2013-03-06 | 上海华虹Nec电子有限公司 | 一种硅通孔的制作方法 |
CN102556953A (zh) * | 2012-02-16 | 2012-07-11 | 江苏大学 | 一种双面硅纳米线阵列的制备方法 |
CN102956548A (zh) * | 2012-11-09 | 2013-03-06 | 华中科技大学 | 一种电场辅助的硅通孔刻蚀工艺 |
CN103390581A (zh) * | 2013-07-26 | 2013-11-13 | 中微半导体设备(上海)有限公司 | 硅通孔刻蚀方法 |
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CN105668509A (zh) | 2016-06-15 |
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Address after: 310000, room 341, Jin Jun Road, Jianggan District, Hangzhou, Zhejiang, 1114 Patentee after: Huadong medicine (Hangzhou) gene science and Technology Co Ltd Address before: 310000, No. 220, North Ring Road, Xiacheng District, Zhejiang, Hangzhou Patentee before: Huadong medicine (Hangzhou) gene science and Technology Co Ltd |
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Address after: 310000, room 341, Jin Jun Road, Jianggan District, Hangzhou, Zhejiang, 1114 Patentee after: Navigation gene technology (Hangzhou) Co., Ltd. Address before: 310000, room 341, Jin Jun Road, Jianggan District, Hangzhou, Zhejiang, 1114 Patentee before: Huadong medicine (Hangzhou) gene science and Technology Co Ltd |
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Effective date of registration: 20211216 Address after: 518000 g1316, Lianxing building, building B, Yihua new village, district 46, Haifu community, Xin'an street, Bao'an District, Shenzhen, Guangdong Province Patentee after: Pilot medical technology (Shenzhen) Co.,Ltd. Address before: 310000 room 1114, Jin Jun Road, 341 Shui Xiang Road, Jianggan District, Hangzhou, Zhejiang. Patentee before: PILOT GENE TECHNOLOGIES (HANGZHOU) Co.,Ltd. |