CN105629663B - 感光性树脂组合物 - Google Patents

感光性树脂组合物 Download PDF

Info

Publication number
CN105629663B
CN105629663B CN201510812533.4A CN201510812533A CN105629663B CN 105629663 B CN105629663 B CN 105629663B CN 201510812533 A CN201510812533 A CN 201510812533A CN 105629663 B CN105629663 B CN 105629663B
Authority
CN
China
Prior art keywords
resin composition
group
compound
photosensitive resin
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510812533.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN105629663A (zh
Inventor
许槿
罗钟昊
权真
李垠泳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials Korea Ltd
Original Assignee
Rohm and Haas Electronic Materials Korea Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials Korea Ltd filed Critical Rohm and Haas Electronic Materials Korea Ltd
Publication of CN105629663A publication Critical patent/CN105629663A/zh
Application granted granted Critical
Publication of CN105629663B publication Critical patent/CN105629663B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN201510812533.4A 2014-11-21 2015-11-20 感光性树脂组合物 Active CN105629663B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2014-0163483 2014-11-21
KR1020140163483A KR102329586B1 (ko) 2014-11-21 2014-11-21 포지티브형 감광성 수지 조성물 및 이로부터 제조된 경화막

Publications (2)

Publication Number Publication Date
CN105629663A CN105629663A (zh) 2016-06-01
CN105629663B true CN105629663B (zh) 2021-01-15

Family

ID=56044744

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510812533.4A Active CN105629663B (zh) 2014-11-21 2015-11-20 感光性树脂组合物

Country Status (4)

Country Link
JP (1) JP6941416B2 (ja)
KR (1) KR102329586B1 (ja)
CN (1) CN105629663B (ja)
TW (1) TWI702472B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180307141A1 (en) * 2015-11-06 2018-10-25 Rohm And Haas Electronic Materials Korea Ltd. Photosensitive resin composition and cured film prepared therefrom
KR102539889B1 (ko) * 2016-08-11 2023-06-05 동우 화인켐 주식회사 화학증폭형 감광성 수지 조성물 및 이로부터 제조된 절연막
KR102472024B1 (ko) * 2016-10-05 2022-11-30 롬엔드하스전자재료코리아유한회사 감광성 수지 조성물 및 이로부터 제조된 경화막
CN107918249A (zh) * 2016-10-05 2018-04-17 罗门哈斯电子材料韩国有限公司 感光性树脂组合物和由其制备的固化膜
KR20180135375A (ko) * 2017-06-12 2018-12-20 롬엔드하스전자재료코리아유한회사 착색 감광성 수지 조성물 및 이로부터 제조된 차광성 스페이서
KR20190056088A (ko) 2017-11-16 2019-05-24 롬엔드하스전자재료코리아유한회사 감광성 수지 조성물 및 이로부터 제조된 경화막
CN109904212B (zh) * 2019-03-28 2021-07-20 昆山国显光电有限公司 一种有机发光显示面板及其制作方法
CN111607082A (zh) * 2020-06-05 2020-09-01 北京大学 一种低热膨胀系数聚酰亚胺薄膜的制备方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009251538A (ja) * 2008-04-11 2009-10-29 Nippon Zeon Co Ltd 感放射線樹脂組成物
CN101784958A (zh) * 2007-08-24 2010-07-21 东丽株式会社 感光性组合物、由该组合物形成的固化膜、以及具有固化膜的元件
CN101937172A (zh) * 2009-06-29 2011-01-05 Jsr株式会社 正型放射线敏感性组合物、固化膜、层间绝缘膜及其形成方法、显示元件以及硅氧烷聚合物
JP2011253035A (ja) * 2010-06-02 2011-12-15 Toray Ind Inc 感光性シロキサン組成物、それから形成された硬化膜、および硬化膜を有する素子
CN102667625A (zh) * 2009-12-22 2012-09-12 东丽株式会社 正型感光性树脂组合物、由该组合物形成的固化膜及具有固化膜的元件
CN102725692A (zh) * 2010-01-15 2012-10-10 富士胶片株式会社 感光性树脂组合物、固化膜的形成方法、固化膜、有机el显示装置及液晶显示装置
CN103547966A (zh) * 2011-05-20 2014-01-29 日产化学工业株式会社 感光性树脂组合物
CN104011596A (zh) * 2011-12-26 2014-08-27 东丽株式会社 感光性树脂组合物和半导体元件的制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102870047B (zh) * 2010-04-28 2016-03-02 Jsr株式会社 正型感射线性组合物、显示元件用层间绝缘膜及其形成方法
WO2012086370A1 (ja) * 2010-12-24 2012-06-28 株式会社Adeka 感光性樹脂組成物
CN103443707A (zh) * 2011-03-30 2013-12-11 日本瑞翁株式会社 树脂组合物和半导体元件基板
TWI446111B (zh) * 2012-04-20 2014-07-21 Chi Mei Corp 感光性樹脂組成物、黑色矩陣、彩色濾光片及其液晶顯示元件
TWI470359B (zh) * 2012-09-27 2015-01-21 Chi Mei Corp 感光性樹脂組成物、保護膜及具有保護膜的元件
CN103116246B (zh) * 2013-02-27 2016-07-06 村上精密制版（昆山）有限公司 一种感光性树脂组合物及其应用

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101784958A (zh) * 2007-08-24 2010-07-21 东丽株式会社 感光性组合物、由该组合物形成的固化膜、以及具有固化膜的元件
JP2009251538A (ja) * 2008-04-11 2009-10-29 Nippon Zeon Co Ltd 感放射線樹脂組成物
CN101937172A (zh) * 2009-06-29 2011-01-05 Jsr株式会社 正型放射线敏感性组合物、固化膜、层间绝缘膜及其形成方法、显示元件以及硅氧烷聚合物
CN102667625A (zh) * 2009-12-22 2012-09-12 东丽株式会社 正型感光性树脂组合物、由该组合物形成的固化膜及具有固化膜的元件
CN102725692A (zh) * 2010-01-15 2012-10-10 富士胶片株式会社 感光性树脂组合物、固化膜的形成方法、固化膜、有机el显示装置及液晶显示装置
JP2011253035A (ja) * 2010-06-02 2011-12-15 Toray Ind Inc 感光性シロキサン組成物、それから形成された硬化膜、および硬化膜を有する素子
CN103547966A (zh) * 2011-05-20 2014-01-29 日产化学工业株式会社 感光性树脂组合物
CN104011596A (zh) * 2011-12-26 2014-08-27 东丽株式会社 感光性树脂组合物和半导体元件的制造方法

Also Published As

Publication number Publication date
CN105629663A (zh) 2016-06-01
TWI702472B (zh) 2020-08-21
JP2016128901A (ja) 2016-07-14
TW201624135A (zh) 2016-07-01
KR20160061055A (ko) 2016-05-31
JP6941416B2 (ja) 2021-09-29
KR102329586B1 (ko) 2021-11-22

Similar Documents

Publication Publication Date Title
CN105629663B (zh) 感光性树脂组合物
TWI719070B (zh) 感光性樹脂組成物及自其製備之固化膜
CN105652593B (zh) 感光性树脂组合物和由其制备的固化膜
US11106133B2 (en) Positive-type photosensitive resin composition and cured film prepared therefrom
CN109478017B (zh) 感光性树脂组合物及其制备的固化膜
US20230109843A1 (en) Photosensitive resin composition and cured film prepared therefrom
KR20180037888A (ko) 감광성 수지 조성물 및 이로부터 제조된 경화막
JP7416608B2 (ja) ポジ型感光性樹脂組成物及びそれから調製される硬化膜
CN108139671B (zh) 光敏树脂组合物及由其制备的固化膜
KR20230102745A (ko) 포지티브형 감광성 수지 조성물 및 이로부터 제조된 경화막
CN116382030A (zh) 正型光敏树脂组合物和由其制备的固化膜
KR20200083196A (ko) 포지티브형 감광성 수지 조성물 및 이를 이용한 경화막

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant