CN105609463A - 自动旋转固定硅圆片的一体化清洗夹具 - Google Patents

自动旋转固定硅圆片的一体化清洗夹具 Download PDF

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CN105609463A
CN105609463A CN201610051093.XA CN201610051093A CN105609463A CN 105609463 A CN105609463 A CN 105609463A CN 201610051093 A CN201610051093 A CN 201610051093A CN 105609463 A CN105609463 A CN 105609463A
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silicon wafer
integrated cleaning
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CN105609463B (zh
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李金龙
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CETC 24 Research Institute
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Abstract

本发明公开了自动旋转固定硅圆片的一体化清洗夹具，属于半导体制造技术领域，包括硅圆片固定盘，所述硅圆片固定盘上设置有多个不同直径的圆弧夹持圈和用于固定硅圆片的离心压紧装置，所述硅圆片固定盘包括位于其中心的支撑盘、均布在支撑盘四周向外延伸的多个凸棱和设置在凸棱的端部可将所有凸棱连接固定在一起的加强外圈，所述凸棱呈由中心往外级数逐渐增加的台阶结构，所述圆弧夹持圈为连接相邻台阶平面的竖直弧形连接面。本发明通过固定盘及压紧装置可以自动固定硅圆片并进行正面及背面清洗，且可有效地规避夹具偏心、硅圆片被甩出的风险，使上下硅圆片便捷，不需手动固定，降低了人力成本。

Description

自动旋转固定硅圆片的一体化清洗夹具
技术领域
本发明属于半导体制造技术领域，具体涉及一种自动旋转固定硅圆片的一体化清洗夹具。
背景技术
半导体器件的清洗主要采用超声清洗及水汽二流体清洗两种方式，其中，超声清洗对半导体器件有无法确定的损伤，所以在某些领域为禁用或限用工艺；水汽二流体旋转清洗，可有效去除晶圆表面的有机沾污和可动颗粒，因而在半导体制造、封装领域得到了广泛的应用。但在对一些轻、薄、易碎的半导体器件进行水汽二流体清洗时，也存在以下风险：
如硅圆片，具有轻、薄、易碎等特点，在取、放、夹持、旋转等方面，易出现掉落、受应力而碎裂，尤其在需要旋转的场合，更容易因重心偏移、夹持不当、受力过大或不均匀而使其碎裂，具有很大的加工、生产风险。
常见的硅圆片固定方式为背面真空吸附、UV膜粘附、四面向中心施力夹持等方式，但其固定方式均具有背面无法清洗、硅圆片整体承受向中心的应力、旋转易偏心、更换效率低等缺点。
针对上述问题，发明一种夹持可靠、不影响使用的一体化清洗夹具显得尤其重要。
发明内容
有鉴于此，本发明的目的在于提供一种自动旋转固定硅圆片的一体化清洗夹具，可在旋转中自动对硅圆片进行固定，且可同时进行双面清洗，解决了现有技术存在的背面无法清洗、旋转易偏心、更换效率低的问题。
为达到上述目的，本发明提供如下技术方案：
自动旋转固定硅圆片的一体化清洗夹具，包括硅圆片固定盘，所述硅圆片固定盘上设置有多个不同直径的圆弧夹持圈和用于固定硅圆片的离心压紧装置，所述硅圆片固定盘包括位于其中心的支撑盘、均布在支撑盘四周向外延伸的多个凸棱和设置在凸棱的端部可将所有凸棱连接固定在一起的加强外圈，所述凸棱呈由中心往外级数逐渐增加的台阶结构，所述圆弧夹持圈为连接相邻台阶平面的竖直弧形连接面。
进一步，所述离心压紧装置包括设置在所述竖直弧形连接面附近竖直向下的离心杆旋转槽和设置于离心杆旋转槽内的可旋转离心杆。
进一步，所述离心压紧装置还包括旋转销，所述离心杆上设置旋转销孔，所述离心杆旋转槽的两侧壁上设置有旋转销固定槽，所述旋转销穿过所述旋转销孔，两端固定于所述旋转销固定槽上。
进一步，所述硅圆片固定盘上设置有三个直径分别为Φ100.4mm、Φ150.4mm、Φ200.4mm的圆弧夹持圈。
进一步，所述凸棱在每一级台阶平面上设置有弹性支撑柱。
进一步，所述弹性支撑柱采用聚四氟乙烯材料制成。
进一步，所述凸棱共设置八条，相邻凸棱之间的夹角为45°。
进一步，所述离心杆上设置有液体流动孔。
本发明的有益效果在于：
本发明通过均布凸棱结构的固定盘可以实现对硅圆片的背面清洗，且可有效地规避夹具偏心、硅圆片被甩出的风险；通过离心压紧装置自动向中心摆动固定硅圆片，使上下硅圆片便捷，不需人工手动固定；通过多个不同直径的圆弧夹持圈可同时进行多种规格硅圆片的清洗操作，相对于的仅能单个清洗现有技术，大幅提高了生产率和装置的适应能力，降低了使用成本。
本发明的其他优点、目标和特征在某种程度上将在随后的说明书中进行阐述，并且在某种程度上，基于对下文的考察研究对本领域技术人员而言将是显而易见的，或者可以从本发明的实践中得到教导。本发明的目标和其他优点可以通过下面的说明书来实现和获得。
附图说明
为了使本发明的目的、技术方案和有益效果更加清楚，本发明提供如下附图进行说明：
图1为本发明的结构示意图；
图2为图1的A-A剖视图；
图3为图2(去除离心杆后)的局部放大图。
附图标记：
1-硅圆片固定盘；2-圆弧夹持圈；3-支撑盘；4-凸棱；5-加强外圈；6-离心杆旋转槽；7-离心杆；8-旋转销；9-旋转销孔；10-旋转销固定槽；11-弹性支撑柱；12-液体流动孔；13-离心压紧装置。
具体实施方式
下面将结合附图，对本发明的优选实施例进行详细的描述。
如图所示，本实施例中的自动旋转固定硅圆片的一体化清洗夹具，包括硅圆片固定盘1，硅圆片固定盘上设置有多个不同直径的圆弧夹持圈2和用于固定硅圆片的离心压紧装置13，具体的，硅圆片固定盘上设置有三个直径分别为Φ100.4mm、Φ150.4mm、Φ200.4mm的圆弧夹持圈2，可同时对直径分别为Φ100.4mm、Φ150.4mm、Φ200.4mm的硅圆片进行夹持固定，利于提高其适用范围和降低成本，本硅圆片固定盘1包括位于其中心的支撑盘3、均布在支撑盘3四周向外延伸的多个凸棱4和设置在凸棱4的端部可将所有凸棱连接固定在一起的加强外圈5，凸棱4呈由中心往外级数逐渐增加的台阶结构，随着台阶的增加，其厚度也相应增加，相邻台阶平面之间的连接面为竖直弧形面，本实施例的台阶数由支撑盘的中心向往外依次为一级、两级及三级，竖直弧形面的弧形直径随级数的增加而增加，同一直径的竖直弧形面组合形成同一直径的圆弧夹持圈2，夹持同一规格的硅圆片，一级、两级及三级分别对应Φ100.4mm、Φ150.4mm有Φ200.4mm的硅圆片。
本实施例通过均布凸棱结构的固定盘可以实现对硅圆片的背面清洗，且可有效地规避夹具偏心、硅圆片被甩出的风险，也可降低材料成本；通过离心压紧装置旋转过程中自动向中心摆动从而达到固定硅圆片的目的，使上下硅圆片非常便捷，没有人工压夹工序，极大的缩短了装夹时间，同时也避免了压夹过程可能对产品表面带来的损伤；通过多个不同直径的圆弧夹持圈可同时进行多种规格硅圆片的清洗操作，相对于仅能单个清洗的现有技术，大幅提高了生产率和装置的适应能力，降低了使用成本。
进一步，离心压紧装置包括设置在竖直弧形连接面附近竖直向下的离心杆旋转槽6和设置于离心杆旋转槽6内的可旋转离心杆7，离心压紧装置还包括旋转销8，离心杆7上设置旋转销孔9，离心杆旋转槽6的两侧壁上设置有旋转销固定槽10，使用时，将旋转销8穿过离心杆的旋转销孔9，将其两端固定于旋转销固定槽6上，使离心杆7可在离心杆旋转槽6内在旋转离心力的作用下，绕旋转销轴线转动，由原竖直状态变成向中心自动摆动状态，从而固定硅圆片。
进一步，凸棱4在每一级台阶平面上设置有弹性支撑柱11，本实施例的弹性支撑柱11采用聚四氟乙烯材料制成。通过弹性支撑柱11对硅圆片形成点支撑，使凸棱4不与硅圆片接触而影响其背面的清洗效果和质量。
进一步，凸棱4的数量可以根据实际需要进行调整，可以是4-12范围内的任意数值，最好为偶数，本实施例优选为八条，且相邻凸棱4之间的夹角为45°，使硅圆片在各个方向上的受力对称、均匀，对晶圆片的损伤小。
进一步，离心杆上设置有液体流动孔12，通过液体流动孔12液体清洗介质可以更充分的进入硅圆片上，避免清洗死角，利于提高清洗质量。
制作时，硅圆片固定盘1可使用不锈钢块材车削加工，直接成型，同时通过线切割切出离心杆旋转槽，加工方便，制作简单，成本低，目前，该夹具已安全有效地清洗晶圆1500余片，未出现任何损伤。
最后说明的是，以上优选实施例仅用以说明本发明的技术方案而非限制，尽管通过上述优选实施例已经对本发明进行了详细的描述，但本领域技术人员应当理解，可以在形式上和细节上对其作出各种各样的改变，而不偏离本发明权利要求书所限定的范围。

Claims (8)

1.自动旋转固定硅圆片的一体化清洗夹具，包括硅圆片固定盘，其特征在于：所述硅圆片固定盘上设置有多个不同直径的圆弧夹持圈和用于固定硅圆片的离心压紧装置，所述硅圆片固定盘包括位于其中心的支撑盘、均布在支撑盘四周向外延伸的多个凸棱和设置在凸棱的端部可将所有凸棱连接固定在一起的加强外圈，所述凸棱呈由中心往外级数逐渐增加的台阶结构，所述圆弧夹持圈为连接相邻台阶平面的竖直弧形连接面。
2.根据权利要求1所述的自动旋转固定硅圆片的一体化清洗夹具，其特征在于：所述离心压紧装置包括设置在所述竖直弧形连接面附近竖直向下的离心杆旋转槽和设置于离心杆旋转槽内的可旋转离心杆。
3.根据权利要求2所述的自动旋转固定硅圆片的一体化清洗夹具，其特征在于：所述离心压紧装置还包括旋转销，所述离心杆上设置旋转销孔，所述离心杆旋转槽的两侧壁上设置有旋转销固定槽，所述旋转销穿过所述旋转销孔，两端固定于所述旋转销固定槽上。
4.根据权利要求1所述的自动旋转固定硅圆片的一体化清洗夹具，其特征在于：所述硅圆片固定盘上设置有三个直径分别为Φ100.4mm、Φ150.4mm、Φ200.4mm的圆弧夹持圈。
5.根据权利要求1所述的自动旋转固定硅圆片的一体化清洗夹具，其特征在于：所述凸棱在每一级台阶平面上设置有弹性支撑柱。
6.根据权利要求5所述的自动旋转固定硅圆片的一体化清洗夹具，其特征在于：所述弹性支撑柱采用聚四氟乙烯材料制成。
7.根据权利要求1所述的自动旋转固定硅圆片的一体化清洗夹具，其特征在于：所述凸棱共设置八条，相邻凸棱之间的夹角为45°。
8.根据权利要求1所述的自动旋转固定硅圆片的一体化清洗夹具，其特征在于：所述离心杆上设置有液体流动孔。
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