CN105607429A - Exposure apparatus and device manufacturing method - Google Patents
Exposure apparatus and device manufacturing method Download PDFInfo
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- CN105607429A CN105607429A CN201511025090.0A CN201511025090A CN105607429A CN 105607429 A CN105607429 A CN 105607429A CN 201511025090 A CN201511025090 A CN 201511025090A CN 105607429 A CN105607429 A CN 105607429A
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Optical Transform (AREA)
Abstract
Positional information of each of wafer stages (WST1 and WST2) during exposure and during alignment is measured directly under a projection optical system (PL) and directly under a primary alignment system (AL1), respectively, by a plurality of encoder heads, Z heads and the like, which a measurement bar (71) placed below surface plates (14A and 14B) has, using gratings placed on the lower surfaces of fine movement stages (WFS1 and WFS2). Since a main frame (BD) that supports the projection optical system (PL) and the measurement bar (71) are separated, deformation of the measurement bar caused by inner stress (including thermal stress) and transmission of vibration or the like from the main frame to the measurement bar, and the like do not occur, which is different from the case where the main frame and the measurement bar are integrated. Consequently, high-precision measurement of the positional information of the wafer stages can be performed.
Description
The present patent application is that international filing date is that June 21, international application no in 2010 are" PCT/JP2010/060921 ", national applications number are that " 201080027008.7 ", denomination of invention areThe divisional application of the application for a patent for invention of " exposure sources and device making method ".
Technical field
The present invention relates to a kind of exposure sources and device making method, more specifically, relate to via lightSystem and utilize the exposure sources of energy light beam object-exposing, and use the device system of this exposure sourcesMaking method.
Background technology
Traditionally, manufacturing the electricity that element etc. is shown as semiconductor devices (integrated circuit etc.), liquid crystalIn the photoetching treatment of sub-device (microdevice), mainly use as the stepping projection exposure of method repeatedlyApparatus for projection exposure (the so-called scanning of equipment (so-called stepper) or step-scan methodStepper (also referred to as scanner)) etc. exposure sources. This apparatus for projection exposure has microscope carrier dressPut, bearing table device keeps the substrates (being referred to as below wafer) such as wafer or glass plate and along specifyingTwo dimensional surface drives this wafer.
Bearing table device is in order to carry out accurate exposure, and the position of microscope carrier is accurately controlled in requirement, in addition, forImprove the handling capacity of exposing operation, and require the high-speed and high acceleration of microscope carrier. Answer this requirement,Develop in recent years following bearing table device, this bearing table device uses the planar motors of electromagnetic force driving methodControl the position (for example, with reference to patent documentation 1) of wafer in two dimensional surface.
In addition, for example in the 5th embodiment of patent documentation 2, disclose and have: form at platform upper surfaceRecess in the exposure sources of configuration codes device head (encoderhead). In patent documentation 2, retouchIn the exposure sources of stating, by making measuring beam directly be incident on and be positioned over wafer carrier from lower surfaceTwo-dimensional grating on, and accurately measure the positional information of wafer carrier.
But, if by the wafer carrier disclosing in patent documentation 1 have mover and platform have fixedThe planar motors of son is applied to the placement in platform disclosing in the 5th embodiment of patent documentation 2 and compilesThe exposure sources of code device head,, in the time driving wafer carrier, possibility is because acting on the reaction force of platformCause the certainty of measurement of encoder system to reduce.
Reference listing
Patent documentation
[patent documentation 1] United States Patent (USP) the 6th, 437, No. 463
No. 2008/0094594th, [patent documentation 2] U.S. Patent Application Publication
Summary of the invention
According to a first aspect of the invention, provide the first exposure sources, described the first exposure sources warpUtilize energy light beam to expose to object by the optical system of the first support member support, described first exposes to the sunLight device equipment comprises: moving body, described moving body keeps described object, and can along specifyTwo dimensional surface moves; Guide surface forms member, and described guide surface forms member and forms described moving body edgeThe guide surface using when described two dimensional surface and moving; The first drive system, described the first drive systemDrive described moving body; The second supporting member, described the second supporting member with described optical system phaseIn anti-side, form member with described guide surface and place dividually, form member through described guide surface,To separate with described the first supporting member; The first measuring system, described the first measuring system comprises firstMeasure member, described first measures member measuring beam irradiates the measurement parallel with described two dimensional surfaceFace also receives the light from described measurement face, and described the first measuring system utilizes described first to measureThe output of member obtains at least positional information in described two dimensional surface of described moving body, described surveyAmount face is disposed in a place in described moving body and described the second supporting member, and described firstMeasure at least a portion of member and be disposed in another in described moving body and described the second supporting memberA place; And second measuring system, described the second measuring system obtains described the second supporting memberPositional information.
By this equipment, the first measuring system comprises that following first measures member, the first measurement memberAt least a portion is disposed in a place in moving body and the second supporting member, and first measures structureMeasuring beam is radiated at the measurement face that another place in moving body and the second supporting member arranges by partGo up and receive the light from the face of measurement, the first measuring system utilizes the output measurement of the first measurement member to moveKinetoplast is the positional information in the two dimensional surface parallel with measurement face at least. Thereby can suppress moving body weekThe impact of surrounding environment gas variation etc., and accurately measure the position letter of moving body by the first measuring systemBreath. In addition, be furnished with measurement face or first by the second measuring system measurement and measure member at leastThe positional information of the second supporting member of a part. Moreover, owing to forming member through guide surface, andWith the opposition side of optical system, to form member separately from guide surface, and with described first support structureThe mode that part separates is placed the second supporting member, therefore the reaction force of the driving force of reason moving body notAnd reduction certainty of measurement. In addition, different during from the first supporting member and the second supporting member one, noReason internal stress (also comprising thermal stress) causes the second supporting member deforming, and vibration is from firstSupport member is conveyed to the second supporting member etc., and reduces the position letter of the first measuring system measurement moving bodyThe precision of breath.
In this case, so-called guide surface for the orthogonal direction of two dimensional surface on guiding mobileBody, can be contact-type, also can be non-contact type. For example, the bootstrap technique of non-contact type comprises useThe structure of the aerostatic bearings such as air cushion, or use maglev structure etc. In addition, guide surface is notBe confined to guide according to the shape of guide surface the structure of moving body. For example, using gas described aboveIn the structure of the aerostatic bearing of pad, guide surface is formed to the phase his-and-hers watches relative with moving body of memberFace cuts open light and becomes to have excellent planar degree, and non-via the gap of specifying according to the shape of this opposite faceContact guiding moving body. In addition, a part for the motor etc. that uses electromagnetic force is being placed on to guidingFace form member place, and also on moving body, place its part, both work in coordination and generation effectIn with the structure of the power of the orthogonal direction of described two dimensional surface in, the two dimensional surface that utilizes its power specifyingThe position of upper control moving body. For example also comprise following structure: form cloth horizontalization on member at guide surfaceFace motor, and produce and comprise both direction orthogonal in two dimensional surface and and two dimensional surface on moving bodyThe power of the direction of orthogonal direction, does not arrange described aerostatic bearing, and makes moving body non-contact suspensionFloating.
According to a second aspect of the invention, provide the second exposure sources, described the second exposure sources warpUtilize energy light beam to expose to object by the optical system of the first support member support, described second exposes to the sunLight device comprises: moving body, described moving body keeps described object, and can be along the two dimension of specifyingPlanar movement; The second supporting member, places discretely described second with described the first supporting member and supportsMember; The first drive system, moving body described in described the first drive systems; Moving body supports structurePart, described moving body supporting member is placed between described optical system and described the second supporting memberTo separate with described the second supporting member, in the time that described moving body moves along described two dimensional surface, with2 points in the orthogonal direction of the length direction with described the second supporting member of this moving bodySupport described moving body; The first measuring system, described the first measuring system comprises the first measurement member,Described first measures member utilizes measuring beam irradiate the measurement face parallel with described two dimensional surface and connectReceive the light from described measurement face, described the first measuring system is utilized the described first output of measuring memberObtain at least positional information in described two dimensional surface of described moving body, described measurement face is disposed inA place in described moving body and described the second supporting member, and described the first measurement member is extremelyA few part is disposed in another place in described moving body and described the second supporting member, Yi JiTwo measuring systems, described the second measuring system obtains the positional information of described the second supporting member.
By this equipment, the first measuring system comprises the first measurement member, and first measures member at leastA part be disposed in moving body and the second supporting member one upper, first measures member is being arranged inOn measurement face on another in moving body and the second supporting member, irradiate measuring beam and receiveFrom the light of the face of measurement, and the first measuring system utilizes the output of the first measurement member to obtain moving body extremelyFew positional information in the two dimensional surface parallel with measurement face. Thereby can suppress moving body surrounding enviromentThe impact of gas variation etc., and accurately obtain the positional information of moving body by the first measuring system. ThisObtain the measurement face that is furnished with or first and measure at least a portion of member outward, by the second measuring systemThe positional information of the second supporting member. Be placed between optical system and the second supporting member and with secondThe moving body supporting member that supporting member separates, in the time that moving body moves along two dimensional surface, is movingLocate to support moving body at 2 in the orthogonal direction of the length direction with the second supporting member of body.In addition, different during from the first supporting member and the second supporting member one, reason internal stress is not (yetComprise thermal stress) cause the second supporting member deforming, and vibration is conveyed to second from the first supporting memberSupporting member etc., and reduction the first measuring system is measured the precision of the positional information of moving body.
According to a third aspect of the invention we, provide a kind of device producing method, having comprised: use thisAny one of bright first, second exposure sources exposed to object; And the object through exposure is developed.
Brief description of the drawings
Fig. 1 is the structure chart that briefly shows the exposure sources of a kind of embodiment.
Fig. 2 is the plane of the exposure sources of Fig. 1.
Fig. 3 (A) is the side view of observing the exposure sources of Fig. 1 from+Y side, and Fig. 3 (B) is from-XSide is observed the side view (part sectioned view) of the exposure sources of Fig. 1.
Fig. 4 (A) is the plane of the wafer carrier WST1 that comprises of exposure sources, and Fig. 4 (B) is Fig. 4 (A)The end-view of B-B line section, Fig. 4 (C) is the end-view of the C-C line section of Fig. 4 (A).
Fig. 5 is the structure chart that fine motion microscope carrier position measuring system is shown.
Fig. 6 is the I/O relation of the master controller that comprises for the exposure sources of key diagram 1Block diagram.
Fig. 7 illustrates that the wafer to being positioned on wafer carrier WST1 exposes and carries at waferIt on platform WST2, is the state diagram of carrying out wafer replacement.
Fig. 8 illustrates that the wafer to being positioned on wafer carrier WST1 exposes, and to placingWafer on wafer carrier WST2 carries out the state diagram of wafer alignment.
Fig. 9 be illustrate wafer carrier WST2 on platform 14B to the right anxious off-position put (scrumPosition) mobile state diagram.
Figure 10 is the mobile knot that illustrates that wafer carrier WST1 and wafer carrier WST2 put to anxious off-positionThe state diagram of bundle.
Figure 11 illustrates that the wafer to being positioned on wafer carrier WST2 exposes and carries at waferOn platform WST1, carry out the state diagram of wafer replacement.
Figure 12 (A) is the plane that the wafer carrier of variation is shown, Figure 12 (B) is the B of Figure 12 (A)-B line profile.
Specific implementation method
Below, according to Fig. 1 to Figure 11, embodiments of the invention are described.
Fig. 1 briefly shows the structure of the exposure sources 100 of a kind of embodiment. Exposure sources 100 is stepsEnter the apparatus for projection exposure of scan method, it is so-called scanner. As will be described later, this enforcementIn example, be provided with projection optical system PL, below will be flat with the optical axis AX of this projection optical system PLRow direction as Z-direction, in the plane orthogonal with it, will relatively scan graticule andThe direction of wafer is as Y direction, using with Z axis and the orthogonal direction of Y-axis as X-direction,And using the rotation around X-axis, Y-axis and Z axis (inclination) direction respectively as θ x, θ y and θ zDirection, describes.
As shown in Figure 1, exposure sources 100 comprises near be positioned on base 12+Y side endExposure station (exposure-processed region) 200, be positioned on base 12-Y side end near surveyMeasure station (measurement processing region) 300, comprise two wafer carrier WST1, the bearing table device of WST250 and their control system etc. In Fig. 1, in exposure station 200, be provided with wafer carrier WST1,And on wafer carrier WST1, keep wafer W. In addition, in measuring station 300, being provided with wafer carriesPlatform WST2, and on wafer carrier WST2, keep other wafer W.
Exposure station 200 comprises illuminator 10, graticule microscope carrier RST, projecting cell PU and officePortion's liquid-immersion device 8 etc.
For example disclosed in No. 2003/0025890th, U.S. Patent Application Publication etc., illuminator10 comprise: light source; And lamp optical system, lamp optical system has the light integrator of comprisingDeng uniform-illumination optical system and reticle blind etc. (all not shown). Illuminator 10Utilize illumination light (light of exposure) IL with roughly uniformly illumination irradiate reticle blind (also referred to asShielding harness) slot-shaped field of illumination IAR that limit, on graticule R. Illumination light IL asUse argon fluoride (ArF) PRK (wavelength 193nm).
On graticule microscope carrier RST, graticule R has pattern plane (lower surface in Fig. 1),In pattern plane, be formed with circuit pattern etc., for example, utilize vacuum suction to fix graticule R. For example profitBy the graticule microscope carrier drive system 11 (not shown in Fig. 1, with reference to Fig. 6) that comprises linear motor etc.,Can be in scanning direction (in Fig. 1 in paper the Y direction of left and right directions) with the stroke of specifying and refer toFixed sweep speed and drive graticule microscope carrier RST, and also can be at the small driving mark of X-directionLine sheet microscope carrier RST.
Utilize graticule laser interferometer (hereinafter referred to as " graticule interferometer ") 13, and via solidDue to the flexible mirror 15 of graticule microscope carrier RST (in fact arranged have with Y direction justHand over reflecting surface Y flexible mirror (or retroreflector) and have with X-direction orthogonalThe X flexible mirror of reflecting surface), for example detect at any time graticule with the resolution ratio of about 0.25nmThe positional information (comprise the rotation information of θ z direction) of microscope carrier RST in XY plane. GraticuleThe measured value of interferometer 13 is sent to master controller 20 (not shown in Fig. 1, with reference to Fig. 6). SeparatelyOutward, for example No. 2007/083758 (corresponding U.S. Patent Application Publication of PCT International PublicationNo. 2007/0288121) etc. disclosed, also can utilize encoder system to measure graticule microscope carrier RSTPositional information.
United States Patent (USP) the 5th for example, waits for 646, No. 413 and discloses in detail, graticule microscope carrier RST'sTop has configured a pair of reticle alignment system RA that utilizes image processing method1And RA2, eachAlignment system all has imaging device as CCD and by (the illumination in the present embodiment of the light of exposure wavelengthLight IL) as to mutatis mutandis illumination light (in Fig. 1, reticle alignment system RA2At the paper back sideSide is hidden in reticle alignment system RA1Below). On fine motion microscope carrier WFS1 (or WFS2)Measurement plate described later be positioned at projection optical system PL under state under, master controller 20Detect a pair of reticle alignment mark (omission that is formed at graticule R via projection optical system PLGraphic) projected image and measure a pair of the first reference mark (a pair of the first reference mark pair on plateShould be in reticle alignment mark), use a pair of reticle alignment system RA1And RA2According to main controlThis detection that device 20 carries out and detect the projected area of projection optical system PL at the pattern of graticule RRelation between reference position (being the center of a pair of the first reference mark) on center, territory and measurement plate.Reticle alignment system RA1And RA2Detection signal supply via unshowned signal processing systemBe given to master controller 20 (with reference to Fig. 6). In addition, also can not arrange reticle alignment system RA1WithRA2. In this situation, such as No. 2002/0041377th, U.S. Patent Application Publication etc. is disclosed,Following detection system is preferably installed, this detection system have be arranged in micro-travelling carriage described later place thoroughlyLight portion (photodetection portion), to detect the projected image of reticle alignment mark.
In Fig. 1, projecting cell PU is positioned over the below of graticule microscope carrier RST. Via flangeThe FLG of portion and support projection unit PU, this flange part FLG utilizes unshowned supporting member waterMain frame (also referred to as the metrology frame) BD that level land is supported and be fixed on the periphery of projecting cell PUPortion. Main frame BD also can be configured to utilize and arrange antihunting device etc. on described supporting member, keeps awayExempt from from exterior conductive vibration, or avoid conduction vibration to outside. Projecting cell PU comprises lens barrel(barrel) 40 and be held in the projection optical system PL in lens barrel 40. As projection optics beSystem PL, for example use following dioptric system, this dioptric system by along with Z-directionMultiple optical modules (lens subassembly) that parallel optical axis AX arranges form. Projection optical systemPL for example for (telecentric) of the both sides heart far away and have appointment projection multiplying power (for example 1/4 times,1/5 times or 1/8 times etc.). Thereby, when the illumination light IL illumination graticule utilizing from illuminator 10When field of illumination IAR on sheet R, illumination light IL is by graticule R, wherein, and with projection opticsThe first surface (object plane) of system PL is roughly as one man placed the pattern plane of this graticule R. Then,A downscaled images (part for circuit pattern for the circuit pattern of graticule R in the IAR of field of illuminationDownscaled images), be formed at and described photograph via projection optical system PL (projecting cell PU)Region (below also referred to as the exposure area) IA of territory, area pellucida IAR conjugation, region IA is at wafer WUpper, wafer W is placed on second (image surface) side and the wafer of projection optical system PLSurface-coated have photoresist (induction agent). Then, utilize graticule microscope carrier RST and wafer carrierThe synchronous driving of WST1 (or WST2), by making graticule in scanning direction (Y direction)Sheet R is mobile with respect to field of illumination IAR (illumination light IL), and in (Y-axis side, scanning directionTo) on make wafer W mobile with respect to exposure area IA (illumination light IL), carry out on wafer WThe scan exposure of an irradiation area (zoning). By this, the pattern of graticule R is turnedPrint on irradiation area. More specifically, in the present embodiment, utilize illuminator 10 and projected lightSystem PL, and on wafer W, generate the pattern of graticule R, and utilize illumination light IL by crystalline substanceInductive layer (resist layer) exposure on circle W, and on wafer W, form its pattern. In this situationUnder, keep projecting cell PU by main frame BD, and in the present embodiment, utilize respectively viaVibration proof mechanism and be positioned over installed surface (base plate face etc.) multiple (for example three or four) support structurePart carrys out approximate horizontal and supports main frame BD. In addition, vibration proof mechanism is also configurable in each supporting memberAnd between main frame BD. In addition, for example No. 2006/038952nd, PCT International Publication is disclosed, also can be by being positioned over unshowned main frame member or the graticule of projecting cell PU topPedestals etc. support main frame BD (projecting cell PU) to hang mode from above.
Local liquid-immersion device 8 comprises that fluid Supplying apparatus 5, liquid withdrawal system 6 are (in Fig. 1 allNot shown, with reference to Fig. 6) and nozzle unit 32 etc. As shown in Figure 1, via unshowned supportMember and by main frame BD that projecting cell PU etc. is supported to hang mode support nozzle from aboveUnit 32, to surround around the bottom of lens barrel 40, this bottom keeps forming projection optics aroundThe optical element of the most close image planes side (wafer W side) of system PL, in this case, this lightElement is lens (below also referred to as " top lens ") 191. Nozzle unit 32 comprises: liquidThe supply port of Lq and recovery mouthful; Lower surface, lower surface and wafer W are staggered relatively and be furnished with recoveryMouthful; And respectively with feed tube for liquid 31A and liquid recovery tube 31B (all not shown in Fig. 1,With reference to Fig. 2) connect supply stream and reclaim stream. One end of supply pipe (not shown) is connected toFeed tube for liquid 31A, and the other end of supply pipe is connected to fluid Supplying apparatus 5, recovery tube is not (Illustrate) one end be connected to liquid recovery tube 31B, and the other end of recovery tube is connected to liquids recoveryDevice 6.
In the present embodiment, master controller 20 is controlled fluid Supplying apparatus 5 (with reference to Fig. 6), to incite somebody to actionLiquid supply is to the space between top lens 191 and wafer W, and control liquid withdrawal system6 (with reference to Fig. 6), to retrieve the liquid in the space between top lens 191 and wafer W.About this operation, master controller 20 is controlled the amount of liquid supplied with and the amount of liquid of recovery, with on topBetween lens 191 and wafer W, keeping a certain amount of liquid Lq (with reference to Fig. 1) and change at any time shouldLiquid. In the present embodiment, as aforesaid liquid, use transmission argon fluoride excimer laser (wavelengthThe light of 193nm) pure water (refractive index n ≈ 1.44).
Measuring station 300 comprises the alignment device 99 that is arranged in main frame BD. For example United States Patent (USP) ShenPlease disclose No. 2008/0088843 etc. disclosedly, alignment device 99 comprises five shown in Fig. 2Alignment system AL1, AL21～AL24. More specifically, as shown in Figure 2, passing through projecting cellPU center (the optical axis AX of projection optical system PL, and in the present embodiment also with describedIA center, exposure area is consistent) and straight line (hereinafter referred to as the reference axis) LV parallel with Y-axisUpper, place the state of inspection center in the position that separates distance to a declared goal from optical axis AX to-Y side and transferPut main alignment system AL1. Clip main alignment system AL1 and in a side of X-direction and anotherOne side is arranged respectively less important alignment system AL21,AL22And AL23,AL24, wherein, with respect to baseFiducial axis LV roughly places less important alignment system AL2 symmetrically1,AL22And AL23,AL24DetectionCenter. More specifically, five alignment system AL1, AL21～AL24Inspection center along straight lineLa (hereinafter referred to as reference axis) places, and straight line La is in the inspection center of main alignment system AL1Locate vertically to intersect with reference axis LV and be parallel to X-axis. Be noted that to show and comprise five aligningsSystem AL1, AL21～AL24And keep the structure of the holding device (slide block) of these alignment systemsAs the alignment device 99 in Fig. 1. Such as No. 2009/0233234th, U.S. Patent Application Publication etc.Disclosed, less important alignment system AL21～AL24Be fixed on main frame via portable slide blockThe lower surface (with reference to Fig. 1) of frame BD, can utilize unshowned driving mechanism at least in X-directionAdjust the relative position of the surveyed area of secondary alignment system.
In the present embodiment, as each alignment system AL1, AL21～AL24, for example, use imageFIA (field picture is aimed at (the FieldImageAlignment)) system of processing method. For example, at PCTIn No. 2008/056735 grade of International Publication, alignment system AL1, AL2 are disclosed in detail1～AL24Structure. From each alignment system AL1, AL21～AL24Imaging signal via unshownedSignal processing system is supplied to master controller 20 (with reference to Fig. 6).
In addition, exposure sources 100 has the conveyance operation of wafer carrier WST1 being carried out to waferThe first loading position and the second loading position of wafer carrier WST2 being carried out to the conveyance operation of waferPut, but not shown. The in the situation that of the present embodiment, the first loading position is disposed in platform 14ASide, the second loading position is disposed in platform 14B side.
As shown in Figure 1, bearing table device 50 comprises: base 12; Be positioned over one of base 12 topsTo platform 14A, 14B (in Fig. 1, platform 14B is hidden in the paper rear side of platform 14A); ?With on the parallel plane guide surface of XY being formed by the upper surface of a pair of platform 14A, 14B, moveTwo wafer carrier WST1, WST2; Via pipe arrangement, distributing system (following, for easyBe called flexible pipe) Ta2、Tb2(not shown in Fig. 1, with reference to Fig. 2, Fig. 3 (A)) and be connected toWafer carrier WST1, (flexible pipe carrier TCb is in Fig. 1 for flexible pipe carrier TCa, the TCb of WST2Not shown. With reference to Fig. 2, Fig. 3 (A) etc.); And measurement wafer carrier WST1, the position of WST2The measuring system of information etc. Via flexible pipe Ta2、Tb2, and from outside respectively to wafer carrier WST1,WST2 supplies with for the electric power of various sensors, actuator (as motor), for the temperature of actuatorCooling agent that degree is adjusted, for the forced air of air bearing etc. In addition, below also by electric power, useBe called firmly (powerusage) in the merging such as cooling agent, forced air of temperature adjustment. Need trueIn suction gravitation situation, also the strength for vacuum (negative pressure) is included in firmly.
Base 12 is made up of the member with flat profile, and as shown in Figure 1, at base plateOn face 102 via vibration proof mechanism (omit diagram) approximate horizontal ground (being parallel to XY plane earth)Base for supporting 12. In central portion at base 12 upper surfaces about X-direction, as shown in Fig. 3 (A)Ground forms the recess 12a (chase) that the direction parallel with Y-axis extended. In the upper surface side of base 12(but, getting rid of the part that forms recess 12a) accommodates coil unit CU, coil unit CUComprise XY two-dimensional directional as line direction and column direction and multiple coils of rectangular placement. ThisAs shown in Fig. 3 (A) and Fig. 3 (B), below the inner bottom surface of the recess 12a of base 12, hold outward,Have coil unit 18, coil unit 18 comprise XY two-dimensional directional as line direction and column direction andMultiple coils of rectangular placement. Utilizing master controller 20 (with reference to Fig. 6) to control is respectively supplied toForm size of current and the direction of multiple coils of coil unit 18.
As shown in Figure 2, each platform 14A, 14B by from viewed in plan (from top observe) by YDirection of principal axis forms as the member of the rectangular plate shape of length direction, and is positioned over respectively reference axis LV's-X side and+X side. Platform 14A and platform 14B be with respect to reference axis LV symmetry, and at XDirection of principal axis is every placing with a little interval. By by each upper surface (+Z of platform 14A, 14BThe face of side) cut open light, make the upper surface of platform there is very high flatness, the upper surface of platform canWith performance wafer carrier WST1, WST2 drawing in Z-direction during respectively along XY planar movementThe function of guide face. Or, also can adopt following configuration: utilize planar motors described later to carry waferPlatform WST1, the power of WST2 effect Z direction, makes wafer carrier WST1, and WST2 is at platformThe upper magnetic suspension of 14A, 14B. The in the situation that of the present embodiment, owing to having used the structure of planar motorsThereby can not use aerostatic bearing, therefore as described in, need not improve on platform 14A, 14BThe flatness on surface.
As shown in Figure 3, platform 14A, 14B are via unshowned air bearing (or rolling bearing)And be supported on the upper surface 12b of two side portions of the recess 12a of base 12.
Platform 14A, 14B have respectively: Part I 14A1、14B1, Part I 14A1、14B1Respectively there is the tabular of thinner thickness, at Part I 14A1、14B1Upper surface form above-mentionedGuide surface; And respectively at this Part I 14A1、14B1Lower surface, integratedly fixingThe tabular Part II 14A thick and X-direction size is short2、14B2. The First of platform 14ADivide 14A1+ X side end is from Part II 14A2+ X side end face stretch out in a little+X side,The Part I 14B of platform 14B1-end of X side is from Part II 14B2-end of X sideStretch out in a little-X of face side. But, configuration, not in being confined to above-mentioned configuration, also can adopt not clothPut the configuration of stretching out.
At Part I 14A1、14B1Each inside accommodate coil unit (omission icon), lineCoil unit comprises XY two-dimensional directional as line direction and column direction and multiple lines of rectangular placementCircle. Utilize master controller 20 (with reference to Fig. 6) to control and be supplied to respectively and form the many of each coil unitThe size of current of individual coil and direction.
At the Part II 14A of platform 14A2Inside (bottom) accommodate the two-dimensional directional by XYAs line direction and column direction and rectangular placement and by multiple permanent magnets (and unshowned yoke)The magnet unit MUa forming, with the coil unit of upper surface side corresponding to being contained in base 12CU. Together with the coil unit CU of magnet unit MUa and base 12, configuration example is as United States Patent (USP) ShenPlease disclose No. 2003/0085676 etc. disclosure electromagnetic force (Lorentz force) driving method by putting downThe platform drive system 60A (with reference to Fig. 6) that face motor forms. Platform drive system 60A produces willThree degree of freedom direction (the driving force that X, Y, θ z) drive of platform 14A in XY plane.
Similarly, at the Part II 14B of platform 14B2Inside (bottom), accommodate by multiplePermanent magnet (and unshowned yoke) form magnet unit MUb, magnet unit MUb withThe coil unit CU of base 12 forms platform drive system 60B (with reference to Fig. 6) together, and platform drivesMoving system 60B is by the plane horse that platform 14B is driven to the three degree of freedom direction in XY planeReach formation. In addition, form each platform drive system 60A, the coil unit of the planar motors of 60BAnd the modes of emplacement of magnet unit, also can be contrary with the situation of above-mentioned (moving-magnetic type) (at base side toolThere is magnet unit, there is the moving-coil type of coil unit in platform side).
Utilize the first and second position of platform measuring system 69A that for example comprise encoder system, 69B(with reference to Fig. 6) obtains respectively the three degree of freedom direction of (measurement) platform 14A, 14B independentlyPositional information. First and second position of platform measuring system 69A, each output of 69B is supplied toMaster controller 20 (with reference to Fig. 6), master controller 20 uses (foundation) position of platform measuring system69A, the output of 69B is controlled to be supplied to and is formed platform drive system 60A, the coil unit of 60BThe size of current of each coil and direction, and control according to need in each XY plane of platform 14A, 14BThe position of three degree of freedom direction. Master controller 20 is described later anti-in platform 14A, 14B performanceWhen the function of agent (CounterMass), in order to make platform 14A, 14B moving from reference positionMomentum, in specified scope, uses (foundation) position of platform measuring system 69A, the output of 69B,And via platform drive system 60A, 60B drives platform 14A, 14B so that platform 14A, 14BTurn back to the reference position of platform. That is, platform drive system 60A, 60B is as fine setting motor (TrimMotor)。
First and second position of platform measuring system 69A, the structure of 69B there is no concrete restriction, for exampleCan use a kind of encoder system, in this encoder system, encoder head be disposed at base 12 (orAt Part II 14A2、14B2Configuration codes device head configures scale on base 12), encoderHead is by being positioned over Part II 14A2、14B2Each lower surface scale (Scale) (for exampleTwo-dimensional grating) the upper reverberation (from the diffraction light of two-dimensional grating) that irradiates measuring beam and utilize acquisitionObtain the position letter of the three degree of freedom direction in (measurement) platform 14A, each XY plane of 14BBreath. In addition, also can utilize for example optical interferometer system, or combined light interferometer system and encoderThe measuring system of system and obtain the positional information of (measurement) platform 14A, 14B.
As shown in Figure 2, one of wafer carrier, i.e. wafer carrier WST1, comprises and keeps wafer WFine motion microscope carrier (also referred to as platform) WFS1 and surround the rectangle frame of the surrounding of fine motion microscope carrier WFS1The coarse motion microscope carrier WCS1 of shape. As shown in Figure 2, another wafer carrier, i.e. wafer carrier WST2,Comprise the square that keeps the fine motion microscope carrier WFS2 of wafer W and surround the surrounding of fine motion microscope carrier WFS2Shape frame shape coarse motion microscope carrier WCS2. From Fig. 2, recognize, except with respect to wafer carrier WST1Outside the state configuration of left and right reversion, wafer carrier WST2 comprises that entire infrastructure is identical, comprises and drivingMoving system and position measuring system etc. Therefore, below adopting wafer carrier WST1 is that masterpiece is saidBright, only in the time being necessary to illustrate especially, just explain about wafer carrier WST2.
Coarse motion microscope carrier WCS1, as shown in Fig. 4 (A), has by being spaced apart from each other in Y direction and putting downRow place, respectively the member of the cubic using X-direction as length direction and form a pair ofCoarse motion slide section 90a, 90b; And by the cubic using Y direction as length direction respectivelyMember forms, and at one end of Y direction and the other end be coupled a pair of coarse motion slide section 90a, 90bA pair of coupling component 92a, 92b. , coarse motion microscope carrier WCS1 is formed in central portion and hasRectangular box-like through the rectangular aperture portion of Z-direction.
As shown in Fig. 4 (B) and Fig. 4 (C), in each inside (bottom) of coarse motion slide section 90a, 90bAccommodate magnet unit 96a, 96b. Magnet unit 96a, 96b corresponding to be contained in platform 14A,The Part I 14A of 14B1、14B1Each inner coil unit, and by by XY two dimensionDirection is as line direction and column direction and multiple magnet of rectangular placement form. Magnet unit 96a,Together with the coil unit of 96b and platform 14A, 14B, configuration example is as U.S. Patent Application PublicationWait the coarse motion microscope carrier drive system 62A (with reference to Fig. 6) disclosing, coarse motion microscope carrier No. 2003/0085676Drive system 62A is by the electricity that can produce in six-freedom degree direction driving force to coarse motion microscope carrier WCS1The planar motors of magnetic force (Lorentz force) driving method forms. In addition, similarly, utilize wafer to carryMagnet unit and platform 14A, 14B that the coarse motion microscope carrier WCS2 (with reference to Fig. 2) of platform WST2 hasCoil unit, form the coarse motion microscope carrier drive system 62B (with reference to Fig. 6) that formed by planar motors.In this case, because the masterpiece of Z-direction is used for coarse motion microscope carrier WCS1 (or WCS2),Therefore magnetic suspension on platform 14A, 14B. Thereby do not need instructions for use compared with the gas of high manufacturing accuracyBody hydrostatic bearing, therefore does not need to improve the flatness of platform 14A, 14B upper surface yet.
In addition, the coarse motion microscope carrier WCS1 of the present embodiment, WCS2 is only coarse motion slide section 90a, 90bThere is the structure of the magnet unit of planar motors, but be not limited to this, also can with coupling component 92a,92b places magnet unit together. In addition, drive coarse motion microscope carrier WCS1, the actuator of WCS2 is notBe limited to the planar motors of electromagnetic force (Lorentz force) driving method, also can use for example VR to driveThe planar motors of moving method etc. In addition, coarse motion microscope carrier WCS1, the driving direction of WCS2 is not limited toSix-freedom degree direction can be only also for example three degree of freedom direction (X, Y, the θ in XY planeZ). In this case, for example can utilize aerostatic bearing (for example air bearing) to make coarse motion microscope carrierWCS1, WCS2 suspends on platform 14A, 14B. In addition, in the present embodiment, although movingThe planar motors of magnetic-type is used as coarse motion microscope carrier drive system 62A, 62B, but be not limited to this, alsoCan use and on platform, place magnet unit and on coarse motion microscope carrier, place the DYN dynamic of coil unitPlanar motors.
Coarse motion slide section 90a-side of Y side and coarse motion slide section 90b+side of Y sideFace, is fixed with respectively the guiding elements of bringing into play guiding function in the time of small driving fine motion microscope carrier WFS194a, 94b. As shown in Fig. 4 (B), guiding elements 94a is L by the section extending in X-directionThe member of word shape forms, and its lower surface flushes placement with the lower surface of coarse motion slide section 90a. Although drawLead member 94b symmetrical with respect to guiding elements 94a, but structure is identical and modes of emplacement is identical.
In the inside (bottom surface) of guiding elements 94a, accommodate a pair of with appointed interval in X-directionCoil unit CUa, CUb (with reference to Fig. 4 (A)), coil unit CUa, CUb comprise respectively byXY two-dimensional directional is as line direction and column direction and multiple coils of rectangular placement. In addition, drawingThe inside (bottom) of leading member 94b accommodates a coil unit CUc (with reference to Fig. 4 (A)), lineCoil unit CUc comprises XY two-dimensional directional as line direction and column direction and rectangular placement manyIndividual coil. Utilize master controller 20 (with reference to Fig. 6) to control and be supplied to and form coil unit CUa～CUcSize of current and the direction of each coil.
Coupling component 92a, 92b are formed hollow, accommodate therein for supplying with firmly extremelyUnshowned piping-member and the Wiring construction element etc. of fine motion microscope carrier WFS1. Also can be at coupling component 92aAnd/or the inside of 92b holds various optical components (for example spatial image measuring instrument, uneven illuminationEven measuring instrument, illuminance monitor, wavefront aberration measuring instrument etc.).
In this case, utilize the planar motors that forms coarse motion microscope carrier drive system 62A, at platformOn 14A, follow acceleration and deceleration and in the time that Y direction drives wafer carrier WST1 (for example, at exposure station200 and measuring station 300 between while moving), platform 14A utilizes anti-that wafer carrier WST1 drivesThe effect of active force, according to so-called action-reaction law (law of conservation of momentum), and and brilliantThe direction that circle microscope carrier WST1 is contrary drives. In addition, also can utilize platform drive system 60A at YDirection of principal axis produces driving force, and forms the state that does not meet described action-reaction law.
In addition, when drive wafer carrier WST2 in Y direction on platform 14B time, platform14B also utilizes the effect of the reaction force of the driving force of wafer carrier WST2, does according to what is calledAction-reaction law (law of conservation of momentum), and drive in the direction contrary with wafer carrier WST2.That is, the function of platform 14A, 14B performance reaction thing, by wafer carrier WST1, WST2 andThe momentum of all systems forming of platform 14A, 14B gives conservation, and does not produce gravity motion. CauseThis, not reason wafer carrier WST1, WST2 occur in moving of Y direction platform 14A,The problem of the inclined to one side load of the upper effect of 14B etc. In addition, about wafer carrier WST2, also can utilize platformDrive system 60B produces driving force in Y direction, does not meet described effect reaction calmly and formThe state of rule.
In addition, utilize wafer carrier WST1, WST2 is at the reaction force of the driving force of X-directionEffect, the function of platform 14A, 14B performance reaction thing.
As shown in Fig. 4 (A) and Fig. 4 (B), fine motion microscope carrier WFS1 comprises: be rectangle by viewed in planMember and the main part (mainsection) 80 that forms, be fixed on main part 80+Y sideA pair of fine motion slide section 84a, the 84b of side and be fixed on main part 80-side of Y sideFine motion slide section 84c.
Main part 80 with coefficient of thermal expansion compared with little material as formed with pottery or glass etc., at its endIt is under the state on same plane that face is positioned at the bottom surface of coarse motion microscope carrier WCS1, utilizes coarse motion microscope carrierWCS1 supports with cordless. Main part 80, for weight reduction, also can form hollow. SeparatelyOutward, the bottom surface of main part 80 can be not also same plane with the bottom surface of coarse motion microscope carrier WCS1.
Be placed with the crystalline substance that utilizes vacuum suction etc. and keep wafer W in the upper face center of main part 80Circle retainer (not shown). In the present embodiment, for example use the protuberance (flange part) in ring-typeThe crystalline substance of the so-called pin chuck method of multiple support portions (branching rod element) of interior formation supporting wafer WJustify retainer, become the another side (back side) of the wafer holder of wafer placed side in one side (surface)Side is arranged two-dimensional grating RG described later etc. In addition, wafer holder also can with fine motion microscope carrier WFS1(main part 80) forms, also can be via quiet for example electric chuck (Chuck) mechanism or clamp(Cramp) maintaining body of mechanism etc. and be releasably fixed to main part 80. In this case, lightGrid RG is disposed in the rear side of main part 80. In addition, wafer holder also can utilize adhesiveDeng being fixed to main part 80. As shown in Fig. 4 (A), on the upper surface of main part 80, plate 82 quiltsBe attached on the outside of wafer holder (put area of wafer W), wherein, the central authorities of plate 82Place forms than the circular open of the large circle of wafer W (wafer holder) and has corresponding to main part80 rectangular-shaped profile (profile). In the present embodiment, the surface of plate 82 for example comprise by metal,The substrate of the formation such as pottery or glass and be formed at the film of the liquid-repellant material of its substrate surface. Liquid repellentProperty material (liquid-repellentmaterial) for example comprises PFA (tetrafluoroethene-perfluoro alkaneBase vinyl ethers co-polymer (Tetrafluoroethylene-perfluoroalkylvinyletherCopolymer)), PTFE (high molecular weight ptfe (Polytetrafluoroethylene)), ironFluorine dragon (registration mark) etc. The material that forms in addition film also can be propylene base system resin, silicon is resin.In addition, whole plate 82 also can be by PFA, PTFE, Teflon (registration mark), propylene base system treeFat and silicon are at least one of resin and forming. In the present embodiment, the upper surface of plate 82 is to liquidThe contact angle of Lq for example exceedes 90 degree. Also implement same refusing on aforesaid coupling component 92b surfaceLiquefaction is processed.
Plate 82 is fixed in the upper surface of main part 80, make plate 82 surperficial whole (orA part) and the surface of wafer W be the same face. In addition the surface of plate 82 and wafer W and front,The surface of stating coupling component 92b is roughly positioned on the same face. In addition, plate 82+X side and+Near the conglobate opening of the shape corner of Y side, in this opening roughly to become with the surface of wafer WSeamlessly place and measure plate FM1 for the state of the same face. Form at the upper surface of measuring plate FM1Have and utilize respectively described a pair of reticle alignment system RA1,RA2(with reference to Fig. 1, Fig. 6) and detectA pair of the first reference mark and utilize main alignment system AL1 and the second reference mark of detecting(all not shown). As shown in Figure 2, on the fine motion microscope carrier WFS2 of wafer carrier WST2, inPlate 82-X side and+corner of Y side near, roughly to become the same face with the surface of wafer WState be fixed with the measurement plate FM2 same with measuring plate FM1. In addition, also plate 82 can be pacifiedBe loaded on the mode of fine motion microscope carrier WFS1 (main part 80), for example change into and fine motion microscope carrier WFS1Be integrally formed wafer holder, in the peripheral region of the encirclement wafer holder of fine motion microscope carrier WFS1The upper surface of (with plate 82 the same areas (also can comprise the surface of measuring plate)) is implemented liquid repellent processing,And formation liquid repellent face.
As shown in Fig. 4 (B), at the lower surface central portion of the main part 80 of fine motion microscope carrier WFS1, withIts lower surface is positioned at and roughly (the unlikely ratio of lower surface of plate on the same face of other parts (peripheral part)Peripheral part protrudes from below) state, cover the wafer holder (placement of wafer W and placeRegion) and measure plate FM1 (or being measurement plate FM2) in the situation that of fine motion microscope carrier WFS2The laminal plate of the big or small designated shape of degree. In the one side (upper surface (or lower surface)) of plateBe formed with two-dimensional grating RG (being designated hereinafter simply as grating RG). Grating RG comprises with X-directionFor the reflection-type diffraction grating (X diffraction grating) of cycle direction and taking Y direction as cycle sideTo reflection-type diffraction grating (Y diffraction grating). This plate for example utilizes glass and forms grating RGFor example with the spacing of 138nm～4 μ m, for example, engrave the scale of diffraction grating and do with 1 μ m spacingBecome. In addition, the whole lower surface that grating RG also can main body covered portion 80. In addition, for gratingThe kind of the diffraction grating of RG, except mechanicalness forms ditch etc., for example, also can be in sense optically-activeProperty resin on sintering disturb line and producing. In addition, the structure of laminal plate need not be confined to above-mentioned knotStructure.
As shown in Fig. 4 (A), a pair of fine motion slide section 84a, 84b are summary pros in plan viewThe tabular component of shape, and main part 80+side of Y side, in X-direction with distance to a declared goalSeparate placement. Fine motion slide section 84c is elongated rectangular in X-direction in plan viewTabular component, and be positioned at and fine motion slide section 84a, 84b with the one end at its length direction and the other endCenter is roughly the state on the parallel straight line of same Y-axis, be fixed on main part 80-Y sideSide.
A pair of fine motion slide section 84a, 84b are supported by aforesaid guiding elements 94a respectively, and fine motion is slidingThe directed member 94b of the 84c of piece portion supports. More specifically, fine motion microscope carrier WFS carries with respect to coarse motionPlatform WCS, not support at collinear three places.
In each inside of fine motion slide section 84a～84c, corresponding to the guiding of coarse motion microscope carrier WCS1Coil unit CUa～CUc that member 94a, 94b have, accommodate by using XY two-dimensional directional asMultiple permanent magnets (and unshowned yoke) of line direction and column direction and rectangular placement formMagnet unit 98a, 98b, 98c. Magnet unit 98a together with coil unit CUa, magnet listThe 98b of unit is together with coil unit CUb, and magnet unit 98c is together with coil unit CUc, respectivelyWhat configuration example disclosed as U.S. Patent Application Publication waits for No. 2003/0085676 can be at X, Y, Z axis sideTo three planar motors of driving method of electromagnetic force (Lorentz force) that produce driving force, utilize thisThree planar motors form by fine motion microscope carrier WFS1 six-freedom degree direction (X, Y, Z, θ x,The fine motion microscope carrier drive system 64A (with reference to Fig. 6) that θ y and θ z) drive.
In wafer carrier WST2, also form similarly the coil being had by coarse motion microscope carrier WCS2The magnet unit that unit and fine motion microscope carrier WFS2 have and three planar motors forming, and utilizeThese three planar motors form by fine motion microscope carrier WFS2 six-freedom degree direction (X, Y, Z,The fine motion microscope carrier drive system 64B (with reference to Fig. 6) that θ x, θ y and θ z) drive.
Fine motion microscope carrier WFS1 can X-direction along X-direction extend guiding elements 94a,94b moves the stroke longer than other five free degree directions. This is equally applicable to fine motion microscope carrier WFS2.
Utilize above structure, fine motion microscope carrier WFS1 can be with respect to coarse motion microscope carrier WCS1 at sixFree degree direction moves. In addition, in this case, the anti-work that utilizes fine motion microscope carrier WFS1 to driveEffect firmly, sets up with aforementioned same action-reaction law (law of conservation of momentum). Have moreBody ground, the function of the reaction thing of coarse motion microscope carrier WCS1 performance fine motion microscope carrier WFS1, coarse motion carriesPlatform WCS1 drives in the direction contrary with fine motion microscope carrier WFS1. Fine motion microscope carrier WFS2 and coarse motionMicroscope carrier WCS2 has similarity relation.
In addition, in the present embodiment, master controller 20 is by fine motion microscope carrier WFS1 (or WFS2)Follow acceleration and deceleration and (for example in exposure, carry out between irradiation area in the time that X-direction increases drivingWhen step-by-step operation etc.), utilize the planar motors that forms coarse motion microscope carrier drive system 62A (or 62B)And in X-direction, drive fine motion microscope carrier WFS1 (or WFS2). In addition, simultaneously via coarse motionMicroscope carrier drive system 62A (or 62B) give coarse motion microscope carrier WCS1 (or WCS2) drive inThe unidirectional initial velocity of fine motion microscope carrier WFS1 (or WFS2) (by coarse motion microscope carrier WCS1 (orWCS2) drive in the same direction of fine motion microscope carrier WFS1 (or WFS2)). By this, make coarse motionMicroscope carrier WCS1 (or WCS2) brings into play the function of so-called reaction thing, and can shorten coarse motion microscope carrierWCS1 (or WCS2) follows the movement of fine motion microscope carrier WFS1 (or SFW2) in X-directionThe reaction force of driving force (result from) and displacement round about. Particularly carry in fine motionPlatform WFS1 (or WFS2) comprises the operation of moving to the stepping of X-direction, i.e. fine motion is carriedPlatform WFS1 (or WFS2) carries out alternatively repeatedly to the operation feelings of acceleration and the deceleration of X-directionUnder condition, can make in the movement of coarse motion microscope carrier WCS1 (or WCS2) required about X-directionStroke for the shortest. In this case, master controller 20 also can will comprise that fine motion microscope carrier and coarse motion carryThe center of gravity of wafer carrier WST1 (or WST2) whole system of platform is carried out constant speed in X-directionThe initial velocity of motion is given coarse motion microscope carrier WCS1 (or WCS2). Utilize this operation, coarse motion carriesPlatform WCS1 (or WCS2) is using the position of fine motion microscope carrier WFS1 (or WFS2) as benchmark,And move back and forth in the scope of specifying. Therefore, coarse motion microscope carrier WCS1 (or WCS2) is at XAxial shift motion, need only have in the scope of its appointment, add some edges distanceCan. For example in No. 2008/0143994 grade of U.S. Patent Application Publication, disclosed about this in detailThin content.
In addition, as aforementioned, because fine motion microscope carrier WFS1 utilizes coarse motion microscope carrier WCS1 not existCollinear three places support, and therefore master controller 20 utilizes suitable control example as micro-in acted on respectivelyThe driving force (thrust) of the Z-direction of the 84a～84c of movable slider portion, can (revolve according to angle arbitrarilyThe amount of turning) make fine motion microscope carrier WFS1 (being wafer W) with respect to XY plane in θ x and/or θ y sideTo inclination. In addition, master controller 20 utilize for example make fine motion slide section 84a, 84b act on respectively+The driving force of θ x direction (counter clockwise direction of the paper of Fig. 4 (B)), and make fine motion slide section 84cThe driving force of effect-θ x direction (clockwise direction of the paper of Fig. 4 (B)), can make fine motion microscope carrierThe central portion of WFS1 is in+Z direction bending (one-tenth convex). In addition, though master controller 20 for exampleFine motion slide section 84a, act on respectively-θ of 84b y ,+θ y direction (are observed from+Y side respectivelyFor turning left, turning right) driving force, the central portion that still can make fine motion microscope carrier WFS1+Z direction is curvedBent (one-tenth convex). Master controller 20 also can be carried out similar operations to fine motion microscope carrier WFS2.
In addition, in the present embodiment, fine motion microscope carrier drive system 64A, 64B use moving-magnetic typePlanar motors, but be not limited to this, also can use in the fine motion slide section of fine motion microscope carrier and place coilUnit and the moving-coil type planar motors of placing magnet unit on the guiding elements of coarse motion microscope carrier.
As shown in Fig. 4 (A), at coupling component 92a and the fine motion microscope carrier WFS1 of coarse motion microscope carrier WCS1Main part 80 between a pair of flexible pipe 86a, 86b are installed, for being supplied to from outside coupling structurePart 92a firmly conducts to fine motion microscope carrier WFS1. In addition, the each Tu Jun that comprises Fig. 4 (A) economizes sketch mapShow, but in fact a pair of flexible pipe 86a, 86b are respectively and utilize many flexible pipes to form. Each flexible pipeOne end of 86a, 86b is connected in coupling component 92a's+side of X side, the other end respectively viaHave from the end face of-X side the+length institute shape of directions X to specify at the upper surface of main part 80The a pair of recess 80a (with reference to Fig. 4 (C)) of the designated depth becoming and be connected in the inside of main part 80.As shown in Fig. 4 (C), flexible pipe 86a, 86b are configured at the upper surface of fine motion microscope carrier WFS1 outstandingIn top. As shown in Figure 2, at coupling component 92a and the fine motion microscope carrier WFS2 of coarse motion microscope carrier WCS2Main part 80 between, a pair of flexible pipe 86a, 86b are also installed, for being supplied to coupling from outsideThat closes member 92a firmly conducts to fine motion microscope carrier WFS2.
In the present embodiment, due to fine motion microscope carrier drive system 64A, 64B uses three of moving-magnetic typeIndividual planar motors, therefore conducts between coarse motion microscope carrier and fine motion microscope carrier via flexible pipe 86a, 86bExerting oneself beyond electric power. In addition, also can replace flexible pipe 86a, 86b, adopt for example PCT and change intoStructure, method that No. 2004/100237th, International Publication discloses, with non-contact method at coarse motion microscope carrierAnd between fine motion microscope carrier, conduction is exerted oneself.
As shown in Figure 2, one of flexible pipe carrier, flexible pipe carrier TCa is via flexible pipe Ta2And connectIn piping-member, the Wiring construction element of the coupling component 92a inside of coarse motion microscope carrier WCS1. As Fig. 3 (A)Shown in, flexible pipe carrier TCa be positioned over base 12-rank portion that the end of X side forms on.Flexible pipe carrier TCa utilizes the actuator of linear motor etc. in the portion of the rank of base 12, and follows waferMicroscope carrier WST1 drives in Y direction.
As shown in Fig. 3 (A), another flexible pipe carrier, flexible pipe carrier TCb be positioned over base 12+In the rank portion that the end of X side forms, and be connected in coarse motion microscope carrier WCS2 via flexible pipe Tb2Piping-member, the Wiring construction element (with reference to Fig. 2) of coupling component 92a inside. Flexible pipe carrier TCbThe actuator that utilizes linear motor etc. in the portion of the rank of base 12, exists and follow wafer carrier WST2Y direction drives.
As shown in Fig. 3 (A), flexible pipe Ta1,Tb1One end be connected to respectively flexible pipe carrier TCa, TCb,Flexible pipe Ta1,Tb1The other end be connected to and (be for example arranged on outside unshowned firmly feedwayPower supply, air drain, compressor or vavuum pump etc.). From feedway firmly via flexible pipe Ta1Be supplied toFlexible pipe carrier TCa exerts oneself, via flexible pipe Ta2, be contained in the coupling structure of coarse motion microscope carrier WCS1Unshowned piping-member, Wiring construction element and flexible pipe 86a, the 86b of part 92a, and be supplied to fine motionMicroscope carrier WFS1. Similarly, from feedway firmly via flexible pipe Tb1And be supplied to flexible pipe carrierTCb exerts oneself, via flexible pipe Tb2, be contained in the coupling component 92a of coarse motion microscope carrier WCS2Unshowned piping-member, Wiring construction element and flexible pipe 86a, 86b and be supplied to fine motion microscope carrier WFS2.
Next, just measure wafer carrier WST1, the measuring system of the positional information of WST2 is saidBright. Exposure sources 100 has: measure fine motion microscope carrier WFS1, the fine motion of the positional information of WFS2Microscope carrier position measuring system 70 (with reference to Fig. 6) and measure coarse motion microscope carrier WCS1, WCS2 eachThe coarse motion microscope carrier position measuring system 68A of positional information, 68B (with reference to Fig. 6).
Fine motion microscope carrier position measuring system 70 has the measuring stick 71 shown in Fig. 1. As Fig. 3 (A) and figureShown in 3 (B), measuring stick 71 is positioned over each Part I 14A of a pair of platform 14A, 14B1、14B1Below. As shown in Fig. 3 (A) and Fig. 3 (B), measuring stick 71 is length direction by Y directionSection rectangle beam-like element form. Be placed with in the inside (bottom) of measuring stick 71 comprise manyThe magnet unit 79 of individual magnet. Magnet unit 79 forms measurement together with aforesaid coil unit 18Bar drive system 65 (with reference to Fig. 6), this measuring stick drive system 65 is by can be by measuring stick 71 sixThe planar motors of electromagnetic force (Lorentz force) driving method that individual free degree direction drives forms.
Produce+Z direction of the planar motors of measuring stick 71 utilization formation measuring stick drive systems 65Driving force, and floating support (contactless support) is on base 12. Measuring stick 71+Z sideHalf portion (first half) is positioned over each Part II 14A of platform 14A, 14B2、14B2MutuallyBetween ,-Z side half portion (Lower Half) is contained in the recess 12a forming in base 12.In addition, between each of measuring stick 71 and platform 14A, 14B and base 12, be formed with appointmentPlay, is each mechanicalness contactless state.
Measuring stick drive system 65 can be configured to avoid the external disturbance by back plate vibration etc. to conduct toMeasuring stick 71. The in the situation that of the present embodiment, because can make planar motors produce driving of Z-directionPower, carrys out control survey bar 71 so can utilize measuring stick drive system 65 to eliminate the mode of disturbingCope with interference. In addition, cannot act on Z-direction in measuring stick drive system 65 to measuring stick 71The situation of power under, for example also can utilize in measuring stick drive system, be arranged on via vibration proof mechanismBase plate side install member (coil unit 18 or magnet unit 79), with prevent vibration etc. outsideDisturb. But, this structure is not intended to be construed as limiting.
Utilize the material that coefficient of thermal expansion is lower (such as invar or pottery etc.) to form measuring stick 71.In addition, the shape of measuring stick 71 is not subject to concrete restriction. For example section also can be circle (cylindric)Or trapezoidal or triangle. In addition also not necessarily utilize, the long element shape of bar-shaped or beam-like element etc.Become measuring stick.
Measuring stick 71+Y side and-to form viewed in plan be square to each upper surface of Y side endThe recess of shape, and in its recess, embed respectively laminal plate (with reference to Fig. 2 and the 3rd (B) figure),The surface of this plate is formed with two-dimensional grating RGa, RGb (being designated hereinafter simply as grating RGa, RGb),Two-dimensional grating RGa, RGb comprise the reflection-type diffraction grating (X of X-direction as cycle directionDiffraction grating) and Y direction as the reflection-type diffraction grating (Y diffraction grating) of cycle direction.Plate for example utilizes glass and forms, and grating RGa, RGb have same the spreading out with aforementioned grating RGPenetrate the spacing of grating, and form similarly.
In this case, as shown in Fig. 3 (B), be fixed with Z axis at the lower surface of main frame BDDirection is as a pair of supporting member 74a, the 74b of hanging from above of length direction. A pair of hang from above supporting member 74a,Each of 74b is for example made up of cylindrical component, and it is upper that its one end (upper end) is fixed on main frame BD,And the other end (lower end) via specify play and be positioned over measuring stick 71 grating RGa,RGb respectively relatively. Accommodate in it in a pair of each bottom of hanging supporting member 74a, 74b from abovePortion for example with No. 2007/083758 (corresponding U.S. Patent Application Publication of PCT International PublicationNo. 2007/0288121) etc. the encoder head of disclosure same comprise light source, Photodetection system (bagDraw together photoelectric detector) and the encoder head of the diffraction interference type that forms through blocking of various optical systemA pair of head unit 50a, 50b.
Each of a pair of head unit 50a, 50b has the one-dimensional coding device head of measuring for X-direction(being designated hereinafter simply as X head) and the one-dimensional coding device head of measuring for Y direction (are designated hereinafter simply asY head) (all not shown).
The X head and the Y head that belong to head unit 50a irradiate measuring beam on grating RGa, and profitWith receiving respectively from the X diffraction grating of grating RGa, the diffraction light of Y diffraction grating, by head listThe measuring center of the 50a of unit is benchmark, and measures respectively measuring stick 71 (grating RGa) in X-axis sideTo and the positional information of Y direction.
Similarly, the X head and the Y head that belong to head unit 50b irradiate measuring beam on grating RGb,And utilize and receive respectively from the X diffraction grating of grating RGb, the diffraction light of Y diffraction grating,Be benchmark by the measuring center of head unit 50b, exist and measure respectively measuring stick 71 (grating RGb)The positional information of X-direction and Y direction.
In this case, because being fixed on support projection unit PU, head unit 50a, 50b (throwShadow optical system PL) the position relationship of main frame BD be certain hang from above supporting member 74a,The inside of 74b, therefore, the measuring center of head unit 50a, 50b and main frame BD and projected lightThe position relationship of system PL is fixed. Therefore using the measuring center of head unit 50a, 50b as baseThe accurate X-direction of measuring stick 71 and the positional information of Y direction, respectively with by main frame BD(on datum mark) is as the X-direction of measuring stick 71 and the positional information of Y direction of benchmarkOf equal value.
More specifically, utilize a pair of Y head that belongs to respectively head unit 50a, 50b to form main frameBD (on datum mark) measures a pair of Y of measuring stick 71 in the position of Y direction as benchmarkLinear encoder, and utilize a pair of X head that belongs to respectively head unit 50a, 50b to form main frameBD (on datum mark) measures a pair of X of measuring stick 71 in the position of X-direction as benchmarkLinear encoder.
Each survey of a pair of X head (x-ray encoder) and a pair of Y head (Y linear encoder)Value is supplied to master controller 20 (with reference to Fig. 6), and master controller 20 is according to a pair of Y uniform encondingThe mean value of the measured value of device calculate measuring stick 71 to main frame BD (on datum mark) in Y-axisThe relative position of direction, and the mean value of the measured value of a pair of x-ray encoder of foundation, calculate surveyGauge rod 71 is the relative position in X-direction to main frame BD (on datum mark). In addition, mainController 20 is poor according to each measured value of a pair of x-ray encoder, calculates measuring stick 71 and existsThe position (Z axis rotation amount around) of θ z direction.
In addition, each of head unit 50a, 50b for example has the light using with CD drive unit etc.Learn the Z head (omitting graphic) of the shift sensor of the same optical profile type of pick device. Particularly,Head unit 50a has two Z heads placing at X-direction interval, and head unit 50b has oneZ head. Three Z heads are positioned over not at collinear three places. Three Z heads form following table tableFace position measuring system, this surface location measuring system is forming grating RGa, the RGb of measuring stick 71The upper measurement light that is parallel to Z axis that irradiates in plate surface (or forming surface of reflection-type diffraction grating)Bundle, receives by the reverberation of the surface of plate (or forming surface of reflection-type diffraction grating) reflection, willHead unit 50a, 50b (measurement datum) are as benchmark, and measurement is in the measurement of each point of irradiationThe surface location (position of Z-direction) of bar 71. Master controller 20 is according to the measurement of three Z headsValue calculates the Z-direction of the measuring stick 71 using main frame BD (measurement datum) as benchmarkPosition and the rotation amount of θ x, θ y direction. In addition. As long as Z head is positioned over not together alwaysThree places of line, placement location is not limited to this, for example, also can place three Z at a side head unitHead. In addition, for example also can utilize the optical interferometer system that comprises optical interferometer to measure measuring stick 71Surface position information. In this case, also can by for make optical interferometer irradiate measuring beam withThe isolated pipe (anti-variation pipe) of surrounding enviroment gas (for example air) is fixed on and hangs supporting member from above74a, 74b. In addition, the quantity of each encoder head of X, Y, Z is not limited to above-mentioned example,For example also can further increase the quantity of encoder head and optionally use encoder head.
In the exposure sources 100 of the present embodiment, utilize above-mentioned many that head unit 50a, 50b haveIndividual encoder head (x-ray encoder, Y linear encoder) and Z head (surface location measuring system)The measuring stick position measuring system 67 (with reference to Fig. 6) forming, measuring stick position measuring system 67 is measuredMeasuring stick 71 is the relative position in six-freedom degree direction with respect to main frame BD. Master controller 20According to the measured value of measuring stick position measuring system 67, measure at any time measuring stick 71 with respect to main frameThe relative position of BD, and control survey bar drive system 65, with measuring stick 71 and main frame BDThe mode of the unlikely change of relative position (form integratedly with measuring stick 71 and main frame BDThe position of control survey bar 71 similarly).
As shown in Figure 5, in measuring stick 71, arrange the first gage outfit group 72 and the second gage outfit group73, the position of the fine motion microscope carrier (WFS1 or WFS2) below measurement is positioned at projecting cell PUWhen information, use the first gage outfit group 72, the fine motion microscope carrier below measurement is positioned at alignment device 99When the positional information of (WFS1 or WFS2), use the second gage outfit group 73. In addition for easySeparate graphicly, in Fig. 5, represent alignment system AL1, AL2 with dotted line (2 chain lines)1～AL24。In addition, Fig. 5 is with regard to alignment system AL21～AL24Symbol omit icon.
As shown in Figure 5, the first gage outfit group 72 is positioned over the below of projecting cell PU, and comprisesFor X-direction measure one-dimensional coding device head (being designated hereinafter simply as X head or encoder head) 75x,The a pair of one-dimensional coding device head (being designated hereinafter simply as Y head or encoder head) of measuring for Y direction75ya, 75yb and three Z 76a, 7b6,76c.
X 75x, a Y 75ya, 75yb and three Z 76a～76c are with its invariant positionState and be positioned over the inside of measuring stick 71. It is upper that X 75x is positioned over reference axis LV, Y 75ya,75yb X 75x-X side and+X side interval same distance and placing respectively. The present embodimentThree encoder head 75x, 75ya, 75yb, for example use respectively and PCT International Publication theNo. 2007/083758 (No. 2007/0288121st, corresponding U.S. Patent Application Publication) etc. is disclosedEncoder head same by light source, Photodetection system (comprising photoelectric detector) and various optical systemSystem gives blocking and the head of the diffraction interference type that forms.
Each X 75x, a Y 75ya, 75yb are in wafer carrier WST1 (or WST2) positionUnder projection optical system PL (with reference to Fig. 1) time, via platform 14A and platform 14BBetween space, or be formed at the printing opacity of each Part I of platform 14A, 14B 14A1,14B1Portion's (for example opening), is radiated at fine motion microscope carrier WFS1 (or WFS2) lower surface by measuring beamThe grating RG (with reference to Fig. 4 (B)) placing. Moreover, each X 75x, a Y 75ya, 75ybReceive the diffraction light from grating RG, and obtain fine motion microscope carrier WFS1 (or WFS2) at XYPositional information (also comprising the rotation information of θ z direction) in plane. More specifically, use gratingThe X diffraction grating that RG has is measured the position of fine motion microscope carrier WFS1 (or WFS2) in X-directionThe X a putting 75x, forms x-ray encoder 51 (with reference to Fig. 6). In addition, use grating RGY diffraction grating measure fine motion microscope carrier WFS1 (or WFS2) in one of the position of Y directionTo Y 75ya, 75yb, form a pair of Y linear encoder 52,53 (with reference to Fig. 6). X headEach measured value of 75x, a Y 75ya, 75yb is supplied to master controller 20 (with reference to Fig. 6), mainController 20 uses the measured value of (foundation) X 75x to measure fine motion microscope carrier WFS1 (or WFS2)In the position of X-direction, and survey according to the mean value of the measured value of an a pair of Y 75ya, 75ybAmount (calculating) fine motion microscope carrier WFS1 (or WFS2) is in the position of Y direction. In addition master control,Device 20 processed uses each measured value of a pair of Y linear encoder 52,53, and measures (calculating)Fine motion microscope carrier WFS1 (or WFS2) is in the position of θ z direction (rotation amount around Z axis).
In this case, the point of irradiation (inspection of the measuring beam irradiating from X 75x on grating RGMeasuring point) consistent with the exposure position at exposure area IA (with reference to Fig. 1) center on wafer W. ThisOutward, the contrast of the measuring beam irradiating from an a pair of Y 75ya, 75yb respectively on grating RGThe center of exit point (test point), with the measuring beam irradiating from X 75x on grating RGPoint of irradiation (test point) is consistent. Master controller 20 is according to the measurement of two Y 75ya, 75ybValue on average calculate the positional information of fine motion microscope carrier WFS1 (or WFS2) in Y direction. Thereby,Irradiating in irradiation area (exposure area) the IA center of the illumination light IL of wafer W in factThe positional information of fine motion microscope carrier WFS1 (or WFS2) in Y direction measured at exposure position place. MoreParticularly, the substantive measuring center of the measuring center of X 75x and two Y 75ya, 75ybConsistent with exposure position. Therefore, master controller 20 is by using x-ray encoder 51 and Y lineProperty encoder 52,53, can be at any time under exposure position (back side) carry out fine motion microscope carrier WFS1The survey of (or WFS2) positional information (comprising the rotation information of θ z direction) in XY planeAmount.
Z 76a～76c for example uses the optic pick-up using with CD drive unit etc. sameOptical profile type shift sensor head. Three Z 76a～76c are positioned over and isosceles triangle (or positive threeDihedral) position corresponding to each summit. Each Z 76a～76c to fine motion microscope carrier WFS1 (orWFS2) lower surface irradiates the measuring beam parallel with Z axis from below, and receives from being formed with lightThe reverberation of plate surface (or forming surface of the reflection-type diffraction grating) reflection of grid RG. By this, eachIndividual Z 76a～76c is formed in the surface of each point of irradiation measurement fine motion microscope carrier WFS1 (or WFS2)The surface location measuring system 54 (with reference to Fig. 6) of position (position of Z-direction). Three Z headsEach measured value of 76a～76c is supplied to master controller 20 (with reference to Fig. 6).
In addition, by the measuring beam irradiating from three Z 76a～76c respectively on grating RGThree points of irradiation are as the center of gravity of the isosceles triangle (or equilateral triangle) on summit, on wafer WThe exposure position at exposure area IA (with reference to Fig. 1) center consistent. Therefore, master controller 20 is complied withAccording to the mean value of the measured value of three Z 76a～76c, can under exposure position, get at any timeObtain the positional information (surface position information) of fine motion microscope carrier WFS1 (or WFS2) in Z-direction.In addition, master controller 20 uses the measured value of (foundation) three Z 76a～76c, adds fine motionMicroscope carrier WFS1 (or WFS2), in the position of Z-direction, measures (calculating) θ x direction and θThe rotation amount of y direction.
The second gage outfit group 73 has: the X head that forms x-ray encoder 55 (with reference to Fig. 6)77x, form a pair of Y linear encoder 56,57 (with reference to Fig. 6) a pair of Y 77ya, 77yb,And three Z 78a, 78b, the 78c of formation surface location measuring system 58 (with reference to Fig. 6).Each of a pair of Y 77ya, 77yb using X 77x as benchmark and three Z 78a～78cPosition relationship, with a pair of Y 75ya, 75yb using a described X 75x as benchmark and threeEach position relationship of Z 76a～76c is identical. The measuring beam irradiating from X 77x is at gratingPoint of irradiation (test point) on RG, consistent with the inspection center of main alignment system AL1. ,The substantive measuring center of the measuring center of X 77x and two Y 77ya, 77yb is with mainly rightThe inspection center of Barebone AL1 is consistent. Therefore, master controller 20 can be at any time with main alignment systemThe position letter of fine motion microscope carrier WFS2 (or WFS1) in XY plane measured by the inspection center of AL1Breath and surface position information.
In addition, although the X of the present embodiment 75x, 77x and Y 75ya, 75yb, 77ya,Each light source, Photodetection system (comprising photoelectric detector) with blocking in 77ybAnd various optical systems (all not shown on figure) be placed on the inside of measuring stick 71, Bu GuobianThe structure of code device head is not limited to this. For example also light source and Photodetection system can be positioned over to measuring stickOutside. In this situation, also can for example interconnect the inner optical system of placing of measuring stick via optical fiber etc.Unify light source and Photodetection system. In addition, also can adopt following structure: encoder head is positioned overThe outside of measuring stick, only guides to light by measuring beam via being positioned over the optical fiber of measuring stick insideGrid. In addition, also can use a pair of x-ray encoder to measure (in this case, as long as a YLinear encoder) wafer is at the rotation information of θ z direction. In addition, also can for example make to use up dryRelate to instrument and measure the surface position information of fine motion microscope carrier. In addition, also can replace the first gage outfit group 72And each head of the second gage outfit group 73, and will at least comprise each one by X-direction and Z-directionAs the XZ encoder head of direction of measurement, and using Y direction and Z-direction as direction of measurementThree encoder heads of total of YZ encoder head be arranged to and described X head and an a pair of Y phaseSame placement location.
In addition, also can measuring stick 71 be divided into multiple. For example also may be partitioned into and there is the first measurementHead group 72 part, and there is the second gage outfit group's 73 part, various piece (measuring stick) willMain frame BD (measurement datum) is as benchmark, detects and the relative position of main frame BD,And be certain by its position relationship control. In this case, also can be two of each several part (measuring stick)End is arranged head unit 50a, 50b, and calculate position and the θ of each several part (measuring stick) in Z-directionThe rotation amount of x, θ y direction.
Between exposure station 200 and measuring station 300, move on platform 14A at wafer carrier WST1When moving, coarse motion microscope carrier position measuring system 68A (with reference to Fig. 6) measures coarse motion microscope carrier WCS1 (crystalline substanceCircle microscope carrier WST1) positional information. The structure of coarse motion microscope carrier position measuring system 68A there is no toolBody limits, and comprise encoder system or optical interferometer system (also optical interferometer system capable of being combined andEncoder system). In the situation that coarse motion microscope carrier position measuring system 68A comprises encoder system,For example can adopt following structure: along the mobile route of wafer carrier WST1, to hang shape from aboveState is fixed on multiple encoder heads of main frame BD, irradiates measuring beam and exists in fixing (or formation)The scale (for example two-dimensional grating) of coarse motion microscope carrier WCS1 upper surface, and receive its diffraction light and measureThe positional information of coarse motion microscope carrier WCS1. At coarse motion microscope carrier position measuring system, 68A comprises the interference of lightIn the situation of instrument system, can adopt following structure: be parallel to X-axis and Y-axis from having respectivelyMeasure X-ray interferometer and the Y optical interferometer of axle, irradiate measuring beam in coarse motion microscope carrier WCS1'sSide, and receive its reverberation and measure the positional information of wafer carrier WST1.
Coarse motion microscope carrier position measuring system 68B (with reference to Fig. 6) has with the position measurement of coarse motion microscope carrierSystem 68A identical structure, and measure the position of coarse motion microscope carrier WCS2 (wafer carrier WST2)Information. Master controller 20 is according to the measured value of coarse motion microscope carrier position measuring system 68A, 68B, logicalCross and individually control coarse motion microscope carrier drive system 62A, 62B, controls respectively coarse motion microscope carrier WCS1,Each position of WCS2 (wafer carrier WST1, WST2).
In addition, exposure sources 100 also comprises and measures respectively coarse motion microscope carrier WCS1 and fine motion microscope carrierThe relative position of the relative position of WFS1 and coarse motion microscope carrier WCS2 and fine motion microscope carrier WFS2Relative position measurement system 66A, 66B (with reference to Fig. 6). Relative position measurement system 66A, 66B'sStructure there is no concrete restriction, for example, can utilize the gap sensor that comprises electrostatic capacitance sensor to carry out structureBecome. In this situation, gap sensor for example can utilize and be fixed on coarse motion microscope carrier WCS1 (or WCS2)Probe portion (probesection) and be fixed on the target of fine motion microscope carrier WFS1 (or WFS2)Portion (targetsection) forms. In addition, the structure of relative position measurement system is not limited to this,For example also can use linear encoder system and optical interferometer system etc. and form relative position measurement systemSystem.
The control system of the exposure sources of main composition shown in Fig. 6 100, and the each portion of comprehensive control is shownThe block diagram of the I/O relation of the master controller 20 of structure. Master controller 20 comprise work station (orPerson's microcomputer) etc., and control described local liquid-immersion device 8, platform drive system 60A comprehensively,60B, coarse motion microscope carrier drive system 62A, the exposures such as 62B and fine motion microscope carrier drive system 64A, 64BEach portion structure of equipment 100.
Next, illustrate and use two wafer carrier WST1, WST2's according to Fig. 7 to Figure 11Parallel processing operation. In addition, in following operation, utilize master controller 20 as described in control liquidBody feeding 5 and liquid withdrawal system 6, and utilize at the top of projection optical system PL lensUnder 191, keep a certain amount of liquid Lq, and form at any time immersion liquid region.
Fig. 7 is illustrated in exposure station 200, to being positioned over the fine motion microscope carrier of wafer carrier WST1Wafer W on WFS1 carries out the exposure of step-scan method, simultaneously at the second loading position,Between the fine motion microscope carrier WFS2 of wafer transport mechanism (not shown) and wafer carrier WST2, carry outThe state of wafer replacement.
Master controller 20 carries out the exposing operation of step-scan method by following operation: according to pre-The wafer alignment result of first carrying out (for example will be utilized enhancement mode global alignment (EGA) and obtainWafer W on the arrangement coordinate of each irradiation area, convert to the second base of measuring on plate FM1Quasi-mark is as the information of the coordinate of benchmark) and the result of reticle alignment etc., repeatedly make crystalline substanceCircle microscope carrier WST1 (starts to add to the beginning scanning position of the each irradiation area exposure use on wafer WSpeed position) move (stepping between irradiation) operation between mobile irradiation area, and with scanning exposure methodThe scan exposure behaviour of the each irradiation area by the pattern transfer that is formed at graticule R on wafer WDo. In this step-scan operation, follow wafer carrier WST1 for example when scan exposure in Y-axisThe movement of direction, as aforementioned, the function of platform 14A, 14B performance reaction thing. In addition, forStep-by-step operation between irradiating, and utilize master controller 20 to drive fine motion microscope carrier WFS1 in X-directionTime, utilizing and give initial velocity to coarse motion microscope carrier WCS1, coarse motion microscope carrier WCS1 brings into play fine motionThe function of the inner counter agent of microscope carrier. Therefore, wafer carrier WST1 (coarse motion microscope carrier WCS1,Fine motion microscope carrier WFS1) movement unlikelyly cause platform 14A, 14B vibration, and unlikely wafer is carriedPlatform WST2 brings harmful effect.
At top lens 191 and wafer W (being wafer W and plate 82 according to the position of irradiation area)Between keep under the state of liquid Lq, by utilizing immersion exposure, carry out above-mentioned exposure behaviourDo.
The exposure sources 100 of the present embodiment, in above-mentioned a series of exposing operation, utilizes master controller20 use the first gage outfit group 72 of fine motion microscope carrier position measuring system 70 to measure fine motion microscope carrier WFS1Position, and according to the position of this measurement result control fine motion microscope carrier WFS1 (wafer W).
During at the second loading position, utilize unshowned wafer transport mechanism at fine motion microscope carrier WFS2,Wafer after fine motion microscope carrier WFS2 unloading exposure, and new wafer is loaded to fine motion microscope carrierWFS2 is upper and carry out wafer replacement. In this case, the second loading position is at fine motion microscope carrier WFS2On carry out the position of wafer replacement, in the present embodiment, the second loading position is arranged on main aligningThe fine motion microscope carrier WFS2 (wafer carrier WST2) of location survey plate FM2 under system AL1Position.
In above-mentioned wafer replacement and after wafer replacement, wafer carrier WST2 is in the second loading positionPut while stopping, master controller 20 start the new wafer W to carry out wafer alignment (and other beforeProcess and measure) before, carry out the second gage outfit group 73 of fine motion microscope carrier position measuring system 70,Encoder 55,56,57 (and surface location measuring systems 58) reset (again establishing of initial pointFixed).
(and surface location is measured for wafer replacement (loading new wafer W) and encoder 55,56,57System 58) reset after end, master controller 20 uses main alignment system AL1 to detectMeasure the second reference mark on plate FM2. Then, master controller 20 detects main alignment systemThe calibration center (indexcenter) of AL1 is as the position of the second reference mark of benchmark, and complies withDuring according to its testing result and detection, utilize encoder 55,56,57 measure the position of fine motion microscope carrier WFS2Result, calculate (right as the orthogonal coordinate system of reference axis to reference axis La and reference axis LVQuasi coordinates system) in the position coordinates of the second reference mark.
Next, master controller 20 uses encoder 55,56,57, measures fine motion microscope carrier WFS2 (crystalline substanceCircle microscope carrier WST2) position coordinates in alignment coordinates system, and carry out EGA (with reference to Fig. 8).Specifically, master controller 20 is for example in institutes such as No. 2008/0088843rd, U.S. Patent Application PublicationsDisclose, make wafer carrier WST2, that is, make to support the coarse motion microscope carrier WCS2 of fine motion microscope carrier WFS2For example move in Y direction, fine motion microscope carrier WFS2 is implemented in the multiple positions on its mobile routeLocation,, use at least one of alignment system AL1, AL21～AL24 when the location, detect and existAim at the position coordinates of irradiation area (sample irradiation region) alignment mark in alignment coordinates system.Fine motion when Fig. 8 illustrates the detection of carrying out the position coordinates of alignment mark in alignment coordinates system is carriedThe situation of platform WFS2.
In this situation, each alignment system AL1, AL21～AL24 and above-mentioned wafer carrier WST2To the move operation interlock of Y direction, (be for example equivalent to detect light and detect at surveyed areaIrradiation area) in sequentially place multiple alignment mark (identified as samples of arranging along X-directionNote). Thereby, in the time measuring above-mentioned alignment mark, do not drive wafer carrier WST2 in X-direction.
Then, master controller 20 is according to the multiple alignings that are arranged in the sample irradiation region on wafer WThe position coordinates of mark and design attitude coordinate, carry out for example United States Patent (USP) the 4th, and 780, No. 617 grade is draped over one's shouldersThe statistical calculation (EGA computing) revealing, calculates the position of multiple irradiation areas in alignment coordinates systemPut coordinate (arrangement coordinate).
In addition, in the exposure sources 100 of the present embodiment, due to measuring station 300 and exposure station 200Separate each irradiation area the wafer W that therefore master controller 20 obtains from wafer alignment resultPosition coordinates, the position coordinates of the second reference mark detecting before deducting, and obtain the second baseThe position of quasi-mark is as the position coordinates of the multiple irradiation areas on the wafer W of initial point.
Conventionally above-mentioned wafer replacement and wafer alignment program finishes than exposure program is Zao. Thereby, waferAim at while end, master controller 20 drives wafer carrier WST2 on+directions X, and to platformThe position of readiness of the appointment on 14B moves. In this case, when driving wafer carrier at+directions XWhen WST2, fine motion microscope carrier WFS is de-from fine motion microscope carrier position measuring system 70 measurable scopesFrom (the each measuring beam irradiating from the second gage outfit group 73 exceeds grating RG). Thereby, master controlDevice 20 processed is according to measured value and the phase of fine motion microscope carrier position measuring system 70 (encoder 55,56,57)To the measured value of position measuring system 66B, obtain the position of coarse motion microscope carrier WCS2, afterwards, comply withAccording to the position of the measured value control wafer carrier WST2 of coarse motion microscope carrier position measuring system 68B. MoreParticularly, from using encoder 55,56,57 to measure the position of wafer carrier WST2 in XY planePut, switch to the measurement that uses coarse motion microscope carrier position measuring system 68B. Then, master controller 20Before the wafer W end exposure on fine motion microscope carrier WFS1, make wafer carrier WST2 above-mentionedThe position of readiness standby of specifying.
In the time of wafer W end exposure on fine motion microscope carrier WFS1, master controller 20 start byWafer carrier WST1, WST2 is the anxious position that stops towards each right side shown in Figure 10. Wafer carriesPlatform WST1 towards right side anxious off-position put and in the time that-directions X drives, fine motion microscope carrier WFS1 is from micro-Dynamic load platform position measuring system 70 (encoder 51,52,53 and surface location measuring system 54) can be surveyedWeight range departs from (measuring beam irradiating from the first gage outfit group 72 exceeds grating RG). Thereby,Master controller 20 is according to the measured value of fine motion microscope carrier position measuring system 70 (encoder 51,52,53)With the measured value of relative position measurement system 66A, obtain the position of coarse motion microscope carrier WCS1, afterwards,According to the position of the measured value control wafer carrier WST1 of coarse motion microscope carrier position measuring system 68A., master controller 20 is flat at XY from using encoder 51,52,53 to measure wafer carrier WST1Position in face, switches to the measurement that uses coarse motion microscope carrier position measuring system 68A. In addition exist,In this situation, master controller 20 uses coarse motion microscope carrier position measuring system 68B to measure wafer carrierThe position of WST2, and according to its measurement result as shown in Figure 9, on platform 14B in+Y-direction(with reference to the hollow arrow in Fig. 9) upper wafer carrier WST2 that drives. Utilize this wafer carrier WST2The effect of reaction force of driving force, the function of platform 14B performance reaction thing.
In addition, master controller 20 and wafer carrier WST1, WST2 puts towards above-mentioned right side urgency off-positionMobile simultaneously, according to the measured value of relative position measurement system 66A, on+directions X, driveFine motion microscope carrier WFS1, and with coarse motion microscope carrier WCS1 near to or in contact with, and according to relative positionThe measured value of measuring system 66B drives fine motion microscope carrier WFS2 on-directions X, and with coarse motion microscope carrierWCS2 near to or in contact with.
Then, at two wafer carrier WST1, WST2 is displaced under the state that the anxious off-position in right side puts,As shown in figure 10, wafer carrier WST1 and wafer carrier WST2 become in X-direction approachingOr the urgency of contact is stopped state. Meanwhile, fine motion microscope carrier WFS1 and coarse motion microscope carrier WCS1 becomeSuddenly stop state, coarse motion microscope carrier WCS2 and fine motion microscope carrier WFS2 become the anxious state that stops. Then, profitWith coupling component 92b, the coarse motion microscope carrier WCS2 of fine motion microscope carrier WFS1, coarse motion microscope carrier WCS1Coupling component 92b and the upper surface of fine motion microscope carrier WFS2 be formed on the whole plane of one in appearanceFace.
Along with wafer carrier WST1 and WST2 are keeping above-mentioned three urgency to stop under state in-X sideTo movement, be formed at the immersion liquid region (liquid between top lens 191 and fine motion microscope carrier WFS1Lq) to coupling component 92b, the coarse motion microscope carrier WCS2 of fine motion microscope carrier WFS1, coarse motion microscope carrier WCS1Coupling component 92b and fine motion microscope carrier WFS2 on sequentially move. Figure 10 illustrates immersion liquid region (liquidBody Lq) the state of movement before starting. In addition, keeping above-mentioned three urgency to stop driving under stateWhen wafer carrier WST1 and wafer carrier WST2, preferably with prevent or suppress liquid Lq leakThe mode going out is set gap (play), fine motion between wafer carrier WST1 and wafer carrier WST2 and is carriedGap (play) and coarse motion microscope carrier WCS2 and fine motion between platform WFS1 and coarse motion microscope carrier WCS1Gap between microscope carrier WFS2 (play). In this case, so-called approaching, also comprises and becomes above-mentioned urgencyThe situation that between stopping between two members of state, gap (play) is zero, is the situation of both contacts.
In the time that immersion liquid region (liquid Lq) completes to the movement on fine motion microscope carrier WFS2, wafer carriesPlatform WST1 moves on platform 14A. Therefore, master controller 20 uses the position measurement of coarse motion microscope carrierSystem 68A measures the position of wafer carrier WST1, makes wafer carrier WST1 on platform 14AMove in-Y-direction, further move at+directions X, wafer carrier WST1 is moved toThe first loading position shown in Figure 11. In this situation, wafer carrier WST1 moves to-Y-directionTime, utilize the effect of the reaction force of driving force, the function of platform 14A performance reaction thing. ThisAlso can, in the time that wafer carrier WST1 moves to+directions X, utilize the reaction force of driving force outward,Effect, make the function of platform 14A performance reaction thing.
Arrive after the first loading position at wafer carrier WST1, master controller 20 is by wafer carrierThe position measurement of WST1 in XY plane, from being used coarse motion microscope carrier position measuring system 68A'sMeasurement switches to the measurement that uses encoder 55,56,57.
With the movement of above-mentioned wafer carrier WST1 time, master controller 20 drives wafer carrierWST2, and by measure plate FM2 be positioned projection optical system PL under. Before this,Master controller 20 is the position measurement in XY plane by wafer carrier WST2, from using coarse motion to carryThe measurement of platform position measuring system 68B switches to the measurement that uses encoder 51,52,53. Then,Use reticle alignment system RA1,RA2Detect a pair of the first reference mark of measuring on plate FM2,And detect and graticule R corresponding to the first reference mark on reticle alignment be marked on wafer faceThe relative position of projected image. In addition, via projection optical system PL and form the liquid in immersion liquid regionBody Lq and carry out this detection.
The relative position information that master controller 20 foundations detected in this case, and will previously obtainFine motion microscope carrier WFS2 on the second reference mark as the upper each irradiation area of the wafer W of benchmarkPositional information, calculates the projected position of the pattern of graticule R (in the projection of projection optical system PLThe heart) and be positioned over the each irradiation area on the wafer W on fine motion microscope carrier WFS2 relative position closeSystem. Master controller 20 calculates result according to it, with the described crystalline substance being positioned on fine motion microscope carrier WFS1The situation of circle W is managed the position of fine motion microscope carrier WFS2 (wafer carrier WST2) similarly, andAnd with step-scan method by the pattern transfer of graticule R to being positioned on fine motion microscope carrier WFS2Each irradiation area on wafer W. Figure 11 illustrates so each irradiation area transfer printing on wafer WThe situation when pattern of graticule R.
When the wafer W on above-mentioned fine motion microscope carrier WFS2 is carried out to exposing operation, main controlDevice 20 is at the first loading position, wafer transport mechanism (not shown) and wafer carrier WST1 itBetween carry out wafer replacement, and on fine motion microscope carrier WFS1, place new wafer W. In this case,The first loading position is the position of carrying out wafer replacement on wafer carrier WST1, at the present embodimentIn, the first loading position be arranged on main alignment system AL1 under location survey plate FM1The position of fine motion microscope carrier WFS1 (wafer carrier WST1).
Then, master controller 20 uses main alignment system AL1 to detect to measure the on plate FM1Two reference marks. In addition, detecting before the second reference mark, at wafer carrier WST1 theUnder the state of one loading position, master controller 20 is carried out second of fine motion microscope carrier position measuring system 70Gage outfit group 73, i.e. encoder 55,56, the resetting of 57 (and surface location measuring systems 58)(resetting of initial point). Thereafter, master controller 20 is managed the position of wafer carrier WST1,And to the wafer W on fine motion microscope carrier WFS1, carry out and aforementioned same use alignment systemThe wafer alignment (EGA) of AL1, AL21～AL24.
The wafer alignment (EGA) of wafer W on fine motion microscope carrier WFS1 is finished, and to fine motionWhen the exposure of wafer W on microscope carrier WFS2 also finishes, master controller 20 is wafer carrier WST1,WST2 is the anxious position that stops towards left side. The anxious off-position in this left side is put instruction wafer carrier WST1,WST2 is being set to described reference axis LV symmetrical with the anxious off-position in the right side shown in Figure 10The position relationship of position. Enter according to the order identical with the position measurement of described wafer carrier WST2Row is the anxious position measurement that stops the wafer carrier WST1 in position towards left side.
In this left side, anxious off-position is put, and wafer carrier WST1 and wafer carrier WST2 also become aforementionedUrgency stop state, meanwhile, fine motion microscope carrier WFS1 and coarse motion microscope carrier WCS1 become the anxious shape that stopsState, coarse motion microscope carrier WCS2 and fine motion microscope carrier WFS2 become the anxious state that stops. Then, utilize fine motionThe coupling component 92b of microscope carrier WFS1, coarse motion microscope carrier WCS1, the coupling of coarse motion microscope carrier WCS2The upper surface of member 92b and fine motion microscope carrier WFS2 forms the face of the whole plane being integrated in appearance.
Master controller 20 keep above-mentioned three urgency stop under state, with contrary before+directions XDrive wafer carrier WST1, WST2. Meanwhile, be formed at top lens 191 and fine motion microscope carrier WFS2Between immersion liquid region (liquid Lq) with before on the contrary to fine motion microscope carrier WFS2, coarse motion microscope carrierThe coupling component 92b of WCS2, the coupling component 92b of coarse motion microscope carrier WCS1, fine motion microscope carrier WFS1On sequentially move. Certainly keep anxious and stop state and when mobile, also with before similarly, carry out wafer and carryPlatform WST1, the position measurement of WST2. When in immersion liquid region, the movement of (liquid Lq) completes, mainController 20 is according to starting the wafer W on wafer carrier WST1 to enter with aforementioned same orderRow exposure. With this exposing operation while, master controller 20 is with aforementioned similarly to the second loading positionDrive wafer carrier WST2, and the wafer W after the exposure on wafer carrier WST2 is replaced withNew wafer W, and new wafer W is carried out to wafer alignment.
After, master controller 20 is carried out above-mentioned use wafer carrier WST1 repeatedly, and WST2 is alsoRow is processed operation.
As described above, the exposure sources 100 of the present embodiment is in the time of exposing operation and when wafer alignment(main in the time of the measurement of alignment mark), measure keep wafer W fine motion microscope carrier WFS1 (orWFS2) when positional information (positional information in XY plane and surface position information), respectivelyThe first gage outfit group 72 and the second gage outfit group 73 of measuring stick 71 is fixed in use. Then, byIn the encoder head 75x, 75ya, 75yb and Z the 76a～76c that form the first gage outfit group 72,And formation the second gage outfit group's 73 encoder head 77x, 77ya, 77yb and Z 78a～78c,Can be respectively to being positioned over the grating RG of bottom surface of fine motion microscope carrier WFS1 (or WFS2), from justMeasuring beam is irradiated with beeline in side, therefore, because of wafer carrier WST1, the Zhou Bianhuan of WST2The temperature change of border gas, for example because of air, to change the measure error causing little, can accurately measure fine motionThe positional information of microscope carrier WFS.
In addition, the first gage outfit group 72 substantially with wafer W on exposure area IA centerThe consistent point measurement fine motion microscope carrier WFS1 (or WFS2) of exposure position believes in the position of XY planeBreath and surface position information, the second gage outfit group 73 substantially with the inspection of main alignment system AL1Survey the position of the consistent point measurement fine motion microscope carrier WFS2 (or WFS1) of regional center in XY planePut information and surface position information. Therefore, can suppress because measurement point and exposure position are in XY planeSite error and produce Abbe error, based on this point, also can accurately obtain fine motion microscope carrier WFS1Or the positional information of WFS2.
In addition the measuring stick 71 that, has the first gage outfit group 72 and the second gage outfit group 73 is according to surveyingThe measured value of gauge rod position measuring system 67, with to the constant mode of the relative position of main frame BD,Utilize master controller 20, control at any time its six-freedom degree direction via measuring stick drive system 65Position. Therefore, master controller 20 can be according to the positional information of utilizing the first gage outfit group 72 to measure,Via at least one party of fine motion microscope carrier drive system 64A and coarse motion microscope carrier drive system 62A (orAt least one party of fine motion microscope carrier drive system 64B and coarse motion microscope carrier drive system 62B), accurately controlUsing the optical axis of projection optical system PL that is held in lens barrel 40 as the wafer carrier WST1 of benchmarkThe position of (or WST2). In addition, master controller 20 can be according to utilizing the second gage outfit group 73 to surveyThe positional information of amount, via fine motion microscope carrier drive system 64A and coarse motion microscope carrier drive system 62A(or fine motion microscope carrier drive system 64B and coarse motion microscope carrier drive system 62B are at least at least one partyOne side), accurately control the wafer carrier using the inspection center of main alignment system AL1 as benchmarkThe position of WST1 (or WST2). In addition, due to measuring stick 71 and platform 14A, 14B, the endSeat 12 grades are mechanicalness contactless state, even if therefore platform 14A, 14B have the plane of formation horseThe stator reaching, measuring stick 71 and then the first gage outfit group 72 and still unlikely being subject to of the second gage outfit group 73To wafer carrier WST1, the impact of the reaction force of the driving force of WST2. In addition, owing to putting downThe below of platform 14A, 14B, separates with main frame BD mechanicalness and places measuring stick 71, therefore withMain frame BD is different while being integrated with measuring stick 71, not reason internal stress (also comprising thermal stress)Cause distortion (for example twisted) and the vibration of measuring stick 71 to conduct to measuring stick 71 from main frame BDDeng, cause fine motion microscope carrier position measuring system 70 to measure fine motion microscope carrier WFS1's (or WFS2)The precision of positional information reduces.
In addition, at the wafer carrier WST1 of the present embodiment, in WST2, due at fine motion microscope carrierThe placement coarse motion microscope carrier WCS1 of surrounding (or WCS2) of WFS1 (or WFS2), therefore than slightlyOn dynamic load platform, carry the wafer carrier of the rough micro-moving mechanism structure of fine motion microscope carrier, can dwindle wafer carrier WST1,The size of the short transverse (Z-direction) of WST2. Thereby, can shorten and form the driving of coarse motion microscope carrierSystem 62A, the application point of the thrust of the planar motors of 62B (is coarse motion microscope carrier WCS1 (or WCS2)Bottom surface and platform 14A, 14B upper surface between), with wafer carrier WST1, the center of gravity of WST2In the distance of Z-direction, can lower and drive wafer carrier WST1, pitching moment when WST2 (orTilting moment). Therefore wafer carrier WST1, the stable operation of WST2.
In addition,, in the exposure sources 100 of the present embodiment, form wafer carrier WST1, WST2The platform of the guide surface during along XY planar movement, corresponding to two wafer carrier WST1, WST2And formed by two platform 14A, 14B. Owing to utilizing planar motors (coarse motion microscope carrier drive system62A, 62B) drive wafer carrier WST1, when WST2, these two platform 14A, 14B are independentThe function of performance reaction thing, therefore, even for example by wafer carrier WST1 and wafer carrierWST2 on platform 14A, 14B respectively at Y direction on opposite directions drive time, stillCan eliminate individually the reaction force that platform 14A, 14B act on respectively.
In addition, in the above-described embodiments, just use by being displaced into XY in the specified scope on platformThe coarse motion microscope carrier of two-dimensional directional, what form with the fine motion microscope carrier of small driving on coarse motion microscope carrier is slightly micro-Dynamic load platform explains as the situation of wafer carrier, but is not limited to this, and the structure of wafer carrier can be doneVarious distortion. Figure 12 (A) illustrates the plane of a variation of the wafer carrier of above-described embodiment,Figure 12 (B) illustrates the B-B line profile of Figure 12 (A). The wafer of the variation shown in Figure 12 (A) carriesPlatform WST3, its member 180 that is equivalent to the fine motion microscope carrier of above-described embodiment (keeps brilliant at upper surfaceCircle W, and there is the flat member of grating RG at lower surface) to being equivalent to coarse motion microscope carrierBe that rectangular box-like member 190 is fixed integratedly from viewed in plan, and global shape form tabular.Wafer carrier WST3 has magnet unit 196a, 196b in the end of+Y ,-Y side respectively.Wafer carrier WST3 utilizes the coil unit (omission icon) of magnet unit 196a, 196b and platformAnd form can produce the planar motors of thrust in six-freedom degree direction, and on platform along XYPlane drives (, the function of the drive system of planar motors performance rough micro-moving mechanism dual-purpose). In addition, existIn this situation, planar motors also can be moving-magnetic type, also can be moving-coil type, any all applicable.
In addition, in the above-described embodiments, utilize master controller 20 according to measuring stick position measuring system67 measured value, with to the constant mode of the relative position of projection optical system PL, control survey barThe situation of 71 position explains, but is not limited to this. For example also can not control survey bar 71Position, and utilize master controller 20 according to utilizing the measured position of measuring stick position measuring system 67Put information and utilize the measured positional information of fine motion microscope carrier position measuring system 70 (for example, to measureThe measured value of the measured value correction fine motion microscope carrier position measuring system 70 of bar position measuring system 67),Drive coarse motion microscope carrier drive system 62A, 62B and/or fine motion microscope carrier drive system 64A, 64B, controlsFine motion microscope carrier WFS1 processed, the position of WFS2.
In addition, the exposure sources of above-described embodiment has two platforms corresponding to two wafer carrier,But platform quantity is not limited to this, for example, also can be more than one or three. In addition wafer carrier,Quantity is also not limited to two, also can be more than one or three. For example also can be by U.S. Patent application public affairsOpen No. 2007/0201010 disclosed have spatial image measuring appliance, the even measuring appliance of uneven illumination,The measurement microscope carrier of illuminance monitor, wavefront aberration measuring appliance etc. is positioned on platform.
In addition, make platform or base component be separated into the position of multiple portion boundary lines, be not limited toThe position of above-described embodiment. Although boundary line be set to comprise reference axis LV and with optical axis AX phaseIntersect, still, for example, while having border in exposure station, the thrust decay situation of the planar motors of its partUnder, also boundary line can be set in to other places.
In addition, measuring stick 71 for example also can utilize No. 2007/0201010th, U.S. Patent Application PublicationDisclosed deadweight arrester, and the mid portion of bearing length direction (also can counted on basePlace).
In addition, on base 12, drive the motor of platform 14A, 14B to be not limited to electromagnetic force (long-range navigationHereby power) planar motors of driving method, for example also can be VR driving method planar motors (orLinear motor). In addition, motor is not limited to planar motors, also can be and comprises the side of being fixed on platformMover and be fixed on the voice coil motor (voicecoilmotor) of stator of base. In addition platform,Also can be such as U.S. Patent Application Publication and wait eliminating via deadweight of disclosing for No. 2007/0201010Device and supporting on base. Moreover the driving direction of platform is not limited to three degree of freedom direction, alsoFor example can be six-freedom degree direction, only Y direction or two direction of principal axis of XY only. This feelingsUnder condition, also can utilize aerostatic bearing (such as air bearing) etc. that platform is suspended on base.In addition,, when the moving direction of platform only gets final product for Y direction, platform also can be for example can be in Y-axisDirection moves and is equipped on the Y guiding elements extending in Y direction.
In addition, in the above-described embodiments, with the lower surface of fine motion microscope carrier, i.e. the upper surface phase of platformRight face is placed grating, but is not limited to this, also can see through the main part of fine motion microscope carrier as lightSolid component, and grating is positioned over to the upper surface of main part. In this case, with above-mentioned enforcementExample relatively, because the distance of wafer and grating approaches, therefore can be dwindled wafer because comprising exposure pointBe exposed face and utilize encoder 51,52, the datum level of the position of 53 measurement fine motion microscope carriers be (gratingPlaced side) in the difference of Z-direction and Abbe (Abbe) error producing. In addition, grating also can shapeBe formed in the back side of wafer holder. In this situation, even wafer holder expands or installs in exposureWhen there is deviation position to fine motion microscope carrier, still can follows it and measure the position of wafer holder (wafer).
In addition, in the above-described embodiments, although comprise X head and a pair of Y head with regard to encoder systemSituation explains, but is not limited to this, for example also can be by two of an X-direction and Y direction sideBe positioned in one or two measuring stick to the two dimension head (2D head) as direction of measurement. ArrangingIn the situation of two 2D heads, their test point also can be formed on grating centered by exposure position,And at 2 points of X-direction interval same distance. In addition each stature group in above-described embodiment,Number is respectively an X head, two Y heads, but also can further increase. In addition exposure station,The first gage outfit group 72 of 200 sides also can further have multiple groups. For example can be positioned overThe head group of the position that exposure position (wafer W exposure in irradiation area) is corresponding is around each (+The four direction of X ,+Y ,-X ,-Y-direction) further establish head group. Then, also can instituteMeaning pre-reads and measures the position of the front fine motion microscope carrier (wafer W) of described irradiation area exposure. ThisOutward, the structure of the encoder system of formation fine motion microscope carrier position measuring system 70 is not limited to above-mentioned enforcementExample, can be arbitrary structures. For example also can use the position that can measure X-axis, Y-axis and Z axis all directionsPut the 3D head of information.
In addition, in the above-described embodiments, from encoder head penetrate measuring beam, penetrate from Z headMeasuring beam respectively via the gap between two platforms or be formed at the transmittance section of each platform and shinePenetrate in the grating of fine motion microscope carrier. In this situation, transmittance section also can be for example considered as platform 14A,The moving range of the reaction thing of 14B, and by the hole decile slightly larger than the beam diameter of each measuring beamBe not formed at platform 14A, 14B, make measuring beam pass through these multiple peristomes. In addition, for exampleAlso can each encoder head, each Z head uses the head of pencil-type, inserts these and be formed in each platformThe peristome of head.
In addition, in the above-described embodiments, illustrate and follow driving wafer carrier WST1, WST2's is thickDynamic load platform drive system 62A, 62B adopts planar motors, and utilizes the stator department with planar motorsPlatform 14A, 14B, form along wafer carrier WST1 the XY plane of WST2 and when mobileThe situation of guide surface (producing the face of power of Z-direction). But above-described embodiment is office notBe limited to this. In addition, in the above-described embodiments, at fine motion microscope carrier WFS1, the upper layout of WFS2 is measuredFace (grating RG), and on measuring stick 71, arrange by first of encoder head (and Z head) formationGage outfit group 72 (and second gage outfit group 73), but above-described embodiment is not limited to this. ,Also can be contrary to the above, encoder head (and Z head) is arranged in to fine motion microscope carrier WFS1, andMeasuring stick 71 sides form measurement face (grating RG). This contrary configuration is for example applicable to electron beamThe employings such as exposure sources or EUV exposure sources on so-called H type microscope carrier, combine maglev microscope carrierAnd the bearing table device forming. Owing to supporting the microscope carrier of this bearing table device by guide rod, therefore at microscope carrierBelow place relative with microscope carrier and setting scale bar (Scalebar) (be equivalent to the table at measuring stickFace forms diffraction grating), and place at least one of encoder head at the lower surface of microscope carrier corresponding theretoPartly (optical system etc.). In this case, utilize this guide rod to form guide surface and form member.Certainly also can be other structure. In measuring stick 71 sides, grating RG part is set, for example, also can be surveyGauge rod 71, also can be the nonmagnetic substance comprehensively or at least simultaneously of being located on platform 14A (14B)Deng plate.
In addition, in the exposure sources 100 of above-described embodiment, when utilizing measuring stick position measuring system67 while measuring the position of measuring sticks 71, the wafer W (fine motion microscope carrier) for example, during from accurate control exposureThe viewpoint of position, should by the position of placing the first gage outfit group 72, (measuring center of essence be for exposing to the sunOptical position) near as measurement point. But while observing with regard to above-described embodiment, understand from Fig. 5,Grating RGa, RGb are placed in both ends at the length direction of measuring stick 71, these gratings RGa,The position of RGb becomes the measurement point of the position of measuring measuring stick 71. In this situation, in X-direction,Because measurement point is near of placement the first gage outfit group's 72 position, therefore, even if carry out positionMeasure its impact still little. But, in Y direction, due to the location interval of grating RGa, RGbPlace the first gage outfit group's 72 position, the measuring stick 71 that therefore may be subject between two positions is out of shape etc.Impact. Therefore, for correct measurement measuring stick 71 is in the position of Y direction, and according to this surveyAmount result is accurately controlled the position of wafer W (fine motion microscope carrier), for example, for modifying factor is according to need filledThe rigidity of point raising measuring stick 71, or the distortion of measuring stick 71 etc. causes the position measurement of measuring stickError, should take to use measurement mechanism to measure the phase contraposition of measuring stick 71 and projection optical system PLThe countermeasure of putting etc. As the measurement mechanism of latter instance, for example can use following interferometer system, shouldInterferometer system is using the fixed mirror (reference mirror) that is fixed on projection optical system PL as benchmark, andMeasure the position of wafer carrier and the position of measuring stick 71.
In addition, in the above-described embodiments, illustrate that WCS2 comprises via each coarse motion microscope carrier WCS1Coupling component 92b, transition immersion liquid district between fine motion microscope carrier WFS1 and fine motion microscope carrier WFS2Territory (liquid Lq), and immersion liquid region (liquid Lq) is maintained to projection optical system PL all the timeThe situation of below. But be not limited to this, also can make and for example U.S. Patent Application PublicationThe unshowned shutter means of the disclosed same structure of the third embodiment of No. 2004/0211920,Utilize and wafer carrier WST1, the replacing of WST2 and being displaced into below projection optical system PL,And immersion liquid region (liquid Lq) is maintained to projection optical system PL below all the time.
In addition, also can be in measuring stick 71 set temperature sensor, pressure sensor and for shakingThe moving acceleration transducer of measuring etc. In addition, also can arrange that to measure the distortion of measuring stick 71 (twistedDeng) strain transducer and shift sensor etc. Then, the value that also can use these sensors to obtain,Revise by fine motion microscope carrier position measuring system 70 and coarse motion microscope carrier position measuring system 68A, 68B instituteThe positional information obtaining.
In addition, although explanation is applicable to above-described embodiment the bearing table device (wafer carrier) of exposure sources50 situation, but be not limited to this, also applicable to graticule microscope carrier RST.
In addition, in the above-described embodiments, grating RG also can utilize protection member, for example, utilize glassLid covers and protects. Glass cover also can be set as the roughly whole of main body covered portion 80 lower surfaces, also canBe set as a part that only covers main part 80 lower surfaces that comprise grating RG. In addition, because protectionGrating RG needs sufficient thickness, should adopt tabular protection member, but also can make according to materialWith the protection member of film-form.
In addition, also can by fixing one side or form grating RG transparent panel another side contact orApproach the back side of wafer holder and place, and in the one side side of its transparent panel, protection member (glass being setGlass lid), or do not establish protection member (glass cover), and by transparent panel fixing or formation grating RGOne side contact or approach the back side of wafer holder and place. Particularly the former, also can replace transparentPlate and change on the opaque members such as pottery fixing or form grating RG, or also can be at waferGrating RG is fixed or forms at the back side of retainer. The latter's situation, even wafer keeps in exposureDevice expands or installation site during to fine motion microscope carrier deviation, still can follow it and measures wafer holder (crystalline substanceCircle) position. Or also can on previous fine motion microscope carrier, only keep wafer holder and grating RG.In addition, also can utilize solid glass component to form wafer holder, and at the upper table of this glass componentFace (wafer placed side) is placed grating RG.
In addition, in the above-described embodiments, although be combination coarse motion microscope carrier and fine motion exemplified with wafer carrierThe situation of the rough micro-moving mechanism microscope carrier of microscope carrier, but be not limited to this. In addition the fine motion of above-described embodiment,Microscope carrier WFS1, WFS2 can drive in whole six-freedom degree directions, but is not limited to this, need onlyAt least in XY plane, can in parallel two dimensional surface, move. Moreover, fine motion microscope carrier WFS1,WFS2 also can contact and be supported in coarse motion microscope carrier WCS1 or WCS2. Therefore, to coarse motion microscope carrier WCS1Or WCS2 driving fine motion microscope carrier WFS1, the fine motion microscope carrier drive system of WFS2, for example also can beCombination rotation motor and ball screw (or feed screw).
In addition, also can be according to implementing in the whole moving range region of wafer carrier its position measurementMode forms fine motion microscope carrier position measuring system. In this situation, do not need coarse motion microscope carrier position measurement systemSystem.
In addition, the wafer that the exposure sources of above-described embodiment uses also can be 450mm wafer, 300mmThe wafer of the various sizes such as wafer any.
In addition, in the above-described embodiments, although illustrated that exposure sources is the exposure sources of immersion liquid typeSituation, but be not limited to this, above-described embodiment also can be applicable to suitably not via liquid (water)And the dry type exposure sources that carries out the exposure of wafer W.
In addition, in the above-described embodiments, although illustrated that exposure sources is the situation of scanning stepper,But be not limited to this, also can in the silent oscillation exposure sources such as stepper, be suitable for above-described embodiment. EvenFor stepper etc., utilize encoder to measure the microscope carrier position of the object that carries exposure object, still can make because ofAir variation and the errors in position measurement that occurs is almost nil. Thereby, can be according to the measured value of encoderMicroscope carrier is accurately located, and result can be by accurate graticule pattern transfer to object. In addition,State embodiment also applicable to the stepping and the stitching (Stepand that synthesize irradiation area and irradiation areaStitch) the reduced projection exposure sources of method.
In addition, the projection optical system in the exposure sources of above-described embodiment, is not only reduction system,Times system or the expansion system such as also can be, projection optical system is not only dioptric system, also can be reflectionSystem or reflected refraction system, it is thrown image and also can be handstand image or upright image.
In addition, illumination light IL is not limited to argon fluoride excimer laser (wavelength 193nm), also can beThe ultraviolet light of KrF (KrF) PRK (wavelength 248nm) etc., or fluorine (F2) laser (rippleLong 157nm) etc. vacuum-ultraviolet light. For example United States Patent (USP) the 7th, 023, No. 610 disclosed, alsoCan use by vacuum-ultraviolet light be from the infrared light belt of dfb semiconductor laser or optical-fiber laser vibration orThe single wavelength laser of visual light belt, for example with doping erbium (or erbium and ytterbium) fiber amplifierAmplify, and use nonlinear optics crystallization and higher hamonic wave that Wavelength-converting is ultraviolet light.
In addition, to be not limited to wavelength be more than 100nm to the illumination light IL of the exposure sources of above-described embodimentLight, certainly also can use wavelength not reach the light of 100nm. For example also grenz ray district can usedFor example, in the EUV exposure sources of EUV (extreme ultraviolet) light in territory (wavelength band of 5～15nm) suitableUse above-described embodiment. In addition, above-described embodiment is also applicable to using electric wire or ion beam etc. chargedThe exposure sources of particle line.
In addition, in the above-described embodiment, use and on the substrate of light transmission, form the shading figure specifyingThe light-transmission type shielding (graticule) of case (or phase pattern, dim light pattern), but also can replace thisGraticule, and use No. the 6th, 778,257, United States Patent (USP) for example disclosed, according to figure that must exposureThe electronic data of case, forms through the electronic shield of pattern or reflection graphic patterns or luminous pattern and (comprisesVariable shaping shielding, initiatively shielding (Activemask) or also referred to as for example one of image generatorThe non-light emitting-type image of kind illustrates the DMD (digital micromirror device) of assembly (spatial light modulation device)Deng). In the situation that using this variable shaping shielding, owing to carrying carrying of wafer or glass plate etc.Platform, to variable shaping shielding scanning, therefore utilizes the position that uses encoder system to measure this microscope carrier, canObtain the effect equal with above-described embodiment.
In addition, No. 2001/035168th, PCT International Publication is for example disclosed, by doingDisturbing line, to be formed at wafer W upper and on wafer W, form the exposure sources (photoetching of line and space patternSystem) in also applicable above-described embodiment.
Moreover, for example United States Patent (USP) the 6th, 611, No. 316 are disclosed, by two graticule patternsSynthesize on wafer via projection optical system, expose and a photograph on wafer by single passPenetrate region and roughly implement in the exposure sources of double exposure simultaneously, also applicable above-described embodiment.
In addition, in above-described embodiment, should form pattern object (exposure object of irradiation energy light beamObject) be not limited to wafer, also can be glass plate, ceramic substrate, film member or light shield element plate etc.Other object.
The purposes of exposure sources is not limited to be used in the exposure sources of semiconductor manufacture use, also can extensively be suitable forIn for example on square glass plate transfer printing liquid crystal the liquid crystal exposure sources of element pattern is shown; Or forManufacture organic EL, film magnetic head, image device (CCD etc.), micromachine and DNA chipDeng exposure sources. In addition, except the microdevice of semiconductor devices etc., in order to manufacture light exposureThe mark that equipment, EUV exposure sources, X ray exposure sources and electric wire exposure sources etc. useLine sheet or shielding, and on glass substrate or Silicon Wafer etc. in the exposure sources of transfer printing circuit pattern, alsoApplicable above-described embodiment.
Whole communiques of the exposure sources of quoting about above-mentioned explanation in addition, etc., the international public affairs of PCTOpen, the disclosure content of U.S. Patent Application Publication description and US Patent specification, by referenceMode is incorporated into this.
Manufacture the electronic device of semiconductor devices etc. by following steps: function, the property of carrying out deviceThe step that can design; Make the step of graticule according to this design procedure; Make wafer from silicon materialsStep; The exposure sources (patterning device) and the exposure method thereof that utilize described embodiment, will shieldCover the pattern transfer of (graticule) to the lithography step of wafer; The wafer of exposure is given to the aobvious of video picturePicture step; Utilize etching to remove the etching step of exposing member of photoresist residual fraction part in additionSuddenly; After etching, remove the photoresist of unwanted photoresist and remove step; Device combination step (comprisesCutting processing procedure, connection process and encapsulation procedure); And inspection step. In this case, in photoetchingIn step, use the exposure sources of above-described embodiment to carry out aforesaid exposure method, and on wafer shapeBecome device pattern, therefore the device of high integration is manufactured on high production rate ground.
In addition, the application discloses following scheme.
1. 1 kinds of exposure sources of scheme, described exposure sources is via by the light of the first support member supportSystem utilizes energy light beam to expose to object, and described exposure sources comprises:
Moving body, described moving body keeps described object, and can move along the two dimensional surface of specifying;
Guide surface forms member, and described guide surface forms member and forms described moving body along described two dimensionThe guide surface using when planar movement;
The first drive system, moving body described in described the first drive systems;
The second supporting member, described the second supporting member in the side contrary with described optical system with instituteState guide surface and form member and place dividually, form member through described guide surface, with described firstSupporting member separates;
The first measuring system, described the first measuring system comprises the first measurement member, described first measuresMember irradiates the measurement face parallel with described two dimensional surface and receives from described measurement with measuring beamThe light of face, and described the first measuring system utilizes described first to measure described in the output of member obtainsMoving body is the positional information in described two dimensional surface at least, and described measurement face is disposed in described movementA place in body and described the second supporting member, and at least a portion of described the first measurement memberBe disposed in another place in described moving body and described the second supporting member; And
The second measuring system, described the second measuring system obtains the position letter of described the second supporting memberBreath.
The exposure sources of scheme 2. as described in scheme 1, wherein
Described the second measuring system have attach to described the first supporting member and described second support structureThe sensor of one in part, described sensor irradiates described the first supporting member and institute with measuring beamState the back light that another in the second supporting member also receives described measuring beam, described second measuresSystem is utilized the output of described sensor to obtain described the second supporting member and is supported with respect to described firstThe relative position information of member.
The exposure sources of scheme 3. as described in scheme 2, wherein
Described the second supporting member is to be parallel to the beam-like element that described two dimensional surface is placed.
The exposure sources of scheme 4. as described in scheme 3, wherein
Two ends of the length direction of described beam-like element are relative with described the first supporting member respectively,And
Described the second measuring system has and is arranged in described the first supporting member and described beam-like element existsThe a pair of described sensor of one in two ends of length direction, and use this pair of sensorsOutput obtain the relative position information of described beam-like element with respect to described the first supporting member.
The exposure sources of scheme 5. as described in any one in scheme 1～4, wherein
On described measurement face, place grating, the cycle direction of described grating is to be parallel to described two dimension to put downThe direction of face, and
Described first measures member comprises encoder head, described in described encoder head irradiates with measuring beamGrating also receives from described grating diffration light.
The exposure sources of scheme 6. as described in any one in scheme 1～5, wherein
Described guide surface forms member is platform, and described platform is placed on described the second supporting memberDescribed optical system side is with relative with described moving body, and in the one side of the side relative with described moving bodyThe described guide surface that upper formation is parallel with described two dimensional surface.
The exposure sources of scheme 7. as described in scheme 6,
Wherein said platform has the transmittance section that described measuring beam can pass through.
The exposure sources of scheme 8. as described in scheme 6 or 7, wherein
Described the first drive system comprises planar motors, and described planar motors has and is arranged in described movementThe mover at body place and the stator that is arranged in described platform place, described planar motors is utilized described stator and instituteState the driving force producing between mover and drive described moving body.
The exposure sources of scheme 9. as described in scheme 8, also comprises:
Base component, described base component supports described platform to make the described platform can be with describedThe interior movement of plane that two dimensional surface is parallel.
The exposure sources of scheme 10. as described in scheme 9, wherein
Described the second supporting member by suspension support on described base component.
The exposure sources of scheme 11. as described in scheme 9 or 10, also comprises:
Platform drive system, described platform drive system comprises the stator that is arranged in described base component placeWith the mover that is arranged in described platform place, and utilize and produce between described mover and described statorDriving force and drive described platform with respect to described base component.
The exposure sources of scheme 12. as described in any one in scheme 1～11, wherein
Described the second measuring system comprises at least one in encoder system and optical interferometer system.
The exposure sources of scheme 13. as described in any one in scheme 1～12, also comprises:
Control system, described control system is used the metrical information and described of described the first measuring systemThe metrical information of two measuring systems, via described the first drive system control described moving body positionPut; And
The second drive system, described the second drive system at least drives described along described two dimensional surfaceTwo supporting members, wherein
Described control system is used the measured value of described the second measuring system and controls described the second drivingSystem is so that the position of described the second supporting member to be set, to make to maintain described the first supporting member and instituteState the relative position relation between the second supporting member, and use the measured value of described the first measuring systemAnd control the position of described moving body via described the first drive system.
The exposure sources of scheme 14. as described in scheme 13, wherein
Described the second measuring system obtains described the second supporting member with respect to described the first supporting memberThe first direction of principal axis orthogonal in described two dimensional surface and the second direction of principal axis sixPositional information in free degree direction, and
Described the second drive system drives described the second supporting member in described six-freedom degree direction.
The exposure sources of scheme 15. as described in any one in scheme 1～14, wherein
Described measurement face is disposed in described moving body place, and
Described first described at least a portion of measuring member is placed on described the second support members.
The exposure sources of scheme 16. as described in scheme 15, wherein
Described moving body is relative with described optical system and parallel with described two dimensional surface firstOn face, lay described object, and in the side contrary with described first surface and parallel with described two dimensional surfaceSecond upper place described measurement face.
The exposure sources of scheme 17. as described in scheme 15 or 16, wherein
Described moving body comprises: the first mobile member, first moves described in described the first drive systemsMoving member; And second mobile member, described the second mobile member keeps described object, and by described inThe first mobile member supports moving with respect to described the first mobile member; And
Described measurement face is placed on described the second mobile member place.
The exposure sources of scheme 18. as described in scheme 17, also comprises:
Six degree of freedom drive system, described six degree of freedom drive system moves structure with respect to described firstPart, the first direction of principal axis orthogonal in described two dimensional surface and the second direction of principal axis sixIn individual free degree direction, drive described the second mobile member.
The exposure sources of scheme 19. as described in any one in scheme 15～18, wherein
Described the first measuring system has one or more described first and measures member, described theOne measures the member measuring center that the measurement axle of essence passes through on described measurement face, described in being radiated atThe exposure position at the irradiation area center of the energy light beam on object is consistent.
The exposure sources of scheme 20. as described in any one in scheme 15～19, also comprises:
Mark detecting system, described mark detecting system detects the mark being placed on described object, itsIn
Described the first measuring system has one or more second and measures member, and described second surveysThe amount measuring center of member and the inspection center of described mark detecting system are consistent, in wherein said measurementThe heart is the point of irradiation center on described measurement face.
The exposure sources of scheme 21. as described in any one in scheme 1～20, wherein
Described the first drive system drives described moving body in six-freedom degree direction.
The exposure sources of scheme 22. as described in any one in scheme 1～21, wherein
Described the first measuring system can further obtain described moving body with described two dimensional surface justPositional information in the direction of handing over.
The exposure sources of scheme 23. as described in scheme 22, wherein
Described the first measuring system at least or not do not measure collinear three places described moving body withPositional information in the orthogonal direction of described two dimensional surface.
24. 1 kinds of exposure sources of scheme, described exposure sources is via by the light of the first support member supportSystem utilizes energy light beam to expose to object, and described exposure sources comprises:
Moving body, described moving body keeps described object, and can move along the two dimensional surface of specifying;
The second supporting member, places described the second supporting member discretely with described the first supporting member;
The first drive system, moving body described in described the first drive systems;
Moving body supporting member, described moving body supporting member be placed on described optical system and described inBetween the second supporting member to separate with described the second supporting member, when described moving body is along described twoWhen dimensional plane moves, described moving body supporting member this moving body with described the second supporting memberLocate to support described moving body at 2 in the orthogonal direction of length direction;
The first measuring system, described the first measuring system comprises the first measurement member, described first measuresMember utilizes measuring beam irradiate the measurement face parallel with described two dimensional surface and receive from described surveyThe light of amount face, described the first measuring system utilizes the described first output of measuring member to obtain described movementBody is the positional information in described two dimensional surface at least, described measurement face be disposed in described moving body andA place in described the second supporting member, and described first at least a portion of measuring member is by clothPut another place in described moving body and described the second supporting member, and
The second measuring system, described the second measuring system obtains the position letter of described the second supporting memberBreath.
The exposure sources of scheme 25. as described in scheme 24, wherein
Described moving body supporting member is platform, and described platform is placed on described the second supporting memberDescribed optical system side is with relative with described moving body, and in the one side of the side relative with described moving bodyThe guide surface that upper formation is parallel with described two dimensional surface.
26. 1 kinds of device producing methods of scheme, comprising:
Exposure sources in operational version 1～25 described in any one exposes to object; And
Object through exposure is developed.
Utilizability in industry
As described above, exposure sources of the present invention is applicable to utilizing energy light beam that object is exposed. ThisOutward, device producing method of the present invention is applicable to manufacturing electronic device.
Claims (1)
1. an exposure sources, described exposure sources is via by the optical system of the first support member supportSystem utilizes energy light beam to expose to object, and described exposure sources comprises:
Moving body, described moving body keeps described object, and can move along the two dimensional surface of specifying;
Guide surface forms member, and described guide surface forms member and forms described moving body along described two dimensionThe guide surface using when planar movement;
The first drive system, moving body described in described the first drive systems;
The second supporting member, described the second supporting member in the side contrary with described optical system with instituteState guide surface and form member and place dividually, form member through described guide surface, with described firstSupporting member separates;
The first measuring system, described the first measuring system comprises the first measurement member, described first measuresMember irradiates the measurement face parallel with described two dimensional surface and receives from described measurement with measuring beamThe light of face, and described the first measuring system utilizes described first to measure described in the output of member obtainsMoving body is the positional information in described two dimensional surface at least, and described measurement face is disposed in described movementA place in body and described the second supporting member, and at least a portion of described the first measurement memberBe disposed in another place in described moving body and described the second supporting member; And
The second measuring system, described the second measuring system obtains the position letter of described the second supporting memberBreath.
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| US21845509P | 2009-06-19 | 2009-06-19 | |
| US61/218,455 | 2009-06-19 | ||
| US12/818,394 | 2010-06-18 | ||
| US12/818,394 US8294878B2 (en) | 2009-06-19 | 2010-06-18 | Exposure apparatus and device manufacturing method |
| CN201080027008.7A CN102460304B (en) | 2009-06-19 | 2010-06-21 | Exposure sources and device making method |
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| CN201080027008.7A Division CN102460304B (en) | 2009-06-19 | 2010-06-21 | Exposure sources and device making method |
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| CN105607429A true CN105607429A (en) | 2016-05-25 |
| CN105607429B CN105607429B (en) | 2021-10-22 |
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| CN201080027008.7A Active CN102460304B (en) | 2009-06-19 | 2010-06-21 | Exposure sources and device making method |
| CN201511025090.0A Active CN105607429B (en) | 2009-06-19 | 2010-06-21 | Exposure apparatus and device manufacturing method |
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| US (1) | US8294878B2 (en) |
| EP (2) | EP3686675A1 (en) |
| JP (1) | JP5348630B2 (en) |
| KR (3) | KR102152594B1 (en) |
| CN (2) | CN102460304B (en) |
| HK (1) | HK1224023A1 (en) |
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| CN113917800A (en) * | 2021-10-12 | 2022-01-11 | 哈尔滨工业大学 | High-dynamic ultra-precise multi-rotor workpiece table for photoetching machine |
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| US8294878B2 (en) * | 2009-06-19 | 2012-10-23 | Nikon Corporation | Exposure apparatus and device manufacturing method |
| US8355116B2 (en) * | 2009-06-19 | 2013-01-15 | Nikon Corporation | Exposure apparatus and device manufacturing method |
| NL2008272A (en) | 2011-03-09 | 2012-09-11 | Asml Netherlands Bv | Lithographic apparatus. |
| NL2008833A (en) * | 2011-06-21 | 2012-12-28 | Asml Netherlands Bv | Lithographic apparatus, method of deforming a substrate table and device manufacturing method. |
| TWI477893B (en) * | 2011-07-06 | 2015-03-21 | Univ Nat Cheng Kung | Manufacturing method of photomask |
| KR20140039245A (en) * | 2011-07-06 | 2014-04-01 | 레니쇼우 피엘씨 | Method of manufacture and apparatus therefor |
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| KR102152594B1 (en) | 2020-09-07 |
| US8294878B2 (en) | 2012-10-23 |
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| TWI503633B (en) | 2015-10-11 |
| CN102460304B (en) | 2016-01-27 |
| KR102033840B1 (en) | 2019-11-08 |
| KR102027589B1 (en) | 2019-10-01 |
| WO2010147241A2 (en) | 2010-12-23 |
| CN105607429B (en) | 2021-10-22 |
| CN102460304A (en) | 2012-05-16 |
| TWI592768B (en) | 2017-07-21 |
| JP5348630B2 (en) | 2013-11-20 |
| EP2443515B1 (en) | 2020-01-08 |
| US20110007291A1 (en) | 2011-01-13 |
| TW201734671A (en) | 2017-10-01 |
| WO2010147241A3 (en) | 2011-07-14 |
| KR20190117811A (en) | 2019-10-16 |
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