CN101180706A - Exposure apparatus and exposure method - Google Patents
Exposure apparatus and exposure method Download PDFInfo
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- CN101180706A CN101180706A CNA2006800172887A CN200680017288A CN101180706A CN 101180706 A CN101180706 A CN 101180706A CN A2006800172887 A CNA2006800172887 A CN A2006800172887A CN 200680017288 A CN200680017288 A CN 200680017288A CN 101180706 A CN101180706 A CN 101180706A
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Abstract
An exposure apparatus in which a projection optical system and a sensor for measuring the positional relationship with a predetermined member can be supported by a relatively simple and lightweight mechanism while lessening the influence of vibration on the projection optical system. In a projection exposure apparatus for projecting the image of the pattern on a reticle (R) onto a wafer (W) by means of a projection optical system (PL), the projection optical system (PL) is suspended from a base frame (18) through suspending members (35A to 35C) and supported, and a measuring frame (15) to which sensor columns (34A, 34B) provided with laser interferometers (12A, 12B) are secured is suspended from the base frame (18) through suspending members (35A to 35C) and supported.
Description
Technical field
The present invention is relevant for the exposure device of the picture that uses the set pattern of projection optical system projection and use the exposure method of this exposure device, for example be applicable in order in the photoetching process of making various elements such as semiconductor element and LCD, photomask pattern is transferred to the user of institute on the substrate.
Background technology
For example in the photoetching process of one of technology of semiconductor element, for the pattern transfer that will be formed at graticule as photomask (or photomask etc.) is exposed on the wafer that scribbles photoresist as substrate (or glass plate etc.), use projection aligner, and the exposure device of the projection aligner of scan exposure type such as scanning stepper etc. of single exposure type such as stepper.
In these exposure devices, the rigidity of the supporting mechanism of the location of carrying out graticule and wafer and the microscope carrier that moves, this microscope carrier and the portions of mechanism such as supporting mechanism of projection optical system has significant impact to removing shake performance and exposure accuracy device performance, the weight of portion of mechanism and the manufacturing costs of exposure device such as (overlapping accuracies etc.).Generally speaking, have the exposure device of high rigid mechanism portion,, but then, have portion of mechanism weight to become tendency big, that manufacturing cost rises though have the higher device performance.Therefore, proposed a kind ofly partly to keep high rigidity, but in order to alleviate the weight of portion of mechanism integral body in necessity, and with base of graticule microscope carrier and wafer carrying bench etc. to have the parallel linkage of the plural bar that can stretch respectively, give the exposure device (for example, with reference to patent documentation 1) of independent support.
In addition, recently, also develop to improving the liquid immersion type exposure device (for example, with reference to patent documentation 2) of resolution supply fluid between projection optical system and wafer.
Patent documentation 1: the international brochure that discloses No. 01/022480
Patent documentation 2: the international brochure that discloses No. 99/49504
Summary of the invention
If use the method for the parallel linkage with plural number bar that can stretch respectively of prior art, though can alleviate the control precision of machine portion weight and raising microscope carrier movable part, but also have the formation of portion of mechanism complicated, and the also complicated anxiety of control when making the location of microscope carrier and acceleration and deceleration.
Again, in the exposure device, the transducer that has use to concern in order to the position of measuring projection optical system and wafer carrying bench etc., in the past, this transducer was supported for and the projection optical system one.Yet, even is one with for example high rigid support members with projection optical system and sensor support, also can because of exposure with the irradiation of illumination light heat or from the influences such as vibration on ground, and make position relation change between projection optical system and transducer that anxiety above permissible range be arranged.Moreover, with projection optical system and sensor support is the formation of one, when the assembling of for example carrying out exposure device was adjusted, the position that has both concerned that the position of setting set objective for concerns the also elongated problem of time that required time is elongated and carry out the maintenance of projection optical system and transducer.
Again, the exposure device of existing liquid immersion type, because the part that liquid is supplied to the device between projection optical system and wafer is supported for and the projection optical system one, so the vibration that this liquid supplying apparatus produced will reach projection optical system, and the anxiety of exposure accuracy reduction is arranged.
The present invention is because the problems referred to above, its the 1st purpose is to provide a kind of exposure device, it can support in order to measure the transducer of the position relation between projection optical system and set member with mechanism comparatively simple and light weight under the state of minimizing to the vibration effect of projection optical system.
Again, the 2nd purpose of the present invention is to provide a kind of exposure device, it can support in order to liquid is supplied to the part of the device between projection optical system and exposure object object with mechanism comparatively simple and light weight under the state of minimizing to the vibration effect of projection optical system.
The 1st exposure device of the present invention with projection optical system PL projection pattern picture, possesses: measuring unit 15, it possess in order to measure this projection optical system, and and the member WST of this projection optical system associated location between the transducer 12 of position relation; And the 1st bracing or strutting arrangement 38A, 38B, 38C, 39A, it has the 1st flexible construction 38A, supports in order to this measuring unit is separated suspention with this projection optical system.
According to the present invention, the 1st flexible construction can constitute with low price than the rigid construction light weight, and also can obtain preferable characteristics such as blocking vibration, elimination thermal walking by this flexible construction.Therefore, can be under the state of minimizing, with this transducer of mechanism supports of comparatively simple and light weight to the vibration effect of projection optical system.
Secondly, the 2nd exposure device of the present invention is projected to pattern image on the object W with projection optical system PL, it is characterized in that possessing: liquid supplying apparatus 61,62,63, in order to liquid is supplied between this projection optical system and this object; And the 1st bracing or strutting arrangement 38A, 38B, 38C, 39A, it has the 1st flexible construction 38A, supports in order at least a portion of this liquid supplying apparatus is separated suspention with this projection optical system.
Among the present invention,, therefore also can under the state of minimizing, support the part of this liquid supplying apparatus with mechanism comparatively simple and light weight to the vibration effect of projection optical system because the 1st flexible construction of use is also arranged.
Among the present invention, can further possess the 2nd bracing or strutting arrangement 35A, 35B, 35C, 36A, this 2nd bracing or strutting arrangement has the 2nd flexible construction 35A, supports this projection optical system in order to suspention.In view of the above, can promote the vibrationproof performance of projection optical system.
Secondly, exposure method of the present invention uses exposure device of the present invention that this pattern image is transferred on the object.
Again, though show that for easy to understand the present invention is corresponding the drawing of an execution mode describes, the present invention is not limited to this execution mode certainly.In addition, the formation of the execution mode of corresponding drawing can suitably be improved, and also can replace at least a portion by other formation thing.
According to the 1st exposure device of the present invention, can under the state of minimizing, support in order to measure the transducer of the position relation between projection optical system and set member with mechanism comparatively simple and light weight to the vibration effect of projection optical system.
Again, according to the present invention, because measuring unit (measurement section) suspended in midair support with different suspension members respectively with projection optical system, so measuring unit and projection optical system are separated from one another in the heat transmission.Therefore, even dispose thermal source, from the also unlikely lens barrel that is passed to projection optical system of the heat of thermal source in measuring unit.So because the distortion that heat is caused can not result from lens barrel, therefore being unlikely the optical element that lens barrel inside is disposed applies unnecessary stress.Be with, can suppress the deterioration of the imaging performance of projection optical system.
According to the 2nd exposure device of the present invention, can under the state of minimizing, support in order to liquid is supplied to the part of the device between projection optical system and exposure object object with mechanism comparatively simple and light weight to the vibration effect of projection optical system again.
Moreover, at least a portion (for example in order to the supply and/or the mouth of withdrawal liquid) that the present invention also might become the liquid supplying apparatus of vibration source is fixed in members such as measuring unit, and is suspended this member in midair support with different suspension members respectively with projection optical system.So because vibration can not reach the lens barrel of projection optical system, therefore exposure device of the present invention can be with correct being transferred on the substrate of pattern of photomask etc.
Description of drawings
Fig. 1 is the figure that the summary of the projection aligner of demonstration the present invention the 1st execution mode constitutes.
Fig. 2 shows part that the summary of the portion of projection aligner mechanism of the 1st execution mode the constitutes figure that decides what is right and what is wrong.
Fig. 3 is the part of measurement frame 15 in the displayed map 2 and the projection optical system PL vertical view of deciding what is right and what is wrong.
Fig. 4 is the part of the configuration example of suspension member 35A in the displayed map 2 and the antihunting device 36A enlarged drawing of deciding what is right and what is wrong.
Fig. 5 is the stereogram of the antihunting device 36A of displayed map 4.
Fig. 6 shows part that the summary of the portion of projection aligner mechanism of the present invention's the 2nd execution mode the constitutes figure that decides what is right and what is wrong.
The main element symbol description:
15: measurement frame
18: frame pedestal
35A～35C: suspension member
36A, 39A: antihunting device
38A～38C: suspension member
40A～40C, 41A～41C: actuator
61: supply department
63: the supply mouth
65: reclaim and use mouth
67: recoverer
R: graticule
RST: graticule microscope carrier
PL: projection optical system
W: wafer
Embodiment
Below, with reference to Fig. 1～Fig. 5 preferable the 1st execution mode of the present invention is described.
Fig. 1 is the figure that each functional unit that constitutes the projection aligner of this routine exposure device is represented with squareization, among this Fig. 1, omits the process chamber (chamber) of taking in projection aligner.Among Fig. 1, be the LASER Light Source 1 of using KrF excimer laser (wavelength 248nm) or ArF excimer laser (wavelength 193nm) to be constituted as exposure light source.As this exposure light source, in addition, also can use F
2Laser (wavelength 157nm), output are from the light source of the high order harmonic component laser of solid-state laser light source (YAG or semiconductor laser etc.) or mercury discharge lamp etc.
Exposure illumination light IL from LASER Light Source 1 as exposing light beam (exposure light), homogenization optical system 2 by being made of lens combination and fly's-eye lens system, beam splitter 3, light quantity adjustment are with variable dimmer 4, speculum 5 and relay lens system 6, with Illumination Distribution irradiation reticle blind (blind) mechanism 7 of homogeneous.This routine projection aligner is the scan exposure type, the movable window shade of this field of illumination of switch when reticle blind mechanism 7 possesses in order to the fixedly window shade of regulation slit-shaped field of illumination, with scan exposure.By the illumination light IL of reticle blind mechanism 7, shine in as the field of illumination on the graticule R of photomask by imaging len system 8.Lamp optical system 9 is the formations that comprise homogenization optical system 2, beam splitter 3, variable dimmer 4, speculum 5, relay lens system 6, reticle blind mechanism 7 and imaging len system 8.Again, Fig. 1 is a functional block diagram, and the light path bending in the lamp optical system 9 is with the quantity and the configuration of speculum, and is different with the configuration of reality.
Be formed in the circuit pattern of graticule R, be subjected to the picture of illumination light illuminated portion, by the both sides heart far away and projection multiplying power is the projection optical system PL of reduction magnification (for example 1/4 etc.), is projected and images on the wafer W that scribbles photoresist as object (induction substrate or photoreceptor).Below, the axle of getting the optical axis AX that is parallel to projection optical system PL for the Z axle, to get the direction that is parallel to Fig. 1 paper in the plane perpendicular to the Z axle be X-axis, the direction of getting perpendicular to Fig. 1 paper is that Y-axis describes.In this example, be vertical direction along the direction (Z direction) of Z axle.Again, along the scanning direction of the direction (Y direction) of Y-axis graticule R and wafer W when being scan exposure, the field of illumination on the graticule R is the elongated shape of the X-direction (directions X) along non-scanning direction, and optical axis AX deflection scanning direction relatively.
Fig. 2 is from the part of portion of mechanism that-directions X is observed the projection aligner of Fig. 1 skeleton diagram of deciding what is right and what is wrong, as shown in Figure 2, this routine projection optical system PL takes in the catadioptric type projection optical system of concave mirror in the protuberance PLa of lens barrel, and carries out the projection that the Y direction is upright, directions X reverses.As this kind projection optical system PL, can use international monopoly for example to disclose the catadioptric type projection optical system that No. 2004/019128 brochure put down in writing.In addition, also can use international monopoly to disclose No. 2004/107011 brochure or international monopoly and disclose the catadioptric type projection optical system that No. 2005/59617 brochure, No. 2005/0117224 communique of U.S. Patent Publication are put down in writing.Also can use dioptric system to be used as projection optical system PL again.
Get back to Fig. 1, projection optical system PL is configured in contactless state in the central portion opening 15a of measurement frame 15 (measuring unit) of plate-like members.Be fixed with various transducers (chatting after the details) in measurement frame 15.The profile of measurement frame 15 though shown in the vertical view of Fig. 3, be the polygon at center with projection optical system PL, also can be a circle etc.
Among Fig. 1, be configured in the graticule R of the object plane side of projection optical system PL, remain on graticule microscope carrier RST in modes such as vacuum suction.Graticule microscope carrier RST goes up constant speed in Y direction (scanning direction) at graticule pedestal 31 (with reference to Fig. 2) by air bearing and moves, and can adjust the position of directions X, Y direction with around the anglec of rotation ω of Z axle R.The coordinate position of the relative projection optical system PL of graticule microscope carrier RST (directions X, Y direction position, and anglec of rotation ω R), with the moving lens Mr that is fixed in graticule microscope carrier RST, be fixed in measuring one by one of projection optical system PL upper side with reference to mirror Me and with the laser interferometer 10 of these subtends configurations.Laser interferometer 10 comprises: laser interferometer body 10a, with laser beam cut apart to moving lens Mr be supplied to speculum 10c with reference to the beam splitter 10b of mirror Me and with laser beam with reference to mirror Me.
Again, in fact laser interferometer 10 comprises: measure at 2 places that directions X separates graticule microscope carrier RST the Y coordinate laser interferometer 10A (with reference to Fig. 2) and in order to the laser interferometer 10B (with reference to Fig. 3) of the X coordinate of measuring graticule microscope carrier RST.Laser interferometer 10A and 10B are fixed on the upper end that the transducer that is individually fixed in measurement frame 15 is used pillar 34B (with reference to Fig. 2) and 34C (with reference to Fig. 3).Among Fig. 1, moving through with the drive system 11 of formations such as linear motor or micro-motion actuator of graticule microscope carrier RST carried out.The metrical information of laser interferometer 10 is supplied to microscope carrier control unit 14, microscope carrier control unit 14 is according to the control information (input information) that comes self-control system 20 (being made of the computer of planning as a whole to control this metrical information and install all actions), the action of control-driven system 11.
On the other hand, among Fig. 1, be configured in the wafer W of the image planes side of projection optical system PL, the chip holder absorption by icon not remains on the wafer carrying bench WST.Wafer carrying bench WST is loaded on the wafer holder WB (with reference to Fig. 2) by air bearing, can be displaced into the Y direction at least with constant speed when scan exposure, and can move in directions X and the stepping of Z direction.The coordinate position of the relative projection optical system PL of wafer carrying bench WST (directions X, Y direction position, and around the anglec of rotation ω of Z axle W), be fixed in projection optical system PL bottom with reference to mirror Mf1, be fixed in the moving lens Mw of wafer carrying bench WST and measure one by one with the laser interferometer 12 of these subtends configuration.With laser interferometer 10 similarly, laser interferometer 12 also comprises: laser interferometer body 12a, beam splitter 12b and speculum 12c.Laser interferometer 12 in fact also comprises: in order to the laser interferometer 12A (with reference to Fig. 2) of the Y coordinate of measuring wafer carrying bench WST, in to the exposure of wafer in 2 places that the Y direction is separated measure wafer carrying bench WST the X coordinate laser interferometer 12C (with reference to Fig. 2) and in order to measure wafer change in the laser interferometer 12D (with reference to Fig. 3) of X coordinate of wafer carrying bench WST.Laser interferometer 12,12C, 12D is fixed on the transducer pillar 34A (with reference to Fig. 2) and the 34C that are individually fixed in measurement frame 15, the bottom of 34D (with reference to Fig. 3).
Again, as shown in Figure 2, on this routine wafer holder WB, by air bearing be mounted with wafer carrying bench WST separate independent, be formed with the measurement of mutatis mutandis a plurality of reference marks with microscope carrier 29, the drive mechanism that it can be by icon not is in directions X, Y direction.Again, laser interferometer 12 in Fig. 1 also includes laser interferometer 12B and 12E (with reference to Fig. 3), the position of the moving lens Mm of microscope carrier 29 sides is measured in the measurement with reference to mirror Mf2 of its relative projection optical system PL side, measures Y coordinate and X coordinate with microscope carrier 29 according to this.In addition, when measurement is positioned at projection optical system PL below with microscope carrier 29, use the X coordinate of microscope carrier 29 with the laser interferometer 12C measurement of Fig. 3. Laser interferometer 12B and 12E are individually fixed in and are fixed on the bottom of transducer with pillar 34B (with reference to Fig. 2).In the laser interferometer 12 of Fig. 1, also comprise in order to measure the laser interferometer of wafer carrying bench WST around the anglec of rotation of X-axis and Y-axis again. Laser interferometer 10 and 12, can be considered be in order to measure projection optical system PL with as wafer carrying bench WST, the graticule microscope carrier RST of set member, and the transducer that concerns with the position of 29 of microscope carriers of the measurement of Fig. 2.
Wafer carrying bench WST and measuring with the moving of microscope carrier 29 carries out with the drive system 13 of Fig. 1 that actuator was constituted of linear motor and voice coil motor (VCM) etc.The metrical information of laser interferometer 12 is supplied to microscope carrier measuring unit 14, and microscope carrier measuring unit 14 is according to this metrical information and come the control information (input information) of self-control system 20, the action of control-driven system 13.
Among Fig. 1, in wafer carrying bench WST also possess control wafer W Z direction position (focal position), with Z levelling gear around the inclination angle of X-axis and Y-axis.Be fixed with the multi-point automatic focusing transducer (23A of oblique incidence mode in measurement frame 15,23B), this multi-point automatic focusing transducer is by the projection optics system 23A to a plurality of measurement point projection slit pictures on wafer W surface, with receive from the picture traversing amount information of this surperficial reverberation with the imaging again that detects these slit images, its light receiving optical system 23B that is supplied to microscope carrier control unit 14 is constituted.As an example, projection optics system 23A and light receiving optical system 23B, as shown in Figure 2, be separately fixed at the 1st support portion 16A and the 2nd support portion 16B, the 1st support portion 16A and the 2nd support portion 16B are fixed on the bottom surface of measurement frame 15 across projection optical system PL in the Y direction.It is in order to measuring projection optical system PL and the transducer that concerns as the position between the wafer W of set member that automatic focus transducer 23A, 23B also can be considered, and its detailed formation, has been disclosed in for example Japanese kokai publication hei 1-253603 communique.
Microscope carrier control unit 14, use is from the traversing amount information of the slit image of automatic focus transducer 23A, 23B, calculate defocus amount from projection optical system PL image planes in these a plurality of measurement points, drive Z levelling gear in the wafer carrying bench WST in when exposure in the automatic focus mode, so that this defocus amount maintains in the set control precision.
Again, microscope carrier control unit 14 comprises: according to the metrical information of laser interferometer 10 drive system 11 is controlled to be best graticule side control circuit, with metrical information according to laser interferometer system 12 drive system 13 is controlled to be best wafer side control circuit.In addition, master control system 20 instructs each other with each control circuit in the microscope carrier control system 14 and the exchange of parameter, implements optimum exposure according to the specified program of operator and handles.Therefore, be provided with operation panel unit (comprising input element and display element) as the not icon of the interface of operator and master control system 20.
Further, the time must carry out aiming at of wafer W and graticule R in advance in exposure.Therefore, the projection aligner of Fig. 1 is provided with in order to graticule R is set in both the reticle alignment system of allocation (below, claim the RA system) 21 and in order to detect the alignment system 22 (mark detecting system) from the axle mode of the mark on the wafer W.The body of alignment system 22 is fixed in measurement frame 15, and with its leading section to mutatis mutandis illuminated light guide to detected mark, and will from the photoconduction of this certification mark to this body send the light optical system, be fixed in for example the 2nd support portion 16B of Fig. 2.Alignment system 22, can be considered is in order to measure projection optical system PL and wafer W and to measure the transducer that concerns with the position between the detected mark on the microscope carrier 29.
As previously discussed, in this example, because wafer carrying bench WST separates with microscope carrier 29 with measurement, therefore, among Fig. 2, for example make wafer carrying bench WST past-the Y direction moves and carries out wafer when changing, can move to below the projection optical system PL by measuring with microscope carrier 29, detect the set reference mark of measuring on the microscope carrier 29 with RA system 21 and alignment system 22 in regular turn, carry out the measurement at datum line amount (interval of the inspection center of exposure center and alignment system 22).Afterwards, back out with microscope carrier 29 past+Y directions making to measure, wafer carrying bench WST is moved to the below of projection optical system PL, use alignment system 22 carries out wafer W on time, can use this datum line amount to aim at accurately.
Among Fig. 1, when LASER Light Source 1 is quasi-molecule laser source, be provided with the laser controlling unit 25 under the control of master control system 20, this control unit 25 is the impulse hunting pattern (simple venation pattern, burst pattern, standby mode etc.) of control LASER Light Source 1, and controls the discharge high voltage of LASER Light Source 1 for the average light quantity of adjusting the pulse laser that penetrates.Again, fader control unit 27, according to from photoelectric detector 26 (integrator sensors, in order to receive a part of illumination light that beam splitter 3 is cut apart) the variable dimmer 4 of signal controlling obtaining suitable exposure, and pulsing light light intensity (light quantity) information is delivered to laser controlling unit 25 and master control system 20.
In addition, among Fig. 1, when scan exposure, after the irradiation of beginning illumination light IL to graticule R, under the state of a part of pattern with graticule R by an irradiation area on the sub-wafer W of picture projection of projection optical system PL, by make graticule microscope carrier RST and wafer carrying bench WST with the projection multiplying power of projection optical system PL be speed than the scan exposure action of same moved further (synchronous scanning) in the Y direction, the pattern image of graticule R is transferred to this irradiation area.Afterwards, the irradiation of lighting-off light IL, the action and the above-mentioned scan exposure that repeat to make the wafer W stepping be displaced into directions X, Y direction by wafer carrying bench WST move, with step-scan (step ﹠amp; Scan) mode is transferred to all irradiation areas on the wafer W with the pattern image of graticule R.
Secondly, describe the formation of this routine portion of projection aligner mechanism in detail.
In the portion of mechanism shown in Figure 2, be provided with two the pedestal 17A and the 17B that vary in size in ground FL and be used as base, with the face that is provided with of regulation projection aligner.Be fixed with LASER Light Source 1 and the 1st illuminator chamber 19A on small-sized pedestal 17B, going up to link in the 1st illuminator chamber 19A has the 2nd illuminator chamber 19B.As an example,, take in the lamp optical system 9 of Fig. 1,6 member among the 19B from homogenization optical system 2 to relay lens system in illuminator chamber 19A; In the 19C of the ejaculation end of illuminator chamber 19B, take in the movable window shade of reticle blind mechanism 7.In addition,, take in illumination light bending speculum upward from LASER Light Source 1 in the bottom of the 1st illuminator chamber 19A, and different with the light path bending among Fig. 1 with the configuration and the quantity of speculum.
On the other hand, be fixed with wafer holder WB on the large-scale pedestal 17A, go up in mode side by side in wafer holder WB and be mounted with wafer carrying bench WST and measure with microscope carrier 29.Again, be provided with frame pedestal 18 (framework) in pedestal 17A around wafer holder WB, on frame pedestal 18, load graticule bar 31, on graticule bar 31, load in order to keep the graticule microscope carrier RST of graticule R by for example active vibration insulators 30A and 30B (in fact being to be configured in 3 or 4 positions).In addition, on graticule bar 31, be supported with the 3rd illuminator chamber 19E that the imaging system 8 of Fig. 1 is taken in confession by pillar 32, incident end 19D in the 3rd illuminator chamber 19E takes in the fixedly window shade of the reticle blind mechanism 7 of Fig. 1, and directions X (non-scanning direction) both ends of the light path of the illumination light IL in pillar 32 leading section openings dispose a pair of RA system 21.In this case, projection optical system PL is by the opening 15a of measurement frame 15 central portions and the opening 18a on frame pedestal 18 tops, and its leading section is accommodated in the recess of the central portion bottom surface of graticule bar 31, is formed with the opening that illumination light IL uses in this recess.
As previously discussed, projection optical system PL relative measurement frame 15 and frame pedestal 18 dispose with contactless state.In measurement frame 15, be fixed with transducer sprag 34A, 34D, 34E (with reference to Fig. 3, be fixed with laser interferometer 12A in these pillars, 12D, 12E), and transducer with long struts 34B and 34C (be fixed with laser interferometer 12B respectively, 10A and 12C, 10B).Transducer is used the upper end of long struts 34B, with contactless state by frame pedestal 18 opening 18a and the opening 31a of graticule bar 31 in project on the graticule bar 31, similarly, the transducer of Fig. 3 with pillar 34C also to project on the graticule bar 31 in the opening of contactless state by frame pedestal 18 and graticule bar 31.In addition, in the bottom surface of measurement frame 15, as previously mentioned, be fixed with a pair of support portion 16A, 16B (is equipped with automatic focus transducer (23A, 23B) and the part of alignment system 22).
Again, this routine measurement frame 15 supports with the independent suspention dividually of projection optical system PL by suspension member (the 1st flexible construction) 38A, 38B, 38C (with reference to Fig. 3) from the bottom surface three on frame pedestal 18 tops.In this example,, also can replace chain and use metal wire or upper and lower side to be formed with bar member of elastic construction etc. though use chain as suspension member 38A～38C.In addition, between suspension member 38A～38C and frame pedestal 18, be provided with antihunting device 39A (with reference to Fig. 4) such as (vibrationproof portions) in order to the Z direction vibration of the optical axis direction that alleviates projection optical system PL.By frame pedestal 18, suspension member 38A～38C, and antihunting device 39A etc., constitute the 1st bracing or strutting arrangement that supports measurement frame 15 in order to suspention.So, by independently supporting measurement frame 15 with the flexible construction suspention of light weight with projection optical system PL, (for example can alleviate from the vibration of measurement frame 15, constitute the vibrating member etc. of the part of autofocus system) to the influence of projection optical system PL, and can possess the measurement frame 15 of various transducers with the mechanism supports of simple light weight.Again, during this constitutes, though the possibility that has the relative position of projection optical system PL and measurement frame 15 to change, but because the laser interferometer 12A in the measurement frame 15,10A etc. are the relative positions of measuring wafer carrying bench WST and the relative projection optical system PL of graticule microscope carrier RST, so wafer carrying bench WST and graticule microscope carrier RST, perseverance can be that benchmark carries out high-precision Position Control with projection optical system PL.
Among Fig. 2, be formed with lip portions PLb in projection optical system PL side, this lip portions PLb suspends support from the bottom surface three on reference frame 18 tops in midair by suspension member (the 2nd flexible construction) 35A, 35B, 35C (with reference to Fig. 3).The formation of suspension member 35A～35C is identical with suspension member 38A～38C, between suspension member 35A～35C and frame pedestal 18, also is provided with in order to alleviate the antihunting device 36A (with reference to Fig. 4) such as (vibrationproof portions) of Z direction vibration.Antihunting device 36A chats after the formation of 39A is waited until.By frame pedestal 18, suspension member 35A～35C, and antihunting device 36A etc., constitute the 2nd bracing or strutting arrangement in order to suspention support projection optical system PL.So, the support projection of the suspention of the flexible construction by light weight similarly optical system PL can alleviate vibration when driving wafer carrying bench WST and graticule microscope carrier RST, and from the vibration of the ground FL influence to projection optical system PL.In addition, projection optical system PL also can be fixed in for example frame pedestal 18 or the not pillar of icon by high rigid member.
Again, shown in the vertical view of the measurement frame 15 of Fig. 3, support in this example measurement frame 15 suspension member 38A～38C, with suspension member 35A～35C of support projection optical system PL, be configured in roughly the same angle position in the side of projection optical system PL.By making suspension member 38A～38C consistent, can make measurement frame 15 and projection optical system PL be easy to be assembled into the projection aligner body, and promote the stability of measurement frame 15 and projection optical system PL with the phase place of suspension member 35A～35C.In addition, might not make suspension member 38A～38C consistent, for example also suspension member 35A～35C can be configured in the roughly centre position between suspension member 38A～38C with the phase place of suspension member 35A～35C.Moreover, the quantity (support of projection optical system PL is counted) of the quantity of suspension member 38A～38C (support of measurement frame 15 is counted) and suspension member 35A～35C can be beyond 3 for example more than 4, the quantity of the quantity of suspension member 38A～38C and suspension member 35A～35C also can be different.
This structure can obtain high removing and shake performance and can significantly alleviate portion of mechanism weight, but the relative position of this projection optical system PL and frame pedestal 18 might be with lower frequency change.Therefore, for the relative position with 18 of projection optical system PL and frame pedestals is maintained at set state, three places in the bottom surface on frame pedestal 18 tops are fixed with pillar 33A, 33B, the 33C (with reference to Fig. 3) that extends the Z direction, are provided with the positioner of the 6DOF of noncontact mode between the lip portions PLb of these pillars 33A～33C and projection optical system PL.
Among Fig. 3, be fixed with arm 37A, 37B, the 37C that extends to lip portions PLb direction respectively in pillar 33A, 33B, 33C.Arm 37A～37C around the optical axis AX of projection optical system PL with 120 ° of arranged spaced roughly.In addition, between the 1st arm 37A and the lip portions PLb, be provided with so that lip portions PLb in the 1st actuator 40A of Z direction displacement, with so that lip portions PLb in the 2nd actuator 41A of circumferencial direction displacement.As actuator 40A,, in addition also can use the noncontact electromagnetic actuators of the mode unshakable in one's determination of EI for example etc. though 41A can use voice coil motor.
On near the lip portions PLb the arm 37A, be provided with the 1st double-axel acceleration sensor 39A in order to the acceleration of the Z direction that detects lip portions PLb and circumferencial direction again.The twin shaft acceleration information that detects with acceleration transducer 39A is provided to control part 42, and control part 42 drives dual-axis actuator 40A according to this acceleration information, and 41A is so that the relative arm 37A of this lip portions PLb (and then frame pedestal 18 of Fig. 2) is static.
Among Fig. 3, between the 2nd arm 37B and the lip portions PLb and between the 3rd arm 37c and the lip portions PLb, also be respectively equipped with so that lip portions PLb in the 3rd and the 5th actuator 40B of Z direction displacement and 40C, with make 4th and 6th actuator 41B and the 41C of lip portions PLb in the circumferencial direction displacement.Actuator 40B, 41B and 40C, the formation of 41C respectively with actuator 40A, 41A is identical.On near arm 37B and the 37C the lip portions PLb, be respectively equipped with the 2nd and the 3rd double-axel acceleration sensor 39B and 39C in order to the acceleration of the Z direction that detects lip portions PLb and circumferencial direction again.The acceleration information of acceleration transducer 39B and 39C also is provided to control part 42, control part 42 drives dual-axis actuator 40B according to this acceleration information, 41B and 40C, 41C is so that this lip portions PLb relative arm 37B of difference and 37C (and then frame pedestal 18 of Fig. 2) are static.
As previously mentioned, comprise acceleration transducer 39A～39C (displacement transducer) of 6, actuator 40A～40C of 6,41A～41C and control part 42 constitute the positioner of projection optical system PL (lip portions PLb).By this positioner,, and be maintained at certain state around the relative anglec of rotation of X-axis, Y-axis, Z axle with the relative position of the directions X of the relative frame pedestal 18 of projection optical system PL, Y direction, Z direction.Actuator 40A～40C that this is routine, the response frequency of 41A～41C is the 10Hz degree, at the vibration till this response frequency, this routine projection optical system PL is supported with the active sus-pension.At the vibration that surpasses this frequency, projection optical system PL is then suspended in midair support with passive vibration absorbing structure.
Though use 3 pillar 33A～33C among Fig. 3, also can use 4 pillars again.
Secondly, with reference to be configured in Fig. 4 and Fig. 5 key diagram 2 suspension member 35A and frame pedestal 18 between the configuration example of antihunting device 36A.Again, be located at the formation of the antihunting device 39A between suspension member 38A and the frame pedestal 18, also roughly identical with antihunting device 36A.
Fig. 4 is the part that shows suspension member 35A and the antihunting device 36A enlarged drawing of deciding what is right and what is wrong, Fig. 5 is the stereogram of the antihunting device 36A of Fig. 4, among Fig. 4, bottom surface in frame pedestal 18, be fixed with in central authorities and be formed with circular open and be formed with the supporting member 55 of spacer portion in both ends, the cylinder 52 that is fixed with cylindric, bottom surface sealing in the bottom surface of supporting member 55 is to cover this circular open.Again, in cylinder 52 across plurality of gaps, with can about the state configuration that moves freely of (± direction) direction piston 54 is arranged, bending arm 53a is downwards passed through in the outside at 3 places respectively in the top of piston 54,53b, 53c (with reference to Fig. 5) is linked to the discoideus member 52 that is configured in cylinder 52 belows, and linking in the coupling member 51B of the underrun L of discoideus member 52 font has suspension member 35A.Suspension member 35A is the lip portions PLb that is linked to projection optical system PL by the coupling member 51A of the font of falling L.When suspension member 35A was chain, not only terminal processing was very easy, and its length adjustment is also easy.
Among Fig. 5, be formed with rectangular aperture 55a, 55b, 55c in mode in 3 places, insert logical arm 53a～53c in these openings 55a～55c inside respectively around central circular openings in supporting member 55.
Get back to Fig. 4, be formed with opening 56a in the side of cylinder 56.Air outside compressor (not icon) is linked to opening 56a by air inlet pipe 57, from the supply of the space between air inlet pipe 57 countercylinders 56 and the piston 54 compression stroke of height dedusting.In view of the above, cylinder 56 promptly slides in the Z direction in the noncontact mode by air bearing with piston 54.Again, because this compression stroke system flows into the space B 2 of piston 54 bottom surface sides in cylinder 56, therefore pushing up piston 54 and suspension member 35A upward by this compressed air phase countercylinder 56, (+Z direction) supported.By this formation, frame pedestal 18 promptly links in the noncontact mode with suspension member 35A.Comprise supporting member 55, cylinder 56, piston 54, arm 53a～53c, discoideus member 52 and air inlet pipe 57 and constitute antihunting device 36A.
Among this antihunting device 36A, pass the compressed air of the space of 54 in cylinder 56 and piston, disengage to the top of piston 54 toward the top.Also this compressed air that disengage toward the top can be delivered to the outside from the side of cylinder 56 by the blast pipe of icon not again.In this example, the interval g1 between supporting member 55 and arm 53a～53c sets the interval that is narrower than 54 in cylinder 56 and piston for, and the compressed-air actuated pressure that control air inlet pipe 57 is supplied is so that this interval g1 is certain.Therefore, the projection optical system PL of piston 54 and suspension member 35A and then the Fig. 2 of company, all being supported for perseverance can float with certain in fact pressure.Therefore, even frame pedestal 18 vibrates in the Z direction, therefore the also unlikely suspension member 35A that reaches of this vibration also can obtain the high performance of shaking of removing in vertical direction.
Again, when reducing the compressed-air actuated pressure that air inlet pipe 57 supplied, arm 53a～53c promptly is loaded on the bottom surface of supporting member 55, prevents that suspension member 35A and projection optical system PL from further reducing.
Again, be arranged in order to the suspention Fig. 2 measurement frame 15 Fig. 3 suspension member 38A (38B, 38C are too), and frame pedestal 18 between antihunting device 39A, also the antihunting device 36A with Fig. 4 is roughly the same formation.But among the antihunting device 39A, the interval g2 that arm 53a～53c and supporting member are 55 sets for than the interval g1 of vibrationproof member 36A wide (for example 0.5～1mm degree).Its result, for example when desiring to stop the situation of step of exposure, by stopping to supply compressed air to air inlet pipe 57, the measurement frame 15 of Fig. 2 promptly moves toward the direction of leaving projection optical system PL slightly.That is, antihunting device 39A also has the effect of measurement frame 15 along the travel mechanism that the optical axis direction of projection optical system PL moves that make.In view of the above, can prevent really that projection optical system PL from contacting with measurement frame 15.
As antihunting device 39A, can use electromagnetic actuators of displacement 1mm degree for example etc. again.Moreover the mechanism etc. that as antihunting device 36A, except that utilizing the atmospheric mechanism as this example, uses helical spring mechanicalness mechanism, uses mechanism such as noncontact electromagnetic actuators such as voice coil motor or make up these all can.
As previously discussed, in this routine projection aligner, as shown in Figures 2 and 3, to the frame pedestal 18 of rigid construction suspension member 35A～35C and 38A～38C, suspend support projection optical system PL respectively in midair and the measurement frame 15 of various transducers is installed with the active sus-pension by flexible construction.Therefore, have the following advantages.
(1) owing to after assembling, also can keep the state of also being adjusted with modular manner assembling projection optical system PL and measurement frame 15, its result can shorten the precision confirmation step after assembling.
When (2) carrying out the replacing of projection optical system PL and/or measurement frame 15 in the manufacturing works of the manufacturing works of exposure device or semiconductor element etc., because the adjustment state to the part beyond these causes the possibility of variation to eliminate in fact fully, therefore can shorten the set-up procedure (involution step) after changing.
(3) by the separating of projection optical system PL and measurement frame 15, the benchmark of measurement can be unified to be " the lens barrel outside of projection optical system PL ".Therefore, need not note the rigidity and the thermal expansion character of measurement frame 15 in design, can constitute measurement frame 15 with cheap material.
Owing to need not therefore can make measurement frame 15 miniaturizations, lightweight with measurement frame 15 support projection optical system PL, with regard to the result, the degree of freedom of design can be applied to the warm air-conditioning system in the exposure device.Its result can realize the lightweight that exposure device is all, can expect that also the shortening of built-up time and shipment advantage such as transport easily.
Again, in the present embodiment, though with the laser interferometer 12B of wafer side and the integrated transducer pillar 34B that is fixed in of laser interferometer 10A of graticule side, the present invention is not limited to present embodiment.For example, both can be separated and only wherein a side supported with pillar 34B with transducer, the opposing party is then with other position support.At this moment, can adopt laser interferometer 10A to be disposed at graticule bar 31 but not the transducer formation of pillar 34B with the graticule side.
Secondly, with reference to Fig. 6 the 2nd execution mode of the present invention is described.The projection aligner that this is routine changes the projection aligner of Fig. 2 into liquid immersion type.The part of corresponding diagram 2 is given same-sign and detailed among Fig. 6.
Fig. 6 shows that the summary of the portion of mechanism of the projection aligner that this is routine constitutes, among this Fig. 6, suspension member 35A～35C suspention in 3 places of the underrun flexible construction on frame pedestal 18 tops is supported with projection optical system PL, and suspension member 38A～38C suspention at 3 places by flexible construction is supported with measurement frame 15.And, in the bottom surface of measurement frame 15 to be fixed with support portion 16A and 16B across the mode of projection optical system PL leading section in Y direction (scanning direction).
Again, the supply department 61 and the recoverer 67 of liquid are set on the FL of ground, liquid such as pure water 64 from supply department's 61 supplies, be supplied between projection optical system PL and the wafer W with mouth 63 by having flexual pipeline 62 and metallic supply, by under this state, exposing, the resolution of projection optical system PL can be promoted, also depth of focus can be improved.In addition, the liquid of being supplied 64, by metallic recovery with mouth 65 and have flexual pipeline 66 and be attracted and be recycled to recoverer 67.Comprise supply department 61, pipeline 62, and supply constitute liquid supplying apparatus with mouth 63, comprise and reclaim with mouth 65, pipeline 66, reach the retracting device that recoverer 67 constitutes the attraction withdrawal liquid.Again, the concrete formation of liquid supplying apparatus and retracting device, for example being disclosed in, international monopoly discloses No. 99/49504 brochure etc.
In this example, the supply of the part of liquid supplying apparatus is fixed in+the support portion 16B of Y direction with mouth 63, and the recovery of the part of retracting device is fixed in-the support portion 16A of Y direction with 65 of mouths.During this constituted, because liquid 64 is the flow direction-Y direction, so wafer carrying bench WST (wafer W) also was scanned in-Y direction.From the above, since in+Y scanning direction wafer carrying bench WST to carry out immersion exposure, therefore also be fixed with supply with mouth (not icon) in support portion 16A side, also be fixed with recovery mouth (not icon) in support portion 16B, these mouths also are linked to supply department 61 and recoverer 67 respectively.All the other formations are identical with the projection aligner of Fig. 1 and Fig. 2, also are fixed with in order to the transducer of taking in laser interferometer 12A and laser interferometer 12B etc. with pillar 34A and 34B etc. in the measurement frame 15 of Fig. 6.
As previously discussed, be fixed in measurement frame 15 by support portion 16B and 16A respectively with mouth 65, can reduce from supply department 61 flowing to of the influence of the liquid of recoverer 67, promote exposure accuracy the vibration of projection optical system PL by supplying with mouth 63 and reclaiming.
In addition, for example reclaim with mouth 65, the pillar etc. that also can be located at frame pedestal 18 is supported.Also can support the part of pipeline 62 and 66 with measurement frame 15 again.
Again, the projection aligner of above-mentioned execution mode, can be by being assembled into the exposure device body by lamp optical system, the projection optical system that a plurality of optical components constitute and carrying out the optics adjustment, after graticule microscope carrier that will be made of most machine components and wafer carrying bench are installed on exposure device body and connection line and pipeline, comprehensively adjust (electric adjustment, confirming operation etc.) and made.Again, the manufacturing of this projection aligner is preferably carried out in the clean room that temperature and cleannes etc. is all managed.
Again, when using the projection aligner of above-mentioned execution mode to make semiconductor element, this semiconductor element through the step of the function of element, performance design, according to this step make graticule step, form the step of wafer, the pattern exposure of graticule to step, element number of assembling steps (comprising cutting step, engagement step, encapsulation step) and the inspection step of formations circuit patterns such as the step of wafer, etching waited after using the projection aligner of above-mentioned execution mode to aim at and made from silicon materials.
Again, the present invention also can be applicable to single exposure type projection aligners such as stepper.Moreover, also can be applicable to and use reflecting system to be used as projection optical system, and use the number of wavelengths nm～extreme ultraviolet (EUV light) of 100nm degree to be used as the projection aligner of exposure light bundle.
Again, the present invention is not limited to be suitable for the exposure device to semiconductor element manufacturing usefulness, for example, also can be widely used in being formed on the exposure device that display unit such as the liquid crystal display cells of square glass plate or plasma display panel are used, and in order to make photographic element (CCD), micromechanics, film magnetic head, and the exposure device of various elements such as DNA chip.Exposure technology (exposure device) when in addition, the present invention also can be applicable to the photomask (photomask, graticule etc.) that adopts photoetching process to make the photomask pattern that is formed with various elements.
As previously discussed, the invention is not restricted to above-mentioned execution mode, in not breaking away from main idea scope of the present invention, various formations can be arranged.Again, the application's case is quoted all disclosure that comprise specification, claim, graphic and summary of Japanese Patent Application 2005-292186 number of proposing on October 5th, 2005 and Japanese Patent Application 2006-273493 number of proposing on October 4th, 2006 fully.
Utilize exposure device of the present invention, the assembling adjustment of exposure device will become easily, and remove and shake performance acquisition lifting and can promote exposure accuracy, so the various elements that energy is cheap and manufacturing comprises fine pattern accurately.
Claims (19)
1. exposure device, it is characterized in that with projection optical system projection pattern picture described exposure device possesses:
Measuring unit, it possess in order to measure described projection optical system, and and the member of described projection optical system associated location between the transducer of position relation; And
The 1st bracing or strutting arrangement, it has the 1st flexible construction, supports in order to described measuring unit is separated suspention with described projection optical system.
2. exposure device as claimed in claim 1 is characterized in that described exposure device further possesses the 2nd bracing or strutting arrangement, and this 2nd bracing or strutting arrangement has the 2nd flexible construction, supports described projection optical system in order to suspention.
3. exposure device as claimed in claim 2 is characterized in that, the support that described the 1st bracing or strutting arrangement supports described measuring unit is counted, and counts identical with the support that described the 2nd bracing or strutting arrangement supports described projection optical system;
Described the 1st, the 2nd bracing or strutting arrangement is to be configured in identical in fact angle position in the side of described projection optical system.
4. as claim 2 or 3 described exposure devices, it is characterized in that described the 1st, the 2nd bracing or strutting arrangement comprises metal wire or chain.
5. as each described exposure device in the claim 2 to 4, it is characterized in that, in the vibrationproof portion that the part setting of described the 2nd bracing or strutting arrangement is vibrated in order to the optical axis direction that alleviates described projection optical system.
6. as each described exposure device in the claim 1 to 5, it is characterized in that described exposure device possesses in the noncontact mode described projection optical system positioning means for positioning in addition.
7. exposure device as claimed in claim 6 is characterized in that, described the 1st bracing or strutting arrangement has the framework that supports described the 1st flexible construction;
Described positioner is that described relatively framework is located described projection optical system.
8. exposure device as claimed in claim 7 is characterized in that, described positioner possesses:
Displacement transducer is in order to measure the 6DOF displacement information of the described relatively framework of described projection optical system; And
The 6DOF actuator according to the measurement result of described displacement transducer, is located the described relatively framework of described projection optical system in the noncontact mode.
9. as each described exposure device in the claim 1 to 8, it is characterized in that described the 1st bracing or strutting arrangement possesses travel mechanism, it makes described measuring unit move along the optical axis direction of described projection optical system.
10. as each described exposure device in the claim 1 to 9, it is characterized in that described exposure device possesses the 1st microscope carrier that keeps object and move, described object is described pattern image projection place of carrying out projection with described projection optical system;
The described transducer of described measuring unit comprises the 1st laser interferometer in order to the position of measuring described the 1st microscope carrier, with in the focal position measurement mechanism of the position of the described projection optical system optical axis direction of measuring described body surface at least one.
11. exposure device as claimed in claim 10 is characterized in that, described exposure device possesses photomask and the 2nd mobile microscope carrier that keeps being formed with described pattern;
The described transducer of described measuring unit comprises the 2nd laser interferometer in order to the position of measuring described the 2nd microscope carrier.
12. an exposure device, it is projected to pattern image on the object with projection optical system, it is characterized in that, described exposure device possesses:
Liquid supplying apparatus is in order to be supplied to liquid between described projection optical system and the described object; And
The 1st bracing or strutting arrangement, it has the 1st flexible construction, supports in order at least a portion of described liquid supplying apparatus is separated suspention with described projection optical system.
13. exposure device as claimed in claim 12 is characterized in that, described exposure device possesses in order to attract the retracting device of the described liquid between described projection optical system and described object;
At least a portion of described retracting device is supported on described the 1st bracing or strutting arrangement.
14. as claim 12 or 13 described exposure devices, it is characterized in that, described exposure device supports a transducer with described the 1st bracing or strutting arrangement, described transducer in order to measure described projection optical system, and and the member of described projection optical system associated location between the position relation.
15. as each described exposure device in the claim 12 to 14, it is characterized in that described exposure device further possesses the 2nd bracing or strutting arrangement, this 2nd bracing or strutting arrangement has the 2nd flexible construction, supports described projection optical system in order to suspention.
16. exposure device as claimed in claim 15 is characterized in that, the support that described the 1st bracing or strutting arrangement supports described liquid supplying apparatus is counted, and counts identical with the support that described the 2nd bracing or strutting arrangement supports described projection optical system;
Described the 1st, the 2nd bracing or strutting arrangement is configured in identical in fact angle position in the side of described projection optical system.
17., it is characterized in that described the 1st, the 2nd bracing or strutting arrangement comprises metal wire or chain as claim 15 or 16 described exposure devices;
Part in described the 2nd bracing or strutting arrangement is provided with the vibrationproof portion of vibrating in order to the optical axis direction that alleviates described projection optical system.
18., it is characterized in that described exposure device possesses in the noncontact mode described projection optical system positioning means for positioning in addition as each described exposure device in the claim 12 to 17.
19. an exposure method is characterized in that:
Use each described exposure device in the claim 1 to 18, described pattern image is transferred on the object.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005292186 | 2005-10-05 | ||
| JP292186/2005 | 2005-10-05 | ||
| JP273493/2006 | 2006-10-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101180706A true CN101180706A (en) | 2008-05-14 |
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ID=39406071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006800172887A Pending CN101180706A (en) | 2005-10-05 | 2006-10-04 | Exposure apparatus and exposure method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101180706A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101963271A (en) * | 2010-09-29 | 2011-02-02 | 上海微电子装备有限公司 | Bracket capable of improving modal performance |
| CN102460305A (en) * | 2009-06-19 | 2012-05-16 | 株式会社尼康 | Exposure apparatus and device manufacturing method |
| CN102460304A (en) * | 2009-06-19 | 2012-05-16 | 株式会社尼康 | Exposure apparatus and device manufacturing method |
| CN104749904A (en) * | 2013-12-31 | 2015-07-01 | 上海微电子装备有限公司 | Objective lens supporting device and lithography machine |
| CN106548930A (en) * | 2016-10-24 | 2017-03-29 | 上海华力微电子有限公司 | A kind of method for reducing exposure focal length error |
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2006
- 2006-10-04 CN CNA2006800172887A patent/CN101180706A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102460305A (en) * | 2009-06-19 | 2012-05-16 | 株式会社尼康 | Exposure apparatus and device manufacturing method |
| CN102460304A (en) * | 2009-06-19 | 2012-05-16 | 株式会社尼康 | Exposure apparatus and device manufacturing method |
| CN102460305B (en) * | 2009-06-19 | 2016-01-27 | 株式会社尼康 | Exposure device and device producing method |
| CN102460304B (en) * | 2009-06-19 | 2016-01-27 | 株式会社尼康 | Exposure sources and device making method |
| CN101963271A (en) * | 2010-09-29 | 2011-02-02 | 上海微电子装备有限公司 | Bracket capable of improving modal performance |
| CN101963271B (en) * | 2010-09-29 | 2012-06-20 | 上海微电子装备有限公司 | Bracket capable of improving modal performance |
| CN104749904A (en) * | 2013-12-31 | 2015-07-01 | 上海微电子装备有限公司 | Objective lens supporting device and lithography machine |
| WO2015101194A1 (en) * | 2013-12-31 | 2015-07-09 | 上海微电子装备有限公司 | Objective lens support device and photoetching machine |
| CN104749904B (en) * | 2013-12-31 | 2017-08-25 | 上海微电子装备（集团）股份有限公司 | Object lens support meanss and litho machine |
| CN106548930A (en) * | 2016-10-24 | 2017-03-29 | 上海华力微电子有限公司 | A kind of method for reducing exposure focal length error |
| CN106548930B (en) * | 2016-10-24 | 2019-07-23 | 上海华力微电子有限公司 | A method of reducing exposure focal length error |
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