CN102549502A

CN102549502A - Exposure apparatus and device manufacturing method

Info

Publication number: CN102549502A
Application number: CN2010800433718A
Authority: CN
Inventors: 一之濑刚
Original assignee: Nikon Corp
Current assignee: Nikon Corp
Priority date: 2009-09-30
Filing date: 2010-09-30
Publication date: 2012-07-04
Also published as: TW201137532A; JP2013506973A; WO2011040646A3; US20110085150A1; KR20120091159A; WO2011040646A2

Abstract

A wafer (W) is loaded on a wafer stage (WST1) and unloaded from the wafer stage (WST1), using a chuck member (102) which holds the wafer (W) from above in a non-contact manner. Accordingly, members and the like to load/unload the wafer (W) on/from the wafer stage (WST1) do not have to be provided, which can keep the stage from increasing in size and weight. Further, by using the chuck member (102) which holds the wafer (W) from above in a non-contact manner, a thin, flexible wafer can be loaded onto the wafer stage (WST1) as well as unloaded from the wafer stage (WST1) without any problems.

Description

Exposure sources and device producing method

Technical field

The present invention relates to a kind of exposure sources and device producing method, more specifically, relate to therein and utilize energy beam with the exposure sources of object exposure and the device producing method that uses this exposure sources through optical system.

Background technology

Routine traditionally; Be used for making photoetching process, mainly using the exposure sources of the apparatus for projection exposure (so-called scanning ledex (it also is known as scanner)) of apparatus for projection exposure of stepping repetitive mode (so-called ledex) for example or step-scan mode such as the electronic installation (micro device) of semiconductor device (integrated circuit etc.) or liquid crystal display cells.

In the exposure sources of these types, use receive exposure such as the substrate of wafer, glass plate etc. just gradually (for example, under the situation of wafer for every at a distance from 10 years) become increasing.Though having the 300mm wafer of 300mm diameter is present main flow, the arrival with 450mm wafer epoch of 450mm diameter closes on (for example, with reference to non-patent literature 1) day by day.When occurring to the transition of 450mm wafer, the quantity of the section that from single wafer, produces (chip) becomes the twice of quantity of the chip that from present 300mm wafer, produces or more, and it helps to reduce cost.In addition, be expected to be used for reducing the cost that all resources are used through efficiently making of energy, water and other resource.

But, because the thickness of wafer do not increase with the size of wafer pro rata, thus when than the 300mm wafer, the strength ratio of 450mm wafer a little less than.Therefore, even when solving the problem of carrying wafers for example, also can reckon with, will be difficult to carry out carrying wafers with the identical ways and means of present 300mm wafer.Therefore, expectation can be handled the appearance of the new system of 450mm wafer.

Reference list

Non-patent literature

[non-patent literature 1] International Technology Roadmap for Semiconductors (international semiconductor technical development prospect), version in 2007.

Summary of the invention

According to a first aspect of the invention; First exposure sources is provided; Said first exposure sources is through utilizing energy beam that object is made public by the optical system of first supporting members supports; Said equipment comprises: movable body, said movable body keep said object and can move along predetermined plane; Guiding surface forms member, and said guiding surface forms member and forms employed guiding surface when said movable body moves along said predetermined plane; Second supporting member; Said second supporting member is arranged through said guiding surface formation member and separates in side relative with said optical system and said guiding surface formation member, and the position of said second supporting member and said first supporting member relation maintains predetermined relationship; Comprise that first measures the position measuring system of member; Said first measures the irradiation of member utilization measurement bundle is parallel to the surface measurements of said predetermined plane and receives the light from said surface measurements; And said position measuring system obtains the positional information of said movable body in said predetermined plane based on the output of the said first measurement member; Said surface measurements is arranged on a place in said movable body and said second supporting member, and at least a portion of the said first measurement member is arranged on another place in said movable body and said second supporting member; Drive system, said drive system drives said movable body based on the positional information of said movable body in said predetermined plane; And handling system; Said handling system has at least one and keeps the sucker member of said object from the top with the noncontact mode, and handling system uses said sucker member that said object is loaded on the said movable body and with said object to unload from said movable body.

According to this equipment, handling system uses and to keep the sucker member of object that object is loaded on the movable body and with object from the top with the noncontact mode unloading from movable body.Therefore, needn't be provided with object be loaded on the movable body or with object from the member of movable body unloading etc., it can avoid movable body size and weight increase.In addition, through using the sucker member that keeps object with the noncontact mode from the top, object thin, flexibility loads on the mutual movable body and from movable body with can having no problem and unloads.

In the case, guiding surface be used for the direction of predetermined plane quadrature on guide movable body, and can be contact or contactless.For example, contactless bootstrap technique comprises the structure that uses the gas at rest bearing of mattress for example, uses maglev structure or the like.In addition, guiding surface is not limited to that movable body is wherein accompanyed or follow the shape of guiding surface and the structure that is directed.For example; In the structure that uses the gas at rest bearing such as mattress; The apparent surface relative with movable body of guiding surface formation member is finish-machined to has high flatness, and movable body is directed to accompany or follow the shape of said facing surfaces with the noncontact mode via predetermined gap.On the other hand; In following structure; Wherein, form the member place although the part of the motor of use electromagnetic force etc. is arranged in guiding surface, the part of this motor etc. also is arranged in the movable body place; With the direction of above-mentioned predetermined plane quadrature on the power that acts on form member through guiding surface and produce with cooperating of movable body, the position of movable body is controlled by the power on the predetermined plane.For example; Also comprise such structure; Wherein, Planar motors is arranged on guiding surface and forms the member place, and makes and be included in both direction orthogonal in the predetermined plane and produce on movable body with power on the direction of the direction of predetermined plane quadrature, and movable body suspends with the noncontact mode under the situation that the gas at rest bearing is not set.

According to a second aspect of the invention; Second exposure sources is provided; Said second exposure sources is through utilizing energy beam that object is made public by the optical system of first supporting members supports; Said equipment comprises: movable body, said movable body keep said object and can move along predetermined plane; Second supporting member, the position relation of said second supporting member and said first supporting member maintains predetermined relationship; The movable body supporting member; Said movable body supporting member is arranged between said optical system and said second supporting member so that separates with said second supporting member; When said movable body moves along said predetermined plane, said movable body supporting member with the direction of the longitudinal direction quadrature of said second supporting member on support said movable body at two some places of said movable body at least; Position measuring system; It comprises that first measures member; Said first measures the irradiation of member utilization measurement bundle is parallel to the surface measurements of said predetermined plane and receives the light from said surface measurements; And said position measuring system obtains the positional information of said movable body in said predetermined plane based on the output of the said first measurement member; Said surface measurements is arranged on a place in said movable body and said second supporting member, and at least a portion of the said first measurement member is arranged on another place in said movable body and said second supporting member; Drive system, said drive system drives said movable body based on the positional information of said movable body in said predetermined plane; And handling system; Said handling system has at least one and keeps the sucker member of said object from the top with the noncontact mode, and said handling system uses said sucker member that said object is loaded on the said movable body and with said object to unload from said movable body.

According to this equipment, handling system uses and to keep the sucker member of object that object is loaded on the movable body and with object from the top with the noncontact mode unloading from movable body.Therefore, needn't be provided with object be loaded on the movable body or with object from the member of movable body unloading etc., it can avoid movable body size and weight increase.In addition, through using the sucker member that keeps object with the noncontact mode from the top, object thin, flexibility is loaded on the movable body and from movable body with can having no problem and unloads.

In this case; The movable body supporting member with the direction of the longitudinal direction quadrature of second supporting member on mean at least two some places supporting movable bodies, movable body with the direction of the longitudinal direction quadrature of second supporting member on be supported, for example with the direction of two dimensional surface quadrature on place, only two ends or two ends and pars intermedia place, do not comprising center and two ends on the direction with the longitudinal direction quadrature of second supporting member the part place, comprise the entire portion place at the two ends on the direction with the longitudinal direction quadrature of second supporting member or the like.In this case, bearing method broadly comprises the contact supporting, certainly, also comprises the noncontact supporting of for example supporting through gas at rest bearing such as mattress or magnetic levitation etc.

According to a third aspect of the invention we, a kind of device producing method is provided, has comprised: object has been made public with one in first exposure sources of the present invention and second exposure sources; And the object that has made public is developed.

Description of drawings

Fig. 1 is the view of structure that schematically shows the exposure sources of an embodiment.

Fig. 2 is the vertical view of the exposure sources among Fig. 1.

Fig. 3 is the side view of the exposure sources when Fig. 1 when+Y side is observed.

Fig. 4 (A) is the vertical view of the wafer carrying bench WST1 that disposes of exposure sources, and Fig. 4 (B) is the end-view along the xsect of the line B-B intercepting among Fig. 4 (A), and Fig. 4 (C) is the end-view along the xsect of the line C-C intercepting among Fig. 4 (A).

Fig. 5 is the view that the structure of fine motion microscope carrier position measuring system is shown.

Fig. 6 (A) and Fig. 6 (B) are the views that the structure of sucker unit is shown.

Fig. 7 is used for the block scheme of I/O relation of the master controller that exposure sources disposed in the key diagram 1.

Fig. 8 illustrates the wafer that is installed on the wafer carrying bench WST1 is carried out exposure and measured the view of the state of second reference mark on the plate FM2 in detection on the wafer carrying bench WST2.

Fig. 9 illustrates the wafer that is installed on the wafer carrying bench WST1 is carried out exposure; And carry out the view of the state of wafer aligned to being installed in wafer on the wafer carrying bench WST2.

Figure 10 (A) to Figure 10 (C) be the view that is used for explaining the wafer aligned process (one of).

Figure 11 (A) to Figure 11 (D) be the view that is used for explaining the wafer aligned process (two).

Figure 12 be illustrate wafer carrying bench WST2 on surface plate 14B towards the right side and the view of the state that moves of column position.

Figure 13 be illustrate wafer carrying bench WST1 and wafer carrying bench WST2 to and the view of the state of the mobile completion of column position.

Figure 14 illustrates wafer carrying bench WST1 to arrive the wafer W that has experienced exposure on the first unloading position UPA, the wafer carrying bench WST1 and unloaded, and at the view that detects the state of measuring first reference mark (execution reticle alignment) on the plate FM2 on the wafer carrying bench WST2.

Figure 15 (A) to Figure 15 (D) be used for explaining wafer (one of) the view of uninstall process.

Figure 16 (A) is the view that is used for explaining the uninstall process of wafer (two) to Figure 16 (D).

Figure 17 illustrates wafer carrying bench WST1 to move to first " loaded " position from the first unloading position UPA, and the wafer W on the wafer carrying bench WST2 is carried out the view of the state of exposure.

Figure 18 illustrates that wafer carrying bench WST1 arrives the first " loaded " position LPA, new wafer W is loaded on the mutual wafer carrying bench WST1, and the wafer W on the wafer carrying bench WST2 is carried out the view of the state of exposure.

Figure 19 is illustrated in wafer carrying bench WST1 to go up second reference mark that detects on the measurement plate FM1, and the wafer W on the wafer carrying bench WST2 is carried out the view of the state of exposure.

Embodiment

Below will embodiment of the present invention be described referring to figs. 1 through Figure 19.

Fig. 1 schematically shows the structure about the exposure sources 100 of this embodiment.Exposure sources 100 is the apparatus for projection exposure of step-scan mode, that is, it is so-called scanner.As described subsequently, in this embodiment, be provided with projection optical system PL, and in the following description, provide explanation based on following hypothesis: promptly, the direction parallel with the optical axis AX of projection optical system PL is Z-direction; With the Z-direction plane orthogonal in relatively scan graticule and wafer direction be Y direction; And with the direction of Z axle and Y axle quadrature be X-direction; And be respectively θ x, θ y and θ z direction around rotation (inclination) direction of X axle, Y axle and Z axle.

As seen in fig. 1, exposure sources 100 disposes: be arranged in bedplate 12+near the Y side exposure station (exposure-processed part) 200; Be arranged in bedplate 12-near the Y side measuring station (measurement processing part) 300; The bearing table device 50 that comprises two wafer carrying bench WST1 and WST2; Their control system etc.In Fig. 1, wafer carrying bench WST1 is arranged in exposure station 200 and wafer W remains on the wafer carrying bench WST1.Wafer carrying bench WST2 is arranged in measuring station 300 and another wafer W remains on the wafer carrying bench WST2.

Exposure station 200 disposes: illuminator 10, graticule microscope carrier RST, projecting cell PU, local liquid-immersion device 8 etc.

Illuminator 10 comprises: light source; Lamp optical system with the illuminance homogeneity optical system that comprises optical integrator etc.; (all not shown) such as graticule baffle plates is as disclosed in the open No.2003/0025890 of U.S. Patent application for example etc.Illuminator 10 is utilized has roughly the evenly field of illumination IAR of illumination light (exposure light) IL illumination slit shape on graticule R of illuminance, and field of illumination IAR is limited on graticule baffle plate (being also referred to as masking system).As an example, argon fluoride (ArF) excimer laser (wavelength: 193nm) as illumination light IL.

On graticule microscope carrier RST, the graticule R with patterned surfaces (lower surface among Fig. 1) is fixed through for example vacuum suction, and circuit pattern etc. are formed on the patterned surfaces.Graticule microscope carrier RST can be in the direction of scanning (Y direction; Horizontal direction for the page of Fig. 1) goes up according to predetermined stroke and driven with predetermined sweep velocity; And can be through comprise that for example the graticule microscope carrier drive system 11 (not shown among Fig. 1, with reference to Figure 13) of linear motor etc. is driven on X-direction precise and tinyly.

The positional information (be included in rotation information θ z direction on) of graticule microscope carrier RST in the XY plane; Removable mirror 15 through being fixed to graticule microscope carrier RST (in fact; Be provided with and have with the removable mirror of Y (or reverse reflective mirror) of the reflecting surface of Y direction quadrature and have the removable mirror of X with the reflecting surface of X-direction quadrature); With graticule laser interferometer (being called hereinafter, " graticule interferometer ") 13 resolution with for example about 0.25nm detected constantly.The measured value of graticule interferometer 13 is sent out to master controller 20 (not shown among Fig. 1, with reference to Figure 13).Point out in passing, as disclose at for example U.S. Patent application in 2007/0288121 grade disclosed, the positional information of graticule microscope carrier RST can be measured by encoder system.

As at length disclosed in United States Patent(USP) No. 5,646,413 grades for example, above graticule microscope carrier RST, be furnished with the RA of reticle alignment system of a pair of Flame Image Process mode ₁And RA ₂(in Fig. 1, the RA of reticle alignment system ₂On the degree of depth of the page, be hidden in the RA of reticle alignment system ₁The rear), the said a pair of reticle alignment RA of system ₁And RA ₂In each light (the illumination light IL in this embodiment) that all has the imaging device of CCD for example and will have an exposure wavelength as aiming at illumination light.Master controller 20 (with reference to Fig. 7) through projection optical system PL measure plate be arranged under the projection optical system PL state down detection be formed on the graticule R a pair of reticle alignment mark (accompanying drawing omits) and on the measurement plate on the fine motion microscope carrier WFS1 (or WFS2) projected image of a pair of first reference mark corresponding of (describing in the back) with the reticle alignment mark, and the said a pair of reticle alignment RA of system ₁And RA ₂Be used for detecting according to this detection of being carried out by master controller 20 center and the aligned position of measuring on the plate of view field of the pattern of the graticule R that is formed by projection optical system PL, that is, the position between the center of said a pair of first reference mark concerns.Reticle alignment detection system RA ₁And RA ₂Detection signal offer master controller 20 (with reference to Fig. 7) through the signal processing system (not shown).Point out the RA of reticle alignment system in passing ₁And RA ₂Not to be provided with.In the case; Preferably; Installation has subsequently the detection system of the transmittance section of describing that is arranged on fine motion microscope carrier place (Photoelectric Detection portion), detecting the projected image of reticle alignment mark, as disclosed in the for example open No.2002/0041377 of U.S. Patent application etc.

In Fig. 1 projecting cell PU be arranged in graticule microscope carrier RST below.Projecting cell PU is via being fixed to the peripheral flange portion FLG of projecting cell PU through main frame (it also is known as metrology) BD supporting, and main frame BD is flatly supported through unshowned supporting member.Main frame BD can not be delivered to main frame or main frame not to extraneous transmitting vibrations through at the supporting member place vibration isolating device etc. being set, being configured such that the vibration that comes from the outside.Projecting cell PU comprises lens barrel 40 and remains on the projection optical system PL in the lens barrel 40.For example, the dioptric system of being made up of a plurality of optical elements (lens element) that are provided with along the optical axis AX that is parallel to Z-direction is used as projection optical system PL.Projection optical system PL is the both sides heart far away for example, and has predetermined projection magnification ratio (for example 1/4th, 1/5th, 1/8th times etc.).Therefore, when the field of illumination IAR on the graticule R was illuminated through the illumination light IL from illuminator 10, illumination light IL penetrated graticule R, and the patterned surfaces of graticule R is arranged to roughly overlap with first plane (object plane) of projection optical system PL.Then; The downscaled images of the circuit pattern in the IAR of field of illumination of graticule R (downscaled images of the part of circuit pattern); Be formed among the IA of zone (hereinafter, being also referred to as the exposure area) through projection optical system PL (projecting cell PU), area I A matches with above-mentioned field of illumination IAR on wafer W; Wafer W is arranged in second plane (plane of delineation) side of projection optical system PL, and the surfaces coated of wafer W is covered with resist (emulsion).Then; Through driven in synchronism graticule microscope carrier RST and wafer carrying bench WST1 (or WST2) and (Y direction) goes up mpving wire sheet R in the direction of scanning with respect to field of illumination IAR (illumination light IL), and with respect to exposure area IA (illumination light IL) (Y direction) goes up and moves wafer W and carry out the scan exposure of the projected area (zoning) on the wafer W in the direction of scanning.Therefore, the pattern of graticule R is transferred on the projected area.More specifically; In this embodiment;, and this pattern is formed on the wafer W at the pattern that has produced on the wafer W on the graticule R through illuminator 10 and projection optical system PL through the photographic layer on the wafer W (resist layer) being made public with illumination light (exposure light) IL.In the case; Projecting cell PU is kept by main frame BD, and in this embodiment, main frame BD by a plurality of (for example; Three or four) supporting of supporting member approximate horizontal ground, each supporting member all is arranged on the installation surface (for example bottom surface) through vibration isolation mechanism.Point out that in passing vibration isolation mechanism can be arranged between each and the main frame BD in the supporting member.In addition, as disclosed in PCT International Publication No.2006/038952 for example, main frame BD (projecting cell PU) can be supported by the mode of the main frame member (not shown) that is arranged in tops such as projecting cell PU or graticule pedestal with suspension.

Local liquid-immersion device 8 comprises: liquid supplying apparatus 5, liquid withdrawal system 6 (all not shown in Fig. 1, with reference to Figure 13) and nozzle unit 32 etc.As shown in Figure 1; Nozzle unit 32 supports with hang through the main frame BD of unshowned supporting member by supporting projecting cell PU etc.; Periphery with the lower end that surrounds lens barrel 40; The optical element that lens barrel 40 will make up projection optical system PL keeps near plane of delineation side (wafer W side), and optical element is lens (hereinafter, being also referred to as terminal lens) 191 in the case.Nozzle unit 32 disposes: the supply opening of liquid Lq and recovery opening; Lower surface, wafer W relatively are arranged in this lower surface, and the recovery opening is arranged on the lower surface place; And be connected respectively to the supply stream passage of liquid supply tube 31A and liquid recovery tube 31B and reclaim circulation road (all not shown among Fig. 1) with reference to Fig. 2.One end of supply pipe (not shown) is connected to liquid supply tube 31A, and the other end of supply pipe is connected to liquid supplying apparatus 5, and an end of recovery tube (not shown) is connected to liquid recovery tube 31B, and the other end of recovery tube is connected to liquid withdrawal system 6.

In this embodiment; Master controller 20 controlling liquid feeding mechanisms 5 (with reference to Figure 13) to be supplying liquid to the space between terminal lens 191 and the wafer W, and controlling liquid retracting device 6 (with reference to Figure 13) is with from the space reclamation liquid between terminal lens 191 and the wafer W.In this operation, the amount of the amount of the liquid that master controller 20 control is supplied and the liquid that is reclaimed when liquid is changed constantly in the space between lens 191 and the wafer W endways, makes the amount of liquid Lq keep constant (with reference to Fig. 1).In this embodiment, the water purification (refractive index with n1.44) of transmission argon fluoride (ArF) excimer laser (light with wavelength of 193nm) is as aforesaid liquid.

Measuring station 300 is provided with alignment device 99 at main frame BD place.As disclosed in the open No.2008/0088843 of U.S. Patent application for example etc., alignment device 99 comprises five alignment system AL1 shown in Fig. 2 and AL2 ₁To AL2 ₄More specifically; As shown in Figure 2; Main alignment system AL1 is arranged in the following state: its inspection center is located at-Y side and optical axis AX position spaced apart by a predetermined distance, and is positioned at the center of passing projecting cell PU (the optical axis AX of projection optical system PL, and in this embodiment; Overlap with the center of the exposure area IA that describes before) and to be parallel to straight line (hereinafter, the being called datum axis) LV of Y axle last.Side on X-direction and opposite side (main alignment system AL1 is therebetween) are respectively arranged with the secondary alignment system AL2 that their inspection center roughly arranges with respect to datum axis LV symmetrically ₁With AL2 ₂, and AL2 ₃With AL2 ₄More specifically, five alignment system AL1 and AL2 ₁To AL2 ₄Inspection center arrange that along straight line (hereinafter, being called datum axis) LA straight line LA vertically intersects and be parallel to the X axle at the inspection center place of main alignment system AL1 with reference axis LV.Point out in passing, in Fig. 1, five alignment system AL1 and AL2 ₁To AL2 ₄, comprise the holding device (slide block) that keeps these alignment systems, be depicted as alignment device 99.As disclosed in the open No.2009/0233234 of U.S. Patent application for example etc., secondary alignment system AL2 ₁To AL2 ₄Be fixed to the lower surface (with reference to Fig. 1) of main frame BD through removable slide block, and the relative position of the surveyed area of secondary alignment system is adjustable through unshowned driving mechanism at least on X-direction.

In this embodiment, FIA (area image alignment) system that for example uses the Flame Image Process mode is as alignment system AL1 and AL2 ₁To AL2 ₄In each.Alignment system AL1 and AL2 ₁To AL2 ₄For example be configured among the PCT International Publication No.2008/056735 etc. at length open.From alignment system AL1 and AL2 ₁To AL2 ₄In each imaging signal offer master controller 20 (with reference to Figure 13) through unshowned signal processing system.

As shown in Figure 1, bearing table device 50 disposes: base 12; Be arranged in a pair of surface plate 14A and the 14B (in Fig. 1, surface plate 14B is hidden in surface plate 14A rear on the depth direction of the page) of base 12 tops; Two wafer carrying bench WST1 and WST2, it moves on the guiding surface that is parallel to the XY plane on the upper surface that is formed on said a pair of

surface plate

14A and 14B; And the measuring system of measuring the positional information of wafer carrying bench WST1 and WST2.

Base 12 is processed by the member with tubular shape, and as seen in fig. 1, through the vibration isolation mechanism on the backplate surface 102 (accompanying drawing omission) approximate horizontal ground (being parallel to the XY plane) supporting.In the middle body on X-direction of the upper surface of base 12, be formed with upwardly extending recess 12a (groove) in the side that is parallel to the Y axle, as shown in Figure 3.Upper surface side (in this case, not comprising the part that recess 12a forms) at base 12 is equipped with coil unit CU, and coil unit CU comprises a plurality of coils with matrix arrangement, and said matrix is used as line direction and column direction with the XY two-dimensional directional.Point out in passing, vibration isolation mechanism need not be set.

As shown in Figure 2, each among surface plate 14A and the 14B is processed by the rectangular plate shape member, and (when observing from the top) its longitudinal direction is on Y direction in vertical view, and

surface plate

14A and 14B be arranged in datum axis LV-X side and+X side.Surface plate 14A and surface plate 14B arrange with respect to datum axis LV with the mode that on X-direction, has very narrow gap between the two symmetrically.Each upper surface (+Z side surface) through among finished surface plate 14A and the 14B makes upper surface have very high flatness; When among wafer carrying bench WST1 and the WST2 each during, upper surface is used as with respect to employed Z-direction guiding surface along the XY plane motion.Alternately, can use such structure, wherein, make the power on the Z-direction pass through planar motors, it is described in the back, affacts on wafer carrying bench WST1 and the WST2, so that wafer carrying bench WST1 and WST2 magnetic levitation are above surface plate 14A and 14B.Under the situation of this embodiment, adopted and used the structure of planar motors, and do not used the still air bearing, therefore, the flatness of the upper surface of

surface plate

14A and 14B needn't be as above-mentioned so high.

As shown in Figure 3,

surface plate

14A and 14B are bearing in through unshowned air bearing (or rolling bearing) on the upper surface 12b of two sidepieces of recess 12a of base 12.

Surface plate

14A and 14B have respectively: the 14A of first ₁And 14B ₁, the 14A of first ₁And 14B ₁In each all on the upper surface that forms guiding surface by it, have relatively thin plate shape; And be fixed to the 14A of first respectively integratedly ₁And 14B ₁The second portion 14A of lower surface ₂And 14B ₂, second portion 14A ₂And 14B ₂In each all have relatively thicker plate shape and shorter on X-direction.The 14A of first of surface plate 14A ₁Stretch out second portion 14A in the end of+X side a little to+X side ₂At the end face of+X side, and the 14B of first of surface plate 14B ₁Stretch out second portion 14B in the end of-X side a little to-X side ₂End face in-X side.But it is a kind of that structure is not limited to above-mentioned this, but can use the structure that wherein is not provided with extension.

The 14A of first ₁And 14B ₁In each inside all be equipped with coil unit (accompanying drawing omission), coil unit comprises a plurality of coils with matrix arrangement, said matrix with the XY two-dimensional directional as line direction and column direction.The size and Orientation of electric current that is fed to each coil in each said a plurality of coils that constitute in the coil unit is by master controller 20 controls (with reference to Fig. 7).

The second portion 14A of surface plate 14A ₂Inside (on the bottom) be equipped with magnet unit MUa with coil unit CU corresponding to the upper surface side that is contained in base 12; Magnet unit MUa is made up of a plurality of permanent magnets with matrix arrangement (and unshowned yoke), and said matrix is used as line direction and column direction with the XY two-dimensional directional.Magnet unit MUa constitutes surface plate drive system 60A (with reference to Fig. 7) with the coil unit CU of base 12, surface plate drive system 60A by as the planar motors that in United States Patent (USP) for example, please disclose disclosed electromagnetic force (Lorentz force) type of drive among the No.2003/0085676 etc. form.Surface plate drive system 60A is created in the driving force of the last table-drive panel 14A of three degree of freedom direction (X, Y, θ z) in the XY plane.

Similarly, at the second portion 14B of surface plate 14B ₂Inside (on the bottom); Be equipped with the magnet unit MUb that forms by a plurality of permanent magnets (and unshowned yoke); Magnet unit MUa constitutes surface plate drive system 60B (with reference to Fig. 7) with the coil unit CU of base 12, and surface plate drive system 60B is made up of the planar motors of table-drive panel 14B on the three degree of freedom direction in the XY plane.Point out in passing, constitute among surface plate drive system 60A and the 60B each planar motors coil unit and magnet unit layout can with above-mentioned situation (magnet movement formula) (make magnet unit be in the base side and coil unit is in the coil movement formula of surface plate side) on the contrary.

Surface plate 14A and the 14B positional information on the three degree of freedom direction is obtained (measurement) through first surface Board position measuring system 69A and second surface Board position measuring system 69B (with reference to Fig. 7) respectively independently of one another, and each among first surface Board position measuring system 69A and the second surface Board position measuring system 69B comprises for example encoder system.The output of each among first surface Board position measuring system 69A and the second surface Board position measuring system 69B is provided to master controller 20 (with reference to Fig. 7); And master controller 20 is based on the output of surface plate

position measuring system

69A and 69B; Control the size and Orientation of the electric current of the corresponding coil that is provided to the coil unit that constitutes surface

plate drive system

60A and 60B; Thus, the relevant position on control table panel 14A and the 14B three degree of freedom direction in the XY plane as required.Master controller 20 is based on the output of surface plate

position measuring system

69A and 69B; Through surface

plate drive system

60A and 60B table-

drive panel

14A and 14B; So that

surface plate

14A and 14B turn back to the reference position of surface plate; Make that

surface plate

14A and 14B fall in the preset range from the move distance of reference position when

surface plate

14A and 14B are used as subsequently the reaction mass with description.More specifically, surface

plate drive system

60A and 60B are as the fine setting motor.

The structure of first surface Board position measuring system 69A and second surface Board position measuring system 69B does not receive special restriction simultaneously; Also can use encoder system; Wherein, for example encoder heads is arranged in base 12 places, encoder heads is through being arranged in second portion 14A ₂And 14B ₂Lower surface on scale (for example; Two-dimensional grating) going up irradiation measures bundle and receives the diffraction light (reflected light) that is produced by two-dimensional grating; (or respectively, encoder heads is arranged in second portion 14A to obtain positional information on (measurement) respective table panel 14A and the 14B three degree of freedom direction in the XY plane ₂And 14B ₂The place, and scale is arranged in base 12 places).Point out that in passing also can obtain the positional information of (measurement)

surface plate

14A and 14B through for example optical interference instrument system or measuring system, measuring system is the combination of optical interference instrument system and encoder system.

In the wafer carrying bench one, wafer carrying bench WST1 disposes: the fine motion microscope carrier WFS1 that keeps wafer W; And the coarse motion microscope carrier WCS1 periphery, that have rectangular frame shape that surrounds fine motion microscope carrier WFS1, as shown in Figure 2.In the wafer carrying bench another, wafer carrying bench WST2 disposes: the fine motion microscope carrier WFS2 that keeps wafer W; And the coarse motion microscope carrier WCS2 periphery, that have rectangular frame shape that surrounds fine motion microscope carrier WFS2, as shown in Figure 2.As conspicuous from Fig. 2, except arranging, wafer carrying bench WST2 is in about the laterally opposite state of wafer carrying bench WST1, and wafer carrying bench WST2 has the identical structure with wafer carrying bench WST1, and it comprises drive system, position measuring system etc.Therefore, in the following description, focus on wafer carrying bench WST1 and described typically, and only under the situation that needs this description especially, just wafer carrying bench WST2 is described.

Shown in Fig. 4 (A); Coarse motion microscope carrier WCS1 has a pair of coarse motion Slipper 90a and 90b;

Coarse motion Slipper

90a and 90b are parallel to each other and on Y direction, turn up the soil layout at interval; And each among coarse motion Slipper 90a and the 90b is that rectangular parallelepiped member and a pair of coupling member 92a and the 92b of X-direction forms by its longitudinal direction; Among said a pair of coupling member 92a and the 92b each is that the rectangular parallelepiped member of Y direction is formed by its longitudinal direction, and said a pair of

coupling member

92a and 92b utilize their ends on Y direction to connect said a pair of coarse motion Slipper 90a and 90b with another end.More specifically, coarse motion microscope carrier WCS1 forms and entreats the rectangular frame shape that partly has the rectangular aperture part that on Z-direction, runs through therein.

Shown in Fig. 4 (B) and Fig. 4 (C),, be equipped with

magnet unit

96a and 96b respectively in the inside of

coarse motion Slipper

90a and 90b (at).

Magnet unit

96a and 96b are corresponding to the 14A of first that is contained in

surface plate

14A and 14B respectively ₁And 14B ₁The coil unit of inside, and each magnet unit forms by a plurality of magnets with matrix arrangement, said matrix with the XY two-dimensional directional as line direction and column

direction.Magnet unit

96a and 96b constitute coarse motion microscope carrier drive system 62A (with reference to Fig. 7) with the coil unit of

surface plate

14A and 14B; Coarse motion microscope carrier drive system 62A is made up of the planar motors of electromagnetic force (Lorentz force) type of drive; This planar motors can (be described as the six-freedom degree direction hereinafter in X-direction, Y direction, Z-direction, θ x direction, θ y direction and θ z direction; Or six-freedom degree direction (X, Y, Z, θ x, θ y and θ z)) coarse motion microscope carrier WCS1 is produced driving force, as disclosed in the for example open No.2003/0085676 of U.S. Patent application etc.In addition, similarly, the magnet unit that the coarse motion microscope carrier WCS2 (with reference to Fig. 2) of wafer carrying bench WST2 is had, and the coil unit of

surface plate

14A and 14B constitute the coarse motion microscope carrier drive system 62B (with reference to Fig. 7) that is made up of planar motors.In the case, owing to the masterpiece on the Z-direction is used on the coarse motion microscope carrier WCS1 (or WCS2), so the magnetic levitation of coarse motion microscope carrier is above surface plate 14A and 14B.Therefore, need not must uses need the still air bearing of higher relatively mechanical precision, and therefore, the flatness that improves the upper surface of surface plate 14A and the 14B no longer necessity that becomes.

Point out in passing; Although the coarse motion microscope carrier WCS1 and the WCS2 of this embodiment have configurations, wherein, only coarse motion Slipper 90a and 90b have the magnet unit of planar motors; But this embodiment is not limited thereto, and magnet unit also can be arranged in coupling member 92a and 92b place.In addition, the actuator that is used to drive coarse motion microscope carrier WCS1 and WCS2 is not limited to the planar motors of electromagnetic force (Lorentz force) type of drive, but for example, can use the planar motors of VR type of drive etc.In addition, the driving direction of coarse motion microscope carrier WCS1 and WCS2 is not limited to the six-freedom degree direction, and can be, for example, and the only three degree of freedom direction in the XY plane (X, Y, θ z).In this case, coarse motion microscope carrier WCS1 and WCS2 should for example use gas at rest bearing (for example, air bearing) to be suspended in the top of surface plate 14A and 14B.In addition, in this embodiment, although magnet movement formula planar motors is used as among coarse motion microscope carrier drive system 62A and the 62B each; But in addition; Also can use coil movement formula planar motors, wherein, magnet unit is arranged in the surface plate place and coil unit is arranged in coarse motion microscope carrier place.

On the side surface of coarse motion slide block 90a in-Y side; And on the side surface of coarse motion slide block 90b in+Y side; Be fixed with

stationary part

94a and 94b respectively,

stationary part

94a and 94b constitute the part of the fine motion microscope carrier drive system 64 (with reference to Figure 13) that drives fine motion microscope carrier WFS1 that will describe subsequently precise and tinyly.Shown in Fig. 4 (B), stationary part 94a is made up of the member with L shape cross section shape, and said member is arranged on the X-direction and extends, and its lower surface arrangement becomes to flush with the lower surface of coarse motion slide block 90a.Guiding elements 94b is similar to structure and the layout of guiding elements 94a, though guiding elements 94b and guiding elements 94a bilateral symmetry.

In

stationary part

94a and 94b inner (on its bottom); Be equipped with a pair of coil unit CUa and CUb respectively; Among said a pair of coil unit CUa and the CUb each comprises a plurality of coils with matrix arrangement, and said matrix is used as line direction and column direction with the XY two-dimensional directional.Simultaneously, in guiding elements 94b inner (on its bottom), be equipped with a coil unit CUc (with reference to Fig. 4 (A)), coil unit CUc comprises a plurality of coils with matrix arrangement, and said matrix is used as line direction and column direction with the XY two-dimensional directional.Be fed to each the size and Orientation of electric current in the coil that constitutes coil unit CUa to CUc by master controller 20 controls (with reference to Fig. 7).

Inner at coupling member 92a and/or 92b, can ccontaining various types of optical components (for example, spatial image surveying instrument, uneven illumination degree surveying instrument, illuminance monitor, wave-front optical aberration measurement instrument or the like).

In the case; When the planar motors of wafer carrying bench WST1 through formation coarse motion microscope carrier drive system 62A; When Y direction is driven in surface plate 14A upper edge with acceleration/deceleration (for example, when wafer carrying bench WST1 moves between exposure station 200 and measuring station 300), according to so-called action-reaction law (law of conservation of momentum); Because the effect of the reacting force of the driving force of wafer carrying bench WST1, surface plate 14A moves on the direction opposite with wafer carrying bench WST1.In addition, can also form the state that above-mentioned action-reaction law no longer keeps through on Y direction, producing driving force with surface plate drive system 60A.

In addition; As wafer carrying bench WST2 when Y direction is driven in surface plate 14B upper edge; According to so-called action-reaction law (law of conservation of momentum); Because the effect of the reacting force of the driving force of wafer carrying bench WST2, surface plate 14B is also driven on the direction opposite with wafer carrying bench WST2.More specifically,

surface plate

14A and 14B play the effect of reaction mass, and are conservations by the momentum of wafer carrying bench WST1 and WST2 and surface plate 14A and the whole system that forms of 14B, and do not produce the mobile of center of gravity.Therefore, for example can not produce owing to wafer carrying bench WST1 and WST2 act on any inconvenience on surface plate 14A and the 14B what the motion on the Y direction produced such as unequal loading.Point out in passing,, can form the state that above-mentioned action-reaction law no longer keeps through on Y direction, producing driving force with surface plate drive system 60B equally about wafer carrying bench WST2.

In addition, when wafer carrying bench WST1 and WST2 moved on X-direction, because the effect of the reacting force of driving force,

surface plate

14A and 14B played the effect of reaction mass.

Shown in Fig. 4 (A) and Fig. 4 (B), fine motion microscope carrier WFS1 disposes: the major part of being made up of the member of rectangular shaped in vertical view 80; Be fixed to the mover part 84a of major part 80 in the side of+Y side; And be fixed to the mover part 84b of major part 80 in the side of-Y side.

Major part 80 is formed by the material that for example pottery, glass etc. have less relatively thermal expansivity, and in the state that sole arrangement becomes with the bottom surface of coarse motion microscope carrier WCS1 flushes of major part, WCS1 supports with the noncontact mode by the coarse motion microscope carrier.Major part 80 can be hollow with weight reduction.Point out that in passing the bottom surface of major part 80 is not to flush with the bottom surface of coarse motion microscope carrier WCS1.

In the central authorities of the upper surface of major part 80, be furnished with the wafer retainer (not shown) that keeps wafer W through vacuum suction etc.In this embodiment; Use the wafer retainer of so-called chuck sucker mode; In this wafer retainer; A plurality of supporting parts (jaw member) of supporting wafer for example are formed in annular protruding portion (flange portion), and one surface (front surface) has the two-dimensional grating RG that describes subsequently, be arranged on another surface (surface, back) side etc. as the wafer retainer of wafer installation surface.Point out that in passing the wafer retainer can form with fine motion microscope carrier WFS1 (major part 80), maybe can be fixed to major part 80 dismantling through the for example maintaining body such as electrostatic chuck mechanism or clamping mechanism.In the case, grating RG is arranged on the back face side of major part 80.In addition, the wafer retainer can be fixed to major part 80 through bonding agent etc.Shown in Fig. 4 (A); On the upper surface of major part 80; Plate (scolding the liquid plate) 82 is attached on the outside (installation region of wafer W) of wafer retainer; In the central authorities of plate 82, be formed with less times greater than the circular open of wafer W (wafer retainer), and plate 82 has the rectangular profile (profile) corresponding to major part 80.The liquid processing of scolding to liquid Lq is applied to the surface (the liquid surface is scolded in formation) of plate 82.What in this embodiment, the surface of plate 82 comprised the base material of being processed by metal, pottery, glass etc. and was formed on base material lip-deeply scolds the liquid material membrane.Scold the alburnum material to comprise, for example, PEA (tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (Tetra fluoro ethylene-perfluoro alkylvinyl ether copolymer)), PTFE (teflon), special teflon (registered trademark) etc.Point out that in passing the material that forms this film can be acrylic type resin or silicon series plastics.In addition, whole plate 82 can be formed with at least a in PFA, PTFE, Teflon (registered trademark), acrylic type resin and the silicon series plastics.In this embodiment, the upper surface of plate 82 with respect to the contact angle of liquid Lq for for example more than or equal to 90 degree.On the surface of the coupling member 92b that preceding text were described, also used and similarly scolded liquid to handle.

Plate 82 is fixed to the upper surface of major part 80, makes the whole surface (or surface part) of plate 82 and the flush of wafer W.In addition, plate 82 becomes surperficial substantially flush with the coupling member 92b that before described with the surface alignment of wafer W.In addition, being positioned at of plate 82+Y side+be formed with circular open near the turning of X side, and measure plate FM1 and opening between have no under the situation in gap, with the surperficial substantially flush state arrangement of wafer W in opening.Be formed with on the upper surface of measuring plate FM1 respectively by before the said a pair of reticle alignment RA of system that described ₁And RA ₂Said a pair of first reference mark that (with reference to Fig. 1 and Fig. 7) detects and second reference mark (mark is all not shown) that detects by main alignment system AL1.As shown in Figure 2, in the fine motion microscope carrier WFS2 of wafer carrying bench WST2, be positioned at plate 82+the Y side-X side turning near, be similar to the measurement plate FM2 that measures plate FM1 and be fixed on the surperficial substantially flush state with wafer W.Point out in passing; Except plate 82 being attached to fine motion microscope carrier WFS1 (major part 80); Wafer retainer and fine motion microscope carrier WFS1 are formed; And scold liquid to handle to be applied the outer peripheral areas of the upper surface of fine motion microscope carrier WFS1, outer peripheral areas is surrounded wafer retainer (zone (it can comprise the surface of measuring plate) identical with plate 82), and forms and scold liquid surperficial.

Shown in Fig. 4 (B); Middle body at the lower surface of the major part 80 of fine motion microscope carrier WFS1; Plate with predetermined thin sheet form is arranged the lower surface arrangement that is in plate and becomes and the substantially flush state of other part (periphery) (lower surface of plate is not projected into the periphery below), and plate arrives cover wafers retainer (installation region of wafer W) greatly and measure the degree of plate FM1 (or being to measure plate FM2) under the situation of fine motion microscope carrier WFS2.On a surface of plate (upper surface (or lower surface)), be formed with two-dimensional grating RG (hereinafter, abbreviating grating RG as).Grating RG comprises that the cycle direction is at reflecting diffraction grating on the X-direction (X diffraction grating) and the reflecting diffraction grating (Y diffraction grating) of cycle direction on Y direction.Plate is formed by for example glass, and grating RG is through with the for example spacing between the 138nm to 4m, for example produces with the scale of the spacing marking diffraction grating of 1m.Point out that in passing grating RG also can cover the whole lower surface of major part 80.In addition, the type that is used for the diffraction grating of grating RG is not limited to be formed with on it diffraction grating of groove or analog, but also can use the diffraction grating that for example produces through exposure interference fringe on photosensitive resin.Point out that in passing the structure with plate of thin sheet form need not be confined to above-mentioned structure.

Shown in Fig. 4 (A), each among said a pair of fine motion Slipper 84a and the 84b is has the roughly plate type member of square shape in vertical view, and be arranged at interval on the X-direction preset distance major part 80+side surface of Y side on.Fine motion Slipper 84c has in vertical view the plate type member of elongated rectangular shape on X-direction; And be arranged in end of its longitudinal direction and the other end and the center of fine motion Slipper 84a and the 84b state on the straight line that is parallel to the Y axle of conllinear roughly, be fixed to major part 80-side surface of Y side.

Said a pair of

fine motion Slipper

84a and 84b are supported by the guiding elements 94a of previous description respectively, and fine motion Slipper 84c is supported by guiding elements 94b.More specifically, fine motion microscope carrier WFS is bearing in three non-colinear positions with respect to coarse motion microscope carrier WCS.

Inner at fine motion Slipper 84a to 84c; Be equipped with

magnet unit

98a, 98b and 98c respectively; Among

magnet unit

98a, 98b and the 98c each is made up of a plurality of permanent magnets (and not shown yoke) with matrix arrangement; Said matrix with the XY two-dimensional directional as line direction and column direction, the coil unit CUa to CUc that is had with

leader

94a and 94b corresponding to coarse motion microscope carrier WCS1.Magnet unit 98a respectively constitutes three planar motors that can X axle, Y axle and Z-direction on produce electromagnetic force (Lorentz force) type of drive of driving force with coil unit CUb and magnet unit 98c with coil unit CUc with coil unit CUa, magnet unit 98b; As disclosed in the open No.2003/0085676 of U.S. Patent application for example etc., and these three planar motors are formed in six-freedom degree direction (X, Y, Z, θ x, θ y, θ z) and go up the fine motion microscope carrier drive system 64A (with reference to Fig. 7) that drives fine motion microscope carrier WFS1.

Equally in wafer carrying bench WST2; Three planar motors that the magnet unit that is had by coil unit and fine motion microscope carrier WFS2 that constructs similarly also that coarse motion microscope carrier WCS2 had is formed, and these three planar motors are formed in six-freedom degree direction (X, Y, Z, θ x, θ y, θ z) and go up the fine motion microscope carrier drive system 64B (with reference to Fig. 7) that drives fine motion microscope carrier WFS2.

Fine motion microscope carrier WFS1 is removable on X-direction, its have along be arranged in the guiding elements 94a that extends on the X-direction and 94b, than other five strokes that the degree of freedom direction is longer.Same structure is applied to fine motion microscope carrier WFS2.

Utilize above-mentioned structure, fine motion microscope carrier WFS1 is removable on the six-freedom degree direction with respect to coarse motion microscope carrier WCS1.In addition, in this operation, because the effect of the reacting force of the driving of fine motion microscope carrier WFS1, described before being similar to, law of action and reaction (law of conservation of momentum) is maintained.More specifically, coarse motion microscope carrier WCS1 plays the effect of the reaction mass of fine motion microscope carrier WFS1.And coarse motion microscope carrier WCS1 is being driven on the direction of fine motion microscope carrier WFS1.Relation between fine motion microscope carrier WFS2 and the coarse motion microscope carrier WCS2 also is similar.

In addition; As described before; Since fine motion microscope carrier WFS1 three non-colinear positions by coarse motion microscope carrier WCS1 supporting, therefore, master controller 20 can through for example suitably control produce each the driving force (thrust) of Z-direction that becomes to act among the fine motion Slipper 84a to 84c; With arbitrarily angled (amount of spin) in x direction and/or y direction with respect to XY plane inclination fine motion microscope carrier WFS1 (that is wafer W).In addition; Master controller 20 can be for example through make+θ x direction on the driving force of (counter clockwise direction of the page of Fig. 4 (B)) act on each among fine motion Slipper 84a and the 84b; And also make-the x direction on the driving force of (CW of the page of Fig. 4 (B)) act on the fine motion slipper 84c, the middle body that makes fine motion microscope carrier WFS1 is in+Z-direction crooked (bending to spill).In addition; Master controller 20 also can be for example through make-driving force on y direction and the+y direction (for when being respectively when observing counterclockwise and CW from+Y side) acts on respectively on fine motion Slipper 84a and the 84b, the middle body that makes fine motion microscope carrier WFS1 bending (bending to spill) on+Z direction.Master controller 20 also can be carried out similar operation with respect to fine motion microscope carrier WFS2.

Point out in passing; In this embodiment, magnet movement formula planar motors is as fine motion microscope

carrier drive system

64A and 64B, but motor is not limited thereto; And also can use coil movement formula planar motors; In the campaign-styled planar motors of coil, coil unit is arranged in the fine motion slide section office of fine motion microscope carrier, and magnet unit is arranged in the guiding elements place of coarse motion microscope carrier.

Shown in Fig. 4 (A); Between the major part 80 of the coupling member 92a of coarse motion microscope carrier WCS1 and fine motion microscope carrier WFS1, pair of pipes 86a and 86b are installed; Said pair of pipes 86a and 86b are used for the power use is delivered to fine motion microscope carrier WFS1, and power uses and is fed to coupling member 92a from the external world through pipe holder.Through a pair of recess 80a (with reference to Fig. 4 (C)) with predetermined depth; The end of pipe 86a and 86b is connected respectively to the side surface of coupling member 92a in+x side; And the other end is connected respectively to the inside of major part 80, and each among the said a pair of recess 80a is formed on the upper surface of major part 80 towards+directions X definite length extended from the end face of-X side.Shown in Fig. 4 (C), pipe 86a and 86b are configured to not be projected into the upper surface top of fine motion microscope carrier WFS1.As shown in Figure 2; Between the major part 80 of the coupling member 92a of coarse motion microscope carrier WCS2 and fine motion microscope carrier WFS2; Pair of pipes 86a and 86b are installed equally, and pipe 86a and 86b are used for the power use that is fed to coupling member 92a from the external world is transferred to fine motion microscope carrier WFS2.

Here; It is the power that is used for various sensors and the actuator such as motor that power uses, be used for actuator is carried out thermoregulator cooling medium, is used for the generic term of the pressurized air etc. of air bearing, and power uses and is supplied to coupling member 92a from the external world through the pipe holder (not shown).Needing under the situation of vacuum force, the power that is used for producing vacuum (negative pressure) is also included within power and uses.

Pipe holder is arranged to correspond respectively to wafer carrying bench WST1 and WST2 in couples; And in fact each is arranged on the stage portion that the base 12 shown in Fig. 3-X side and+X side end place form, and through follow wafer carrying bench WST1 at the actuator such as linear motor on the stage portion and WST2 drives on Y direction.

Next, the measuring system of the positional information of measuring wafer carrying bench WST1 and WST2 is described.Exposure sources 100 has fine motion microscope carrier position measuring system 70 (with reference to Fig. 7) respectively with the positional information of measuring fine motion microscope carrier WFS1 and WFS2 and coarse motion microscope carrier position measuring system 68A and 68B (with reference to Fig. 7) positional information with measurement coarse motion microscope carrier WCS1 and WCS2.

Fine motion microscope carrier position measuring system 70 has the sounding rod 71 shown in Fig. 1.Sounding rod 71 is arranged in the 14A of first that said a pair of

surface plate

14A and 14B has respectively ₁With 14B ₁The below, as shown in Figure 3.As tangible from Fig. 1 and Fig. 3; Sounding rod 71 by have rectangular cross-sectional shape, Y direction is formed as the beam-like element of its longitudinal direction, and in the two ends in a longitudinal direction each is fixed to main frame BD through suspension element 74 with suspension status.More specifically, main frame BD and sounding rod 71 are one.

Sounding rod 71+Z side half one (first half) is arranged in the second portion 14A of surface plate 14A ₂ Second portion 14B with surface plate 14B ₂Between, and-that Z side half one (Lower Half) is contained in the recess 12a that is formed at base 12 places is inner.In addition, be formed with predetermined gap between each in sounding rod 71 and

surface plate

14A and 14B and the base 12, and sounding rod 71 is in not and member state of contact except that main frame BD.Sounding rod 71 forms (for example, invar (invar), pottery etc.) by the material with low relatively thermal expansivity.Point out that in passing the shape of sounding rod 71 is not limited especially.For example, also can be to measure member to have circular cross section (cylindrical) or trapezoidal or triangular cross section.In addition, sounding rod is not to be formed by the longitudinal member such as rod component or beam-like element.

As shown in Figure 5; Be provided with the first measuring head group 72 and the second measuring head group 73 at sounding rod 71 places; When the positional information of the fine motion microscope carrier below measurement is positioned at projecting cell PU (WFS1 or WFS2), use the first measuring head group 72, when the positional information of the fine motion microscope carrier below measurement is positioned at alignment device 99 (WFS1 or WFS2), use the second measuring head group 73.Point out in passing, in Fig. 5, alignment system AL1 and AL2 ₁To AL2 ₄Illustrate with dotted line (double dot dash line), so that the easy to understand accompanying drawing.In addition, in Fig. 5, omitted alignment system AL2 ₁To AL2 ₄Reference numeral.

As shown in Figure 5, the first measuring head group 72 is positioned at below the projecting cell PU, and comprises: be used for one-dimensional coding device head (hereinafter, abbreviating X head or the scrambler head as) 75x that X-direction is measured; A pair of one-dimensional coding device head (hereinafter, abbreviating Y head or scrambler head as) 75ya and the 75yb that is used for the Y direction measurement; And three Z 76a, 76b and 76c.

X 75x, a Y 75ya and 75yb and three Z 76a to 76c are with the inside of the immovable state arrangement in their position at sounding rod 71.X 75x is arranged on the datum axis LV, and Y 75ya and 75yb are leaving X 75x same distance place and are being arranged in respectively-and X side and+X side.In this embodiment; Diffraction interference type head is used as each among three scrambler head 75x, 75ya and the 75yb; Diffraction interference type head is the head that makes light source, photodetector system (comprising photoelectric detector) and various types of optical system unitizations, is similar to disclosed scrambler head in for example PCT International Publication No.2007/083758 (corresponding U.S. Patent application open No.2007/0288121) etc.

In the time of under wafer carrying bench WST1 (or WST2) is positioned at projection optical system PL (with reference to Fig. 1), each among X 75x and Y 75ya and the 75yb is through the gap between surface plate 14A and the surface plate 14B or be formed on the 14A of first of surface plate 14A ₁The 14B of first with surface plate 14B ₁The transmittance section (for example, opening) at place will be measured bundle and be radiated at the grating RG last (with reference to Fig. 4 (B)) on the lower surface that is arranged in fine motion microscope carrier WFS1 (or WFS2).In addition, X 75x and Y 75ya and 75yb receive diffraction light from grating RG respectively, obtain the positional information (also comprise rotation information z direction on) of fine motion microscope carrier WFS1 (or WFS2) in the XY plane thus.More specifically, X linear encoder 51 (with reference to Fig. 7) is made up of X 75x, and its X diffraction grating that uses grating RG to be had is measured the position of fine motion microscope carrier WFS1 (or WFS2) on X-direction.And a pair of Y linear encoder 52 and 53 (with reference to Fig. 7) are made up of a said a pair of Y 75ya and 75yb, and the Y diffraction grating that they use grating RG to be had is measured the position of fine motion microscope carrier WFS1 (or WFS2) in Y direction.The measured value of each among X 75x and Y 75ya and the 75yb is provided mutual master controller 20 (with reference to Fig. 7); And then master controller 20 measures (calculating) fine motion microscope carrier WFS1 (or WFS2) in the position of X-direction based on the measured value of X 75x, and based on measurement of average value (calculating) the fine motion microscope carrier WFS1 (or WFS2) of the measured value of a said a pair of Y 75ya and the 75yb position in Y direction.The measured value of each in the master controller 20 use said a pair of Y linear encoders 52 and 53 is measured the position of (calculating) fine motion microscope carrier WFS1 (or WFS2) in θ z direction (θ z rotation).

In this case, the point of irradiation (check point) of measurement bundle on grating RG that irradiates from X 75x overlaps with exposure position, and this exposure position is the center of the exposure area IA (with reference to Fig. 1) on the wafer W.In addition, the intermediate point of a pair of point of irradiation (check point) of measurement bundle on grating RG that irradiates from a said a pair of Y 75ya and 75yb respectively overlaps with the point of irradiation (check point) of the measurement bundle that irradiates from X 75x on grating RG.Master controller 20 is based on the mean value calculation fine motion microscope carrier WFS1 (or WFS2) of the measured value of two Y 75ya and the 75yb positional information in Y direction.Therefore, the positional information of fine motion microscope carrier WFS1 (or WFS2) on Y direction roughly measured at the exposure position place, and this exposure position is the center that is radiated at irradiation area (exposure area) IA of the irradiates light IL on the wafer W.More specifically, the roughly measuring center of the measuring center of X 75x and two Y 75ya and 75yb overlaps with exposure position.Therefore; Through using X linear encoder 51 and Y linear encoder 52 and 53, the measurement of master controller 20 can (comprise the rotation information on the θ z direction) at (at dorsal part) execution fine motion microscope carrier WFS1 (or WFS2) under the exposure position in if having time in institute in the XY plane positional information.

For example, the head of displacement transducer of optical mode that is similar to the optical pick-up that in CD drive unit etc., uses is as among the Z 76a to 76c each.Three Z 76a to 76c are arranged in the position corresponding to the corresponding drift angle of isosceles triangle (or equilateral triangle).The measurement bundle that each utilization among the Z 76a to 76c is parallel to the Z axle is from the lower surface of below irradiation fine motion microscope carrier WFS1 (or WFS2), and receive grating RG the reflected light of surface (or the formation of reflecting diffraction grating surface) reflection of plate formed thereon.Therefore, Z 76a to 76c constitutes surface location measuring system 54 (with reference to Fig. 7), and this surface location measuring system 54 is measured the surface location (position on Z-direction) of fine motion microscope carrier WFS1 (or WFS2) at corresponding point of irradiation place.The measured value of each among three Z 76a to 76c is provided to master controller 20 (with reference to Fig. 7).

The center of gravity of isosceles triangle (or equilateral triangle) overlaps with exposure position; This triangular apex is at three points of irradiation of measurement bundle on grating RG that irradiate from three Z 76a to 76c respectively, and this exposure position is the center of the exposure area IA (with reference to Fig. 1) on the wafer W.Therefore, based on the mean value of the measured value of three Z 76a to 76c, master controller 20 can obtaining the positional information (surface position information) of fine motion microscope carrier WFS1 (or WFS2) on Z-direction under the exposure position in free.In addition, the position on Z-direction, master controller 20 is also measured the amount of spin of (calculating) fine motion microscope carrier WFS1 (or WFS2) in x direction and y direction based on the measured value of three Z 76a to 76c.

The second measuring head group 73 has: X the 77x (with reference to Fig. 7) that constitutes X linear encoder 55; Constitute a pair of Y the 77ya and the 77yb (with reference to Fig. 7) of a pair of Y linear encoder 56 and 57; And three Z 78a, 78b and the 78c (with reference to Fig. 7) that constitute surface location measuring system 58.Said a pair of Y 77ya and 77yb and three Z 78a to 78c with the relevant position relation as X 77x of benchmark, are similar to an above-mentioned said a pair of Y 75ya and 75yb and three Z 76a to 76c and concern with relevant position as X 75x of benchmark.The point of irradiation (check point) of measurement bundle on grating RG that irradiates from X 77x overlaps with the inspection center of main alignment system AL1.More specifically, the measuring center of X 77x, and the roughly measuring center of two Y 77ya and 77yb overlap with the inspection center of main alignment system AL1.Therefore, master controller 20 can free in the measurement of surface position information of positional information and fine motion microscope carrier WFS2 (or WFS1) in the inspection center place execution XY plane at main alignment system AL1.

Point out in passing, although the X in this embodiment 75x and 77x; And among Y 75ya, 75yb, 77ya and the 77yb each all has by blocking and is arranged in sounding rod 71 inner light source, photodetector system (comprising photoelectric detector) and various types of optical system, but the structure of scrambler head is not limited thereto.For example, light source and photodetector system can be arranged in the outside of sounding rod.In the case, being arranged in inner optical system of sounding rod and light source and photodetector system is connected to each other through for example optical fiber etc.In addition, also can use such structure, wherein, the scrambler head is arranged in the outside of sounding rod and only measures bundle and is directed into grating through being arranged in the inner optical fiber of sounding rod.In addition, the rotation information of wafer on the Z direction can use a pair of X linear encoder to measure (in this case, a Y linear encoder should be arranged).In addition, the surface position information of fine motion microscope carrier can be used for example optical interdferometer measurement.In addition; The corresponding head that replaces the first measuring head group 72 and the second measuring head group 73; Can three scrambler heads altogether be set in the position of X head that is similar to previous description and said a pair of Y head, three scrambler heads comprise that at least one direction of measurement is the XZ scrambler head of X-direction and Z-direction and the YZ scrambler head that at least one direction of measurement is Y direction and Z-direction.

When moving between the measuring station 300 of wafer carrying bench WST1 on exposure station 200 and surface plate 14A, coarse motion microscope carrier position measuring system 68A (with reference to Fig. 7) measures the positional information of coarse motion microscope carrier WCS1 (wafer carrying bench WST1).The structure of coarse motion microscope carrier position measuring system 68A is restriction especially not, and comprises encoder system or optical interference system (can the optical interference instrument system be combined with encoder system).Comprise at coarse motion microscope carrier position measuring system 68A under the situation of encoder system for example; Can use such structure, wherein, the positional information of coarse motion microscope carrier WCS1; Through being used to from a plurality of scrambler heads; Measurement bundle irradiation be fixed to the scale (for example two-dimensional grating) on the upper surface of (perhaps being formed at) coarse motion microscope carrier WCS1, and receive the diffraction light of measuring bundle and measure, the scrambler head is fixed to main frame BD along the moving line of wafer carrying bench WST1 with suspension status.68A comprises under the situation of optical interference instrument system in coarse motion microscope carrier measuring system; Can use such structure; Wherein, The positional information of wafer carrying bench WST1 is through being used to learn from X-ray the side surface of interferometer and the measurement bundle irradiation coarse motion microscope carrier WCS1 of Y optical interdferometer, and receives the reflected light of measuring bundle and measure, and X-ray interferometer and Y optical interdferometer have measurement axis that is parallel to the X axle and the measurement axis that is parallel to the Y axle respectively.

Coarse motion microscope carrier position measuring system 68B (with reference to Fig. 7) has with coarse motion microscope carrier position measuring system 68A and similarly constructs, and measures the positional information of coarse motion microscope carrier WCS2 (wafer carrying bench WST2).Master controller 20 is through controlling coarse motion microscope

carrier drive system

62A and 62B individually, and based on the measured value of coarse motion microscope carrier position measuring system 68A and 68B, controls the position of coarse motion microscope carrier WCS1 and WCS2 (wafer carrying bench WST1 and WST2) respectively.

In addition; Exposure sources 100 also disposes 66A of relative position measurement system and the 66B of relative position measurement system (with reference to Fig. 7), and they measure relative position and the relative position between coarse motion microscope carrier WCS2 and the fine motion microscope carrier WFS2 between coarse motion microscope carrier WCS1 and the fine motion microscope carrier WFS1 respectively.The structure of relative position measurement 66A of system and 66B is not limited especially simultaneously, and each among 66A of relative position measurement system and the 66B all can be the gap sensor that for example comprises capacitive transducer.In the case, gap sensor can be the structure that for example is fixed to the probe portion of coarse motion microscope carrier WCS1 (or WCS2) and is fixed to the target part of fine motion microscope carrier WFS1 (or WCS2).Point out that in passing structure is not limited thereto, and for example, can use for example structure such as linear encoder system, optical interference instrument system relative position measurement system.

In addition, as shown in Figure 2, in the exposure sources 100 of this embodiment, the first unloading position UPA be arranged in be near the center of X-direction of surface plate 14A projection optical system PL a little+position of Y side; And, leave in-Y direction the first unloading position UPA preset distance place alignment system AL1 a little-the Y side, be furnished with the first " loaded " position LPA.The second unloading position UPB and the second " loaded " position LPB are in the position that is symmetrical in the first unloading position UPA and the first " loaded " position LPA respectively about datum axis LV.Sucker unit 102 ₁To 102 ₄Be separately positioned among the first and second unloading position UPA and the UPB, and among the first and second " loaded " position LPA and the LPB.Fig. 6 (A) and Fig. 6 (B) represent sucker unit 102 in the schematically illustrated first " loaded " position LPA place that is arranged on ₁To 102 ₄Sucker unit 102 ₁And wafer carrying bench WST1.Point out in passing, in Fig. 2 (and in other accompanying drawing), for prevent accompanying drawing become complicated with beyond one's depth, omitted sucker unit 102 ₁To 102 ₄Diagram.

Shown in Fig. 6 (A) and Fig. 6 (B), sucker unit 102 ₁Dispose the drive division 104 of the lower surface that is fixed to main frame BD, axle 106 is gone up at vertical direction (Z-direction) through drive division 104 and is driven, and dish type bernoulli gripper (Bermoulli chuck) (being also referred to as unsteady sucker) 108 is fixed to the lower end of axle 106.

Shown in Fig. 6 (A), narrow

boards shape extension

110a, 110b and 110c are arranged in bernoulli gripper 108 outer three positions of placing and extend.Be attached to the end of

extension

110a, 110b and 110c such as

imaging device

114a, 114b and the 114c of CCD etc.Gap sensor 112 further is attached to the teat (imaging device 114c+X side) of extension 110c.

Bernoulli gripper 108 is a kind ofly to produce suction and keep the sucker of object with the noncontact mode through blow out air based on Bernoulli effect, and Bernoulli effect is for when fluid velocity increases, and hydrodynamic pressure reduces.In bernoulli gripper, the speed decision of the fluid that the size in the gap between sucker and the object blows out by the weight of object and from sucker.

Gap between the upper surface of gap sensor 112 measurement bernoulli grippers 108 and fine motion microscope carrier WFS1 and WFS2.For example capacitive transducer is used as gap sensor.The output of gap sensor 112 is provided to master controller 20 (with reference to Fig. 7).

Imaging device 114a extracts the image of the recess (V-type recess, not shown) of wafer W in the center of wafer W and state that the center of bernoulli gripper 108 roughly overlaps.All the

other imaging device

114b and 114c obtain the image of the periphery of wafer W.The picture signal of imaging device 114a to 114c sends to signal processing system 116 (with reference to Fig. 7).Signal processing system 116 is through for example United States Patent(USP) No. 6; 624; Disclosed method in 433 grades; Detect the otch (for example recess) of wafer, and the periphery except otch, and obtain the offset and rotation (the θ z rotation) error of the wafer on X-direction and Y direction of wafer W.The information of this offset and rotation error is provided to master controller 20 (with reference to Fig. 7).

Sucker unit 102 ₁And the drive division 104 of bernoulli gripper 108 is by master controller 20 controls (with reference to Fig. 7).

Other sucker unit 102 ₂To 102 ₄Be configured to be similar to sucker unit 102 ₁In addition, with four sucker unit 102 ₁To 102 ₄In each together, be provided with carrying wafers arm 118 ₁To 118 ₄, it is in sucker unit 102 ₁To 102 ₄With carry wafer between wafer transport position (for example, and exposure sources 100 connect into the coater of straight line and the transfer position of the wafer between the developer (unload side or load side)).

Fig. 7 illustrates the block scheme of the I/O relation that shows master controller 20, and master controller 20 has constituted the control system of exposure sources 100 as central unit, and carries out the control of all associated components.Master controller 20 comprises workstation (or microcomputer) etc.; And carry out all controls of the associated components of exposure sources 100, for example local liquid-immersion device 8, surface

plate drive system

60A and 60B, coarse motion microscope

carrier drive system

62A and 62B and fine motion microscope

carrier drive system

64A and 64B.

Next, with describing the parallel processing operation of using two wafer carrying bench WST1 and WST2.Should be noted that in following operating process; Master controller 20 as previous ground controlling liquid feeding mechanism 5 and the liquid withdrawal system 6 described; And the liquid Lq of constant amount remain on projection optical system PL terminal lens 191 under, and form the immersion liquid zone thus always.

Fig. 8 illustrates the state of the wafer W on the fine motion microscope carrier WFS1 that is installed to the wafer carrying bench WST1 in the exposure station 200 being carried out the exposure of step-scan mode, and the detection of second reference mark on the measurement plate FM2 of the main alignment system AL1 execution wafer carrying bench WST2 (fine motion microscope carrier WFS2) in the use measuring station 300.

Master controller 20 based on the wafer aligned of having carried out in advance (for example; Through becoming will measure the information that coordinate that second reference mark on the plate FM1 is used as benchmark obtains by the coordinate conversion that is provided with that each projected area on the wafer W that (EGA) obtain is aimed at by enhancement mode holocrystalline unit) and the result of reticle alignment etc.; Through repeating that wafer carrying bench WST1 is moved to scanning starting position (acceleration starting position) so that internal transmission motion (stepping between the projection) operation of each projected area on the exposure wafer; And the scan exposure operation that will be formed on the scan exposure mode on pattern transfer each projected area on the wafer W on the graticule R, carry out the exposing operation of step-scan mode.In this step-scan operating process, according to wafer carrying bench WST1 for example in the motion on Y direction in the scan exposure process, as before the have the opposite effect effect of body of surface plate 14A and 14B is described.In addition, for step-by-step operation between projection, give coarse motion microscope carrier WCS1 initial velocity when master controller 20 drives fine motion microscope carrier WFS1 on X-direction, and coarse motion microscope carrier WCS1 plays the effect with respect to the local reaction mass of fine motion microscope carrier WFS1 thus.In this operation, can give coarse motion microscope carrier WCS1 initial velocity, initial velocity makes microscope carrier move on step direction with constant speed.This driving method is described in the open No.2008/0143994 of for example U.S. Patent application.Therefore, the motion of wafer carrying bench WST1 (coarse motion microscope carrier WCS1 and fine motion microscope carrier WFS1) can not cause the vibration of surface plate 14A and 14B, and can very influence wafer carrying bench WST2.

Above-mentioned exposing operation remains under the state in the space between terminal lens 191 and the wafer W (according to the wafer W and the plate 82 of position, projected area) at liquid Lq and carries out, or more specifically, carries out through immersion exposure.

In the exposure sources 100 of this embodiment; During above-mentioned a series of exposing operation; Master controller 20 uses the first measuring head group 72 of fine motion microscope carrier position measuring system 70 to measure the position of fine motion microscope carrier WFS1, and controls the position of fine motion microscope carrier WFS1 (wafer W) based on this measurement result.

Parallel with the exposing operation that the wafer W that is installed on the fine motion microscope carrier WFS1 in the exposure station 200 is carried out, in measuring station 200, carry out wafer aligned (and other pre-service is measured) to being installed in the new wafer W on the fine motion microscope carrier WFS2, as shown in Figure 9.

Before the wafer aligned; When measurement plate FM2 in the surveyed area that is in main alignment system AL1, on fine motion microscope carrier WFS2 is oriented to when as shown in Figure 8, master controller 20 (initial point resets) the second measuring head group 73 (scrambler 55,56 and 57 (and Z surface location measuring system 58)) that resets.

After scrambler 55,56 and 57 (and Z surface location measuring system 58) resetted, master controller 20 used main alignment system AL1 to detect second reference mark of measuring on the plate FM2, shown in Figure 10 (A).Then; Master controller 20 utilizes the position of detecting second reference mark as the scale center of the main alignment system AL1 of benchmark; And based on testing result with by the result of the position measurement of the fine motion microscope carrier WFS2 of scrambler 55,56 and 57 when detecting; Datum axis La and datum axis LV are used as coordinate axis, calculate the position coordinates of second reference mark in orthogonal coordinate system (alignment coordinates system).

In following explanation, the wafer aligned program will be described, wherein, the wafer W with 43 projected areas of selection shown in Figure 10 (A) is as an example; All projected areas on the selection wafer W are as the sampling projected area; And detection is arranged on one or two the specific alignment mark (hereinafter, being called the sampling mark) in each in the sampling projected area.Point out that in passing in the following description, main alignment system and secondary alignment system all will abbreviate alignment system as.In addition; Although in the wafer aligned process; The positional information of wafer carrying bench WST2 (fine motion microscope carrier WFS2) is measured by fine motion microscope carrier position measuring system 70 (the second measuring head group 73); But in following description, omission is related to the explanation of fine motion microscope carrier position measuring system 70 (the second measuring head group 73) to the wafer aligned program.

After having detected second reference mark; Master controller 20 with wafer carrying bench WST2 step to from position shown in Figure 10 (A) preset distance on the+Y direction and on-directions X the position of preset distance; And locate each in the sampling mark in the first and the 3rd projected area that is arranged on the row of first on the wafer W, make the sampling mark be in alignment system AL2 respectively ₂In the surveyed area of AL1, shown in Figure 10 (B).

Then; Master controller 20 stepping on+directions X is positioned at the wafer carrying bench WST2 of position shown in Figure 10 (B); And locate each in the sampling mark in the second and the 3rd projected area that is arranged on the row of first on the wafer W, make the sampling mark be in alignment system AL1 and AL2 respectively ₃Surveyed area in, shown in Figure 10 (C).And master controller 20 uses alignment system AL1 and AL2 ₃Reach simultaneously and detect two sampling marks individually.This has accomplished the detection of the sampling mark in the projected area of first row.

Then; Master controller 20 with wafer carrying bench WST2 step to from position shown in Figure 10 (C) preset distance on the+Y direction and on-directions X the position of preset distance; And locate each in the sampling mark in the first, the 3rd, the 5th and the 7th projected area that is arranged on the row of second on the wafer W, make the sampling mark be in alignment system AL2 respectively ₁, AL2 ₂, AL1 and AL2 ₃Surveyed area in, shown in Figure 11 (A).And master controller 20 uses alignment system AL2 ₁, AL2 ₂, AL1 and AL2 ₃Reach simultaneously and detect four sampling marks individually.Then; Master controller 20 from the position shown in Figure 11 (A) on+directions X stepping wafer carrying bench WST2; And locate each in the sampling mark in the second, the 4th, the 6th and the 7th projected area that is arranged on the row of second on the wafer W, make the sampling mark be in alignment system AL2 respectively ₂, AL1, AL2 ₃And AL2 ₄Surveyed area in, shown in Figure 11 (B).And master controller 20 uses alignment system AL2 ₂, AL1, AL2 ₃, and AL2 ₄Reach simultaneously and detect four sampling marks individually.This has accomplished the detection of the sampling mark in the projected area of second row.

Then, master controller 20 with the projected area of second row in the detection type of sampling mark like process carry out the detection of the sampling mark in the projected area of the third line.

And; When the detection of the sampling mark in the projected area at the third line is accomplished; Master controller 20 with wafer carrying bench WST2 from the position of setting when this time point step to+the Y direction on the position of preset distance on preset distance and the-directions X; And locate each in the sampling mark in the first, the 3rd, the 5th, the 7th and the 9th projected area that is arranged on the fourth line on the wafer W, make the sampling mark be in alignment system AL2 respectively ₁, AL2 ₂, AL1, AL2 ₃And AL2 ₄Surveyed area in, shown in Figure 11 (C).And master controller 20 uses alignment system AL2 ₁, AL2 ₂, AL1, AL2 ₃And AL2 ₄Reach simultaneously and detect five sampling marks individually.Then; Master controller 20 with wafer carrying bench WST2 from the position shown in Figure 11 (C) in+directions X stepping; And locate each in the sampling mark in the second, the 4th, the 6th, the 8th and the 9th projected area that is arranged on the fourth line on the wafer W, make the sampling mark be in alignment system AL2 respectively ₁, AL2 ₂, AL1, AL2 ₃And AL2 ₄Surveyed area in, shown in Figure 11 (D).And master controller 20 uses alignment system AL2 ₁, AL2 ₂, AL1, AL2 ₃And AL2 ₄Reach simultaneously and detect five sampling marks individually.

In addition, master controller 20 with mode like the detection type of sampling mark in the projected area of second row in the detection of carrying out the sampling mark in the 5th and the 6th capable projected area.At last, master controller 20 is to carry out the detection of the sampling mark in the projected area of the 7th row with mode like the detection type of sampling mark in the projected area of first row.

When accomplishing the detection of the sampling mark in all projected areas in the above described manner; The measurement result of the fine motion microscope carrier position measuring system 70 (the second measuring head group 73) when master controller 20 uses the testing result of sampling mark and samples marker detection; Through carrying out at for example United States Patent(USP) No. 4; The array (position coordinates) of all projected areas on the wafer W is calculated in disclosed statistical computation in 780,617 grades.More specifically, carry out EGA (enhancement mode global alignment).Because measuring station 300 and exposure station 200 are provided with herein dividually, therefore when wafer aligned and when exposure, in the different coordinates system, control the position of fine motion microscope carrier WFS2.Therefore; Master controller 20 use the testing result of second reference mark and when detecting the measured value of fine motion microscope carrier position measuring system 70B, the array coordinate (position coordinates) that has calculated is converted to the position of second alignment mark array coordinate (position coordinates) as benchmark.

As stated; With regard to Y direction; Master controller 20 is wafer carrying bench WST2 little by little stepping on+Y direction, simultaneously, and with regard to X-direction; Reciprocally drive wafer carrying bench WST2, be arranged on the alignment mark (sampling mark) in all projected areas on the wafer W at+directions X and-directions X with detection.In the case, in the exposure sources 100 of this embodiment, owing to can use five alignment system AL1 and AL2 ₁To AL2 ₄, the distance that on X-direction, back and forth drives is short, and the number of times of the position of in a to-and-fro movement, setting lacks twice.Therefore, when when using the situation of single alignment system, can in a small amount of time, detect alignment mark.Point out in passing, seeing under the situation of no problem generation, can only use main alignment system AL1 to carry out the wafer aligned that aforesaid all projected areas all are the sampling projections from the angle of total processing power (throughput).In the case, do not need secondary alignment system AL2 ₁To AL2 ₄Baseline, that is, and secondary alignment system AL2 ₁To AL2 ₄Relative position with respect to main alignment system AL1.In addition, replacing all projected areas all is the sampling projection, and the part of projected area can be the sampling projection.In addition, not only the second measuring head group 73 can be set further, and such measuring head group can further be set, this measuring head group has and secondary alignment system AL2 ₁To AL2 ₄Inspection center in the measuring center of each coincidence, and can use this measuring head group to carry out wafer aligned together with the second measuring head group 73, measure the position coordinates of fine motion microscope carrier WFS2 (wafer carrying bench WST2) simultaneously.

Usually, above-mentioned wafer orientation is accomplished early than exposure in proper order in proper order.Therefore, when wafer orientation was accomplished, master controller 20 drove wafer carrying bench WST2 on+directions X, wafer carrying bench WST2 is moved to the predetermined spare space on the surface plate 14B.In the case, when wafer carrying bench WST2 was driven on+directions X, fine motion microscope carrier WFS2 moved out the measurable range (that is the corresponding measurement bundle that, irradiates from the second measuring head group 73 leaves from grating RG) of fine motion microscope carrier position measuring system 70.Therefore; Based on the measured value of fine motion microscope carrier position measuring system 70 (scrambler 55,56 and 57) and the measured value of the 66B of relative position measurement system; Master controller 20 moves out before the measurable range of fine motion microscope carrier position measuring system 70 at fine motion microscope carrier WFS2; Obtain the position of coarse motion microscope carrier WCS2, and afterwards, based on the position of the measured value control wafer microscope carrier WST2 of coarse motion microscope carrier position measuring system 68B.More specifically, the position measurement of wafer carrying bench WST2 in the XY plane switches to the measurement of using coarse motion microscope carrier position measuring system 68B from the measurement of using scrambler 55,56 and 57.Then, master controller 20 makes wafer carrying bench WST2 wait in above-mentioned predetermined standby position, up to the exposure of accomplishing the wafer W on the fine motion microscope carrier WFS1.

When the exposure of the wafer W on the fine motion microscope carrier WFS1 had been accomplished, master controller 20 began towards the right side shown in Figure 13 and column position drives wafer carrying bench WST1 and WST2 respectively.When on-directions X towards the right side and column position when driving wafer carrying bench WST1; Fine motion microscope carrier WFS1 moves out the measurable range (that is the measurement bundle that, irradiates from the first measuring head group 72 leaves from grating RG) of fine motion microscope carrier position measuring system 70 (scrambler 51,52 and 53 and surface location measuring system 54).Therefore; Move out at fine motion microscope carrier WFS1 before the measurable range of fine motion microscope carrier position measuring system 70; Master controller 20 is based on the measured value of fine motion microscope carrier position measuring system 70 (scrambler 55,56 and 57) and the measured value of the 66A of relative position measurement system; Obtain the position of coarse motion microscope carrier WCS1, and afterwards, based on the position of the measured value control wafer microscope carrier WST1 of coarse motion microscope carrier position measuring system 68A.More specifically, master controller 20 switches to the measurement of using coarse motion microscope carrier position measuring system 68A with the position measurement of the wafer carrying bench WST1 in the XY plane from the measurement of using scrambler 51,52 and 53.In addition; In this operating process, master controller 20 uses coarse motion microscope carrier position measuring system 68B, measures the position of wafer carrying bench WST2; And on surface plate 14B, drive wafer carrying bench WST2 based on measurement result in+Y direction (with reference to the outline line arrow among Figure 12), shown in figure 12.The effect of the reacting force of this driving force through wafer carrying bench WST2, surface plate 14B plays the effect of reaction mass.

In addition; Parallel with wafer carrying bench WST1 and WST2 towards the motion of above-mentioned right side and column position; Master controller 20 drives fine motion microscope carrier WFS1 based on the measured value of the 66A of relative position measurement system on+directions X; And make fine motion microscope carrier WFS1 near to or in contact with coarse motion microscope carrier WCS1, but also on-directions X, drive fine motion microscope carrier WFS2 based on the measured value of the 66B of relative position measurement system, and make fine motion microscope carrier WFS2 near to or in contact with coarse motion microscope carrier WCS2.

Then, all moved under the state of right side and column position at two wafer carrying bench WST1 and WST2, wafer carrying bench WST1 and wafer carrying bench WST2 get on X-direction near to or in contact with state arranged side by side, shown in figure 13.Simultaneously under this state, fine motion microscope carrier WFS1 and coarse motion microscope carrier WCS1 get into state arranged side by side, and coarse motion microscope carrier WCS2 and fine motion microscope carrier WFS2 get into state arranged side by side.Then, the coupling member 92b of the coupling member 92b of the upper surface of fine motion microscope carrier WFS1, coarse motion microscope carrier WCS1, coarse motion microscope carrier WCS2 and fine motion microscope carrier WFS2 form the complete even curface that looks like one.

Keep above-mentioned three states arranged side by side simultaneously along with wafer carrying bench WST1 and WST2 go up to move in the direction (directions X) shown in the outline line arrow, the immersion liquid that forms between terminal lens 191 and the fine motion microscope carrier WFS1 regional (liquid Lq) one after the other moves on the coupling member 92b and fine motion microscope carrier WFS2 of coupling member 92b, coarse motion microscope carrier WCS2 of (being transported to) fine motion microscope carrier WFS1, coarse motion microscope carrier WCS1.Move (conveying) that Figure 13 illustrates immersion liquid zone (liquid Lq) just begun state before.It should be noted that; Keep simultaneously under the situation of above-mentioned three states arranged side by side at driving wafer carrying bench WST1 and wafer carrying bench WST2; Preferably, the gap (space) between gap (space) between the gap (space) between wafer carrying bench WST1 and the wafer carrying bench WST2, fine motion microscope carrier WFS1 and the coarse motion microscope carrier WCS1 and coarse motion microscope carrier WCS2 and the fine motion microscope carrier WFS2 is set for and is made the leakage of liquid Lq be prevented from or suppress.In this case, be zero situation near the gap (space) between two members that are included in state arranged side by side, or more specifically, the situation of two member contacts.

When immersion liquid zone (liquid Lq) mobile completion to fine motion microscope carrier WFS2, wafer carrying bench WST1 has moved on the surface plate 14A.Shown in figure 14, master controller 20 drives wafer carrying bench WST1 to the first unloading position UPA.

When wafer carrying bench WST1 arrived the first unloading position UPA, master controller 20 used sucker unit 102 at the first unloading position UPA place ₂, and wafer W on the unloading wafer microscope carrier WST1 (fine motion microscope carrier WFS1), that made public in the above described manner.Point out in passing, in Figure 14,, omitted sucker 102 in order to prevent the accompanying drawing indigestion that becomes ₂Diagram, and typically show the unloading of wafer W.

At first, shown in Figure 15 (A) and Figure 15 (B), master controller 20 control sucker unit 102 ₂ Drive division 104, and go up to drive bernoulli gripper 108 in the direction of representing by the outline line arrow (below part).During driving, the measured value of master controller 20 monitoring gap sensors 112.When master controller 20 confirmed that measured values reach predetermined value (for example, the gap of a few approximately μ m), master controller 20 stopped to drive bernoulli gripper 108 downwards, and release is by the maintenance to wafer W of the wafer retainer (not shown) of fine motion microscope carrier WFS1.After discharging, the flow velocity of the air that master controller 20 adjustment blow out from bernoulli gripper 108 is so that the gap remains on about a few μ m.It allows wafer W to be held from the top with the noncontact mode through the gap of bernoulli gripper 108 via a few approximately μ m.

Then, shown in Figure 15 (C) and Figure 15 (D), master controller 20 controlling and driving portions 104, and going up driving keeps wafer W with the noncontact mode bernoulli gripper 108 by outline line arrow indicated direction (upper section).And master controller 20 is with carrying wafers arm 118 ₂Insert in (on the direction shown in the black arrow, carry out and drive) space by the below of the wafer W of bernoulli gripper 108 maintenances.After the insertion, master controller 20 shown in Figure 16 (A) and Figure 16 (B), and keeps the back side of wafer W to carry arm 118 against contact wafer going up the bernoulli gripper 108 that drives the maintenance wafer W by outline line arrow indicated direction (below part) ₂Upper surface.After the contact, the maintenance that master controller 20 discharges through bernoulli gripper 108.After discharging, master controller 20 is upwards withdrawn bernoulli gripper 108, shown in Figure 16 (C) and Figure 16 (D).It allows wafer W by carrying wafers arm 118 ₂Be held from the below.Drive carrying wafers arm 118 through going up in the direction of representing along black arrow (directions X) ₂Drive carrying wafers arm 118 along desired trajectory afterwards ₂, master controller 20 is transported to wafer unloading position (for example, the transfer position of the wafer between coater and the developer (unload side)) with wafer W from the first unloading position UPA.This has accomplished the unloading of wafer W.

After the wafer W unloading that has made public, master controller 20 moves to the first " loaded " position LPA shown in figure 17 with wafer carrying bench WST1.Master controller 20 moves to wafer carrying bench WST1 on the surface plate 14A on-Y direction, uses coarse motion microscope carrier position measuring system 68A to measure the position of wafer carrying bench WST1 simultaneously.In the case, when wafer carrying bench WST1 moved on-Y direction, because the effect of the reacting force of driving force, surface plate 14A played the effect of reaction mass.Point out in passing, when wafer carrying bench WST1 moves on X-direction, because the effect of the reacting force of driving force can make surface plate 14A play the effect of reaction mass.

When wafer carrying bench WST1 arrives the first " loaded " position LPA, the sucker unit 102 that master controller 20 uses at the first " loaded " position LPA place ₁New wafer W (still unexposed) is loaded on the wafer carrying bench WST1 (fine motion microscope carrier WFS1), shown in figure 18.Point out in passing, in Figure 18,, omitted the diagram of sucker unit 102, and typically shown the loading of wafer W in order to prevent the accompanying drawing indigestion that becomes.

New wafer W is being loaded in the program of above-mentioned unloading.

In other words, at first, master controller 20 uses carrying wafers arm 118 ₁Wafer W is transported to the first " loaded " position LPA from wafer load position (transfer position of wafer (loading side), for example, between coater and the developer).

Then, master controller 20 drives bernoulli gripper 108 downwards, and uses bernoulli gripper 108 to keep wafer W.And then, master controller 20 upwards drives the bernoulli gripper 108 that keeps wafer W, and carrying wafers arm 118 is withdrawn from the first " loaded " position LPA.

Then; Information based on the offset on X-direction and the Y direction; And from before the rotation error of the wafer W sent of the signal processing system 116 described; Master controller 20 is monitored the measured value of coarse motion microscope carrier measuring system 68A simultaneously, thereby is revised the offset and the rotation error of wafer W via fine motion microscope carrier drive system 64A (and coarse motion microscope carrier drive system 62A) adjusts fine motion microscope carrier WFS1 in the XY plane position (comprising that θ z rotates).

Then; Master controller 20 is driven into bernoulli gripper 108 up to the back side of wafer W and the wafer retainer (not shown) position contacting of fine motion microscope carrier WFS1 downwards; And discharge the maintenance of 108 pairs of wafer W of bernoulli gripper simultaneously, and begin to keep wafer W with the wafer retainer (not shown) of fine motion microscope carrier WFS1.After the wafer retainer begins to keep, bernoulli gripper 108 is upwards withdrawn through master controller 20.This allows new wafer W to be loaded on the fine motion microscope carrier WFS1.

After loaded with wafers W, master controller 20 moves to wafer carrying bench WST1 in the measuring station 300.Then, master controller 20 switches to the measurement of using scrambler 55,56 and 57 with the position measurement of the wafer carrying bench WST1 in the XY plane from the measurement of using coarse motion microscope carrier position measuring system 68A.

Then, master controller 20 uses main alignment system AL1 to detect in second reference mark of measuring on the plate FM1, and is shown in figure 19.It should be noted that; Before detecting second reference mark; Master controller 20 is carried out the second measuring head group 73 of fine motion microscope carrier position measuring system 70, or more specifically, reset (the resetting of initial point) of scrambler 55,56 and 57 (and surface location measuring system 58).Afterwards, master controller 20 uses alignment system AL1 and AL2 ₁To AL2 ₄Carry out and the similar wafer aligned of above-mentioned wafer aligned (EGA) about the wafer W on the fine motion microscope carrier WFS1, simultaneously the position of control wafer microscope carrier WST1.

Parallel with the operation of above-mentioned wafer carrying bench WST1, master controller 20 drives wafer carrying bench WST2, and will measure the position of set positions under projection optical system PL of plate FM2, and is shown in figure 14.Before this operation, master controller 20 with the position measurement of the wafer carrying bench WST2 in the XY plane, switches to the measurement of using scrambler 51,52 and 53 from the measurement of using coarse motion microscope carrier position measuring system 68B.Then, use the reticle alignment RA of system ₁And RA ₂Detect to measure said a pair of first reference mark on the plate FM2, and detect the relative position that reticle alignment on the graticule R corresponding with first reference mark is marked at the projected image on the wafer.Point out in passing, should detection through the liquid Lq execution in projection optical system PL and formation immersion liquid zone.

Based on as above detected relative position information; And obtain before with second reference mark on the fine motion microscope carrier WFS2 as each the positional information in the projected area on the wafer W of benchmark, master controller 20 calculate graticule R pattern projected position (projection centre of projection optical system PL) and be installed in the relative position relation between each in the projected area on the wafer W on the fine motion microscope carrier WFS2.In position based on result of calculation control fine motion microscope carrier WFS2 (wafer carrying bench WST2); With on the design transfer of graticule R each projected area on the wafer W that is installed on the fine motion microscope carrier WFS2, it is similar to the situation that is installed in the wafer W on the fine motion microscope carrier WFS1 of previous description to master controller 20 with the step-scan mode.The pattern that Figure 17 to Figure 19 illustrates graticule R is transferred to the state on each projected area on the wafer W in this way.

When the wafer aligned (EGA) with respect to the wafer W on the fine motion microscope carrier WFS1 is accomplished, and the exposure of the wafer W on the fine motion microscope carrier WFS2 has been when also having accomplished, master controller 20 towards the left side and column position drive wafer carrying bench WST1 and WST2.This left side and column position are meant such position relation, and wherein, wafer carrying bench WST1 and WST2 are positioned at about datum axis LV that describes before and right side and the symmetrical position of column position shown in Figure 13.During driving towards left side and column position, the measurement of the position of wafer carrying bench WST1 is to carry out with the similar program of position measuring program of the wafer carrying bench WST2 of previous description.

Equally in this left side and column position; Wafer carrying bench WST1 and wafer carrying bench WST2 get into the previous state of describing arranged side by side; And in this state, fine motion microscope carrier WFS1 and coarse motion microscope carrier WCS1 get into state arranged side by side, and coarse motion microscope carrier WCS2 and fine motion microscope carrier WFS2 get into state arranged side by side.Then, the coupling member 92b of the coupling member 92b of the upper surface of fine motion microscope carrier WFS1, coarse motion microscope carrier WCS1, coarse motion microscope carrier WCS2 and fine motion microscope carrier WFS2 form the complete even curface that appears to one.

When keeping above-mentioned three states arranged side by side, master controller 20 with before in the opposite direction+directions X on drive wafer carrying bench WST1 and WST2.According to this driving; The immersion liquid zone (liquid Lq) that forms between lens 191 and the fine motion microscope carrier WFS2 endways; Sequentially move on the coupling member 92b and fine motion microscope carrier WFS1 of coupling member 92b, coarse motion microscope carrier WCS1 of fine motion microscope carrier WFS2, coarse motion microscope carrier WCS2 itself and the reversed in order of describing before.Certainly, when when keeping abreast of state, moving wafer carrying bench, situation about describing before being similar to, the same position measurement of carrying out wafer carrying bench WST1 and WST2.When the motion of immersion liquid zone (liquid Lq) has been accomplished, master controller 20 with the exposure of the similar program start of describing before of program to the wafer W on the wafer carrying bench WST1.Parallel with this exposing operation, as before described, the wafer W that master controller 20 generals make public on wafer carrying bench WST2 is replaced with new wafer W.In other words, master controller 20 moves to the second unloading position UPB with wafer carrying bench WST2, uses the sucker unit 102 that is arranged on the second unloading position UPB place ₄Unloading is the wafer W of experience exposure on wafer carrying bench WST2, and then wafer carrying bench WST2 is moved to the second " loaded " position LPB, and uses the sucker unit 102 that is arranged on the second " loaded " position LPB place ₃New wafer W is loaded on the wafer carrying bench WST2.After wafer was changed, master controller 20 moved to wafer carrying bench WST2 in the measuring station 300, and then, new wafer W was carried out wafer aligned.

Afterwards, master controller 20 uses above-mentioned wafer carrying bench WST1 and WST2 repeatedly to carry out the parallel processing operation.

Like above detailed description; Exposure sources 100 according to this embodiment; Through using sucker unit 102 (bernoulli grippers 108) to keep wafer W with the noncontact mode from the top, wafer W is loaded on fine motion microscope carrier WFS1 and the WFS2, and from fine motion microscope carrier WFS1 and WFS2 unloading.Therefore, needn't be provided with wafer is loaded into that fine motion microscope carrier WFS1 and WFS2 go up and member that wafer is unloaded from fine motion microscope carrier WFS1 and WFS2 etc., it can avoid the increase of fine motion microscope carrier WFS1 and WFS2 size and weight.In addition; Through using the bernoulli gripper 108 that keeps wafer with the noncontact mode from the top; That approach, flexible object, for example, 450mm wafer etc. is loaded on wafer carrying bench WFS1 and the WFS2 and from wafer carrying bench WFS1 and WFS2 with can having no problem and unloads.

In addition; The exposure sources 100 of this embodiment of root root; The first " loaded " position LPA and wafer W that wafer W is loaded on the fine motion microscope carrier WFS1 are positioned at the diverse location on the surface plate 14A from the first unloading position UPA that fine motion microscope carrier WFS1 unloads; And, be respectively arranged with sucker unit 102 at said diverse location place ₁With 102 ₂(bernoulli gripper 108).Similarly; The second " loaded " position LPA and wafer W that wafer W is loaded on the fine motion microscope carrier WFS2 are positioned at the diverse location on the surface plate 14B from the second unloading position UPA that fine motion microscope carrier WFS2 unloads; And, be respectively arranged with sucker unit 102 at said diverse location place ₃With 102 ₃(bernoulli gripper 108).It has reduced and is used for wafer and changes the needed time.

In addition; In the exposure sources 100 of this embodiment; During the exposing operation and during wafer aligned (mainly; During the measurement of alignment mark), be fixed to the first measuring head group 72 and the second measuring head group 73 of sounding rod 71, in the measurement of the positional information (positional information in the XY plane and surface position information) of the fine motion microscope carrier WFS1 (or WFS2) that keeps wafer W, be used respectively.And; Owing to constitute scrambler head 75x, 75ya and 75yb and a Z 76a to 76c of the first measuring head group 72; And scrambler head 77x, 77ya and the 77yb and the Z 78a to 78c that constitute the second measuring head group 73, can with measure bundle under shine the grating RG on the bottom surface that is positioned at fine motion microscope carrier WFS1 (or WFS2) respectively with the shortest distance, therefore; Temperature fluctuation by the ambient atmosphere of wafer carrying bench WST1 or WST2; Airwaves for example, the measuring error that causes reduces, and can carry out the high-acruracy survey of the positional information of fine motion microscope carrier WFS.

In addition; The first measuring head group 72 is being measured positional information and the surface position information of fine motion microscope carrier WFS1 (or WFS2) in the XY plane with the some place that exposure position roughly overlaps; This exposure position is the center of the exposure area IA on wafer W;, and the second measuring head group 73 is measured positional information and the surface position information of fine motion microscope carrier WFS2 (or WFS1) in the XY plane at the some place that roughly overlaps with the center of the surveyed area of main alignment system AL1.Therefore, the appearance of the so-called Abbe error (Abbe error) that has suppressed to cause by the site error in the XY plane between measurement point and the exposure position, and in this regard, can carry out the high-acruracy survey of the positional information of fine motion microscope carrier WFS1 or WFS2.

In addition; Be fixed to the main frame BD that is fixed with lens barrel 40 owing to have the sounding rod 71 of the first measuring head group 72 and the second measuring head group 73 with suspension status, the optical axis that can utilize the projection optical system PL that is kept by lens barrel 40 that becomes is carried out the high precision position control to wafer carrying bench WST1 (or WST2) as benchmark.In addition, because sounding rod 71 and the member (for example,

surface plate

14A and 14B, base 14 etc.) except main frame BD are in not contact condition, so when

surface plate

14A and 14B, wafer carrying bench WST1 and WST2 etc. were driven, the vibration of generation etc. was not transmitted.Therefore, become and to carry out high-acruracy survey through using the first measuring head group 72 and the second measuring head group 73 positional information of wafer carrying bench WST1 (or WST2).

In addition, according to the exposure sources 100 of this embodiment, master controller 20 uses main alignment system AL1 and secondary alignment system AL2 ₁To AL2 ₄Detection is arranged on one or more a plurality of alignment mark in each in all projected areas on the wafer W that is kept by fine motion microscope carrier WFS2; This main alignment system AL1 is locating to have inspection center with the identical position (XY position) of reference point that is used for being undertaken by fine motion microscope carrier position measuring system 70 position measurement;, this secondary alignment system AL2 ₁To AL2 ₄Have inspection center, this inspection center has the known position relation with the inspection center of main alignment system AL1.Result through based on wafer aligned drives fine motion microscope carrier WFS2 under the situation of exposure, become and can realize enough overlapping precision with fully total processing power.Particularly under the situation of one or more a plurality of alignment marks on each in all projected areas on only using main alignment system AL1 to detect to be arranged on the wafer W that keeps by fine motion microscope carrier WFS2; Through under the situation of exposure, driving fine motion microscope carrier WFS2 based on the wafer aligned result; Become and with high precision all projected areas on the wafer W to be aimed at exposure position; It allows the high precision (optimum precision) in each in having all projected areas of graticule pattern overlapping again, and this main alignment system AL1 is locating to have inspection center with the identical position (XY position) of reference point that is used for being undertaken by fine motion microscope carrier position measuring system 70 position measurement.

In addition; In the wafer carrying bench WST1 and WST2 of this embodiment; Because coarse motion microscope carrier WCS1 (or WCS2) is positioned at the periphery of fine motion microscope carrier WFS1 (or WFS2); Therefore, compare with having the wafer carrying bench that fine motion microscope carrier wherein is installed in the thick/fine motion structure on the coarse motion microscope carrier, wafer carrying bench WST1 and the WST2 size on short transverse (Z-direction) can reduce.Therefore; The point of the effect of the thrust of the planar motors of structure coarse motion microscope

carrier drive system

62A and 62B (promptly; And therefore point between the bottom surface of coarse motion microscope carrier WCS1 (WCS2) and the upper surface of

surface plate

14A and 14B) and between the center of gravity of wafer carrying bench WST1 and WST2, the distance on Z-direction can reduce; When wafer carrying bench WST1 and WST2 were driven, the pitching moment of generation (or rolling moment) can reduce.Therefore, the operation of wafer carrying bench WST1 and WST2 becomes stable.

In addition, in the exposure sources 100 of this embodiment, the surface plate that forms the guiding surface that uses during along the XY plane motion as wafer carrying bench WST1 and WST2 is made up of two

surface plate

14A and 14B, with corresponding to two wafer carrying bench WST1 and WST2.When wafer carrying bench WST1 and WST2 are driven by planar motors; These two

surface plate

14A and 14B play the effect of reaction mass independently; And therefore; For example, both made when wafer carrying bench WST1 and wafer carrying bench WST2 on surface plate 14A and the 14B when on opposite directions, being driven respectively on the Y direction,

surface plate

14A and 14B also can eliminate the reacting force that acts on respectively on the surface plate individually.

Point out in passing; In above embodiment; Use sucker unit 102 and the carrying wafers arm 118 that disposes the bernoulli gripper 108 that is vertically driven by drive division 104 although described, with the situation that wafer is loaded into that fine motion microscope carrier WFS1 goes up with WFS2 and unloads from fine motion microscope carrier WFS1 and WFS2, above embodiment is not limited thereto; For example; Can use the vertical movably mechanical arm of horizontal polylinker to come the loading and unloading wafer, this mechanical arm has the bernoulli gripper 108 that is fixed to end, perhaps is configured such that the sucker unit that can carry bernoulli gripper 108 in the horizontal direction.

In addition; In the above-described embodiment; Replace bernoulli gripper, for example can use with the sucker member that in vacuum preloading formula gas at rest bearing, utilizes differential emptying (differential evacuation) the samely etc., this sucker member can the noncontact mode keep wafer W from the top.

In addition, in this embodiment, although " loaded " position LPA and LPB and unloading position UPA and UPB are positioned at the diverse location place, these positions also can be positioned at the same position place.In this case, at the same position place, two sucker unit of sucker unit 102 that only is used for loaded with wafers and the sucker unit 102 that only is used for unloading wafer can be set further.

In addition; In this embodiment; Although the " loaded " position LPB and the unloading position UPB that are used for " loaded " position LPA and the unloading position UPA of wafer carrying bench WST1 and are used for wafer carrying bench WST2 also can be located " loaded " position and the unloading position of being shared by wafer carrying bench WST1 and WST2 by location independently.

In addition, in this embodiment, be the situation of integral type with main frame BD although described sounding rod 71, set-up mode is not limited thereto, and sounding rod 71 can physically be separated with main frame BD.In this case, should be provided with: measurement mechanism (for example, scrambler and/or interferometer etc.), it measures the position (or displacement) of sounding rod 71 with respect to main frame BD (or reference position); And actuator etc.; The position of its adjustment sounding rod 71; And based on the measurement result of measurement mechanism, master controller 20 and/or another controller should maintain predetermined relationship (for example constant) with the relation of the position between main frame BD (and projection optical system PL) and the sounding rod 71.

In addition, in above-mentioned embodiment and improved example, although with measuring system 30 and 30 ' be described as the variation through optical method for measuring sounding rod 71, above-mentioned embodiment is not limited thereto.In order to measure the variation of sounding rod 71, temperature sensor, pressure transducer, the acceleration transducer etc. that is used for vibration survey can be attached to sounding rod 71.Perhaps, strain transducer (strainmeter) or displacement transducer can be set and wait the variation of measuring sounding rod 71.Then, utilize these sensors to obtain sounding rod 71 (housing 72 ₀) variation (distortion, displacement etc.), and based on the result who has obtained, master controller 20 obtains with respect to be arranged on sounding rod 71 (housing 72 ₀) in the angle of inclination of Z axle of optical axis of a 75x, 75ya and 75yb; And apart from the distance of grating RG; And, obtain each the update information of measuring error (trilocation error) among a 75x, 75ya and the 75yb of the first measuring head group 72 based on angle of inclination, distance and the update information described before.Point out that in passing master controller 20 can be revised the positional information that is obtained by coarse motion microscope carrier position measuring system 68A and 68B based on the variation of the sounding rod 71 that is obtained by sensor.

In addition, although the exposure sources of above embodiment has two surface plate corresponding to two wafer carrying bench, the quantity of surface plate is not limited thereto, and also can adopt a surface plate or three or more a plurality of surface plate.In addition; The quantity of wafer carrying bench is not limited to two, but can adopt a wafer carrying bench or three or more a plurality of wafer carrying bench, and; For example; Have the measurement microscope carrier of aerial image surveying instrument, uneven illumination degree surveying instrument, illuminance monitor, wave aberration surveying instrument etc., can navigate on the surface plate, in the open No.2007/201010 of for example U.S. Patent application, disclose this measurement microscope carrier.

In addition, the position that surface plate or basic component is divided into a plurality of portion boundaries is not limited to position the same in above embodiment.Although the boundary line is set at the line that comprises datum axis LV and intersect at optical axis AX in above embodiment; But the boundary line also can be set in another position; For example, if be arranged in exposure station, under the situation that the thrust of planar motors is weakened at the present part in border place on the border.

In addition, can be at the center section on the longitudinal direction of sounding rod 71 (can be arranged on a plurality of positions) through being bearing on the base like disclosed deadweight canceller in the open No.2007/0201010 of for example U.S. Patent application.

In addition, the motor of table-drive panel 14A and 14B is not limited to adopt the planar motors of electromagnetic force (Lorentz force) type of drive on base 12, but for example, can be the planar motors (or linear motor) that adopts the VR type of drive.In addition, motor is not limited to planar motors, and can be to comprise the mover of the side that is fixed to surface plate and the voice coil motor that is fixed to the stator of base.In addition, surface plate can be passed through, and is bearing on the base like disclosed deadweight compensator in the open No.2007/0201010 of U.S. Patent application for example etc.In addition, the driving direction of surface plate is not limited to the direction of three degree of freedom, but for example, can be the direction of six-freedom degree, Y direction only, or two direction of principal axis of XY only.In this case, surface plate can be suspended in above the base through gas at rest bearing (for example air bearing) etc.In addition, can be merely under the situation of Y direction in the direction of motion of surface plate, surface plate can be installed to and for example be arranged on the Y guiding elements that extends on the Y direction, so that can on Y direction, move.

In addition; In above embodiment, although grating is arranged on the lower surface of fine motion microscope carrier, promptly; Upper surface facing surfaces with surface plate; But set-up mode is not limited to this, and the major part of fine motion microscope carrier is made up of solid element that can transmitted light, and grating can be arranged on the upper surface of major part.In this case; Because it is more approaching than the distance between above embodiment wafer and the grating; Therefore, receive by wafer that the different Abbe errors that cause on Z-direction can reduce between the reference field (locating surface of grating) of surface mutually exposure, that comprise exposure station and the position measurement of the fine motion microscope carrier that is undertaken by scrambler 51,52 and 53.In addition, grating can be formed on the back side of wafer retainer.In this case, the wafer retainer was expanded or attachment location with respect to the skew of fine motion microscope carrier, also can be according to expanding or the position of offset measurement wafer retainer (wafer).

In addition; In this embodiment; Although this situation has been described to the example that encoder system wherein disposes X head and a pair of Y head, set-up mode is not limited to this, and for example; One or two two dimension head (2D head) can be positioned at the inside of sounding rod, and the direction of measurement of this two dimension head (2D head) is the both direction of X-direction and Y direction.Under the situation that is provided with two 2D heads, the check point of two 2D heads can be set on the grating two the some places of distance as exposure position spaced apart same distance on X-direction at center.In above embodiment, although the quantity of head is an X head and two Y heads, the quantity of head can be by further increase.In addition, in above embodiment, although the quantity of the head of each group is an X head and two Y heads, the quantity of head can be by further increase.In addition, the first measuring head group 72 of exposure station 300 sides can further have a plurality of groups.For example, be arranged in each side corresponding to the periphery of the head group of the position of exposure position (being made public in wafer W in the projected area) (+X ,+Y ,-X and-four direction of Y direction), the other end group can be set.And just before the exposure of projected area, the position of fine motion microscope carrier (wafer W) can be read mode with so-called head and kept away the row measurement.In addition, the structure that constitutes the encoder system of fine motion microscope carrier position measuring system 70 is not limited to the structure of above embodiment, but can adopt any configuration.For example, also can use can be on each direction of X axle, Y axle and Z axle the 3D head of measuring position information.

In addition, in above embodiment, measurement bundle of penetrating from the scrambler hair and the measurement bundle of penetrating from the Z hair via the gap between two surface plate or be formed on the transmittance section at each place in the surface plate, are radiated on the grating of fine motion microscope carrier.In this case; Because the transmittance section is formed on each place among surface plate 14A and the 14B; The beam diameter of bundle is measured less times greater than each in the hole of each transmittance section, and the range of movement of Considering

Surface plate

14A or 14B can make to measure to restraint and pass these a plurality of opening portions as reaction mass.In addition, for example, also can be that pencil formula head is as corresponding encoded device head and corresponding Z head, and the opening portion that these inserted is formed on each place in the surface plate.

Point out in passing; In above embodiment; This situation has been described to example; Wherein according to using planar motors as moving 62A of system in the coarse motion microscope carrier district that drives wafer carrying bench WST1 and WST2 and 62B, be used for wafer carrying bench WST1 and WST2 along the XY plane motion guiding surface (surface of generation power on Z-direction) form by the surface plate 14A and the 14B of stationary part with planar motors.But above embodiment is not limited to this.In addition; In above embodiment; Although surface measurements (grating RG) is arranged on fine motion microscope carrier WFS1 and the WFS2, and the first measuring head group 72 (and second measuring head group 73) is made up of the scrambler head that is arranged on sounding rod 71 places (and Z head), and above embodiment is not limited to this.More specifically, opposite with said circumstances, scrambler head (and Z head) can be arranged on fine motion microscope carrier WFS1 place, and surface measurements (grating RG) can be formed on sounding rod 71 sides.This opposite location can be applied to, and has the bearing table device of the structure that magnetic levitation microscope carrier wherein combines with so-called H type microscope carrier, and this bearing table device is for example using in electron beam exposure equipment, the EUV exposure sources etc.In this bearing table device; Because microscope carrier is supported by guide rod; So scale bar (it is equivalent to form the lip-deep sounding rod of diffraction grating) is positioned the microscope carrier below; So that relative with microscope carrier, and at least a portion (for example optical system) of coding head is positioned on the lower surface of the microscope carrier relative with scale bar.In this case, guide rod constitutes guiding surface formation member.Certainly, also can adopt another kind of structure.Grating RG can be sounding rod 71 for example in the position that sounding rod 71 sides are arranged, or is arranged on the whole surface on the surface plate 14A (14B) or the plate of at least one lip-deep no magnetic material etc.

Point out in passing; In above embodiment; Because sounding rod 71 is fixed to main frame BD integratedly, thereby has following possibility: in sounding rod 71, produce distortion etc. owing to internal stress (comprising thermal stress), the relative position between sounding rod 71 and the main frame BD can change.Therefore; Owing to taked the precautionary measures in this case, so also can measure the position (with respect to the relative position of main frame BD, or with respect to the variation of the position of reference position) of sounding rod 71; And accurately adjust the position of sounding rod 71 through actuator etc., or revise measurement result.

In addition; In above embodiment; Scenarios has been described, wherein, the coupling member 92b that is disposed respectively via coarse motion microscope carrier WCS1 and WCS2; Through the zone of the conveying immersion liquid between fine motion microscope carrier WFS1 and fine motion microscope carrier WFS2 (liquid Lq), and immersion liquid zone (liquid Lq) is maintained projection optical system PL below constantly.But; The invention is not restricted to this; But can; Through moving the similar shutter means (not shown) that has with disclosed structure in the 3rd embodiment of the for example open No.2004/0211920 of U.S. Patent application, in the exchange process of wafer carrying bench WST1 and WST2, move to below the projection optical system PL, immersion liquid zone (liquid Lq) is maintained projection optical system PL below constantly.

In addition, although described the situation that wherein above embodiment is applied to the bearing table device (wafer carrying bench) 50 of exposure sources, the invention is not restricted to this, and above embodiment also can be applicable to graticule microscope carrier RST.Point out that in passing in above embodiment, grating RG can cover through the protection member of for example cloche to be protected.Cloche can be arranged to cover the roughly whole surface of the lower surface of major part 80, maybe can be arranged to only to cover the part of the lower surface of the major part 80 that comprises grating RG.In addition, although owing to need be enough to protect the thickness of grating RG, and need plate shape protection member, also can use film shape protection member according to material.In addition; It also can be transparent panel; Grating RG is fixed to or is formed on the surface of transparent panel, and transparent panel has and is positioned to contact with the back side of wafer retainer or near another surface at the back side of wafer retainer, and protection member (cloche) is arranged on a face side of transparent panel; Or under the situation that protection member (cloche) be not set, surface alignment of the transparent panel that grating RG is fixed to or is formed at one-tenth contacts with the back side of wafer retainer or near the back side of wafer retainer.Particularly in the former case, grating RG can be fixed to or be formed on the opaque member such as pottery rather than on the transparent panel, and perhaps grating RG can be fixed to or be formed on the back side of wafer retainer.Under one situation of back, even the wafer retainer expands between exposure period or with respect to the skew of the attachment location of fine motion microscope carrier, also can be according to expanding or squinting and measure the position of wafer retainer (wafer).Perhaps, also can, wafer retainer and grating RG only keep through conventional fine motion microscope carrier.In addition, also can, the wafer retainer is formed by the solid glass member, and grating RG navigates on the upper surface (wafer installation surface) of glass component.Point out that in passing in above embodiment, although described scenarios as an example, wherein wafer carrying bench is the thick/fine motion microscope carrier of the combination of coarse motion microscope carrier and fine motion microscope carrier, the invention is not restricted to this.In addition, in above embodiment,, the invention is not restricted to this, and the fine motion microscope carrier should be parallel to the two dimensional in-plane moving on XY plane at least on all directions of six-freedom degree although fine motion microscope carrier WFS1 and WFS2 can be driven.In addition, fine motion microscope carrier WFS1 and WFS2 can support with the way of contact through coarse motion microscope carrier WCS1 and WCS2.Therefore, driving the fine motion microscope carrier drive system of fine motion microscope carrier WFS1 or WFS2 with respect to coarse motion microscope carrier WCS1 or WCS2, can be rotary motor and the combining of ball screw (or feed screw).Point out that in passing fine motion microscope carrier position measuring system can be configured such that, position measurement can be carried out in the whole zone of the range of movement of wafer carrying bench.In the case, the coarse motion microscope carrier position measuring system no longer needs that become.Point out that in passing the wafer that in the exposure sources of above embodiment, uses for example can be, any one in the wafer of the various sizes of 450mm wafer or 300mm wafer.

Point out in passing; In above embodiment; Although having described exposure sources is the situation of the exposure sources of immersion liquid type, the invention is not restricted to this, and above embodiment can suitably be applied under the situation that does not have liquid (water), carry out the dry type exposure sources of the exposure of wafer W.

Pointing out in passing, in above embodiment, is the situation of scanning ledex although described exposure sources, the invention is not restricted to this, and above embodiment also can be applied to the for example static exposure equipment of ledex.Both made in ledex etc., the generation of the position measurement mistake that is caused by air flow also can be reduced to almost nilly through the position of measuring microscope carrier, and the object of accepting exposure uses scrambler to be installed on the microscope carrier.Therefore, become and to set the position of microscope carrier based on the measured value of scrambler with high precision, and therefore, can carry out the high-precision transfer of graticule pattern to the object.In addition, above embodiment also can be applicable to the stepping that projected area and projected area is synthetic and the reduced projection exposure sources of seam mode.

In addition; The multiplying power of the projection optical system in the exposure sources in the above embodiment is not only and is reduced system; And can be to be equal to amplification system or amplification system, and projection optical system is not only dioptric system, and can be reflecting system or reflected refraction system; And in addition, projected image can be inverted image or upright image.

In addition, illumination light IL is not limited to argon fluoride (ArF) excimer laser (wavelength with 193nm), but can be, such as the ultraviolet light of KrF (KrF) excimer laser (wavelength) with 248nm, and perhaps F for example ₂The vacuum-ultraviolet light of laser (wavelength) with 157nm.As at for example United States Patent(USP) No. 7; 023; Disclosed in 610, harmonic wave also can be used as vacuum-ultraviolet light, and harmonic wave obtains through amplify single wavelength laser bundle in infrared or visible range; Said infrared or visible range is by the DBF semiconductor laser or have and be doped with the for example fibre laser emission of the fiber amplifier of erbium (or erbium and ytterbium), also can become ultraviolet light to obtain wavelength Conversion through using nonlinear optical crystal.

In addition, in above embodiment, the illumination light IL of exposure sources is not limited to have the light more than or equal to the wavelength of 100nm, and needless to say more, can use the light that has less than the wavelength of 100nm.For example, above embodiment can be applied to use EUV (extreme ultraviolet) exposure sources of the EUV light in grenz ray scope (for example, wavelength coverage is 5nm to 15nm).In addition, above embodiment also can be applicable to use the exposure sources of the charged particle beam of electron beam for example or ion beam.

In addition, in the above-described embodiment, used light-transmission type mask (graticule); The light-transmission type mask obtains through on printing opacity matrix, forming predetermined light shield pattern (or phase pattern or optical attenuation pattern), but replaces this graticule, as at for example United States Patent(USP) No. 6; Disclosed in 778,257, (it also is called shape-variable mask, active mask or image composer also can to use the electronics mask; And comprising, for example, is the DMD (digital micro-mirror device) etc. of the image-displaying member (spatial light modulator) of radiationless type type); According to the electronic data of pattern to be made public, printing opacity pattern, reflection graphic patterns or emission pattern are formed on the electronics mask.Under the situation of the mask that uses this shape-variable; The microscope carrier at installation such as wafer, glass plate place is scanned with respect to the mask of shape-variable, and therefore can obtain the effect that is equal to above embodiment through the position of using encoder system to measure this microscope carrier.

In addition, as disclosed in PCT International Publication No.2001/035168 for example, above embodiment also can be applicable to through on wafer W, form the exposure sources (etching system) of line and space pattern forming interference fringe on the wafer W.

In addition; Above embodiment also can be applicable to exposure sources, and this exposure sources synthesizes two graticule patterns via projection optical system on wafer, and is made public by single pass; Roughly side by side carry out double exposure to a projected area on the wafer; As disclosed in United States Patent(USP) No. 6,611,316 for example.

Point out that in passing pattern forms (object that is made public that energy beam shone) object on it and is not limited to wafer in above embodiment, and can be other object, for example glass plate, ceramic substrate, film structural component or mask (mask blank).

The purposes of exposure sources is not limited to exposure sources is used to make semiconductor device; And above embodiment also can be widely applied to; For example, be used to make the exposure sources of liquid crystal display cells, wherein; The liquid crystal display cells pattern is transferred on the rectangular glass, and is applied to the exposure sources that is used to make organic EL, thin-film head, imaging device (for example CCDs), micromachine, DNA section etc.In addition; Above embodiment not only can be when producing the micro device of semiconductor device for example; And when graticule that can in producing the exposure sources of for example optical exposure equipment, EUV exposure sources, X ray exposure sources and electron beam exposure equipment etc., use or mask, be applied to circuit pattern is transferred to the exposure sources on glass substrate, the silicon chip etc.

Point out that in passing up to the present, each in the open and United States Patent (USP) of all disclosed disclosures that relate to exposure sources of in this explanation, being quoted, PCT International Publication, U.S. Patent application etc. all is bonded to this, as a reference.

For example the electronic installation of semiconductor device passes through the following steps manufacturing: the step of the function/performance design of actuating unit; Make the step of graticule based on design procedure; Use silicon materials to make the step of wafer; With previous this embodiment of describing exposure sources (pattern forming apparatus) with and exposure method, with the pattern transfer of mask (graticule) lithography step to the wafer; The development step that the wafer that makes public is developed; The etching step of the member that makes public through being etched in the zone except the zone that removes the resist residue; After etching was accomplished, the resist that removes the resist that no longer needs removed step; Device number of assembling steps (comprising cutting process, bonding process, packaging process); The inspection step; Or the like.In this case, in lithography step, use the exposure sources of above embodiment to carry out the previous exposure method of describing, and the device pattern is formed on the wafer, therefore, can has the device of high integration with the high productivity manufacturing.

Commercial Application

As stated, exposure sources of the present invention is suitable for utilizing energy beam exposure object.In addition, device producing method of the present invention is suitable for making electronic installation.

Claims

1. exposure sources, said exposure sources is through utilizing energy beam that object is made public by the optical system of first supporting members supports, and said equipment comprises:

Movable body, said movable body keep said object and can move along predetermined plane;

Guiding surface forms member, and said guiding surface forms member and forms the guiding surface that when said predetermined plane moves, is used when said movable body;

Second supporting member; Said second supporting member is turned up the soil at interval through said guiding surface formation member and said guiding surface formation member and is arranged on the side relative with said optical system, and the position of said second supporting member and said first supporting member relation maintains predetermined relationship;

Position measuring system; Said position measuring system comprises that first measures member; Said first measures the irradiation of member utilization measurement bundle is parallel to the surface measurements of said predetermined plane and receives the light from said surface measurements; And said position measuring system obtains the positional information of said movable body in said predetermined plane based on the output of the said first measurement member; Said surface measurements is arranged on a place in said movable body and said second supporting member, and at least a portion of the said first measurement member is arranged on another place in said movable body and said second supporting member;

Drive system, said drive system drives said movable body based on the positional information of said movable body in said predetermined plane; And

Handling system; Said handling system has at least one and keeps the sucker member of said object from the top with the noncontact mode, and said handling system uses said sucker member that said object is loaded on the said movable body and with said object to unload from said movable body.

2. exposure sources according to claim 1, wherein,

Said handling system unloads said object at the unloading position place from said movable body, said unloading position is arranged to the " loaded " position that said object is loaded on the said movable body spaced apart.

3. exposure sources according to claim 2, wherein,

Said handling system has and is used for the sucker member that loads the sucker member of said object and be used for unloading said object.

4. according to each described exposure sources in the claim 1 to 3, wherein,

Said handling system has: drive division, said drive division drive said sucker member at least on perpendicular to the direction of said predetermined plane, make said sucker member near with move apart said movable body; And test section, said test section detects the distance between said movable body and said sucker member.

5. exposure sources according to claim 4, wherein,

Make through said drive division keep said object with the noncontact mode said sucker member near said movable body after, said handling system discharges the maintenance to the noncontact mode of said object.

6. according to a described exposure sources in the claim 4 and 5, wherein,

Make through said drive division said sucker member near the said object on the said movable body after, said handling system keeps said object with the noncontact mode.

7. according to each described exposure sources in the claim 1 to 6, wherein,

Said handling system has measurement section, and said measurement section is obtained the positional information of the said object that is kept by said sucker member, and said drive system is regulated the position of said movable body based on the measurement result of said measurement section.

8. according to each described exposure sources in the claim 1 to 7, wherein,

Said sucker member utilizes Bernoulli effect to keep said object with the noncontact mode.

9. according to each described exposure sources in the claim 1 to 8, wherein,

Said second supporting member is to be parallel to the beam-like element that said predetermined plane is arranged.

10. exposure sources according to claim 9, wherein,

Said beam-like element has two ends on its longitudinal direction, said first supporting member is fixed in suspension status in said two ends.

11. according to each described exposure sources in the claim 1 to 10, wherein,

On said surface measurements, be furnished with grating, the cycle direction of said grating is being parallel on the direction of said predetermined plane, and

Said first measures member comprises the scrambler head, and said scrambler head utilizes said measurement bundle to shine said grating and receives from said grating diffration light.

12. according to each described exposure sources in the claim 1 to 11, wherein,

It is surface plate that said guiding surface forms member; Said surface plate is arranged on the said optical system side of said second supporting member with relative with said movable body; And said surface plate has the said guiding surface that is parallel to said predetermined plane, said predetermined plane be formed on said surface plate on a surface on the side relative with said movable body.

13. exposure sources according to claim 12, wherein,

Said surface plate has the transmittance section, and said measurement bundle can pass through said transmittance section.

14. according to a described exposure sources in the claim 12 and 13, wherein,

Said drive system comprises planar motors, and said planar motors has mover that is arranged on said movable body place and the stator that is arranged on said surface plate place, and the said movable body of drive force through between said mover and said stator, producing.

15. according to each described exposure sources in the claim 1 to 14, wherein,

Said surface measurements is arranged on said movable body place, and said at least a portion of the said first measurement member is arranged in the said second supporting member place.

16. exposure sources according to claim 15, wherein,

Said object is installed on the said optical system opposite first with said movable body, and said surface measurements is arranged on the second surface on the opposite side that is positioned at said first surface.

17. a described exposure sources in the root claim 15 and 16, wherein,

Said movable body comprises: first movable member, and said first movable member can move along said predetermined plane; And second movable member, said second movable member keeps said object and can being supported with respect to the mode that said first movable member moves, and said surface measurements is arranged in the said second movable member place.

18. exposure sources according to claim 17, wherein,

Said drive system comprises: first drive system, said first movable member of said first drive systems; And second drive system, said second drive system relatively drives said second movable member with respect to said first movable member.

19. according to each described exposure sources in the claim 15 to 18, wherein,

Said measuring system have said first measure in the member one or two or more a plurality of; The measuring center of the said first measurement member overlaps with exposure position; The fundamental measurement axis passes the measuring center of the said first measurement member on said surface measurements, said exposure position is the center that is radiated at the irradiation area of the energy beam on the said object.

20. according to each described exposure sources in the claim 15 to 19, said equipment also comprises:

Mark detecting system, the mark of said mark detecting system detection arrangement on said object,

Wherein, Said measuring system has one or two or more a plurality of second measures member; The measuring center of the said second measurement member overlaps with the inspection center of said mark detecting system, and the fundamental measurement axis passes the measuring center of the said second measurement member on said surface measurements.

21. an exposure sources, said exposure sources is through utilizing energy beam that object is made public by the optical system of first supporting members supports, and said equipment comprises:

Second supporting member, the position relation of said second supporting member and said first supporting member maintains predetermined relationship;

The movable body supporting member; Said movable body supporting member is arranged between said optical system and said second supporting member with spaced apart with said second supporting member; When said movable body moves along said predetermined plane, said movable body supporting member with the direction of the longitudinal direction quadrature of said second supporting member on support said movable body at two some places of said movable body at least;

Handling system; Said handling system has at least one and keeps the sucker member of said object from the top with the noncontact mode, and said handling system utilizes said sucker member that said object is loaded on the said movable body and with said object to unload from said movable body.

22. exposure sources according to claim 21, wherein,

Said handling system unloads said object in unloading position from said movable body, said unloading position is set for the " loaded " position that said object is loaded on the said movable body spaced apart.

23. according to a described exposure sources in the claim 21 and 22, wherein,

24. according to each described exposure sources in the claim 21 to 23, wherein,

Said movable body supporting member is a surface plate; Said surface plate is arranged on the optical system side of said second supporting member with relative with said movable body; And said surface plate has the said guiding surface that is parallel to said predetermined plane, and said guiding surface is formed on the surface that is positioned on the side relative with said movable body.

25. a device producing method comprises:

Through object being made public according to each described exposure sources in the claim 1 to 24; And

The said object that has made public is developed.