CN105591010B - The packaging method of LED chip, LED support and LED chip - Google Patents
The packaging method of LED chip, LED support and LED chip Download PDFInfo
- Publication number
- CN105591010B CN105591010B CN201410579937.9A CN201410579937A CN105591010B CN 105591010 B CN105591010 B CN 105591010B CN 201410579937 A CN201410579937 A CN 201410579937A CN 105591010 B CN105591010 B CN 105591010B
- Authority
- CN
- China
- Prior art keywords
- led
- groove
- pad
- led chip
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 15
- 239000004020 conductor Substances 0.000 claims abstract description 33
- 239000003292 glue Substances 0.000 claims description 38
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 25
- 229910052709 silver Inorganic materials 0.000 claims description 25
- 239000004332 silver Substances 0.000 claims description 25
- 229910000679 solder Inorganic materials 0.000 abstract description 21
- 230000001965 increasing effect Effects 0.000 abstract description 3
- 241000218202 Coptis Species 0.000 description 23
- 235000002991 Coptis groenlandica Nutrition 0.000 description 23
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 238000003466 welding Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 7
- 239000000084 colloidal system Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000002708 enhancing effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052573 porcelain Inorganic materials 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 241001465382 Physalis alkekengi Species 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Abstract
The invention discloses a kind of LED chips, comprising: LED support, LED support include ontology and one or more pads for being arranged on ontology, and each pad has groove；LED die, LED die are arranged on LED support, and LED die has one or more pins；One or more conducting wires, the first end of conducting wire and a pin of LED die are electrically connected, the groove connection in the second end of conducting wire and the pad of LED support；Electric conductor, electric conductor are filled among groove.The second end of conducting wire and pad are electrically connected by LED chip of the invention by electric conductor, are equivalent to and are increased bonding area, can be improved the binding force of conducting wire and pad, promote LED self structure stability, reduce the probability for leading to dead lamp extremely by solder joint.The invention also discloses the packaging methods of a kind of LED support and LED chip.
Description
Technical field
The present invention relates to LED (Lighting Emitting Diode, light emitting diode) manufacturing technology fields, specifically relate to
And a kind of LED chip, for the LED support of LED chip and the packaging method of LED chip.
Background technique
The features such as LED has the long-life, pollution-free, low-power consumption, it has gradually been promoted as a kind of environmentally protective lamps and lanterns
Using and be widely recognized.The structure of existing LED chip is as shown in Figure 1, mainly include LED support 1', LED die 2', gold
Line 3' and packing colloid (not shown in figure 1).The encapsulation step of the LED chip are as follows: die bond → elargol solidification → bonding wire → sealing
→ glue curing → punching (cutting) → test → packaging → storage.Wherein the purpose of bonding wire craft is by welding gold thread 3'
The pin of LED die 2' is connect by mode with the pad on LED support 1', and then realizes electrically conducting for the two.Specific steps:
Using gold thread bonding equipment, the one end gold thread 3' is subjected to burning ball by high pressure first, burned gold goal is then pressed together on LED die
On the pin of 2' (the first solder joint), the gold thread 3' other end draws the pad locations to LED support 1', by the longitudinal pressure of porcelain mouth with
It presses it with pad to connect, breaks gold thread 3' under the action of porcelain mouth transverse direction shear force, form the second solder joint.Gold thread in Fig. 1
The partial enlarged view of the position 3' is as shown in Figure 2.Since the second solder joint is pressing mode by pure physics in above-mentioned wire bonding process
It realizes, be easy to cause the second solder joint gold thread weakness and binding force is smaller between pad.LED chip is contour in subsequent Reflow Soldering
In warm technique, it is easy to appear the case where internal second solder joint D perforated line or E point fall off caused by expanding because of packing colloid, in turn
Cause the dead lamp of LED product bad.
Summary of the invention
The present invention is directed to solve at least some of the technical problems in related technologies.For this purpose, of the invention
The LED chip that one purpose is to propose a kind of firm welding, avoids dead lamp situation, it is another object of the present invention to propose
A kind of LED support for aforementioned LED chip, yet another object of the invention is that proposing a kind of firm welding, avoiding dead lamp
The packaging method of the LED chip of situation.
The LED chip of embodiment according to a first aspect of the present invention may include: LED support, and the LED support includes this
Body and the one or more pads being arranged on the ontology, each pad have groove；LED die, the LED pipe
Core is arranged on the LED support, and the LED die has one or more pins；One or more conducting wires, the conducting wire
One pin of first end and the LED die is electrically connected, in the pad of the second end of the conducting wire and the LED support
One groove connection；Electric conductor, the electric conductor are filled among the groove.
In the LED chip of the embodiment of the present invention, the second end of conducting wire and pad are electrically connected by electric conductor, are equivalent to
Bonding area is increased, can be improved the binding force of conducting wire and pad, promotes LED self structure stability, is reduced by the second weldering
The abnormal probability for leading to dead lamp of point.
In addition, LED chip according to the above embodiment of the present invention can also have the following additional technical features:
In one embodiment of the invention, the bottom size of the groove is greater than top dimension.Groove using it is upper it is small under
When big structure, welding effect can be made stronger, electric conductor does not fall off removing, and then enables to LED finished product by reflux
When furnace, will not be caused because of colloid high-temperature expansion the second solder joint of gold thread fall off or electric conductor removing.
In one embodiment of the invention, the cross section of the groove is circle, and longitudal section is trapezoidal.The shape it is recessed
Slot has the advantages that symmetrical beautiful, easy to process.
In one embodiment of the invention, the electric conductor is conductive silver glue.
The LED support for aforementioned LED chip of embodiment according to a second aspect of the present invention, may include: ontology；Setting
One or more pads on ontology, each pad have groove.
The LED support for LED chip of the embodiment of the present invention, is arranged in pad fluted, which can be in future
Electric conductor is accommodated when welding, to increase bonding area, enhancing solder bond power, and then promotes LED self structure stability.
In addition, the LED support according to the above embodiment of the present invention for LED chip can also have following additional skill
Art feature:
In one embodiment of the invention, the bottom size of groove is greater than top dimension.
In one embodiment of the invention, the cross section of groove is circle, and longitudal section is trapezoidal.
The packaging method of the LED chip of embodiment according to a third aspect of the present invention may include step: provide disclosed above
LED support；LED die is arranged on LED support, LED die has one or more pins；It provides one or more
One pin of the first end of conducting wire and LED die is electrically connected, also, the second end of conducting wire is protruded into LED support by conducting wire
A pad in groove in；To filling electric conductor among groove.
The packaging method of the LED chip of the embodiment of the present invention fills electric conductor by the groove into pad, increases weldering
Junction product, enhancing solder bond power, and then LED self structure stability is promoted, reduce leads to dead lamp by the second solder joint extremely
Probability.
In addition, the packaging method of LED chip according to the above embodiment of the present invention can also have following additional technology
Feature:
In one embodiment of the invention, electric conductor is conductive silver glue.
In one embodiment of the invention, after filling conductive silver glue into groove, vacuum defoamation processing is carried out.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the LED chip of the prior art.
Fig. 2 is the detailed schematic at bonding wire position in Fig. 1.
Fig. 3 is the structural schematic diagram of the LED chip of the embodiment of the present invention.
Fig. 4 is the partial enlarged view of dotted line collar region in Fig. 3.
Fig. 5 is the structural schematic diagram of the LED support for LED chip of the embodiment of the present invention.
Fig. 6 is the flow diagram of the packaging method of the LED chip of the embodiment of the present invention.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention.
The LED chip of one embodiment of the invention is as shown in Figure 3 and Figure 4.Wherein Fig. 3 is the overall structure of the LED chip
Schematic diagram, Fig. 4 are the partial enlarged view of dotted line collar region in Fig. 3.The LED chip may include LED support 1, LED die 2, lead
Line 3 and electric conductor 4.LED support 1 includes ontology 11 and the one or more pads 12 being arranged on ontology 11, each pad
12 have groove.The groove part and other parts of pad 12 are conductor, it is preferable that can use same conductive material.LED
Tube core 2 can convert electrical energy into luminous energy.LED die 2 can be arranged on LED support 1 by modes such as die bond glue stickings.
LED die 2 has one or more pins.Conducting wire 3 can use gold thread or other materials conducting wire, and number can be one or more
It is a.The first end of conducting wire 3 and a pin of LED die 2 are electrically connected, the second end of conducting wire 3 and the pad 12 of LED support 1
In a groove connection.Electric conductor 4 is filled among groove.It can also include transparent insulation glue in the LED chip, this is transparent
Insulating cement plays encapsulation effect, this is knowledge known to those skilled in the art, therefore omits in Fig. 3 and Fig. 4 and do not draw.
It should be noted that the second end of conducting wire 3 can directly be contacted with groove inner surface, electric conductor 4 can also be passed through
It is connected indirectly with groove.
It should be noted that although showing the tool of LED die 2 in Fig. 3, there are two pins, are connected to by two conducting wires 3
The case where groove in two pads 12, but be only and the limitation of non-present invention for exemplary convenience herein.Of the invention
In other embodiments, it is also possible to the case where other numbers occur.Such as: when the PN electrode in LED die 2 is vertical structure,
A pin can be drawn from the electrode at the top of LED die 2, a pad is then connected to by a conducting wire, and LED die
The electrode of bottom then passes through conductive silver glue and is directly bonded on LED support 1 in 2, be omitted second pin, second conducting wire and
Second reeded pad of tool.
In the LED chip of the embodiment of the present invention, the second end of conducting wire 3 and pad 12 are electrically connected by electric conductor 4, phase
When in increasing bonding area, can be improved the binding force of conducting wire 3 Yu pad 12, promote LED self structure stability, reduce by
Second solder joint leads to the probability of dead lamp extremely.
In one embodiment of the invention, the bottom size of groove is greater than top dimension.Groove is using up-small and down-big
When structure, the removing not easily to fall off of electric conductor 4 can be made, welding effect is stronger, and then enables to LED finished product by reflow ovens
When, will not be caused because of high-temperature expansion the second solder joint of conducting wire fall off or electric conductor 4 remove.
In one embodiment of the invention, the cross section of groove can be circle, and longitudal section can be trapezoidal.Change speech
It, groove is in truncated conical shape, is had the advantages that symmetrical beautiful, easy to process.
In one embodiment of the invention, electric conductor is conductive silver glue.Conductive silver glue has certain flowing before curing
Property, it is easy to inject in groove and gradually fills up recess space.
The LED support for above structure LED chip of one embodiment of the invention is as shown in figure 5, include 100 He of ontology
One or more pads 200 on ontology 100 are set, and each pad 200 has groove.The groove part of pad 200 and
Other parts are conductor, it is preferable that can use same conductive material.Optionally, the bottom size of groove is greater than top ruler
It is very little.The cross section of groove can be circle, and longitudal section can be trapezoidal.
The LED support for LED chip of the embodiment of the present invention, is arranged in pad fluted, which can be in future
Electric conductor is accommodated when welding, to increase bonding area, enhancing solder bond power, and then promotes LED self structure stability.
The packaging method of the LED chip of one embodiment of the invention is as shown in fig. 6, may comprise steps of:
A., LED support is provided.
Specifically, LED support can be above-disclosed any LED support.
B. LED die is arranged on LED support, LED die has one or more pins.
It is alternatively possible to which LED die is bonded on LED support by crystal-bonding adhesive.
C., one or more conducting wires are provided, a pin of the first end of conducting wire and LED die is electrically connected, also,
The second end of conducting wire is protruded into the groove in a pad of LED support.
Specifically, conducting wire can use gold thread or other materials conducting wire.It should be noted that the second end of conducting wire can be straight
Pressure welding is connect on groove inner surface, can also be suspended in recess space.
D. to filling electric conductor among groove.
Optionally, gluing process can also be carried out after step D, i.e., encapsulates LED product using transparent insulation glue, this is this
Field technical staff's known knowledge, therefore do not repeat.
The packaging method of the LED chip of the embodiment of the present invention fills electric conductor by the groove into pad, increases weldering
Junction product, enhancing solder bond power, and then LED self structure stability is promoted, reduce leads to dead lamp by the second solder joint extremely
Probability.
In one embodiment of the invention, electric conductor is conductive silver glue.Conductive silver glue has certain flowing before curing
Property, it is easy to inject in groove and gradually fills up recess space.
In one embodiment of the invention, after filling conductive silver glue into groove, vacuum defoamation processing is carried out.Vacuum is de-
Bubble processing can make that the filling of conductive silver glue in a groove is finer and close, bubble-free is without hole, will not cause breaking dead lamp feelings
Condition.
Content in order to enable those skilled in the art to better understand the present invention, applicant introduce a specific embodiment such as
Under.
Step 1: LED support is provided.It is fluted that the setting of the second bond pad locations of gold thread is corresponded on the pad of the LED support.It should
Groove is used to fill conductive silver glue for welding the second solder joint of gold thread.The bottom of groove and surrounding are and its elsewhere of pad
Identical metal.The recess base diameter is greater than top diameter, which is circle, and longitudal section is trapezoidal.The structure
It is completely embedded into inside grooves, not easily to fall off, removing after can effectively ensure that the solidification of conductive silver glue in future, and then can effectively ensure that
LED finished product avoided when crossing SMT reflow ovens colloid high-temperature expansion cause the second solder joint of gold thread fall off or conductive silver glue remove caused by
Dead lamp situation.
Step 2: LED die is fixed on LED support by crystal-bonding adhesive (elargol or white glue).Die bond glue amount is controlled,
Crystal-bonding adhesive area is equal or slightly larger than die bottom area, and crystal-bonding adhesive, which climbs 1/4 of glue height not higher than die thickness, to be advisable.Die bond
Glue amount is very few to will cause tube core and bracket binding force deficiency；The feelings such as die bond glue amount excessively will cause electric leakage or adhesive surface is bad
Condition.
Step 3: the product that die bond is completed is put into the hot setting that oven carries out crystal-bonding adhesive, specific solidification temperature, time
The condition of cure of crystal-bonding adhesive used need to be referred to.Solidification temperature or time are insufficient, and crystal-bonding adhesive cannot be fully cured, and cannot achieve die bond
Effect.Die bond adhesive curing is completed to complete the combination of LED die and LED support or be electrically conducted.
Step 4: the cured product of crystal-bonding adhesive will be completed and carry out gold thread welding, the second solder joint of gold thread is pressed together on the recessed of pad
In slot.Concrete operations are as follows: by adjusting bonding wire parameter, the second solder joint of gold thread is pressed in the groove of pad by porcelain mouth, welded
It need to ensure that gold thread line footpath is not exposed to groove top pad when line, avoid gold thread line footpath impaired.After gold thread line footpath is impaired, in product
When in use process by external force or LED colloid high-temperature expansion, it is damaged line footpath and is easy the dead lamp of broken string.
Step 5: infusing conductive silver glue to the inside grooves point of bonding wire product, make second solder joint packet of the conductive silver glue by gold thread
Containing wherein.Conductive silver glue amount will fill up entire groove, and all include wherein by gold thread second end.For avoid during note to
Bubble is introduced in groove, the product that point has infused conductive silver glue need to carry out vacuum defoamation processing.
Step 6: the product for having infused conductive silver glue is put into the hot setting that oven carries out conductive silver glue.Solidification temperature,
Time need to refer to the condition of cure of conductive silver glue used.
The conductive silver glue can be completely embedded in inside grooves after hot setting, and because groove with pad is integrated metal
Construction, gold thread also pass through conductive silver glue and entire recess sidewall and bottom in addition to directly forming turning circuit in conjunction with bottom portion of groove
Portion is connected to form larger range of circuit conducting structure.When LED finished product is when client carries out Reflow Soldering operation, because groove is at ladder
Shape structure, conductive silver glue by LED colloid action or itself expand when all can only and recess sidewall form even closer combination, into
And the combination of effective protection the second solder joint of gold thread and pad and electrically conduct, it is ensured that LED is not in dead lamp problem.
Step 7: the product for completing step 6 is subjected to sealing/encapsulating.The glue that stirring, deaeration finish is poured into a plastic pin
Cylinder, sets the gel quantity of corresponding dispensing board according to the bowl size of LED product, and glue amount is subject to flat cup.
Step 8: and the product for finishing sealing is put into oven and carries out glue curing, completes the encapsulation of LED product.It is specific roasting
Box temperature degree, time need to be with reference to used silica gel or the conditions of cure of epoxy resin.It needs to guarantee that the level of LED support is put in baking process
It sets, avoids leading to glue overflow problem because placing injustice.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one this feature.In the description of the present invention, the meaning of " plurality " is at least two, such as two, three
It is a etc., unless otherwise specifically defined.
Any process described otherwise above or method description are construed as in flow chart or herein, can not be pressed
Sequence shown or discussed, including according to related function by it is basic simultaneously in the way of or in the opposite order, to execute
Function, this should be understood by the embodiment of the present invention person of ordinary skill in the field.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.
Claims (8)
1. a kind of LED chip characterized by comprising
LED support, the LED support include ontology and one or more pads for being arranged on the ontology, each described
Pad has groove, and the bottom size of the groove is greater than top dimension；
LED die, the LED die are arranged on the LED support, and the LED die has one or more pins；
One pin of one or more conducting wires, the first end of the conducting wire and the LED die is electrically connected, the conducting wire
Second end is connect with a groove in the pad of the LED support；
Electric conductor, the electric conductor are filled among the groove.
2. LED chip according to claim 1, which is characterized in that the cross section of the groove is circle, and longitudal section is ladder
Shape.
3. LED chip according to claim 1, which is characterized in that the electric conductor is conductive silver glue.
4. a kind of LED support for LED chip as claimed in any one of claims 1-3 characterized by comprising
Ontology；
One or more pads on the ontology are set, and each pad has groove, the bottom ruler of the groove
It is very little to be greater than top dimension.
5. LED support according to claim 4, which is characterized in that the cross section of the groove is circle, and longitudal section is ladder
Shape.
6. a kind of packaging method of LED chip, which comprises the following steps:
LED support described in claim 4 or 5 is provided；
LED die is arranged on the LED support, the LED die has one or more pins；
One or more conducting wires are provided, a pin of the first end of the conducting wire and the LED die is electrically connected, and
The second end of the conducting wire is protruded into the groove in a pad of the LED support；
To filling electric conductor among the groove.
7. the packaging method of LED chip according to claim 6, which is characterized in that the electric conductor is conductive silver glue.
8. the packaging method of LED chip according to claim 7, which is characterized in that led described in filling into the groove
After electric elargol, vacuum defoamation processing is carried out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410579937.9A CN105591010B (en) | 2014-10-24 | 2014-10-24 | The packaging method of LED chip, LED support and LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410579937.9A CN105591010B (en) | 2014-10-24 | 2014-10-24 | The packaging method of LED chip, LED support and LED chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105591010A CN105591010A (en) | 2016-05-18 |
| CN105591010B true CN105591010B (en) | 2018-12-21 |
Family
ID=55930438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410579937.9A Active CN105591010B (en) | 2014-10-24 | 2014-10-24 | The packaging method of LED chip, LED support and LED chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105591010B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231972B (en) * | 2016-12-12 | 2020-04-07 | 晶能光电（江西）有限公司 | LED chip packaging method |
| CN108075029B (en) * | 2017-12-27 | 2019-12-13 | 浙江绿创新拓建筑规划设计有限公司 | Energy-saving lighting device |
| CN110473954A (en) * | 2018-05-09 | 2019-11-19 | 江西鸿利光电有限公司 | A kind of LED chip connection structure of low cost and high reliability |
| CN109473523B (en) * | 2018-09-29 | 2020-05-19 | 华灿光电（浙江）有限公司 | Light emitting diode and packaging method thereof |
| CN112117268B (en) * | 2020-09-25 | 2023-02-10 | 中科芯(苏州)微电子科技有限公司 | Chip integrated module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101488546A (en) * | 2007-10-31 | 2009-07-22 | 夏普株式会社 | Chip-type led and method for manufacturing the same |
| CN102479907A (en) * | 2010-11-30 | 2012-05-30 | 展晶科技(深圳)有限公司 | Light emitting diode encapsulation structure |
| CN202888174U (en) * | 2012-10-12 | 2013-04-17 | 绍兴温家环保新材料有限公司 | LED light source module |
| JP2013179148A (en) * | 2012-02-28 | 2013-09-09 | Unistar Opto Corp | Light emitting diode area light module and method of packaging the same |
| CN104064662A (en) * | 2013-03-21 | 2014-09-24 | 展晶科技(深圳)有限公司 | Light-emitting-diode packaging structure |
-
2014
- 2014-10-24 CN CN201410579937.9A patent/CN105591010B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101488546A (en) * | 2007-10-31 | 2009-07-22 | 夏普株式会社 | Chip-type led and method for manufacturing the same |
| CN102479907A (en) * | 2010-11-30 | 2012-05-30 | 展晶科技(深圳)有限公司 | Light emitting diode encapsulation structure |
| JP2013179148A (en) * | 2012-02-28 | 2013-09-09 | Unistar Opto Corp | Light emitting diode area light module and method of packaging the same |
| CN202888174U (en) * | 2012-10-12 | 2013-04-17 | 绍兴温家环保新材料有限公司 | LED light source module |
| CN104064662A (en) * | 2013-03-21 | 2014-09-24 | 展晶科技(深圳)有限公司 | Light-emitting-diode packaging structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105591010A (en) | 2016-05-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105591010B (en) | The packaging method of LED chip, LED support and LED chip | |
| CN102769087A (en) | LED (light-emitting diode) based on via packaging technique and manufacturing technology of LED | |
| CN103094454A (en) | Packaging method of light-emitting diode (LED) device | |
| CN205452281U (en) | Take power module of double -deck encapsulating of shell fragment | |
| CN204927345U (en) | LED packaging structure | |
| CN103400927B (en) | A kind of high reliability LED support and LED component thereof | |
| CN204966534U (en) | High -power LED support | |
| CN204230289U (en) | LED chip and the LED support for LED chip | |
| CN107403855A (en) | Multi color temperature package structure for LED and its manufacture method | |
| CN108847439A (en) | A kind of packaging method and light emitting diode of light emitting diode | |
| CN103474551A (en) | High-power light-emitting diode (LED) substrate and packaging method thereof | |
| CN204257696U (en) | A kind of strongly heat-dissipated COB packaged LED | |
| CN106356437A (en) | White LED (light emitting diode) packaging device and preparation method thereof | |
| CN107588333B (en) | G9 type LED lamp standard interface embedded with driving power supply and manufacturing method thereof | |
| CN105070813A (en) | Large-power LED support and packaging method thereof | |
| CN103531670B (en) | Method for manufacturing light-emitting | |
| CN214753757U (en) | Flip LED luminescent device | |
| CN104835903A (en) | Method for manufacturing low-light-decay ice blue light emitting diode | |
| CN205429001U (en) | LEDCOB light source packaging structure | |
| CN103855280A (en) | LED wafer-level packaging method | |
| CN103682049A (en) | Waterproof chip LED (Light-Emitting Diode) and production technology thereof | |
| CN104241502A (en) | LED packaging structure | |
| CN203589071U (en) | An LED support and an LED | |
| CN203466185U (en) | Novel IC molding structure | |
| CN103258921A (en) | Method for encapsulating light emitting diodes |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191204 Address after: 518119 1 Yanan Road, Kwai Chung street, Dapeng New District, Shenzhen, Guangdong Patentee after: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. Address before: BYD 518118 Shenzhen Road, Guangdong province Pingshan New District No. 3009 Patentee before: BYD Co.,Ltd. |
|
| CP03 | Change of name, title or address |
Address after: 518119 1 Yanan Road, Kwai Chung street, Dapeng New District, Shenzhen, Guangdong Patentee after: BYD Semiconductor Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kuiyong, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200820 Address after: 516083 Longshan 7th Road, Dayawan West District, Huizhou City, Guangdong Province (BYD Co., Ltd. complex building) Patentee after: Guangdong BYD Energy Saving Technology Co.,Ltd. Address before: 518119 1 Yanan Road, Kwai Chung street, Dapeng New District, Shenzhen, Guangdong Patentee before: BYD Semiconductor Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231102 Address after: No. 21 Jili Road, High tech Development Zone, Yangzhou City, Jiangsu Province, 225128 Patentee after: Yangzhou BYD Semiconductor Co.,Ltd. Address before: 516083 Longshan 7th Road, Dayawan West District, Huizhou City, Guangdong Province (complex building of BYD Co., Ltd.) Patentee before: Guangdong BYD Energy Saving Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right |