CN105555066B - Delay the device of heat fusion machine heating head aging - Google Patents
Delay the device of heat fusion machine heating head aging Download PDFInfo
- Publication number
- CN105555066B CN105555066B CN201610094011.XA CN201610094011A CN105555066B CN 105555066 B CN105555066 B CN 105555066B CN 201610094011 A CN201610094011 A CN 201610094011A CN 105555066 B CN105555066 B CN 105555066B
- Authority
- CN
- China
- Prior art keywords
- heating head
- side groove
- picks out
- heating
- installation recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 76
- 230000032683 aging Effects 0.000 title claims abstract description 13
- 230000004927 fusion Effects 0.000 title claims abstract description 11
- 238000009434 installation Methods 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 238000003825 pressing Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- 238000003475 lamination Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
The present invention relates to the devices that one kind can delay the machine heating head aging of RBM (Registration bonding machine) heat fusion, it includes substrate, dormant bolt hole is offered in the corner location of substrate, heating head installation recess is offered on the front face of substrate, heating head cable picks out left side groove and heating head cable picks out right side groove, heating head cable picks out left side groove and connects with the left side of heating head installation recess, heating head cable picks out right side groove and connects with the right edge of heating head installation recess, heating head cable picks out the depth that the depth that left side groove picks out right side groove with heating head cable is respectively less than heating head installation recess.The present invention prevents on film gummosis to heating head, and the present invention plays the role of delaying heating head aging.
Description
Technical field
The present invention relates to one kind, and RBM (Registration bonding machine) can be delayed to be hot-melted machine heating head
The device of aging, the invention belongs to PCB machinery processing apparatus technical fields.
Background technique
In the entire production procedure of PCB, pressing refers to copper foil (Copper foil), film (Prepreg) and brownification
(Brown oxide) treated internal layer circuit plate is in high temperature and suppresses and depresses to multiple-plate process, mainly includes brownification, pre-
Folded, overlapping, pressing and X-Ray bore the post-processing processes such as target, fishing side, edging.Multiple-plate process for pressing mainly has tip pressing plate
(Pinlam Lamination) and without tip pressing plate (Mass Lamination), Pinlam pressing plate will be arranged on inner plating egative film
Two optical targets (Optical Target), the inner plating after etching are placed on the perforating press with CCD para-position system according to two
A target is gone out the tooling hole (the commonly referred to as hole PE Punch) of pressing plate contraposition by the mold in machine, is opened on copper foil and film
Same tooling hole out, covers one by one according to laminated layer sequence and binds into book form on the compression plate for have Pin, and the mirror for having the hole Pin is added
Face steel plate, and it is covered with the cover board in the hole Pin in top layer, each opening for being sent into press prepares pressing.Pin Lamination institute
The registration holes needed are waist-shaped hole, and long and short side can be with a degree of free extension, level to level alignment degree during pressing
Height is to guarantee high laminate level to level alignment degree uniquely preferable method, but tear that plate is cumbersome, and production capacity is low after the pressing of this method open, at
This height is only used in High layer counter and Rigid Flex at present.
Mass Lamination is largely pressing mode that 4 ~ 10 laminates generally use without pin lamination, this method letter
Single quick, yield is big, is by internal layer core according to lamination and the fusion of film fuse machine or closing-up, later with copper foil and film
It is put into big press pressing.Reflow process mainly melts film at high temperature, is sticked each core layers together using viscosity, mesh
The mode that preceding heat fusion generates high temperature mainly has resistance heating and two kinds of electromagnetic heating, and resistance heating is the resistance wire using coiling
Fever, heat transfer by heat conduction, this heating method is slow, and film fusing flow regime is poor, fuses ineffective.The electricity of rising in recent years
Magnetic heating, by electronic circuit board component part alternating magnetic field, when using placing above containing container made of iron, vessel surface is generated
It cuts alternate magnetic force line and generates alternating current in container bottom metal part, that is, be vortexed, vortex makes the iron atom of container bottom
High speed random motion, atom collide with each other, rub and generate heat, to play the role of heating film, this heating side
Formula is fast, and fusion effect is preferable, big but there are gummosis, and heating head is easy by the sticky aging of glue residue.
Summary of the invention
The purpose of the present invention is overcoming the deficiencies in the prior art, providing one kind can prevent film gummosis to heating
On head, play the role of the device for delaying heat fusion machine heating head aging for delaying heating head aging to protect.
According to technical solution provided by the invention, the device for delaying heat fusion machine heating head aging, it includes substrate,
Dormant bolt hole is offered in the corner location of substrate, heating head installation recess, heating head are offered on the front face of substrate
Cable picks out left side groove and heating head cable picks out right side groove, and heating head cable picks out a left side for left side groove and heating head installation recess
Side connects, and heating head cable picks out right side groove and connects with the right edge of heating head installation recess, and heating head cable picks out left side
The depth that slot and heating head cable pick out right side groove is respectively less than the depth of heating head installation recess.
The heating head cable picks out the width that left side groove picks out right side groove with heating head cable and is respectively less than heating head installation
The width of recess.
The substrate is made of high-temperature resistance plastice.
The present invention prevents on film gummosis to heating head, and the present invention plays the role of delaying heating head aging.
Detailed description of the invention
Fig. 1 is main view of the invention.
Fig. 2 is left view of the invention.
Fig. 3 is top view of the invention.
Specific embodiment
The present invention is further explained in the light of specific embodiments.
This delays the device of heat fusion machine heating head aging, it includes substrate 1, and it is heavy to offer in the corner location of substrate 1
Hook bolt hole 1.1 offers heating head installation recess 1.2 on the front face of substrate 1, heating head cable picks out left side groove 1.3
Right side groove 1.4 is picked out with heating head cable, heating head cable picks out the left side of left side groove 1.3 and heating head installation recess 1.2
Connect, heating head cable picks out right side groove 1.4 and connects with the right edge of heating head installation recess 1.2, and heating head cable picks out a left side
The depth that side channel 1.3 and heating head cable pick out right side groove 1.4 is respectively less than the depth of heating head installation recess 1.2.
The heating head cable picks out left side groove 1.3 and heating head cable picks out the width respectively less than heating of right side groove 1.4
The width of head installation recess 1.2.
The substrate 1 is made of high-temperature resistance plastice.
In use, the device of the invention is locked on the main machine frame of heating head by dormant bolt hole 1.1 by fastening bolt
As entirety, heating head is embedded in heating head installation recess 1.2, and plate to be fused has been mounted with of the invention from upper and lower two
Pass through between the heating head of device, under the protection of apparatus of the present invention, glue residue and heating head completely cut off, and glue residue flows to dress of the invention
It sets, simultaneously because high-temperature resistance plastice, can continue to use at high temperature, glue residue shovel can be cleared up easily, effectively play
Protective effect.
Claims (1)
1. a kind of device for delaying heat fusion machine heating head aging, including substrate (1) are offered in the corner location of substrate (1)
Dormant bolt hole (1.1) offers heating head installation recess (1.2) on the front face of substrate (1), heating head cable picks out a left side
Side channel (1.3) and heating head cable pick out right side groove (1.4)；It is characterized in that: heating head cable picks out left side groove (1.3) and heating
The left side of head installation recess (1.2) connects, and heating head cable picks out right side groove (1.4) and heating head installs recess (1.2)
Right edge connects, and heating head cable, which picks out the depth that left side groove (1.3) pick out right side groove (1.4) with heating head cable and is respectively less than, to be added
The depth of hot head installation recess (1.2)；
The heating head cable picks out left side groove (1.3) and heating head cable picks out the width respectively less than heating of right side groove (1.4)
The width of head installation recess (1.2)；
In use, the device for delaying heat fusion machine heating head aging lock is being added by dormant bolt hole (1.1) by fastening bolt
Become on the main machine frame of hot head whole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610094011.XA CN105555066B (en) | 2016-02-19 | 2016-02-19 | Delay the device of heat fusion machine heating head aging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610094011.XA CN105555066B (en) | 2016-02-19 | 2016-02-19 | Delay the device of heat fusion machine heating head aging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105555066A CN105555066A (en) | 2016-05-04 |
| CN105555066B true CN105555066B (en) | 2019-02-12 |
Family
ID=55833920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610094011.XA Expired - Fee Related CN105555066B (en) | 2016-02-19 | 2016-02-19 | Delay the device of heat fusion machine heating head aging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105555066B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204145894U (en) * | 2014-09-28 | 2015-02-04 | 广州兴森快捷电路科技有限公司 | Hot-melting mechanism |
| CN104968165A (en) * | 2015-07-09 | 2015-10-07 | 高德（无锡）电子有限公司 | Hot melting head device of hot melting machine for PCBs |
| CN205510579U (en) * | 2016-02-19 | 2016-08-24 | 高德（无锡）电子有限公司 | Delay ageing device of heat fused machine heating head |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2581962A1 (en) * | 1998-10-30 | 2013-04-17 | Sony Corporation | Non-aqueous electrolyte battery and manufacturing method therefor |
-
2016
- 2016-02-19 CN CN201610094011.XA patent/CN105555066B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204145894U (en) * | 2014-09-28 | 2015-02-04 | 广州兴森快捷电路科技有限公司 | Hot-melting mechanism |
| CN104968165A (en) * | 2015-07-09 | 2015-10-07 | 高德（无锡）电子有限公司 | Hot melting head device of hot melting machine for PCBs |
| CN205510579U (en) * | 2016-02-19 | 2016-08-24 | 高德（无锡）电子有限公司 | Delay ageing device of heat fused machine heating head |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105555066A (en) | 2016-05-04 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190212 |
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| CF01 | Termination of patent right due to non-payment of annual fee |