CN104968165A - Hot melting head device of hot melting machine for PCBs - Google Patents
Hot melting head device of hot melting machine for PCBs Download PDFInfo
- Publication number
- CN104968165A CN104968165A CN201510402168.XA CN201510402168A CN104968165A CN 104968165 A CN104968165 A CN 104968165A CN 201510402168 A CN201510402168 A CN 201510402168A CN 104968165 A CN104968165 A CN 104968165A
- Authority
- CN
- China
- Prior art keywords
- hot melting
- hot melt
- overcoat
- melt head
- melting head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to a hot melting head device of a hot melting machine for PCBs. The hot melting head device comprises a hot melting head and a pressing jacket; an axial inner hole is formed in the pressing jacket; the hot melting head is installed in the axial inner hole of the pressing jacket; a gap is left between the outer wall of the hot melting head and the wall of the inner hole of the pressing jacket; the hot melting head is connected with a power transmission cable; the hot melting head is driven by a first driving cylinder installed on the rack of the hot melting machine for the PCBs; and the pressing jacket is driven by a second driving cylinder installed on the rack of the hot melting machine for the PCBs. With the hot melting head device of the hot melting machine for the PCBs of the invention adopted, a large amount of glue will not be left around after the PP glue is melt below the hot melting head, and therefore, depth depressions will not be formed at the hot melting head, and yield in a pre-stacking process can be improved. The hot melting head device of the invention has the advantages of simple structure, convenient use and the like.
Description
Technical field
The present invention relates to the device on a kind of PCB fuse machine, the present invention especially relates to a kind of hot melt head unit of PCB fuse machine.
Background technology
PCB(and printed substrate) there is individual operation when making pre-folded, its object often opens central layer and PP(prepreg prepreg by multiple-plate), contraposition, is then fixed by the mode of hot melt or riveted, when pressing, contraposition offset problem would not occur like this.Hot melt has a kind of method to be heated by resistive, its principle is heating head heating power, and plus-pressure is on pre-folded plank, this time, PP was heated, glue wherein can become molten condition, under pressure, final PP in heating region can be fixed together with central layer, PP also can solidify or completely close to solidification, in follow-up bonding processes, although the PP of the non-thermal treatment zone be heated after melting because have several position to have cured when pre-folded, central layer and PP are fixed together, therefore also can not slippage in bonding processes.
At present, the design of this electric heating head is exactly the heating metal derby having resistance in, it is directly with pre-folded plank contact, PP meeting melting in heating process between central layer, and heating head by cylinder to plank pressure, glue on PP so below heating head can flow to surrounding, and then the place of heating head can be dented.If hot melt place depression is deep, in successive process, have following undesirable condition:
1, the easy layering of fusion, like this follow-up no matter be vertical processing procedure or horizontal processing procedure, the place of layering all can Tibetan medicine water, and then pollute other regions of plank, causes plank to be scrapped;
2, fusion is recessed in some horizontal processing procedures meeting Tibetan medicine water, then pollutes plank and equipment.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of and prepreg can not be made to produce undesirable condition and the hot melt head unit of PCB fuse machine easy to use when pre-folding.
According to technical scheme provided by the invention, the hot melt head unit of described PCB fuse machine, it comprises hot melt head and compresses overcoat, compress overcoat and there is axial bore, hot melt head is arranged in the axial bore of compression overcoat, between the outer wall of hot melt head and the inner hole wall compressing overcoat, there is gap, hot melt head is connected with power transmission cable, described hot melt head drives cylinder to drive by being arranged on first in PCB fuse machine frame, compresses overcoat and drives cylinder to drive by being arranged on second in PCB fuse machine frame.
Gap width size between the outer wall of described hot melt head and the inner hole wall compressing overcoat is 0.8 ~ 1.5mm.
Described compression overcoat is made up of Teflon material.
The port of export inner hole wall compressing overcoat is provided with the spacing rib of annular, and spacing rib coordinates with hot melt head.
After the present invention uses, PP glue below hot melt head would not have a large amount of glue to be left to around after melting, and hot melt head place would not be caused like this to occur serious depression, improve yields when folding in advance; The present invention is simple in structure and convenient in use.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Fig. 2 is A-A cutaway view of Fig. 1.
Embodiment
Below in conjunction with specific embodiment, the invention will be further described.
As depicted in figs. 1 and 2, the hot melt head unit of this PCB fuse machine, it comprises hot melt head 1 and compresses overcoat 2, compress overcoat 2 and there is axial bore, hot melt head 1 is arranged in the axial bore of compression overcoat 2, between the outer wall of hot melt head 1 and the inner hole wall compressing overcoat 2, there is gap 3, hot melt head 1 is connected with power transmission cable 4, described hot melt head 1 drives cylinder to drive by being arranged on first in PCB fuse machine frame, compressing overcoat 2 drives cylinder to drive by being arranged on second in PCB fuse machine frame, and first drives cylinder and second to drive cylinder independent separately.
Gap 3 width size between the outer wall of described hot melt head 1 and the inner hole wall compressing overcoat 2 is 0.8 ~ 1.5mm.
Described compression overcoat 2 is made up of Teflon material.
The port of export inner hole wall compressing overcoat 2 is provided with the spacing rib 5 of annular, and spacing rib 5 coordinates with hot melt head 1, making hot melt head 1 can be subject to the restriction of spacing rib 5 when stretching out, avoiding hot melt head 1 to occur rocking.
When heating pcb board, compress overcoat 2 and must not be slower than hot melt head 1 active force on pcb board, its Stress control is that the pressure compressing overcoat 2 pairs of materials is greater than and equals the pressure of heating head to material, below such hot melt head 1, PP glue would not have a large amount of glue to be left to around after melting, and heating head place would not be caused so seriously to cave in.
Compress between the inwall of overcoat 2 and the outer wall of hot melt head 1 and require certain space 3, such object is unlikely to too much heat to be passed to compress overcoat 2 when hot melt head 1 heats, overcoat 2 is compressed if passed to, when compressing overcoat 2 temperature higher than 100 degree, the PP compressed below overcoat 2 also can become molten condition.As a rule the temperature of heating head is at about 200 degree, and selection that Here it is is high temperature resistant and the reason of the full material that conducts heat.
When compression overcoat 2 rises with hot melt head 1, both height are inconsistent.Reason is that hot melt head 1 needs continuous heating, if highly consistent, compress overcoat 2 and also can be heated.When rise comes, compressing overcoat 2 can come from heat that heating head radiation comes to dissipating absorbing in sheeting process.
The present invention sandwiches the compression overcoat 2 that the slow material of high temperature resistant heat transfer (as Teflon) is made around hot melt head 1, and controls with different cylinders respectively from hot melt head 1, and both height when rise comes are inconsistent, prevent heat transfer.When heating, though PP is in molten condition, and will toward surrounding flowing when having pressure, surrounding, because there is the pressure as compressing overcoat 2, so cannot flow to surrounding, would not cause depression like this.
Claims (4)
1. the hot melt head unit of a PCB fuse machine, it is characterized in that: it comprises hot melt head (1) and compresses overcoat (2), compress overcoat (2) and there is axial bore, hot melt head (1) is arranged in the axial bore of compression overcoat (2), between the outer wall of hot melt head (1) and the inner hole wall compressing overcoat (2), there is gap (3), hot melt head (1) is connected with power transmission cable (4), described hot melt head (1) drives cylinder to drive by being arranged on first in PCB fuse machine frame, compressing overcoat (2) drives cylinder to drive by being arranged on second in PCB fuse machine frame.
2. the hot melt head unit of PCB fuse machine as claimed in claim 1, is characterized in that: gap (3) the width size between the outer wall of described hot melt head (1) and the inner hole wall compressing overcoat (2) is 0.8 ~ 1.5mm.
3. the hot melt head unit of PCB fuse machine as claimed in claim 1, is characterized in that: described compression overcoat (2) is made up of Teflon material.
4. the hot melt head unit of PCB fuse machine as claimed in claim 1, is characterized in that: the spacing rib (5) being provided with annular on the port of export inner hole wall compressing overcoat (2), spacing rib (5) coordinates with hot melt head (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510402168.XA CN104968165A (en) | 2015-07-09 | 2015-07-09 | Hot melting head device of hot melting machine for PCBs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510402168.XA CN104968165A (en) | 2015-07-09 | 2015-07-09 | Hot melting head device of hot melting machine for PCBs |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104968165A true CN104968165A (en) | 2015-10-07 |
Family
ID=54222042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510402168.XA Pending CN104968165A (en) | 2015-07-09 | 2015-07-09 | Hot melting head device of hot melting machine for PCBs |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104968165A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105555066A (en) * | 2016-02-19 | 2016-05-04 | 高德（无锡）电子有限公司 | Device capable of delaying ageing of heating head of registration bonding machine |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6439224B1 (en) * | 1999-10-12 | 2002-08-27 | E. Richard Farone | Ice melter |
| CN102009476A (en) * | 2009-09-07 | 2011-04-13 | 上海富亿德塑胶有限公司 | Plastic body hot melting device |
| CN204145894U (en) * | 2014-09-28 | 2015-02-04 | 广州兴森快捷电路科技有限公司 | Hot-melting mechanism |
| CN204859794U (en) * | 2015-07-09 | 2015-12-09 | 高德（无锡）电子有限公司 | Hot melting machine's hot melt head device for PCB |
-
2015
- 2015-07-09 CN CN201510402168.XA patent/CN104968165A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6439224B1 (en) * | 1999-10-12 | 2002-08-27 | E. Richard Farone | Ice melter |
| CN102009476A (en) * | 2009-09-07 | 2011-04-13 | 上海富亿德塑胶有限公司 | Plastic body hot melting device |
| CN204145894U (en) * | 2014-09-28 | 2015-02-04 | 广州兴森快捷电路科技有限公司 | Hot-melting mechanism |
| CN204859794U (en) * | 2015-07-09 | 2015-12-09 | 高德（无锡）电子有限公司 | Hot melting machine's hot melt head device for PCB |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105555066A (en) * | 2016-02-19 | 2016-05-04 | 高德（无锡）电子有限公司 | Device capable of delaying ageing of heating head of registration bonding machine |
| CN105555066B (en) * | 2016-02-19 | 2019-02-12 | 高德（无锡）电子有限公司 | Delay the device of heat fusion machine heating head aging |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151007 |