CN204145894U - Hot-melting mechanism - Google Patents
Hot-melting mechanism Download PDFInfo
- Publication number
- CN204145894U CN204145894U CN201420568355.6U CN201420568355U CN204145894U CN 204145894 U CN204145894 U CN 204145894U CN 201420568355 U CN201420568355 U CN 201420568355U CN 204145894 U CN204145894 U CN 204145894U
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- China
- Prior art keywords
- hot melt
- locating back
- hot
- mounting panel
- melting mechanism
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Abstract
The utility model relates to a kind of hot-melting mechanism, comprise that hot melt is permed, mounting panel, described hot melt is permed the hot melt portion comprising installation portion and be connected with installation portion, this installation portion is connected with mounting panel, the side in this hot melt portion is provided with at least one piece of locating back, this locating back is connected with mounting panel by connector, and the thermal fusing surface that the height that the pressing face of described locating back is mounted opposite plate is less than or equal to described hot melt portion is mounted opposite the height of plate.Described hot-melting mechanism, structure is simple, and easy for installation, cost is lower, by arranging locating back in the side in hot melt portion, and locating back is connected with mounting panel, in reflow process, the pressing face of locating back compresses the plate face of side, hot melt district, efficiently solve the problem that hot melt district gummosis projection produces micelle, eliminate the wrinkling problem extending to delivery unit of the hot melt district Copper Foil caused because of micelle, avoid micelle simultaneously and to come off the quality potential problem caused, be conducive to the quality improving circuit board.
Description
Technical field
The utility model relates to printed circuit technique field, particularly relates to a kind of hot-melting mechanism.
Background technology
Along with printed circuit board is towards densification, and high-layer development, more and more higher to the requirement of the aligning accuracy of printed wiring board.Aligning accuracy requires higher printed circuit board, and pressing working procedure usually adopts mass-lam alignment system, i.e. the mode of the pre-contraposition of hot melt and closing-up controls aligning accuracy.
As the one of hot melting way, resistance heating hot melting way uses extensively, as shown in Figure 1, the gummosis that resistance hot melt produces easily forms protruding micelle 2 in the side in hot melt district 1, cause the Copper Foil in pressing after heat melting zone wrinkling, wrinkling lines extends to delivery unit area 3 by the hot melt district 1 of edges of boards, causes the Copper Foil of delivery unit area wrinkling, reduce conforming product rate, delivery unit area 3 refers to final for making the part of circuit board; And the micelle 2 of edges of boards projection easily comes off in subsequent operation, brings unnecessary trouble to cleaning, if fall into delivery unit area, easily cause quality defect, there is many hidden danger.
Summary of the invention
Based on this, be necessary the defect for prior art, a kind of hot-melting mechanism is provided, gummosis projection in circuit board hot melt zone in reflow process effectively can be avoided to produce micelle problem, improve the quality of circuit board.
Its technical scheme is as follows:
A kind of hot-melting mechanism, comprise that hot melt is permed, mounting panel, described hot melt is permed the hot melt portion comprising installation portion and be connected with installation portion, this installation portion is connected with mounting panel, the side in this hot melt portion is provided with at least one piece of locating back, this locating back is connected with mounting panel by connector, and the thermal fusing surface that the height that the pressing face of described locating back is mounted opposite plate is less than or equal to described hot melt portion is mounted opposite the height of plate.
Its further technical scheme is as follows:
Described connector is stud, and described mounting panel is provided with the first installing hole, and described locating back is provided with the second installing hole, and the two ends of this double threaded screw are mated with the first installing hole, the second installing hole respectively.
Be provided with the first pad between this stud and locating back, between this double threaded screw and mounting panel, be provided with the second pad, between this second pad and double threaded screw, be provided with heat shield.
Described heat shield is mica sheet.
Described locating back is Teflon material, and the height that the pressing face of height and locating back that the thermal fusing surface in described hot melt portion is mounted opposite plate is mounted opposite plate differs 0-5mm.
The distance in described locating back and hot melt portion is 1-8mm.
Described hot-melting mechanism comprises one piece of locating back, and described locating back is arranged on the outside in hot melt portion, and described locating back is connected with mounting panel by two connectors, and two connectors are separately positioned on position, the angle place of locating back.
The thickness of described locating back is more than or equal to 3mm, and the pressing face of this locating back and the angle of horizontal plane are within the scope of 0 °-10 °.
Below the advantage of preceding solution or principle are described:
Above-mentioned hot-melting mechanism, structure is simple, easy for installation, cost is lower, by arranging locating back in the side in hot melt portion, and locating back is connected with mounting panel, in reflow process, the pressing face of locating back compresses the plate face of side, hot melt district, Ban Mianchu under avoiding the gummosis in hot melt district to flow to pressing face on the one hand, ensure that the prepreg under pressing face is non-fusible on the other hand, pressing face non-stick resin, efficiently solve the problem that hot melt district gummosis projection produces micelle, eliminate the wrinkling problem extending to delivery unit of hot melt district Copper Foil because micelle causes, avoid micelle to come off the quality potential problem caused simultaneously, be conducive to the quality improving circuit board.
Accompanying drawing explanation
Form the schematic diagram of micelle in the side in hot melt district when Fig. 1 is existing hot-melting mechanism hot melt;
Fig. 2 is the structural representation of hot-melting mechanism described in the utility model embodiment.
Description of reference numerals:
100, hot melt is permed, and 110, installation portion, 120, hot melt portion, 200, mounting panel, 300, locating back, 400, connector, the 500, first pad, 600, heat shield.
Embodiment
As shown in Figure 1 and Figure 2, a kind of hot-melting mechanism, comprise that hot melt perms 100, mounting panel 200, described hot melt is permed the 100 hot melt portions 120 comprising installation portion 110 and be connected with installation portion 110, this installation portion 110 is connected with mounting panel 200, the side in this hot melt portion 120 is provided with at least one piece of locating back 300, this locating back 300 is connected with mounting panel 200 by connector 400, and the thermal fusing surface that the height that the pressing face of described locating back 300 is mounted opposite plate 200 is less than or equal to described hot melt portion 120 is mounted opposite the height of plate 200.Thermal fusing surface refers to hot melt and to perm the 100 effects side on circuit boards, pressing face refers to locating back 300 and acts on the side on circuit boards, the thermal fusing surface that the height pressing face of locating back 300 being mounted opposite plate 200 is arranged to be less than or equal to described hot melt portion 120 is mounted opposite the height of plate 200, in order to avoid locating back during hot melt 300 supports on circuit boards, cause hot melt portion 120 cannot act on circuit boards, cause hot melt to lose efficacy, affect aligning accuracy.
Described in the present embodiment, connector 400 is stud, and described mounting panel 200 is provided with the first installing hole, and described locating back 300 is provided with the second installing hole, and the two ends of this double threaded screw are mated with the first installing hole, the second installing hole respectively.Connector 400 is arranged to stud structure, the convenient installation to locating back 300 and adjustment.
Be provided with the first pad 500 between this stud and locating back 300, between this double threaded screw and mounting panel 200, be provided with the second pad (not shown), between this second pad and double threaded screw, be provided with heat shield 600.Described heat shield 600 is mica sheet.By arranging the first pad 500, second pad, avoiding stud and mounting panel 200, locating back 300 to get loose, heat shield 600 being set, avoiding the heat on mounting panel 200 to pass on locating back 300, cause locating back 300 overheated.
Described locating back 300 is Teflon material, and the height that the thermal fusing surface in described hot melt portion 120 is mounted opposite plate 200 differs 0-5mm with the height that the bottom of locating back 300 is mounted opposite plate 200.Described locating back 300 is 1-8mm with the distance in hot melt portion 120.Locating back 300 selects Teflon material, can be effectively antiseized, avoids locating back 300 to be stained with the gummosis of hot melt, causes pressing face dirty, damages circuit board.The height that the thermal fusing surface in hot melt portion 120 is mounted opposite plate 200 differs H with the height that the pressing face of locating back 300 is mounted opposite plate 200, H is arranged within the scope of 0-5mm, preferred 0mm, avoids pressing face to differ too large with thermal fusing surface spacing, affects the action effect of locating back 300; Locating back 300 is that L, L are arranged within the scope of 1-8mm with the distance in hot melt portion 120, preferred 1mm, locating back 300 and hot melt portion 120 are separated by too far away, its interval can be caused to form sizing material, be separated by too near, to causing, locating back 300 is overheated, and L is selected within the scope of 1-8mm and can ensures optimum action effect.
Hot-melting mechanism described in the present embodiment comprises one piece of locating back 300, described locating back 300 is arranged on the outside in hot melt portion 120, described locating back 300 is connected with mounting panel 200 by two connectors 400, and two connectors 400 are separately positioned on position, the angle place of locating back 300.The gummosis that hot melt produces mainly flows to the outside in hot melt district, namely near the position of circuit board edge, locating back 300 is arranged on the outside in hot melt portion 120, and while hot melt portion 120 acts on, locating back 300 acts on the plate face outside hot melt district.According to the actual requirements, locating back 300 can be all set in other sides in hot melt portion 120, guarantee that the gummosis of hot melt district surrounding does not overflow.Two connectors 400 are separately positioned on position, the angle place of locating back 300, guarantee the stability that locating back 300 is installed.The thickness of described locating back 300 is more than or equal to 3mm, and the pressing face of this locating back 300 and the angle of horizontal plane are within the scope of 0 °-10 °, and locating back 300 is too thin, insufficient strength, can not reach and well flatten effect, pressing face tilts very much, can affect pressing effect equally.
Hot-melting mechanism described in the present embodiment, structure is simple, easy for installation, cost is lower, by arranging locating back 300 in the side in hot melt portion 120, and locating back 300 is connected with mounting panel 200, in reflow process, the pressing face of locating back 300 compresses the plate face of side, hot melt district, Ban Mianchu under avoiding the gummosis in hot melt district to flow to pressing face on the one hand, ensure that the prepreg under pressing face is non-fusible on the other hand, pressing face non-stick resin, efficiently solve the problem that hot melt district gummosis projection produces micelle, eliminate the wrinkling problem extending to delivery unit of hot melt district Copper Foil because micelle causes, avoid micelle to come off the quality potential problem caused simultaneously, be conducive to the quality improving circuit board.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this specification is recorded.
The above embodiment only have expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (8)
1. a hot-melting mechanism, it is characterized in that, comprise that hot melt is permed, mounting panel, described hot melt is permed the hot melt portion comprising installation portion and be connected with installation portion, this installation portion is connected with mounting panel, the side in this hot melt portion is provided with at least one piece of locating back, and this locating back is connected with mounting panel by connector, and the thermal fusing surface that the height that the pressing face of described locating back is mounted opposite plate is less than or equal to described hot melt portion is mounted opposite the height of plate.
2. hot-melting mechanism as claimed in claim 1, it is characterized in that, described connector is stud, and described mounting panel is provided with the first installing hole, described locating back is provided with the second installing hole, and the two ends of this double threaded screw are mated with the first installing hole, the second installing hole respectively.
3. hot-melting mechanism as claimed in claim 2, is characterized in that, be provided with the first pad between this stud and locating back, be provided with the second pad between this double threaded screw and mounting panel, be provided with heat shield between this second pad and double threaded screw.
4. hot-melting mechanism as claimed in claim 3, it is characterized in that, described heat shield is mica sheet.
5. hot-melting mechanism as claimed in claim 1, it is characterized in that, described locating back is Teflon material, and the height that the pressing face of height and locating back that the thermal fusing surface in described hot melt portion is mounted opposite plate is mounted opposite plate differs 0-5mm.
6. hot-melting mechanism as claimed in claim 5, it is characterized in that, the distance in described locating back and hot melt portion is 1-8mm.
7. hot-melting mechanism as claimed in claim 1, it is characterized in that, it comprises one piece of locating back, and described locating back is arranged on the outside in hot melt portion, and described locating back is connected with mounting panel by two connectors, and two connectors are separately positioned on position, the angle place of locating back.
8. hot-melting mechanism as claimed in claim 7, it is characterized in that, the thickness of described locating back is more than or equal to 3mm, and the pressing face of this locating back and the angle of horizontal plane are within the scope of 0 °-10 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420568355.6U CN204145894U (en) | 2014-09-28 | 2014-09-28 | Hot-melting mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420568355.6U CN204145894U (en) | 2014-09-28 | 2014-09-28 | Hot-melting mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204145894U true CN204145894U (en) | 2015-02-04 |
Family
ID=52422553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420568355.6U Expired - Fee Related CN204145894U (en) | 2014-09-28 | 2014-09-28 | Hot-melting mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204145894U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104968165A (en) * | 2015-07-09 | 2015-10-07 | 高德（无锡）电子有限公司 | Hot melting head device of hot melting machine for PCBs |
| CN105555066A (en) * | 2016-02-19 | 2016-05-04 | 高德（无锡）电子有限公司 | Device capable of delaying ageing of heating head of registration bonding machine |
| CN109801532A (en) * | 2019-03-23 | 2019-05-24 | 国网山东省电力公司高密市供电公司 | A kind of real training hot melt mounting plate |
-
2014
- 2014-09-28 CN CN201420568355.6U patent/CN204145894U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104968165A (en) * | 2015-07-09 | 2015-10-07 | 高德（无锡）电子有限公司 | Hot melting head device of hot melting machine for PCBs |
| CN105555066A (en) * | 2016-02-19 | 2016-05-04 | 高德（无锡）电子有限公司 | Device capable of delaying ageing of heating head of registration bonding machine |
| CN105555066B (en) * | 2016-02-19 | 2019-02-12 | 高德（无锡）电子有限公司 | Delay the device of heat fusion machine heating head aging |
| CN109801532A (en) * | 2019-03-23 | 2019-05-24 | 国网山东省电力公司高密市供电公司 | A kind of real training hot melt mounting plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150204 Termination date: 20200928 |