CN105555066A - Device capable of delaying ageing of heating head of registration bonding machine - Google Patents
Device capable of delaying ageing of heating head of registration bonding machine Download PDFInfo
- Publication number
- CN105555066A CN105555066A CN201610094011.XA CN201610094011A CN105555066A CN 105555066 A CN105555066 A CN 105555066A CN 201610094011 A CN201610094011 A CN 201610094011A CN 105555066 A CN105555066 A CN 105555066A
- Authority
- CN
- China
- Prior art keywords
- heating head
- side groove
- substrate
- head cable
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 78
- 230000032683 aging Effects 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 230000001934 delay Effects 0.000 claims description 4
- 239000003292 glue Substances 0.000 abstract description 5
- 238000003825 pressing Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000002893 slag Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 230000004927 fusion Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 241001074085 Scophthalmus aquosus Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000003679 aging effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
Abstract
The invention relates to a device capable of delaying ageing of a heating head of an RBM (registration bonding machine). The device comprises a substrate, wherein countersunk bolt holes are formed in the corner positions of the substrate; a heating head mounting pit, a left heating head cable connecting side groove and a right heating head cable connecting side groove are formed in the front wall surface of the substrate; the left heating head cable connecting side groove is connected with the left side of the heating head mounting pit; the right heating head cable connecting side groove is connected with the right side of the heating head mounting pit; and the depths of the left heating head cable connecting side groove and the right heating head cable connecting side groove are smaller than that of the heating head mounting pit. The device prevents glue of a prepreg from flowing to the heating head, and plays a role in delaying ageing of the heating head.
Description
Technical field
The present invention relates to one and can delay the aging device of RBM (Registrationbondingmachine) heat fused machine heating head, the invention belongs to PCB machine range device technical field.
Background technology
In the whole production procedure of PCB, pressing refers to Copper Foil (Copperfoil), internal layer circuit plate after film (Prepreg) and brown (Brownoxide) process is at high temperature and suppress and depress to multiple-plate process, mainly comprises brown, pre-folded, superimposed, pressing and X-Ray brill target, drags for the reprocessing such as limit, edging flow process.Multiple-plate process for pressing has mainly contained tip pressing plate (PinlamLamination) and without tip pressing plate (MassLamination), Pinlam pressing plate will arrange two optical targets (OpticalTarget) on inner plating egative film, inner plating after etching is placed on pressing plate contraposition gone out by the perforating press with CCD para-position system by the mould in machine tooling hole (being commonly referred to as PEPunch hole) according to two targets, same tooling hole outputed by Copper Foil and film, the compression plate being enclosed within Pin according to laminated layer sequence is one by one bound into book form, and the mirror steel plate added with Pin hole, and the cover plate in Pin hole is coated with in top layer, each opening sending into press prepares pressing.Registration holes required for PinLamination is waist-shaped hole, long and short limit can free-extension to a certain degree in the process of pressing, level to level alignment degree is high, ensure the unique method preferably of Aligning degree between high-rise flaggy, but it is loaded down with trivial details to tear plate open after this method pressing, production capacity is low, and cost is high, only uses at Highlayercounter and Rigid Flex at present.
MassLamination is a large amount of is the pressing mode that 4 ~ 10 laminates generally use without pin lamination, this method simple and fast, output is large, is fused or closing-up according to lamination and film fuse machine by internal layer core, puts into large press pressing afterwards with Copper Foil and film.Reflow process mainly at high temperature makes film melt, viscosity is utilized to be sticked together by each core layer, the mode that current heat fused produces high temperature mainly contains resistance heating and Electromagnetic Heating two kinds, resistance heating utilizes the resistance wire of coiling to generate heat, heat transfer by heat conduction, this mode of heating is slow, film fusing flowing state difference, fusion poor effect.The Electromagnetic Heating of rising in recent years, by electronic circuit board part alternating magnetic field, when use containing container made of iron place above time, vessel surface produces cutting alternate magnetic force line and produces alternating current at container bottom metallic member, i.e. eddy current, eddy current makes the iron atom high speed random motion of container bottom, atom collides with each other, rub and produce heat, thus play the effect of heating film, this mode of heating is fast, fusion effect is better, but it is large to there is gummosis, and heating head is easily sticky aging by glue slag.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of can stop film gummosis on heating head, play the effect that delays the aging protection of heating head delay the aging device of heat fused machine heating head.
According to technical scheme provided by the invention, describedly delay the aging device of heat fused machine heating head, it comprises substrate, dormant bolt hole is offered at the corner location of substrate, the front face of substrate offers heating head depression is installed, heating head cable picks out left side groove and heating head cable picks out right side groove, heating head cable picks out left side groove and installs the limit, left side of caving in heating head and connect, heating head cable picks out right side groove and installs with heating head the right edge caved in and connect, heating head cable pick out left side groove and heating head cable pick out on the right side of the degree of depth of groove be all less than heating head the degree of depth caved in be installed.
Described heating head cable pick out left side groove and heating head cable pick out on the right side of the width of groove be all less than heating head the width caved in be installed.
Described substrate adopts high-temperature resistance plastice to make.
The present invention prevents film gummosis on heating head, and the present invention serves and delays the aging effect of heating head.
Accompanying drawing explanation
Fig. 1 is front view of the present invention.
Fig. 2 is left view of the present invention.
Fig. 3 is vertical view of the present invention.
Embodiment
Below in conjunction with specific embodiment, the invention will be further described.
This delays the aging device of heat fused machine heating head, it comprises substrate 1, dormant bolt hole 1.1 is offered at the corner location of substrate 1, the front face of substrate 1 offers heating head depression 1.2 is installed, heating head cable picks out left side groove 1.3 and picks out right side groove 1.4 with heating head cable, heating head cable picks out left side groove 1.3 and connects with the limit, left side that heating head installs depression 1.2, heating head cable picks out right side groove 1.4 and connects with the right edge that heating head installs depression 1.2, heating head cable picks out the degree of depth that left side groove 1.3 and heating head cable pick out right side groove 1.4 and is all less than the degree of depth that heating head installs depression 1.2.
Described heating head cable picks out the width that left side groove 1.3 and heating head cable pick out right side groove 1.4 and is all less than the width that heating head installs depression 1.2.
Described substrate 1 adopts high-temperature resistance plastice to make.
During use; the main machine frame by dormant bolt hole 1.1 device of the present invention being locked in heating head by fastening bolt becomes overall; heating head embeds heating head and installs in depression 1.2; plate to be fused has been installed between the heating head of device of the present invention from upper and lower two and has been passed through; under the protection of apparatus of the present invention; glue slag and heating head completely cut off; glue slag flows on device of the present invention; simultaneously owing to being high-temperature resistance plastice; can at high temperature continue to use; glue slag shovel can be cleared up easily, effectively plays a protective role.
Claims (3)
1. one kind delays the aging device of heat fused machine heating head, it is characterized in that: it comprises substrate (1), dormant bolt hole (1.1) is offered at the corner location of substrate (1), the front face of substrate (1) offers heating head depression (1.2) is installed, heating head cable picks out left side groove (1.3) and picks out right side groove (1.4) with heating head cable, heating head cable picks out left side groove (1.3) and connects with the limit, left side that heating head installs cave in (1.2), heating head cable picks out right side groove (1.4) and connects with the right edge that heating head installs cave in (1.2), heating head cable pick out left side groove (1.3) with heating head cable pick out right side groove (1.4) the degree of depth be all less than the degree of depth that heating head installs cave in (1.2).
2. delay the device that heat fused machine heating head is aging as claimed in claim 1, it is characterized in that: described heating head cable pick out left side groove (1.3) with heating head cable pick out right side groove (1.4) width be all less than the width that heating head installs cave in (1.2).
3. delay the device that heat fused machine heating head is aging as claimed in claim 1, it is characterized in that: described substrate (1) adopts high-temperature resistance plastice to make.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610094011.XA CN105555066B (en) | 2016-02-19 | 2016-02-19 | Delay the device of heat fusion machine heating head aging |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610094011.XA CN105555066B (en) | 2016-02-19 | 2016-02-19 | Delay the device of heat fusion machine heating head aging |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105555066A true CN105555066A (en) | 2016-05-04 |
CN105555066B CN105555066B (en) | 2019-02-12 |
Family
ID=55833920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610094011.XA Expired - Fee Related CN105555066B (en) | 2016-02-19 | 2016-02-19 | Delay the device of heat fusion machine heating head aging |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105555066B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040197646A1 (en) * | 1998-10-30 | 2004-10-07 | Kazuhito Hatta | Non-aqueous electrolyte battery |
CN204145894U (en) * | 2014-09-28 | 2015-02-04 | 广州兴森快捷电路科技有限公司 | Hot-melting mechanism |
CN104968165A (en) * | 2015-07-09 | 2015-10-07 | 高德(无锡)电子有限公司 | Hot melting head device of hot melting machine for PCBs |
CN205510579U (en) * | 2016-02-19 | 2016-08-24 | 高德(无锡)电子有限公司 | Delay ageing device of heat fused machine heating head |
-
2016
- 2016-02-19 CN CN201610094011.XA patent/CN105555066B/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040197646A1 (en) * | 1998-10-30 | 2004-10-07 | Kazuhito Hatta | Non-aqueous electrolyte battery |
CN204145894U (en) * | 2014-09-28 | 2015-02-04 | 广州兴森快捷电路科技有限公司 | Hot-melting mechanism |
CN104968165A (en) * | 2015-07-09 | 2015-10-07 | 高德(无锡)电子有限公司 | Hot melting head device of hot melting machine for PCBs |
CN205510579U (en) * | 2016-02-19 | 2016-08-24 | 高德(无锡)电子有限公司 | Delay ageing device of heat fused machine heating head |
Also Published As
Publication number | Publication date |
---|---|
CN105555066B (en) | 2019-02-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101662888B (en) | Preparation method for PCB plate with step trough | |
CN102548258B (en) | Production method of stepped groove circuit board with through hole, soldermask and circuit graphics at groove bottom | |
CN202310279U (en) | Graphical printed board at bottom of dual-step ladder groove | |
CN106455291B (en) | A kind of copper-based printed board structure of high-cooling property metal and preparation method thereof | |
CN102143660A (en) | Half-hole machining process for printed circuit board | |
CN106255350A (en) | Bury copper coin manufacture method | |
CN104938040B (en) | It is built-in with the substrate and its manufacture method of part | |
CN106332475A (en) | Manufacturing method for depth-control stepped metalized blind groove PCB | |
CN105451450A (en) | Manufacturing method for high-frequency stepped circuit board for reducing stepped groove glue overflow | |
CN205510579U (en) | Delay ageing device of heat fused machine heating head | |
CN105555066A (en) | Device capable of delaying ageing of heating head of registration bonding machine | |
CN109587977A (en) | A kind of improvement fusion undesirable method of position making sheet | |
CN106163114A (en) | A kind of metal-base circuit plate structure and processing method thereof | |
CN104902684B (en) | A kind of step groove circuit board and its processing method | |
CN103402333A (en) | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof | |
CN105120596B (en) | Ladder form drag glue laminated closes structure and ladder form drag glue laminated closes method | |
CN203875442U (en) | Intelligent wave solder | |
CN107770951A (en) | High characteristic impedance multilayer circuit board and preparation method | |
CN107801303A (en) | A kind of flexible PCB | |
CN105228346B (en) | The processing method and step groove circuit board of step groove circuit board | |
CN203368904U (en) | Multi-layer PCB plate structure | |
CN207625859U (en) | High characteristic impedance multilayer circuit board | |
CN110139506A (en) | A kind of step printed circuit board and preparation method thereof | |
CN104185355B (en) | The preparation method and circuit board of a kind of circuit board | |
CN206759828U (en) | A kind of molten riveting integrated module of PCB pressings |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190212 |