CN105555066A - Device capable of delaying ageing of heating head of registration bonding machine - Google Patents

Device capable of delaying ageing of heating head of registration bonding machine Download PDF

Info

Publication number
CN105555066A
CN105555066A CN201610094011.XA CN201610094011A CN105555066A CN 105555066 A CN105555066 A CN 105555066A CN 201610094011 A CN201610094011 A CN 201610094011A CN 105555066 A CN105555066 A CN 105555066A
Authority
CN
China
Prior art keywords
heating head
side groove
substrate
head cable
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610094011.XA
Other languages
Chinese (zh)
Other versions
CN105555066B (en
Inventor
吴海娜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gul Wuxi Technologies Co Ltd
Original Assignee
Gul Wuxi Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gul Wuxi Technologies Co Ltd filed Critical Gul Wuxi Technologies Co Ltd
Priority to CN201610094011.XA priority Critical patent/CN105555066B/en
Publication of CN105555066A publication Critical patent/CN105555066A/en
Application granted granted Critical
Publication of CN105555066B publication Critical patent/CN105555066B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination

Abstract

The invention relates to a device capable of delaying ageing of a heating head of an RBM (registration bonding machine). The device comprises a substrate, wherein countersunk bolt holes are formed in the corner positions of the substrate; a heating head mounting pit, a left heating head cable connecting side groove and a right heating head cable connecting side groove are formed in the front wall surface of the substrate; the left heating head cable connecting side groove is connected with the left side of the heating head mounting pit; the right heating head cable connecting side groove is connected with the right side of the heating head mounting pit; and the depths of the left heating head cable connecting side groove and the right heating head cable connecting side groove are smaller than that of the heating head mounting pit. The device prevents glue of a prepreg from flowing to the heating head, and plays a role in delaying ageing of the heating head.

Description

Delay the device that heat fused machine heating head is aging
Technical field
The present invention relates to one and can delay the aging device of RBM (Registrationbondingmachine) heat fused machine heating head, the invention belongs to PCB machine range device technical field.
Background technology
In the whole production procedure of PCB, pressing refers to Copper Foil (Copperfoil), internal layer circuit plate after film (Prepreg) and brown (Brownoxide) process is at high temperature and suppress and depress to multiple-plate process, mainly comprises brown, pre-folded, superimposed, pressing and X-Ray brill target, drags for the reprocessing such as limit, edging flow process.Multiple-plate process for pressing has mainly contained tip pressing plate (PinlamLamination) and without tip pressing plate (MassLamination), Pinlam pressing plate will arrange two optical targets (OpticalTarget) on inner plating egative film, inner plating after etching is placed on pressing plate contraposition gone out by the perforating press with CCD para-position system by the mould in machine tooling hole (being commonly referred to as PEPunch hole) according to two targets, same tooling hole outputed by Copper Foil and film, the compression plate being enclosed within Pin according to laminated layer sequence is one by one bound into book form, and the mirror steel plate added with Pin hole, and the cover plate in Pin hole is coated with in top layer, each opening sending into press prepares pressing.Registration holes required for PinLamination is waist-shaped hole, long and short limit can free-extension to a certain degree in the process of pressing, level to level alignment degree is high, ensure the unique method preferably of Aligning degree between high-rise flaggy, but it is loaded down with trivial details to tear plate open after this method pressing, production capacity is low, and cost is high, only uses at Highlayercounter and Rigid Flex at present.
MassLamination is a large amount of is the pressing mode that 4 ~ 10 laminates generally use without pin lamination, this method simple and fast, output is large, is fused or closing-up according to lamination and film fuse machine by internal layer core, puts into large press pressing afterwards with Copper Foil and film.Reflow process mainly at high temperature makes film melt, viscosity is utilized to be sticked together by each core layer, the mode that current heat fused produces high temperature mainly contains resistance heating and Electromagnetic Heating two kinds, resistance heating utilizes the resistance wire of coiling to generate heat, heat transfer by heat conduction, this mode of heating is slow, film fusing flowing state difference, fusion poor effect.The Electromagnetic Heating of rising in recent years, by electronic circuit board part alternating magnetic field, when use containing container made of iron place above time, vessel surface produces cutting alternate magnetic force line and produces alternating current at container bottom metallic member, i.e. eddy current, eddy current makes the iron atom high speed random motion of container bottom, atom collides with each other, rub and produce heat, thus play the effect of heating film, this mode of heating is fast, fusion effect is better, but it is large to there is gummosis, and heating head is easily sticky aging by glue slag.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of can stop film gummosis on heating head, play the effect that delays the aging protection of heating head delay the aging device of heat fused machine heating head.
According to technical scheme provided by the invention, describedly delay the aging device of heat fused machine heating head, it comprises substrate, dormant bolt hole is offered at the corner location of substrate, the front face of substrate offers heating head depression is installed, heating head cable picks out left side groove and heating head cable picks out right side groove, heating head cable picks out left side groove and installs the limit, left side of caving in heating head and connect, heating head cable picks out right side groove and installs with heating head the right edge caved in and connect, heating head cable pick out left side groove and heating head cable pick out on the right side of the degree of depth of groove be all less than heating head the degree of depth caved in be installed.
Described heating head cable pick out left side groove and heating head cable pick out on the right side of the width of groove be all less than heating head the width caved in be installed.
Described substrate adopts high-temperature resistance plastice to make.
The present invention prevents film gummosis on heating head, and the present invention serves and delays the aging effect of heating head.
Accompanying drawing explanation
Fig. 1 is front view of the present invention.
Fig. 2 is left view of the present invention.
Fig. 3 is vertical view of the present invention.
Embodiment
Below in conjunction with specific embodiment, the invention will be further described.
This delays the aging device of heat fused machine heating head, it comprises substrate 1, dormant bolt hole 1.1 is offered at the corner location of substrate 1, the front face of substrate 1 offers heating head depression 1.2 is installed, heating head cable picks out left side groove 1.3 and picks out right side groove 1.4 with heating head cable, heating head cable picks out left side groove 1.3 and connects with the limit, left side that heating head installs depression 1.2, heating head cable picks out right side groove 1.4 and connects with the right edge that heating head installs depression 1.2, heating head cable picks out the degree of depth that left side groove 1.3 and heating head cable pick out right side groove 1.4 and is all less than the degree of depth that heating head installs depression 1.2.
Described heating head cable picks out the width that left side groove 1.3 and heating head cable pick out right side groove 1.4 and is all less than the width that heating head installs depression 1.2.
Described substrate 1 adopts high-temperature resistance plastice to make.
During use; the main machine frame by dormant bolt hole 1.1 device of the present invention being locked in heating head by fastening bolt becomes overall; heating head embeds heating head and installs in depression 1.2; plate to be fused has been installed between the heating head of device of the present invention from upper and lower two and has been passed through; under the protection of apparatus of the present invention; glue slag and heating head completely cut off; glue slag flows on device of the present invention; simultaneously owing to being high-temperature resistance plastice; can at high temperature continue to use; glue slag shovel can be cleared up easily, effectively plays a protective role.

Claims (3)

1. one kind delays the aging device of heat fused machine heating head, it is characterized in that: it comprises substrate (1), dormant bolt hole (1.1) is offered at the corner location of substrate (1), the front face of substrate (1) offers heating head depression (1.2) is installed, heating head cable picks out left side groove (1.3) and picks out right side groove (1.4) with heating head cable, heating head cable picks out left side groove (1.3) and connects with the limit, left side that heating head installs cave in (1.2), heating head cable picks out right side groove (1.4) and connects with the right edge that heating head installs cave in (1.2), heating head cable pick out left side groove (1.3) with heating head cable pick out right side groove (1.4) the degree of depth be all less than the degree of depth that heating head installs cave in (1.2).
2. delay the device that heat fused machine heating head is aging as claimed in claim 1, it is characterized in that: described heating head cable pick out left side groove (1.3) with heating head cable pick out right side groove (1.4) width be all less than the width that heating head installs cave in (1.2).
3. delay the device that heat fused machine heating head is aging as claimed in claim 1, it is characterized in that: described substrate (1) adopts high-temperature resistance plastice to make.
CN201610094011.XA 2016-02-19 2016-02-19 Delay the device of heat fusion machine heating head aging Expired - Fee Related CN105555066B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610094011.XA CN105555066B (en) 2016-02-19 2016-02-19 Delay the device of heat fusion machine heating head aging

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610094011.XA CN105555066B (en) 2016-02-19 2016-02-19 Delay the device of heat fusion machine heating head aging

Publications (2)

Publication Number Publication Date
CN105555066A true CN105555066A (en) 2016-05-04
CN105555066B CN105555066B (en) 2019-02-12

Family

ID=55833920

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610094011.XA Expired - Fee Related CN105555066B (en) 2016-02-19 2016-02-19 Delay the device of heat fusion machine heating head aging

Country Status (1)

Country Link
CN (1) CN105555066B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040197646A1 (en) * 1998-10-30 2004-10-07 Kazuhito Hatta Non-aqueous electrolyte battery
CN204145894U (en) * 2014-09-28 2015-02-04 广州兴森快捷电路科技有限公司 Hot-melting mechanism
CN104968165A (en) * 2015-07-09 2015-10-07 高德(无锡)电子有限公司 Hot melting head device of hot melting machine for PCBs
CN205510579U (en) * 2016-02-19 2016-08-24 高德(无锡)电子有限公司 Delay ageing device of heat fused machine heating head

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040197646A1 (en) * 1998-10-30 2004-10-07 Kazuhito Hatta Non-aqueous electrolyte battery
CN204145894U (en) * 2014-09-28 2015-02-04 广州兴森快捷电路科技有限公司 Hot-melting mechanism
CN104968165A (en) * 2015-07-09 2015-10-07 高德(无锡)电子有限公司 Hot melting head device of hot melting machine for PCBs
CN205510579U (en) * 2016-02-19 2016-08-24 高德(无锡)电子有限公司 Delay ageing device of heat fused machine heating head

Also Published As

Publication number Publication date
CN105555066B (en) 2019-02-12

Similar Documents

Publication Publication Date Title
CN101662888B (en) Preparation method for PCB plate with step trough
CN102548258B (en) Production method of stepped groove circuit board with through hole, soldermask and circuit graphics at groove bottom
CN202310279U (en) Graphical printed board at bottom of dual-step ladder groove
CN106455291B (en) A kind of copper-based printed board structure of high-cooling property metal and preparation method thereof
CN102143660A (en) Half-hole machining process for printed circuit board
CN106255350A (en) Bury copper coin manufacture method
CN104938040B (en) It is built-in with the substrate and its manufacture method of part
CN106332475A (en) Manufacturing method for depth-control stepped metalized blind groove PCB
CN105451450A (en) Manufacturing method for high-frequency stepped circuit board for reducing stepped groove glue overflow
CN205510579U (en) Delay ageing device of heat fused machine heating head
CN105555066A (en) Device capable of delaying ageing of heating head of registration bonding machine
CN109587977A (en) A kind of improvement fusion undesirable method of position making sheet
CN106163114A (en) A kind of metal-base circuit plate structure and processing method thereof
CN104902684B (en) A kind of step groove circuit board and its processing method
CN103402333A (en) Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof
CN105120596B (en) Ladder form drag glue laminated closes structure and ladder form drag glue laminated closes method
CN203875442U (en) Intelligent wave solder
CN107770951A (en) High characteristic impedance multilayer circuit board and preparation method
CN107801303A (en) A kind of flexible PCB
CN105228346B (en) The processing method and step groove circuit board of step groove circuit board
CN203368904U (en) Multi-layer PCB plate structure
CN207625859U (en) High characteristic impedance multilayer circuit board
CN110139506A (en) A kind of step printed circuit board and preparation method thereof
CN104185355B (en) The preparation method and circuit board of a kind of circuit board
CN206759828U (en) A kind of molten riveting integrated module of PCB pressings

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190212