CN105530766A - Technology for preventing copper sheet of circuit board from blistering - Google Patents
Technology for preventing copper sheet of circuit board from blistering Download PDFInfo
- Publication number
- CN105530766A CN105530766A CN201610096645.9A CN201610096645A CN105530766A CN 105530766 A CN105530766 A CN 105530766A CN 201610096645 A CN201610096645 A CN 201610096645A CN 105530766 A CN105530766 A CN 105530766A
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- time
- technique
- plate
- copper
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Abstract
The invention belongs to the field of processing of circuit boards, and particularly relates to a technology for preventing a copper sheet of a circuit board from blistering. The technology disclosed by the invention sequentially comprises three laminating treatments. The technology overcomes the technological difficulties of misregistration of a sliding plate and internal short-circuit scrap of the plate caused by a pressure increase of a pressure plate and bubbles caused by plate grinding through an abrasive belt in the prior art; the plate grinding process through the abrasive belt is not needed; the plate grinding through the abrasive belt is not affected after hole plugging with resin; the outer layer is not subjected to the plate grinding through the abrasive belt; and a buffer material is added for lamination to ensure the pp underfill eligibility. Therefore, the quality of a production plate is improved; the yield is improved; and the technology has a great market prospect and economic value.
Description
Technical field
The invention belongs to wiring board manufacture field, be specifically related to a kind of technique preventing wiring board copper sheet from bubbling.
Background technology
Prior art, in printed circuit board manufacturing process, Rogers material is in HDI plate manufacturing process, central layer and central layer pressing cannot be changed into, can only the direct pressing of pp of Copper Foil and Rogers sheet material, because of material PP poor fluidity, cause pp and Copper Foil adhesion poor, easily cause the open defect that copper sheet bubbles after pressing; And because this plate contains outermost resin consent, and pp and Copper Foil adhesion poor, so abrasive belt grinding can cause plate face Copper Foil air bubble problem after filling holes with resin.Therefore, find a kind of quality improving wiring board, promote yield, and prevent the technique that wiring board copper sheet bubbles from being the current instant thing in this area.
Summary of the invention
For this reason, technical problem to be solved by this invention is to overcome in prior art increases that platen pressure can cause that slide plate layer is inclined, shortly in plank scrap, and abrasive belt grinding causes the technical bottleneck of bubble, thus proposes a kind of technique preventing wiring board copper sheet from bubbling.
For solving the problems of the technologies described above, the invention discloses a kind of technique preventing wiring board copper sheet from bubbling, described process sequence comprises three pressing process.
Preferably, the composing structure of the second time pressing process in described technique in three pressing process and third time pressing process is: steel plate-release film-padded coaming-two-layer aluminium flake-pcb plate-two-layer aluminium flake-padded coaming--release film-steel plate.
Preferably, described technique, wherein, before the described pressing process of the first time in described technique, also order comprises the first time inner figure process to wiring board.
Preferably, described technique, wherein, the first time described pressing process in described technique and between the described pressing process of second time also order comprise consent process, first time heavy Copper treatment, first time plate electric treatment, internal layer plated hole figure, first time slice analysis, take off film, filling holes with resin process, abrasive band template, second time plate electricity, second time slice analysis, the process of second time inner figure.
Preferably, described technique, wherein, the second time described pressing process in described technique and between third time described pressing process also order comprise first time brown, first time laser drill, the heavy copper of second time, first time whole plate filling perforation plating, third time slice analysis, third time inner figure.
Preferably, described technique, wherein, after the third time described pressing process in described technique also order comprise second time brown, second time laser drill, third time heavy copper, second time whole plate filling perforation plating, third time slice analysis, subtract copper, outer boring, the 4th heavy Copper treatment, third time plate electric treatment, outer graphics, graphic plating, the 4th slice analysis, outer etching, welding resistance, surface treatment.
Preferably, described technique, wherein, the hole copper after the plate electric treatment of first time described in described technique, second time plate electric treatment and third time plate electric treatment is all 5-8um.After hole copper be 5-8um.
Preferably, described technique, wherein, the first time inner figure process described in described technique, the process of second time inner figure, third time inner figure process kind exposure guide rule are 6-21 lattice exposure guide rules.
Preferably, described technique, wherein, described first time sinks in copper, the heavy copper of second time, for the third time heavy copper, the 4th heavy Copper treatment, and backlight test is 9.5 grades.
More preferred, described technique, wherein, in described filling holes with resin process, lives copper-plated stopple with resin ink, and at the temperature of 150 DEG C, baking sheet 1h, to arriving resin solidification.
Technique scheme of the present invention has the following advantages compared to existing technology: the method for the invention does not need through abrasive belt grinding flow process, and after crossing filling holes with resin, abrasive belt grinding is without impact; Outer without the need to crossing abrasive belt grinding, therefore add padded coaming pressing, ensure that pp filler is qualified; Therefore improve and produce plate quality, promote yield; There is great market prospects and economic worth.
Embodiment
Embodiment 1 present embodiment discloses a kind of technique preventing wiring board copper sheet from bubbling, and concrete steps are as follows:
1, sawing sheet: output central layer by jigsaw size;
2, first time inner figure: with 6-21 lattice exposure guide rule complete internal layer circuit exposure, development after etching go out line pattern;
3, first time internal layer AOI: check opening the defects such as short circuit and making correction of internal layer;
4, first time pressing: brown speed is according to the thick brown of end copper copper, and select suitable lamination to carry out pressing according to plate Tg, outer copper foil selects Copper Foil according to copper thickness;
5, filling holes with resin is bored: according to thickness of slab, utilize borehole data to carry out Drilling operation;
6, first time heavy copper: plated-through hole, backlight tests 9.5 grades;
7, plate is electric for the first time: plate electricity ensures the minimum 5-8um of hole copper, ensures copper thickness in rear operation making electroplating hole
8, internal layer plated hole figure: complete internal layer circuit exposure with 6-21 lattice exposure guide rule, the hole site of the needs that develop plating, other position dry film covers;
9, plated hole process;
10, first time slice analysis: slice analysis hole copper thickness meets the demands;
11, take off film: returned by graphic plating dry film, expose table copper;
12, filling holes with resin: copper-plated stopple is lived with resin ink, and at the temperature of 150 DEG C, baking sheet 1h, cured resin;
13, abrasive belt grinding: by clean for outer copper face resin polishing;
14, the heavy copper of second time: is metallized in filling holes with resin position;
15, second time plate electricity: by the copper facing of filling holes with resin position;
16, second time inner figure: complete internal layer circuit exposure with 6-21 lattice exposure guide rule, development after etching goes out line pattern;
17, second time internal layer AOI: check opening the defects such as short circuit and making correction of internal layer;
18, second time pressing: brown speed is according to the thick brown of end copper copper, suitable lamination is selected to carry out pressing according to plate Tg, outer copper foil selects Copper Foil according to copper thickness, pressing for prevent Copper Foil and pp adhesion poor, cause Copper Foil bubble, composing structure is: the steel plate-release film-padded coaming-two-layer aluminium flake-padded coaming of two-layer aluminium flake-pcb---release film-steel plate;
19, brown: brown speed, according to the thick brown of end copper copper, ensures that laser drill is not reflective;
20, first time laser drill: according to thickness of slab, utilize borehole data to carry out laser drill processing;
21, the heavy copper of second time: metallization laser blind hole;
22, first time whole plate filling perforation plating: plating makes, and ensures that blind hole is filled and led up;
23, second time slice analysis: section blind hole position, analyzes and ensures that blind hole is filled and led up;
24, third time inner figure: with 6-21 lattice exposure guide rule complete internal layer circuit exposure, development after etching go out line pattern;
25, third time internal layer AOI: check opening the defects such as short circuit and making correction of internal layer;
26, third time pressing: brown speed is according to the thick brown of end copper copper, suitable lamination is selected to carry out pressing according to plate Tg, outer copper foil selects Copper Foil according to thickness, pressing for prevent Copper Foil and pp adhesion poor, cause Copper Foil bubble, composing structure is: the steel plate-release film-padded coaming-two-layer aluminium flake-padded coaming of two-layer aluminium flake-pcb---release film-steel plate;
27, brown: brown speed, according to the thick brown of end copper copper, ensures that laser drill is not reflective;
28, second time laser drill: according to thickness of slab, utilize borehole data to carry out laser drill processing;
29, third time heavy copper: metallization laser blind hole;
30, the whole plate filling perforation plating of second time: plating makes, and ensures that blind hole is filled and led up;
31, third time slice analysis: section blind hole position, analyze ensure that blind hole is filled and led up;
32, outer boring: according to thickness of slab, utilize borehole data to carry out Drilling operation;
33, the 4th heavy copper: plated-through hole, backlight tests 9.5 grades;
34, electric plating of whole board: be required to meet IPC standard to hole copper by client, to wrapcopper requirement, controls in 7-12um scope;
35, outer graphics: complete outer-layer circuit exposure with 6-21 lattice exposure guide rule, and develop;
36, graphic plating: electroplate according to hole, table copper, meet corresponding copper thick;
37, outer etching: alkali etching, etching speed etches by end copper, controls etching live width;
38, outer AOI: check and outer fieldly open the defects such as short circuit and make correction;
39, rear operation: make the operations such as welding resistance, surface treatment, shaping, product examine.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range of the invention.
Claims (10)
1. the technique preventing wiring board copper sheet from bubbling, is characterized in that, described process sequence comprises three pressing process.
2. technique as claimed in claim 1, it is characterized in that, the composing structure of the second time pressing process in described technique in three pressing process and third time pressing process is: steel plate-release film-padded coaming-two-layer aluminium flake-pcb plate-two-layer aluminium flake-padded coaming--release film-steel plate.
3. technique as claimed in claim 2, is characterized in that, before the described pressing process of the first time in described technique, also order comprises the first time inner figure process to wiring board.
4. technique as claimed in claim 3, it is characterized in that, between the described pressing process of the first time in described technique and the described pressing process of second time also order comprise consent process, first time heavy Copper treatment, first time plate electric treatment, internal layer plated hole figure, first time slice analysis, take off film, filling holes with resin process, abrasive band template, the electric treatment of second time plate, second time slice analysis, the process of second time inner figure.
5. technique as claimed in claim 4, it is characterized in that, between the described pressing process of the second time in described technique and third time described pressing process, also sequentially comprise first time brown, for the first time laser drill, the heavy Copper treatment of second time, for the first time whole plate filling perforation plating, for the third time slice analysis, third time inner figure process.
6. technique as claimed in claim 5, it is characterized in that, after the described pressing process of the third time in described technique also order comprise second time brown, second time laser drill, third time heavy Copper treatment, second time whole plate filling perforation plating, third time slice analysis, subtract copper, outer boring, the 4th heavy Copper treatment, third time plate electric treatment, outer graphics, graphic plating, the 4th slice analysis, outer etching, welding resistance, surface treatment.
7. technique as claimed in claim 5, is characterized in that, the hole copper after the plate electric treatment of first time described in described technique, second time plate electric treatment and third time plate electric treatment is all 5-8um.
8. technique as claimed in claim 7, is characterized in that, the first time inner figure process described in described technique, the process of second time inner figure, third time inner figure process kind exposure guide rule are 6-21 lattice exposure guide rules.
9. technique as claimed in claim 8, is characterized in that, described first time sinks in Copper treatment, the heavy Copper treatment of second time, for the third time heavy Copper treatment, the 4th heavy Copper treatment, and backlight test is 9.5 grades.
10. technique as claimed in claim 9, is characterized in that, in described filling holes with resin process, is lived by copper-plated stopple with resin ink, and at the temperature of 150 DEG C, baking sheet 1h, to arriving resin solidification.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610096645.9A CN105530766B (en) | 2016-02-22 | 2016-02-22 | A kind of technique for preventing wiring board copper sheet from blistering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610096645.9A CN105530766B (en) | 2016-02-22 | 2016-02-22 | A kind of technique for preventing wiring board copper sheet from blistering |
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| Publication Number | Publication Date |
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| CN105530766A true CN105530766A (en) | 2016-04-27 |
| CN105530766B CN105530766B (en) | 2018-04-24 |
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| CN201610096645.9A Expired - Fee Related CN105530766B (en) | 2016-02-22 | 2016-02-22 | A kind of technique for preventing wiring board copper sheet from blistering |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0312991A (en) * | 1989-06-12 | 1991-01-21 | Tokuyama Soda Co Ltd | Manufacturing method of electromagnetic shield wiring board |
| US20100230145A1 (en) * | 2007-01-02 | 2010-09-16 | Ormet Circuits, Inc. | Methods to produce high density, multilayer printed wiring boards from parallel-fabricated circuits and filled vias |
| CN102595799A (en) * | 2011-12-30 | 2012-07-18 | 柏承科技(昆山)股份有限公司 | Manufacturing method of high-density interconnected printed circuit board |
| WO2014190525A1 (en) * | 2013-05-30 | 2014-12-04 | 深圳崇达多层线路板有限公司 | Laminating manufacturing method for oversized pcb backboard |
| CN105188254A (en) * | 2015-08-06 | 2015-12-23 | 柏承科技(昆山)股份有限公司 | HDI ten-layer plate superposition structure |
| CN105263274A (en) * | 2015-10-28 | 2016-01-20 | 深圳崇达多层线路板有限公司 | Manufacture method of high density interconnection board |
-
2016
- 2016-02-22 CN CN201610096645.9A patent/CN105530766B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0312991A (en) * | 1989-06-12 | 1991-01-21 | Tokuyama Soda Co Ltd | Manufacturing method of electromagnetic shield wiring board |
| US20100230145A1 (en) * | 2007-01-02 | 2010-09-16 | Ormet Circuits, Inc. | Methods to produce high density, multilayer printed wiring boards from parallel-fabricated circuits and filled vias |
| CN102595799A (en) * | 2011-12-30 | 2012-07-18 | 柏承科技(昆山)股份有限公司 | Manufacturing method of high-density interconnected printed circuit board |
| WO2014190525A1 (en) * | 2013-05-30 | 2014-12-04 | 深圳崇达多层线路板有限公司 | Laminating manufacturing method for oversized pcb backboard |
| CN105188254A (en) * | 2015-08-06 | 2015-12-23 | 柏承科技(昆山)股份有限公司 | HDI ten-layer plate superposition structure |
| CN105263274A (en) * | 2015-10-28 | 2016-01-20 | 深圳崇达多层线路板有限公司 | Manufacture method of high density interconnection board |
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| CN105530766B (en) | 2018-04-24 |
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