CN105466463B - 传感器芯片 - Google Patents
传感器芯片 Download PDFInfo
- Publication number
- CN105466463B CN105466463B CN201510621626.9A CN201510621626A CN105466463B CN 105466463 B CN105466463 B CN 105466463B CN 201510621626 A CN201510621626 A CN 201510621626A CN 105466463 B CN105466463 B CN 105466463B
- Authority
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- China
- Prior art keywords
- lamination
- opening
- substrate
- sensing element
- sensor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000003475 lamination Methods 0.000 claims abstract description 87
- 238000010438 heat treatment Methods 0.000 claims description 30
- 238000004519 manufacturing process Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 17
- 239000011253 protective coating Substances 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 13
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- 238000012545 processing Methods 0.000 claims description 9
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- 238000005520 cutting process Methods 0.000 description 4
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- 229910044991 metal oxide Inorganic materials 0.000 description 4
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
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- 229910052751 metal Inorganic materials 0.000 description 3
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- 230000003321 amplification Effects 0.000 description 2
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- 239000004065 semiconductor Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
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- 235000013399 edible fruits Nutrition 0.000 description 1
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- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
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- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/048—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance for determining moisture content of the material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
- G01N27/128—Microapparatus
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/14—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/22—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
- G01N27/223—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance for determining moisture content, e.g. humidity
- G01N27/225—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance for determining moisture content, e.g. humidity by using hygroscopic materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/0004—Gaseous mixtures, e.g. polluted air
- G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
- G01N33/0027—General constructional details of gas analysers, e.g. portable test equipment concerning the detector
- G01N33/0036—General constructional details of gas analysers, e.g. portable test equipment concerning the detector specially adapted to detect a particular component
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
Landscapes
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Combustion & Propulsion (AREA)
- Medicinal Chemistry (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Measuring Fluid Pressure (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP14186534.5 | 2014-09-26 | ||
| EP14186534.5A EP3001186B1 (de) | 2014-09-26 | 2014-09-26 | Sensorchip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105466463A CN105466463A (zh) | 2016-04-06 |
| CN105466463B true CN105466463B (zh) | 2019-11-15 |
Family
ID=51625878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510621626.9A Active CN105466463B (zh) | 2014-09-26 | 2015-09-25 | 传感器芯片 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9506885B2 (de) |
| EP (1) | EP3001186B1 (de) |
| JP (1) | JP6713259B2 (de) |
| KR (1) | KR102361998B1 (de) |
| CN (1) | CN105466463B (de) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102609714B1 (ko) * | 2016-04-27 | 2023-12-05 | 엘지전자 주식회사 | 센서 |
| JP6803579B2 (ja) * | 2016-06-08 | 2020-12-23 | Ｎｉｓｓｈａ株式会社 | Ｍｅｍｓガスセンサ、ｍｅｍｓガスセンサ実装体、ｍｅｍｓガスセンサ・パッケージ、ｍｅｍｓガスセンサ組立体、及びｍｅｍｓガスセンサの製造方法 |
| EP3139159A1 (de) * | 2016-08-23 | 2017-03-08 | Sensirion AG | Sensoranordnung |
| JP7081354B2 (ja) * | 2017-07-19 | 2022-06-07 | 地方独立行政法人東京都立産業技術研究センター | センサ保持基板及びセンサモジュール |
| KR102520038B1 (ko) | 2018-01-10 | 2023-04-12 | 삼성전자주식회사 | 가스 센서 패키지 및 이를 포함하는 센싱 장치 |
| US20200150069A1 (en) | 2018-11-12 | 2020-05-14 | Ams Sensors Uk Limited | Gas sensor |
| US11674916B2 (en) | 2018-11-12 | 2023-06-13 | Sciosense B.V. | Gas sensor |
| JP7445920B2 (ja) | 2020-07-02 | 2024-03-08 | パナソニックＩｐマネジメント株式会社 | ガスセンサ装置 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1533741A (zh) * | 2003-03-31 | 2004-10-06 | ��ʿͨ��ʽ���� | 用于指纹识别的半导体装置 |
| CN1193227C (zh) * | 2000-07-19 | 2005-03-16 | Lg电子株式会社 | 绝对湿度传感器 |
| CN1279348C (zh) * | 2002-03-20 | 2006-10-11 | 株式会社电装 | 电容型湿度传感器 |
| EP2481703A1 (de) * | 2011-01-27 | 2012-08-01 | Sensirion AG | Sensorschutz |
| EP2620768A1 (de) * | 2012-01-25 | 2013-07-31 | Sensirion AG | Tragbare Detektionsvorrichtung |
| DE202013102632U1 (de) * | 2013-06-19 | 2013-12-20 | Sensirion Ag | Sensorbaustein |
| CN103969311A (zh) * | 2013-01-31 | 2014-08-06 | 盛思锐股份公司 | 化学传感器及用于制造该化学传感器的方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2880651B2 (ja) | 1994-08-12 | 1999-04-12 | 東京瓦斯株式会社 | 熱式マイクロフローセンサ及びその製造方法 |
| DE19928297A1 (de) | 1999-06-22 | 2000-12-28 | Bosch Gmbh Robert | Verfahren zur Herstellung eines Sensors mit einer Membran |
| US6384353B1 (en) | 2000-02-01 | 2002-05-07 | Motorola, Inc. | Micro-electromechanical system device |
| EP1350078B1 (de) | 2001-01-10 | 2018-02-14 | Sensirion Holding AG | Mikromechanischer flusssensor mit tensiler beschichtung |
| US6528875B1 (en) | 2001-04-20 | 2003-03-04 | Amkor Technology, Inc. | Vacuum sealed package for semiconductor chip |
| US20030037590A1 (en) | 2001-08-27 | 2003-02-27 | Stark Kevin C. | Method of self-testing a semiconductor chemical gas sensor including an embedded temperature sensor |
| US6841883B1 (en) | 2003-03-31 | 2005-01-11 | Micron Technology, Inc. | Multi-dice chip scale semiconductor components and wafer level methods of fabrication |
| JP2005109221A (ja) | 2003-09-30 | 2005-04-21 | Toshiba Corp | ウェーハレベルパッケージ及びその製造方法 |
| US6936918B2 (en) | 2003-12-15 | 2005-08-30 | Analog Devices, Inc. | MEMS device with conductive path through substrate |
| JP2006226743A (ja) | 2005-02-16 | 2006-08-31 | Mitsubishi Electric Corp | 加速度センサ |
| DE102008025599B4 (de) | 2007-05-14 | 2013-02-21 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Gehäuste aktive Mikrostrukturen mit Direktkontaktierung zu einem Substrat |
| JP5137059B2 (ja) | 2007-06-20 | 2013-02-06 | 新光電気工業株式会社 | 電子部品用パッケージ及びその製造方法と電子部品装置 |
| JP5031492B2 (ja) | 2007-09-06 | 2012-09-19 | キヤノン株式会社 | インクジェットヘッド基板の製造方法 |
| JP5237607B2 (ja) | 2007-10-25 | 2013-07-17 | 新光電気工業株式会社 | 基板の製造方法 |
| KR100942439B1 (ko) | 2007-12-28 | 2010-02-17 | 전자부품연구원 | 마이크로 가스센서 및 제조방법 |
| US20090212397A1 (en) | 2008-02-22 | 2009-08-27 | Mark Ewing Tuttle | Ultrathin integrated circuit and method of manufacturing an ultrathin integrated circuit |
| EP2154713B1 (de) | 2008-08-11 | 2013-01-02 | Sensirion AG | Verfahren zur Herstellung einer Messvorrichtung mit einer Spannungsverminderungsschicht |
| JP2010212297A (ja) | 2009-03-06 | 2010-09-24 | Toshiba Corp | 半導体装置および半導体装置の製造方法 |
| US8736002B2 (en) | 2009-11-18 | 2014-05-27 | Sensirion Ag | Sensor mounted in flip-chip technology at a substrate edge |
| EP2502066B1 (de) | 2009-11-18 | 2017-09-27 | Sensirion AG | In flip-chip-technologie auf einem substrat montierter sensor und dessen herstellung |
| US20110138882A1 (en) | 2009-12-11 | 2011-06-16 | Electronics And Telecommunications Research Institute | Semiconductor gas sensor having low power consumption |
| EP2348292A1 (de) | 2010-01-13 | 2011-07-27 | Sensirion AG | Sensorvorrichtung |
| JP5595230B2 (ja) | 2010-11-05 | 2014-09-24 | フィガロ技研株式会社 | ガスセンサ |
| EP2482310B1 (de) | 2011-01-27 | 2020-09-23 | Sensirion AG | Durchkontaktierungen in einem Sensorchip |
| US8907433B2 (en) | 2012-09-28 | 2014-12-09 | Agilent Technologies, Inc. | Thin film with improved temperature range |
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-
2014
- 2014-09-26 EP EP14186534.5A patent/EP3001186B1/de active Active
-
2015
- 2015-09-10 US US14/850,031 patent/US9506885B2/en active Active
- 2015-09-24 JP JP2015186319A patent/JP6713259B2/ja active Active
- 2015-09-25 CN CN201510621626.9A patent/CN105466463B/zh active Active
- 2015-09-30 KR KR1020150137466A patent/KR102361998B1/ko active IP Right Grant
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1193227C (zh) * | 2000-07-19 | 2005-03-16 | Lg电子株式会社 | 绝对湿度传感器 |
| CN1279348C (zh) * | 2002-03-20 | 2006-10-11 | 株式会社电装 | 电容型湿度传感器 |
| CN1533741A (zh) * | 2003-03-31 | 2004-10-06 | ��ʿͨ��ʽ���� | 用于指纹识别的半导体装置 |
| EP2481703A1 (de) * | 2011-01-27 | 2012-08-01 | Sensirion AG | Sensorschutz |
| EP2620768A1 (de) * | 2012-01-25 | 2013-07-31 | Sensirion AG | Tragbare Detektionsvorrichtung |
| CN103969311A (zh) * | 2013-01-31 | 2014-08-06 | 盛思锐股份公司 | 化学传感器及用于制造该化学传感器的方法 |
| DE202013102632U1 (de) * | 2013-06-19 | 2013-12-20 | Sensirion Ag | Sensorbaustein |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3001186A1 (de) | 2016-03-30 |
| KR20160037119A (ko) | 2016-04-05 |
| EP3001186B1 (de) | 2018-06-06 |
| US9506885B2 (en) | 2016-11-29 |
| KR102361998B1 (ko) | 2022-02-10 |
| JP2016070931A (ja) | 2016-05-09 |
| US20160091446A1 (en) | 2016-03-31 |
| CN105466463A (zh) | 2016-04-06 |
| JP6713259B2 (ja) | 2020-06-24 |
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