CN105463237A - Copper-silver alloy bonding wire and manufacturing method thereof - Google Patents
Copper-silver alloy bonding wire and manufacturing method thereof Download PDFInfo
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- CN105463237A CN105463237A CN201510880814.3A CN201510880814A CN105463237A CN 105463237 A CN105463237 A CN 105463237A CN 201510880814 A CN201510880814 A CN 201510880814A CN 105463237 A CN105463237 A CN 105463237A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
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Abstract
The invention relates to a copper-silver alloy bonding wire. The content of silver serving as a main alloy ranges from 0.1% to 5% by weight percentage, the content of the rare earth element serving as a trace alloy is smaller than or equal to 15 ppm, and the balance is copper serving as a substrate material. The substrate material of the bonding wire is high-purity copper, the intensity is high, and the electric conduction property and the heat conduction property are good; the principal component of the alloy is silver, the hardness is low, the inoxidizability is good, and the oxidation rate of copper wires is reduced; the trace alloy is used for doping, surface segregation passivation is achieved, and the oxidation rate of copper wires is further reduced; and in addition, grains are refined, and the machining performance in the wiredrawing process is strengthened.
Description
Technical field
The present invention relates to a kind of alloy bonding silk be mainly used in microelectronics Packaging operation, be specifically related to a kind of Kufil bonding wire.The invention still further relates to the preparation method of described Kufil bonding wire.
Background technology
Along with unicircuit and discrete device are to encapsulation multioutlet, high integration and miniaturization, the thinner bonding wire of semiconductor package reload request carries out the bonding of thin space, long distance, and the technical indicator of semiconductor packages enterprise para-linkage silk proposes low long arc, high temperature resistant, the ultra-fine more and more higher requirement such as high-strength.Meanwhile, for reducing the impact that bonding gold wire high cost is brought, each production firm accelerates the research and development paces to low cost bonding wire.
Copper wire has the heat conduction more excellent than spun gold, conductivity, breaking load and rigidity are stronger, can obtain more excellent ball neck intensity and higher camber line stability, intermetallic compound (IMC) poor growth in mold pressing and encapsulation process, and the combination between substrate is stablized, and cost is low; But copper wire is oxidizable, life-time service reduces the reliability of device.
What be conventionally used for solution copper wire problem of oxidation at present is preparation plating palladium copper bonding wire, utilize plating palladium layers to completely cut off the contact of copper wire and air, reduce its rate of oxidation, but in burning ball bonding process, because plating palladium layers is different from the recrystallization temperature of base material copper wire, easily generation duck hook etc. are bad; And plating palladium copper wire hardness is high, easily damages chip, cause silicon crater and chip cracks during bonding.Therefore, it is very necessary for inventing a kind of Kufil bonding wire that can solve copper wire problem of oxidation.
Summary of the invention
Technical problem to be solved by this invention is, provides a kind of Kufil bonding wire and preparation method thereof, and prepared bonding wire intensity is high, conduction, good heat conductivity; Hardness is low, good in oxidation resistance; And there is better Wire Drawing performance.
The technical scheme that the existing technical problem of the present invention of solution adopts is as follows:
A kind of Kufil bonding wire, it is characterized in that: as the silver content 0.1 ~ 5wt% of master alloying, as the ree content≤15ppm of microalloy, surplus is the copper as base material.
Ree content as microalloy is preferably 3 ~ 15ppm.
The preparation method of described Kufil bonding wire, is characterized in that being prepared from according to following steps:
1), raw material: select the raw material of more than 99.999%; Or utilize purifying technique, make the purity of raw material reach more than 99.999%;
2), alloy: by high purity copper and high purity silver, or high purity copper, silver and trace alloying element are mixed, through prealloy and mother alloy, prepare alloy pig material;
3), cast: through vacuum continuous drawing casting technique, the founding of alloy pig material is become Kufil rod;
4), wire drawing: silk thread Kufil rod being pulled into required wire diameter by drawing wire machine;
5), anneal.
Wherein step 2) in alloy, alloy temperature is 1100 ~ 1600 DEG C, two step vacuum intermediate-frequency alloys, to ensure homogeneity and the product stability of alloy.
Wherein in step 3) cast, cast temperature is 1080 ~ 1300 DEG C, adopts continuous drawing casting mode, to ensure the excellent machinability of rear road B alloy wire.
In the annealing of wherein step 5), the annealing temperature of finished product wire diameter B alloy wire is 450 ~ 650 DEG C.
The present invention has the following advantages:
The first, bonding wire base material is high purity copper, and intensity is high, conduction, good heat conductivity; Main alloying component is silver, and hardness is low, good in oxidation resistance, reduces the rate of oxidation of copper wire; Microalloy adulterates, surface segregation passivation, reduces copper wire rate of oxidation further, and crystal grain thinning, enhance the processing characteristics in drawing process.
The second, Kufil bonding wire intensity is high, can adapt to thin space, low long arc, high temperature resistant and ultra-fine high-strength bonding trend requirement well.
Three, with plating palladium anti-oxidation compared with, Kufil bonding wire in use burn ball evenly, duck hook phenomenon can not be caused because of ectonexine intermetallic Tc difference, and hardness is low, reduce the damage to chip in bonding process, use properties is more stable, and the scope of application is more extensive.
Accompanying drawing explanation
The Kufil bonding wire of Fig. 1 embodiment of the present invention 1, embodiment 2 preparation and the antioxidant property contrast effect figure of fine copper silk.
Embodiment
Below in conjunction with embodiment, the invention will be further described.
Embodiment 1: a kind of diameter is the Kufil bonding wire of 20 μm (0.8mil), each composition by weight percent of material of composition bonding wire is:
Master alloying Ag(silver) consumption is 0.5%, microalloy Ce(cerium) consumption is 5ppm, surplus is base material Cu(copper).
Its preparation method comprises the following steps:
The first step, raw material: select to reach more than 99.999% highly purified copper, silver, cerium raw material;
Second step, alloy: according to alloying constituent, is shielding gas with nitrogen, prepares prealloy, mother alloy at 1250 ± 5 DEG C;
3rd step, cast: carry out vacuum continuous drawing casting technique at 1200 ± 5 DEG C, founding become diameter be 8 ± 0.3mm Kufil rod;
4th step, wire drawing: Kufil rod is first drawn into by rough equipment the B alloy wire that diameter is 1.55mm, draw equipment to be drawn in passing through again B alloy wire that diameter is 0.26mm, final utilization is carefully drawn, ultra-fine draw equipment to be drawn into Kufil spun gold that diameter is 20 μm;
5th step, annealing: be that the annealing device of 600 ± 10 DEG C carries out anneal to silver alloy wire in temperature, to eliminate the internal stress of B alloy wire, makes it not produce distortion, bending, adjustment mechanical property, disruptive force BL > 7gf, unit elongation E/L13 ~ 17%;
6th step, coiling: according to product length requirement, divides the little axle being coiled into different lengths;
7th step, the examination and test of products: the opticmicroscope inspection alloy bonding silk surface condition by magnification being 250 times, observes and has flawless and impurity; By unwrapping wire and the stress situation of pay-off equipment inspection bonding wire; Whether meet the requirements by the mechanical property of universal testing machine inspection bonding wire, its requirement is: disruptive force B/L > 7gf, unit elongation E/L13 ~ 17%;
8th step, prepared by finished product: packed as requested by the Kufil bonding wire product be up to the standards, and scraps warehouse-in after the product of disqualified upon inspection pastes defective label.
Embodiment 2: a kind of diameter is the Kufil bonding wire of 30 μm (1.2mil), each composition by weight percent of material of composition bonding wire is:
Master alloying Ag(silver) consumption is 4.0%, surplus is base material Cu(copper).
Its preparation method comprises the following steps:
The first step, raw material: select to reach more than 99.999% highly purified copper, silver material;
Second step, alloy: according to alloying constituent, is shielding gas with nitrogen, prepares prealloy, mother alloy at 1200 ± 5 DEG C;
3rd step, cast: carry out vacuum continuous drawing casting technique at 1150 ± 5 DEG C, founding become diameter be 8 ± 0.3mm Kufil rod;
4th step, wire drawing: Kufil rod is first drawn into by rough equipment the B alloy wire that diameter is 1.55mm, draw equipment to be drawn in passing through again B alloy wire that diameter is 0.26mm, final utilization is carefully drawn, ultra-fine draw equipment to be drawn into Kufil spun gold that diameter is 20 μm;
5th step, annealing: be that the annealing device of 550 ± 10 DEG C carries out anneal to silver alloy wire in temperature, to eliminate the internal stress of B alloy wire, makes it not produce distortion, bending, adjustment mechanical property, disruptive force BL > 17gf, unit elongation E/L18 ~ 22%;
6th step, coiling: according to product length requirement, divides the little axle being coiled into different lengths;
7th step, the examination and test of products: the opticmicroscope inspection alloy bonding silk surface condition by magnification being 250 times, observes and has flawless and impurity; By unwrapping wire and the stress situation of pay-off equipment inspection bonding wire; Whether meet the requirements by the mechanical property of universal testing machine inspection bonding wire, its requirement is: disruptive force B/L > 17gf, unit elongation E/L18 ~ 22%;
8th step, prepared by finished product: packed as requested by the Kufil bonding wire product be up to the standards, and scraps warehouse-in after the product of disqualified upon inspection pastes defective label.
Kufil bonding wire prepared by the present invention, can reach following technical indicator:
In embodiment 1, Kufil bonding wire BL mean value can reach 9.8gf, and EL mean value can reach 15.6%; In embodiment 2, Kufil bonding wire BL mean value can reach 18.3gf, and EL mean value can reach 21.1%.At 150 DEG C, test the antioxidant property of identical wire diameter bonding wire under 100% humidity as shown in Figure 1.As shown in Figure 1, fine copper silk starts oxidizing reaction occurs after 12h, and the weight of copper wire obviously increases, and speed of response is very fast, and react completely after 72 hours, weight no longer increases.Embodiment 1 and embodiment 2 started oxidizing reaction occurs at 84 hours later, and speed of reaction is obviously slow than fine copper silk, and after 168 hours, the oxidation ratio of copper wire accounts for 50%, and oxidation-resistance is good.
The equipment such as described casting furnace, drawing wire machine, annealing furnace, bonding wire pay-off equipment, universal testing machine, be all conventional bonding wire manufacture and inspection machine, its using method is also by those of ordinary skill in the art are known.
Claims (6)
1. a Kufil bonding wire, is characterized in that: as the silver content 0.1 ~ 5wt% of master alloying, and as the ree content≤15ppm of microalloy, surplus is the copper as base material.
2. Kufil bonding wire as claimed in claim 1, is characterized in that: as the ree content 3 ~ 15ppm of microalloy.
3. the preparation method of Kufil bonding wire as claimed in claim 1 or 2, is characterized in that being prepared from according to following steps:
1), raw material: select the raw material of more than 99.999%; Or utilize purifying technique, make the purity of raw material reach more than 99.999%;
2), alloy: by high purity copper and high purity silver, or high purity copper, silver and trace alloying element are mixed, through prealloy and mother alloy, prepare alloy pig material;
3), cast: through vacuum continuous drawing casting technique, the founding of alloy pig material is become Kufil rod;
4), wire drawing: silk thread Kufil rod being pulled into required wire diameter by drawing wire machine;
5), anneal.
4. the preparation method of Kufil bonding wire as claimed in claim 3, is characterized in that: wherein step 2) in alloy, alloy temperature is 1100 ~ 1600 DEG C, two step vacuum intermediate-frequency alloys, to ensure homogeneity and the product stability of alloy.
5. the preparation method of Kufil bonding wire as claimed in claim 3, it is characterized in that: wherein in step 3) cast, cast temperature is 1080 ~ 1300 DEG C, adopts continuous drawing casting mode, to ensure the excellent machinability of rear road B alloy wire.
6. the preparation method of Kufil bonding wire according to claim 3, is characterized in that: in the annealing of wherein step 5), the annealing temperature of finished product wire diameter B alloy wire is 450 ~ 650 DEG C.
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| CN201510880814.3A CN105463237B (en) | 2015-12-05 | 2015-12-05 | A kind of Kufil bonding wire and preparation method thereof |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107195608A (en) * | 2017-06-15 | 2017-09-22 | 滕州晨晖电子集团股份有限公司 | A kind of copper microalloy bonding line and preparation method thereof |
| CN107904434A (en) * | 2017-11-24 | 2018-04-13 | 昆明贵金属研究所 | A kind of ultra-fine super long copper B alloy wire and its production method |
| CN108265194A (en) * | 2018-01-09 | 2018-07-10 | 北京有色金属研究总院 | A kind of railway power through track copper alloy conductor and preparation method thereof |
| CN108823463A (en) * | 2018-06-30 | 2018-11-16 | 汕头市骏码凯撒有限公司 | One Albatra metal bonding wire and its manufacturing method |
| CN109273055A (en) * | 2018-08-15 | 2019-01-25 | 北京康普锡威科技有限公司 | A kind of method determining alloy surface segregation status and the method for manufacturing alloy |
| CN110718526A (en) * | 2019-10-22 | 2020-01-21 | 烟台一诺电子材料有限公司 | Rare earth copper alloy bonding wire for superfine linear pitch electronic packaging and preparation method thereof |
| CN113549785A (en) * | 2021-07-27 | 2021-10-26 | 四川威纳尔特种电子材料有限公司 | Bonding copper-silver alloy wire and preparation method and application thereof |
| CN116656998A (en) * | 2023-07-31 | 2023-08-29 | 烟台一诺电子材料有限公司 | Silver bonding wire and processing method thereof |
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| WO2007046378A1 (en) * | 2005-10-17 | 2007-04-26 | National Institute For Materials Science | Cu-Ag ALLOY WIRE HAVING HIGH STRENGTH AND HIGH CONDUCTIVITY AND METHOD FOR MANUFACTURE THEREOF |
| WO2008030368A1 (en) * | 2006-09-08 | 2008-03-13 | Tosoh Smd, Inc. | Copper sputtering target with fine grain size and high electromigration resistance and methods of making the same |
| CN102892908A (en) * | 2010-05-14 | 2013-01-23 | 三菱综合材料株式会社 | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
| CN103137236A (en) * | 2011-12-01 | 2013-06-05 | 贺利氏材料科技公司 | Alloyed 2N copper wires for bonding in microelectronics devices |
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| WO2007046378A1 (en) * | 2005-10-17 | 2007-04-26 | National Institute For Materials Science | Cu-Ag ALLOY WIRE HAVING HIGH STRENGTH AND HIGH CONDUCTIVITY AND METHOD FOR MANUFACTURE THEREOF |
| WO2008030368A1 (en) * | 2006-09-08 | 2008-03-13 | Tosoh Smd, Inc. | Copper sputtering target with fine grain size and high electromigration resistance and methods of making the same |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107195608A (en) * | 2017-06-15 | 2017-09-22 | 滕州晨晖电子集团股份有限公司 | A kind of copper microalloy bonding line and preparation method thereof |
| CN107904434A (en) * | 2017-11-24 | 2018-04-13 | 昆明贵金属研究所 | A kind of ultra-fine super long copper B alloy wire and its production method |
| CN107904434B (en) * | 2017-11-24 | 2020-03-31 | 昆明贵金属研究所 | Ultra-fine and ultra-long copper alloy wire and production method thereof |
| CN108265194A (en) * | 2018-01-09 | 2018-07-10 | 北京有色金属研究总院 | A kind of railway power through track copper alloy conductor and preparation method thereof |
| CN108823463A (en) * | 2018-06-30 | 2018-11-16 | 汕头市骏码凯撒有限公司 | One Albatra metal bonding wire and its manufacturing method |
| CN109273055A (en) * | 2018-08-15 | 2019-01-25 | 北京康普锡威科技有限公司 | A kind of method determining alloy surface segregation status and the method for manufacturing alloy |
| CN109273055B (en) * | 2018-08-15 | 2021-12-03 | 北京康普锡威科技有限公司 | Method for judging alloy surface segregation state and method for manufacturing alloy |
| CN110718526A (en) * | 2019-10-22 | 2020-01-21 | 烟台一诺电子材料有限公司 | Rare earth copper alloy bonding wire for superfine linear pitch electronic packaging and preparation method thereof |
| CN113549785A (en) * | 2021-07-27 | 2021-10-26 | 四川威纳尔特种电子材料有限公司 | Bonding copper-silver alloy wire and preparation method and application thereof |
| CN113549785B (en) * | 2021-07-27 | 2022-04-26 | 四川威纳尔特种电子材料有限公司 | Bonding copper-silver alloy wire and preparation method and application thereof |
| CN116656998A (en) * | 2023-07-31 | 2023-08-29 | 烟台一诺电子材料有限公司 | Silver bonding wire and processing method thereof |
| CN116656998B (en) * | 2023-07-31 | 2023-10-10 | 烟台一诺电子材料有限公司 | Silver bonding wire and processing method thereof |
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| CN105463237B (en) | 2017-12-01 |
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Denomination of invention: Copper-silver alloy bonding wire and manufacturing method thereof Effective date of registration: 20200218 Granted publication date: 20171201 Pledgee: Shanghai Pudong Development Bank Limited by Share Ltd Yantai branch Pledgor: Yantai YesNo Electronic Materials Co., Ltd. Registration number: Y2020980000263 |
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Date of cancellation: 20201214 Granted publication date: 20171201 Pledgee: Shanghai Pudong Development Bank Limited by Share Ltd. Yantai branch Pledgor: YANTAI YESNO ELECTRONIC MATERIALS Co.,Ltd. Registration number: Y2020980000263 |
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Denomination of invention: A copper silver alloy bonding wire and its preparation method Effective date of registration: 20201221 Granted publication date: 20171201 Pledgee: Shanghai Pudong Development Bank Limited by Share Ltd. Yantai branch Pledgor: YANTAI YESNO ELECTRONIC MATERIALS Co.,Ltd. Registration number: Y2020980009638 |
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