CN105463237A - Copper-silver alloy bonding wire and manufacturing method thereof - Google Patents
Copper-silver alloy bonding wire and manufacturing method thereof Download PDFInfo
- Publication number
- CN105463237A CN105463237A CN201510880814.3A CN201510880814A CN105463237A CN 105463237 A CN105463237 A CN 105463237A CN 201510880814 A CN201510880814 A CN 201510880814A CN 105463237 A CN105463237 A CN 105463237A
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- CN
- China
- Prior art keywords
- alloy
- wire
- kufil
- bonding wire
- copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510880814.3A CN105463237B (en) | 2015-12-05 | 2015-12-05 | A kind of Kufil bonding wire and preparation method thereof |
Applications Claiming Priority (1)
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CN201510880814.3A CN105463237B (en) | 2015-12-05 | 2015-12-05 | A kind of Kufil bonding wire and preparation method thereof |
Publications (2)
Publication Number | Publication Date |
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CN105463237A true CN105463237A (en) | 2016-04-06 |
CN105463237B CN105463237B (en) | 2017-12-01 |
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CN201510880814.3A Active CN105463237B (en) | 2015-12-05 | 2015-12-05 | A kind of Kufil bonding wire and preparation method thereof |
Country Status (1)
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CN (1) | CN105463237B (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107195608A (en) * | 2017-06-15 | 2017-09-22 | 滕州晨晖电子集团股份有限公司 | A kind of copper microalloy bonding line and preparation method thereof |
CN107904434A (en) * | 2017-11-24 | 2018-04-13 | 昆明贵金属研究所 | A kind of ultra-fine super long copper B alloy wire and its production method |
CN108265194A (en) * | 2018-01-09 | 2018-07-10 | 北京有色金属研究总院 | A kind of railway power through track copper alloy conductor and preparation method thereof |
CN108823463A (en) * | 2018-06-30 | 2018-11-16 | 汕头市骏码凯撒有限公司 | One Albatra metal bonding wire and its manufacturing method |
CN109273055A (en) * | 2018-08-15 | 2019-01-25 | 北京康普锡威科技有限公司 | A kind of method determining alloy surface segregation status and the method for manufacturing alloy |
CN110718526A (en) * | 2019-10-22 | 2020-01-21 | 烟台一诺电子材料有限公司 | Rare earth copper alloy bonding wire for superfine linear pitch electronic packaging and preparation method thereof |
CN113549785A (en) * | 2021-07-27 | 2021-10-26 | 四川威纳尔特种电子材料有限公司 | Bonding copper-silver alloy wire and preparation method and application thereof |
CN116656998A (en) * | 2023-07-31 | 2023-08-29 | 烟台一诺电子材料有限公司 | Silver bonding wire and processing method thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007046378A1 (en) * | 2005-10-17 | 2007-04-26 | National Institute For Materials Science | Cu-Ag ALLOY WIRE HAVING HIGH STRENGTH AND HIGH CONDUCTIVITY AND METHOD FOR MANUFACTURE THEREOF |
WO2008030368A1 (en) * | 2006-09-08 | 2008-03-13 | Tosoh Smd, Inc. | Copper sputtering target with fine grain size and high electromigration resistance and methods of making the same |
CN102892908A (en) * | 2010-05-14 | 2013-01-23 | 三菱综合材料株式会社 | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
CN103137236A (en) * | 2011-12-01 | 2013-06-05 | 贺利氏材料科技公司 | Alloyed 2N copper wires for bonding in microelectronics devices |
-
2015
- 2015-12-05 CN CN201510880814.3A patent/CN105463237B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007046378A1 (en) * | 2005-10-17 | 2007-04-26 | National Institute For Materials Science | Cu-Ag ALLOY WIRE HAVING HIGH STRENGTH AND HIGH CONDUCTIVITY AND METHOD FOR MANUFACTURE THEREOF |
WO2008030368A1 (en) * | 2006-09-08 | 2008-03-13 | Tosoh Smd, Inc. | Copper sputtering target with fine grain size and high electromigration resistance and methods of making the same |
CN102892908A (en) * | 2010-05-14 | 2013-01-23 | 三菱综合材料株式会社 | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
CN103137236A (en) * | 2011-12-01 | 2013-06-05 | 贺利氏材料科技公司 | Alloyed 2N copper wires for bonding in microelectronics devices |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107195608A (en) * | 2017-06-15 | 2017-09-22 | 滕州晨晖电子集团股份有限公司 | A kind of copper microalloy bonding line and preparation method thereof |
CN107904434A (en) * | 2017-11-24 | 2018-04-13 | 昆明贵金属研究所 | A kind of ultra-fine super long copper B alloy wire and its production method |
CN107904434B (en) * | 2017-11-24 | 2020-03-31 | 昆明贵金属研究所 | Ultra-fine and ultra-long copper alloy wire and production method thereof |
CN108265194A (en) * | 2018-01-09 | 2018-07-10 | 北京有色金属研究总院 | A kind of railway power through track copper alloy conductor and preparation method thereof |
CN108823463A (en) * | 2018-06-30 | 2018-11-16 | 汕头市骏码凯撒有限公司 | One Albatra metal bonding wire and its manufacturing method |
CN109273055A (en) * | 2018-08-15 | 2019-01-25 | 北京康普锡威科技有限公司 | A kind of method determining alloy surface segregation status and the method for manufacturing alloy |
CN109273055B (en) * | 2018-08-15 | 2021-12-03 | 北京康普锡威科技有限公司 | Method for judging alloy surface segregation state and method for manufacturing alloy |
CN110718526A (en) * | 2019-10-22 | 2020-01-21 | 烟台一诺电子材料有限公司 | Rare earth copper alloy bonding wire for superfine linear pitch electronic packaging and preparation method thereof |
CN113549785A (en) * | 2021-07-27 | 2021-10-26 | 四川威纳尔特种电子材料有限公司 | Bonding copper-silver alloy wire and preparation method and application thereof |
CN113549785B (en) * | 2021-07-27 | 2022-04-26 | 四川威纳尔特种电子材料有限公司 | Bonding copper-silver alloy wire and preparation method and application thereof |
CN116656998A (en) * | 2023-07-31 | 2023-08-29 | 烟台一诺电子材料有限公司 | Silver bonding wire and processing method thereof |
CN116656998B (en) * | 2023-07-31 | 2023-10-10 | 烟台一诺电子材料有限公司 | Silver bonding wire and processing method thereof |
Also Published As
Publication number | Publication date |
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CN105463237B (en) | 2017-12-01 |
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C06 | Publication | ||
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GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Copper-silver alloy bonding wire and manufacturing method thereof Effective date of registration: 20200218 Granted publication date: 20171201 Pledgee: Shanghai Pudong Development Bank Limited by Share Ltd Yantai branch Pledgor: Yantai YesNo Electronic Materials Co., Ltd. Registration number: Y2020980000263 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20201214 Granted publication date: 20171201 Pledgee: Shanghai Pudong Development Bank Limited by Share Ltd. Yantai branch Pledgor: YANTAI YESNO ELECTRONIC MATERIALS Co.,Ltd. Registration number: Y2020980000263 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A copper silver alloy bonding wire and its preparation method Effective date of registration: 20201221 Granted publication date: 20171201 Pledgee: Shanghai Pudong Development Bank Limited by Share Ltd. Yantai branch Pledgor: YANTAI YESNO ELECTRONIC MATERIALS Co.,Ltd. Registration number: Y2020980009638 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |