CN113549785A - Bonding copper-silver alloy wire and preparation method and application thereof - Google Patents
Bonding copper-silver alloy wire and preparation method and application thereof Download PDFInfo
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C9/00—Alloys based on copper
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- C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
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Abstract
The invention discloses a bonding copper-silver alloy wire and a preparation method thereof, and application of the bonding copper-silver alloy wire, wherein the bonding copper-silver alloy wire is prepared from a copper-silver alloy, and the copper-silver alloy comprises the following components in percentage by mass: 0.05-5% of silver, 20-199ppm of transition metal element and the balance of copper; copper is used as a main raw material, silver is used as an auxiliary material, and a transition metal element is used for modification, so that crystal grains are refined, the compactness of the alloy is enhanced, and the oxidation resistance is improved.
Description
Technical Field
The invention belongs to the field of semiconductor packaging, and particularly relates to a bonded copper-silver alloy wire and a preparation method and application thereof.
Background
In the field of semiconductor packaging, wire bonding is an important process, and is an important technique for connecting a chip and an external lead. The integration is directly influenced by the quality of the bonding effect, along with the development of microelectronic packaging technology, the semiconductor chip gradually develops towards high integration and miniaturization, the requirements on signal transmission density and safety and reliability are higher and higher, and higher requirements such as high conductivity, high elongation, thinner wire diameter and the like are also provided for the comprehensive performance of the bonding material.
The bonding lead mainly comprises a bonding alloy wire, a bonding silver wire, a bonding copper wire, a bonding aluminum wire and a series of products formed by micro-alloying, compounding, surface treatment and other measures on the basis of the bonding alloy wire, the bonding silver wire, the bonding copper wire and the bonding aluminum wire, wherein the copper wire has obvious advantages compared with the gold wire, the adoption of copper wire bonding can greatly reduce the manufacturing cost of a device and improve the competitive advantage, and the excellent material performance of the copper bonding wire accelerates the application in the electronic packaging industry.
Although the bonded copper wire has the advantages, the bonded copper wire also has some more significant disadvantages: (1) easy oxidation: the copper surface is easily oxidized at room temperature, so that the requirements of the copper wire on production and use conditions are extremely strict;
(2) the strength is low: the existing copper material has low tensile strength and high wire breakage rate in the production process, is difficult to process into a bonding lead with a smaller size, and cannot meet the requirements of high speed, high density and laminated packaging;
(3) poor heat resistance: the recrystallization temperature of the existing bonded copper wire is about 200 ℃. The larger grain size of the wire fuse balls, the longer the Heat Affected Zone (HAZ), and the increased risk of wire fracture failure during power cycling, i.e., reduced chip reliability.
Disclosure of Invention
In view of the above problems of the conventional bonded copper wire, the present invention provides a bonded copper-silver alloy wire.
The invention adopts the following technical scheme: a bonding copper-silver alloy wire is prepared from a copper-silver alloy, wherein the copper-silver alloy comprises the following components in percentage by mass: 0.05 to 5 percent of silver, 20 to 199ppm of transition metal element and the balance of copper.
Further defined, the transition metal element comprises the following components in percentage by mass: 10-99ppm of zirconium, 5-50ppm of lanthanum and 5-50ppm of yttrium.
Further limiting, the purities of the copper and the silver are respectively more than or equal to 99.999wt%, the purities of the zirconium are respectively more than or equal to 99.99wt%, and the purities of the lanthanum and the yttrium are respectively more than or equal to 99.95 wt%.
Further limited, the silver alloy is prepared from a copper-silver alloy, and the copper-silver alloy comprises the following components in percentage by mass: silver 1.0%, zirconium 30ppm, lanthanum 10ppm, zirconium 5ppm, and the balance copper.
The invention has the beneficial effects that: copper is used as a main raw material, silver is used as an auxiliary material, and a transition metal element is used for modification, so that crystal grains are refined, the compactness of the alloy is enhanced, and the oxidation resistance is improved.
The invention also provides a preparation method of the bonding copper-silver alloy wire, which comprises the following steps:
preparing a copper alloy ingot: uniformly mixing copper, silver, zirconium, lanthanum and yttrium, heating and melting under a vacuum condition, refining at 1300 ℃ for 25-40min under 1200-;
continuous casting: heating and melting the copper alloy cast ingot in an oxygen-free environment of 1.5-3kPa, and continuously casting the copper alloy cast ingot into a copper alloy bar with the diameter of 8.9-9.1mm after heat preservation, refining and degassing;
homogenizing heat treatment and aging heat treatment: heating the copper alloy bar to 700-800 ℃ at the heating rate of 12-17 ℃/min in an oxygen-free environment, preserving heat for 2-4h, cooling to 400-550 ℃ at the cooling rate of 8-15 ℃/min, preserving heat for 5-15h, and cooling to room temperature;
drawing and processing: repeatedly drawing the cooled copper alloy bar for multiple times to obtain a bonding copper-silver alloy wire with the diameter of 10-50 mu m;
and annealing the bonding copper-silver alloy wire in the inert gas atmosphere to obtain the bonding copper-silver alloy wire.
Further limiting, the annealing speed in the annealing treatment process is 1-3 m/s.
Further limiting, the annealing temperature in the annealing treatment process is 400-600 ℃, and the flow rate of the inert gas in the annealing treatment process is 2-10L/min.
Further limiting, in the homogenizing heat treatment and aging heat treatment processes, 5N nitrogen is adopted to keep an anaerobic environment, and the flow rate of the nitrogen is 3-5L/min;
the temperature during refining is 1250 ℃, the temperature of casting liquid during casting into ingots is 1050 ℃, the heating rate is 15 ℃/min, and the cooling rate is 10 ℃/min.
The invention has the beneficial effects that: the homogenization heat treatment and the aging heat treatment are added to the traditional process, so that the uniformity of the bonding copper-silver alloy wire is improved, and the uncontrollable performance of the bonding copper-silver alloy wire caused by harmful segregation is prevented; and the copper alloy ingot preparation, the continuous casting, the homogenization heat treatment and the aging heat treatment are all carried out under the vacuum condition and heat preservation refining is adopted in the continuous casting, so as to prevent the oxidation and the air hole inclusion of the metal.
By the preparation method, the prepared bonding copper-silver alloy wire has the following advantages:
(1) the strength is high: through the homogenization heat treatment and the aging heat treatment, silver is evenly precipitated in the copper matrix, and in the drawing process, the silver is gradually fiberized, so that the tensile strength of the bonding copper-silver alloy wire can reach more than 500MPa, the processing performance is better, the minimum diameter of the bonding copper-silver alloy wire can reach 10 mu m, the welding wire spacing is favorably shortened, and the method is more suitable for high-speed, high-density and laminated chip packaging.
(2) The oxidation resistance and the vulcanization performance are enhanced. By adding trace rare earth elements, a compact layer of 5-30nm is formed on the surface of the copper alloy, so that the corrosion resistance of elements such as O, S and the like can be effectively enhanced; the operation or processing conditions are wide, and the processing cost is reduced;
(3) the heat resistance is good. Compared with the common bonding copper wire, the recrystallization temperature is increased by 100-220 ℃, the heat affected zone is shorter, the cold and heat impact resistance is stronger, and the poor reliability of the package is greatly improved.
(4) High conductivity. The silver and the transition elements are distributed in a fibrous shape along the processing direction, so that the intensity of the bonding copper-silver alloy wire is improved, the blocking effect on current is reduced, the conductivity is better, and the bonding copper-silver alloy wire is more suitable for packaging semiconductors (such as high-power chips).
Drawings
FIG. 1 is a graph showing the results of a tensile test conducted on a bonded CuAg alloy wire obtained in examples 1 to 6 and a pure copper wire of a comparative example;
fig. 2 is a graph showing the results of an oxidation weight increase test performed on the bonded copper-silver alloy wires prepared in examples 1 to 6 and on the pure copper wires of comparative examples.
Detailed Description
In the following examples, "oxygen-free atmosphere" means an oxygen content of < 5ppm, and the oxygen-free atmosphere may be an atmosphere formed by continuously introducing 5N inert gas.
Example 1
The bonding copper-silver alloy wire of the embodiment comprises the following components in percentage by mass: 0.05% of Ag, 10ppm of Zr, 5ppm of La, 5ppm of Y and the balance of copper;
the preparation method of the bonding copper-silver alloy wire comprises the following steps:
s1, preparing a copper alloy ingot: uniformly mixing copper, silver, zirconium, lanthanum and yttrium according to mass percent, putting the mixture into a graphite crucible, and vacuumizing to 10 DEG-2Pa, medium-frequency induction heating to raise temperature and melt, refining at 1250 ℃ for 30min, mechanically stirring for 20min, cooling to 1050 ℃, casting into ingots, and preparing copper alloy cast ingots.
S2 vacuum continuous casting: and (3) placing the copper alloy ingot in a high vacuum continuous casting furnace, vacuumizing, injecting 5N nitrogen, controlling the pressure in the furnace to be 1.5-3kPa, performing medium-frequency induction heating melting, performing heat preservation refining, degassing, and continuously casting into a copper alloy bar with the thickness of 9 +/-0.1 mm.
S3 homogenization heat treatment and aging heat treatment: placing the copper alloy bar in a vacuum heat treatment furnace at room temperature, vacuumizing, injecting 5N nitrogen for protection, controlling the flow of nitrogen to be 3-5L/min, setting an automatic temperature-raising program, and performing homogenization heat treatment and aging heat treatment on the material. Wherein the heat treatment scheme is as follows: the heating rate is 15 ℃/min, the homogenization heat treatment temperature is 750 ℃, the heat preservation time is 2h, after the homogenization heat treatment is finished, the temperature is slowly reduced to 450 ℃ for aging heat treatment, the cooling rate is 10 ℃/min, the heat preservation time is 10h, after the heat treatment is finished, the copper alloy bar is quickly taken out, and the copper alloy bar is placed in ice water for cooling.
S4 drawing processing: and (3) carrying out multi-pass drawing on the copper alloy bar to obtain the bonding copper-silver alloy wire with the diameter of 15 mu m.
And S5 annealing the bonded copper-silver alloy wire: and annealing the copper-silver alloy wire in a nitrogen atmosphere to eliminate the internal stress generated by processing deformation, wherein the temperature range is 400 ℃, and the annealing speed is 2 m/s.
Example 2
The bonding copper-silver alloy wire of the embodiment comprises the following components in percentage by mass: 1.0% of Ag, 30ppm of Zr, 10ppm of La, 5ppm of Y and the balance of copper.
The manufacturing method of the bonding copper-silver alloy wire comprises the following steps:
s1, preparing a copper alloy ingot: uniformly mixing copper, silver, zirconium, lanthanum and yttrium according to mass percent, putting the mixture into a graphite crucible, and vacuumizing to 10 DEG-2Pa, medium-frequency induction heating to raise temperature and melt, refining at 1250 ℃ for 30min, mechanically stirring for 20min, cooling to 1050 ℃, casting into ingots, and preparing copper alloy cast ingots.
S2 vacuum continuous casting: and (3) placing the copper alloy ingot in a high vacuum continuous casting furnace, vacuumizing, injecting 5N nitrogen, controlling the pressure in the furnace to be 1.5-3kPa, performing medium-frequency induction heating melting, performing heat preservation refining, degassing, and continuously casting into a copper alloy bar with the thickness of 9 +/-0.1 mm.
S3 homogenization heat treatment and aging heat treatment: placing the copper alloy bar in a vacuum heat treatment furnace at room temperature, vacuumizing, injecting 5N nitrogen for protection, controlling the flow of nitrogen to be 3-5L/min, setting an automatic temperature-raising program, and performing homogenization heat treatment and aging heat treatment on the material. Wherein the heat treatment scheme is as follows: the heating rate is 15 ℃/min, the homogenization heat treatment temperature is 750 ℃, the heat preservation time is 3h, after the homogenization heat treatment is finished, the temperature is slowly reduced to 450 ℃ for aging heat treatment, the cooling rate is 10 ℃/min, the heat preservation time is 9h, after the heat treatment is finished, the copper alloy bar is quickly taken out, and the copper alloy bar is placed in ice water for cooling.
S4 drawing processing: and (3) carrying out multi-pass drawing on the copper alloy bar to obtain the bonding copper-silver alloy wire with the diameter of 15 mu m.
And S5 annealing of the bonded copper-silver alloy wire: and annealing the bonding copper-silver alloy wire material in a nitrogen atmosphere to eliminate the internal stress generated by processing deformation, wherein the temperature is 500 ℃, and the annealing speed is 2 m/s.
Example 3
The bonding copper-silver alloy wire of the embodiment comprises the following components in percentage by mass: 2.0% of Ag, 50ppm of Zr, 5ppm of La, 10ppm of Y and the balance of copper.
The manufacturing method of the bonding copper-silver alloy wire comprises the following steps:
s1, preparing a copper alloy ingot: uniformly mixing copper, silver, zirconium, lanthanum and yttrium according to mass percent, putting the mixture into a graphite crucible, and vacuumizing to 10 DEG-2Pa, medium-frequency induction heating to raise temperature and melt, refining at 1250 ℃ for 30min, mechanically stirring for 20min, cooling to 1050 ℃, casting into ingots, and preparing copper alloy cast ingots.
S2 vacuum continuous casting: and (3) placing the copper alloy ingot in a high vacuum continuous casting furnace, vacuumizing, injecting 5N nitrogen, controlling the pressure in the furnace to be 1.5-3kPa, performing medium-frequency induction heating melting, performing heat preservation refining, degassing, and continuously casting into a copper alloy bar with the thickness of 9 +/-0.1 mm.
S3 homogenization heat treatment and aging heat treatment: placing the copper alloy bar in a vacuum heat treatment furnace at room temperature, vacuumizing, injecting 5N nitrogen for protection, controlling the flow of nitrogen to be 3-5L/min, setting an automatic temperature-raising program, and performing homogenization heat treatment and aging heat treatment on the material. Wherein the heat treatment scheme is as follows: the heating rate is 15 ℃/min, the homogenization heat treatment temperature is 750 ℃, the heat preservation time is 3h, after the homogenization heat treatment is finished, the temperature is slowly reduced to 450 ℃ for aging heat treatment, the cooling rate is 10 ℃/min, the heat preservation time is 8h, after the heat treatment is finished, the copper alloy bar is quickly taken out, and the copper alloy bar is placed in ice water for cooling.
S4 drawing processing: and (3) carrying out multi-pass drawing on the copper alloy bar to obtain the bonding copper-silver alloy wire with the diameter of 15 mu m.
And S5 annealing the bonded copper-silver alloy wire: and annealing the bonding copper-silver alloy wire in a nitrogen atmosphere to eliminate the internal stress generated by processing deformation, wherein the temperature is 600 ℃, and the annealing speed is 2 m/s.
Example 4
The bonding copper-silver alloy wire of the embodiment comprises the following components in percentage by mass: 3.0% of Ag, 50ppm of Zr, 30ppm of La, 10ppm of Y and the balance of copper.
The manufacturing method of the bonding copper-silver alloy wire comprises the following steps:
s1, preparing a copper alloy ingot: uniformly mixing copper, silver, zirconium, lanthanum and yttrium according to mass percent, putting the mixture into a graphite crucible, and vacuumizing to 10 DEG-2Pa, medium-frequency induction heating to raise temperature and melt, refining at 1250 ℃ for 30min, mechanically stirring for 20min, cooling to 1050 ℃, casting into ingots, and preparing copper alloy cast ingots.
S2 vacuum continuous casting: and (3) placing the copper alloy ingot in a high vacuum continuous casting furnace, vacuumizing, injecting 5N nitrogen, controlling the pressure in the furnace to be 1.5-3kPa, performing medium-frequency induction heating melting, performing heat preservation refining, degassing, and continuously casting into a copper alloy bar with the thickness of 9 +/-0.1 mm.
S3 homogenization heat treatment and aging heat treatment: placing the copper alloy bar in a vacuum heat treatment furnace at room temperature, vacuumizing, injecting 5N nitrogen for protection, controlling the flow of nitrogen to be 3-5L/min, setting an automatic temperature-raising program, and performing homogenization heat treatment and aging heat treatment on the material. Wherein the heat treatment scheme is as follows: the heating rate is 15 ℃/min, the homogenization heat treatment temperature is 700 ℃, the heat preservation time is 5h, after the homogenization heat treatment is finished, the temperature is slowly reduced to 450 ℃ for aging heat treatment, the cooling rate is 10 ℃/min, the heat preservation time is 7h, after the heat treatment is finished, the copper alloy bar is quickly taken out, and the copper alloy bar is placed in ice water for cooling.
S4 drawing processing: and (3) carrying out multi-pass drawing on the copper alloy bar to obtain the bonding copper alloy wire with the diameter of 10 mu m.
And S5 annealing the bonded copper-silver alloy wire: and annealing the bonding copper-silver alloy wire in a nitrogen atmosphere to eliminate the internal stress generated by processing deformation, wherein the temperature range is 400 ℃, and the annealing speed is 2 m/s.
Example 5
The bonding copper-silver alloy wire of the embodiment comprises the following components in percentage by mass: 4.0% of Ag, 99ppm of Zr, 5ppm of La, 50ppm of Y and the balance of copper.
The manufacturing method of the bonding copper-silver alloy wire comprises the following steps:
s1, preparing a copper alloy ingot: uniformly mixing copper, silver, zirconium, lanthanum and yttrium according to mass percent, putting the mixture into a graphite crucible, vacuumizing to 10-2Pa, performing medium-frequency induction heating to heat and melt the mixture, refining at 1250 ℃ for 30min, mechanically stirring for 20min, cooling to 1050 ℃, casting into ingots, and preparing the copper alloy ingots.
S2 vacuum continuous casting: and (3) placing the copper alloy ingot in a high vacuum continuous casting furnace, vacuumizing, injecting 5N nitrogen, controlling the pressure in the furnace to be 1.5-3kPa, performing medium-frequency induction heating melting, performing heat preservation refining, degassing, and continuously casting into a copper alloy bar with the thickness of 9 +/-0.1 mm.
S3 homogenization heat treatment and aging heat treatment: placing the copper alloy bar in a vacuum heat treatment furnace at room temperature, vacuumizing, injecting 5N nitrogen for protection, controlling the nitrogen flow to be 3-5L/min, setting an automatic temperature rise program, and carrying out homogenization and aging heat treatment on the material. Wherein the heat treatment scheme is as follows: the heating rate is 15 ℃/min, the homogenization heat treatment temperature is 700 ℃, the heat preservation time is 2h, after the homogenization heat treatment is finished, the temperature is slowly reduced to 450 ℃ for aging heat treatment, the cooling rate is 10 ℃/min, the heat preservation time is 6h, after the heat treatment is finished, the copper alloy bar is quickly taken out, and the copper alloy bar is placed in ice water for cooling.
S4 drawing processing: and (3) carrying out multi-pass drawing on the copper alloy bar to obtain the bonding copper-silver alloy wire with the diameter of 15 mu m.
And S5 annealing the bonded copper-silver alloy wire: and annealing the bonding copper-silver alloy wire in a nitrogen atmosphere to eliminate the internal stress generated by processing deformation, wherein the temperature range is 500 ℃, and the annealing speed is 2 m/s.
Example 6
The bonding copper-silver alloy wire of the embodiment comprises the following components in percentage by mass: 5.0% of Ag, 99ppm of Zr, 50ppm of La, 5ppm of Y and the balance of copper.
The manufacturing method of the bonding copper-silver alloy wire comprises the following steps:
s1, preparing a copper alloy ingot: uniformly mixing copper, silver, zirconium, lanthanum and yttrium according to mass percent, putting the mixture into a graphite crucible, and vacuumizing to 10 DEG-2Pa, medium-frequency induction heating to raise temperature and melt, refining at 1250 ℃ for 30min, mechanically stirring for 20min, cooling to 1050 ℃, casting into ingots, and preparing copper alloy cast ingots.
S2 vacuum continuous casting: and (3) placing the copper alloy ingot in a high vacuum continuous casting furnace, vacuumizing, injecting 5N nitrogen, controlling the pressure in the furnace to be 1.5-3kPa, performing medium-frequency induction heating melting, performing heat preservation refining, degassing, and continuously casting into a copper alloy bar with the thickness of 9 +/-0.1 mm.
S3 homogenization heat treatment and aging heat treatment: placing the copper alloy bar in a vacuum heat treatment furnace at room temperature, vacuumizing, injecting 5N nitrogen for protection, controlling the nitrogen flow to be 3-5L/min, setting an automatic temperature rise program, and carrying out homogenization and aging heat treatment on the material. Wherein the heat treatment scheme is as follows: the heating rate is 15 ℃/min, the homogenization heat treatment temperature is 700 ℃, the heat preservation time is 2h, after the homogenization heat treatment is finished, the temperature is slowly reduced to 450 ℃ for aging heat treatment, the cooling rate is 10 ℃/min, the heat preservation time is 5h, after the heat treatment is finished, the copper alloy bar is quickly taken out, and the copper alloy bar is placed in ice water for cooling.
S4 drawing processing: and (3) carrying out multi-pass drawing on the copper alloy bar to obtain the bonding copper-silver alloy wire with the diameter of 15 mu m.
And S5 annealing the bonded copper-silver alloy wire: and annealing the bonding copper-silver alloy wire in a nitrogen atmosphere to eliminate the internal stress generated by processing deformation, wherein the temperature is 600 ℃, and the annealing speed is 2 m/s.
Comparative example
The bonding copper wire is prepared from pure copper on the market.
The performance of the bonding copper-silver alloy wires prepared in examples 1 to 6 and the bonding copper prepared in the comparative example was tested, and the test method and the test results were as follows:
1. tensile test
The difference in mechanical properties between examples 1-6 and the pure copper wire (comparative example) is mainly the difference in tensile strength. Tensile strength conditions corresponding to different processing deformation amounts were measured by using a tensile testing machine (the processing deformation amounts were true strains ln (a0/a), a and a0 are cross-sectional areas of the wire before and after deformation), and the results are shown in fig. 1;
as can be seen from fig. 1, the bonded cu-ag alloy wires prepared in examples 1 to 6 all had tensile strengths exceeding 500MPa when the true strain reached 12, wherein the tensile strength of the bonded cu-ag alloy wire of example 6 reached about 1.6 Gpa; and under the same deformation condition, the tensile strength of the pure copper wire is less than 400 MPa.
2. Oxidation weight gain test
The oxidation resistance of the material was measured by measuring the weight change of the pure copper wire (comparative example) and the bonded copper-silver alloy wires described in examples 1 to 6 before and after the test, respectively, by an oxidation weight increase test. The protocol is shown in (Table 1) and the results are shown in FIG. 2.
TABLE 1
| Testing instrument | Ordinary |
| Test conditions | |
| 40±1℃ | |
| Amount of material used | 15g of wire rod with diameter of 0.5mm |
| Measuring instrument | Precision balance (precision 0.1 mg) |
| Test period | 7*24h |
The bonding copper-silver alloy wire prepared in the embodiment 6 only increases the weight by 0.80g in 7 days of the test, and the oxidation resistance is greatly improved compared with that of 3.57g of a pure copper wire.
As can be seen from fig. 2, the oxidation weight gain of the pure copper wire is obvious in the experimental process, and the weight gain of the bonded copper-silver alloy wire prepared in examples 1 to 6 before and after the experiment is not obvious, so that the oxidation resistance is better.
3. Reliability test
For 7 groups of samples, namely pure copper wires and the bonding copper-silver alloy wires prepared in the embodiments 1 to 6, packaging is carried out in a TQFP packaging mode, the number of leads contained in each chip is 144, and after the packaging, high and low temperature cycle tests (TC tests) are carried out on the chips, and the test results are shown in Table 2.
TABLE 2
| Sample set | Number of cycles tested |
| Pure copper wire | 150 |
| Example 1 | 350 |
| Example 2 | 650 |
| Example 3 | 700 |
| Example 4 | 750 |
| Example 5 | 750 |
| Example 6 | 800 |
As can be seen from table 2, the reliability of the bonded cu-ag alloy wires prepared in examples 1 to 6 is significantly better than that of the pure copper wires, the chips of the pure copper wires used all failed after 150 cycles, while the chips of the bonded cu-ag alloy wires prepared in examples 1 to 6 used all exceeded 350 cycles, and the reliability was much higher than that of the pure copper wires.
Finally, it should be noted that: the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The bonding copper-silver alloy wire is characterized by being prepared from a copper-silver alloy, wherein the copper-silver alloy comprises the following components in percentage by mass: 0.05 to 5 percent of silver, 20 to 199ppm of transition metal element and the balance of copper.
2. The bonded copper-silver alloy wire according to claim 1, wherein the transition metal element comprises the following components in mass percent: 10-99ppm of zirconium, 5-50ppm of lanthanum and 5-50ppm of yttrium.
3. The bonded copper-silver alloy wire of claim 2, wherein the purity of both copper and silver is greater than or equal to 99.999wt%, the purity of zirconium is greater than or equal to 99.99wt%, and the purity of lanthanum and yttrium is greater than or equal to 99.95 wt%.
4. The bonded copper-silver alloy wire according to claim 2, comprising the copper-silver alloy, wherein the copper-silver alloy comprises the following components in percentage by mass: silver 1.0%, zirconium 30ppm, lanthanum 10ppm, zirconium 5ppm, and the balance copper.
5. The preparation method of the bonding copper-silver alloy wire is characterized by comprising the following steps of:
preparing a copper alloy ingot: uniformly mixing copper, silver, zirconium, lanthanum and yttrium, heating and melting under a vacuum condition, refining at 1300 ℃ for 25-40min under 1200-;
continuous casting: heating and melting the copper alloy cast ingot in an oxygen-free environment of 1.5-3kPa, and continuously casting the copper alloy cast ingot into a copper alloy bar with the diameter of 8.9-9.1mm after heat preservation, refining and degassing;
homogenizing heat treatment and aging heat treatment: heating the copper alloy bar to 700-800 ℃ at the heating rate of 12-17 ℃/min in an oxygen-free environment, preserving heat for 2-4h, cooling to 400-550 ℃ at the cooling rate of 8-15 ℃/min, preserving heat for 5-15h, and cooling to room temperature;
drawing and processing: repeatedly drawing the cooled copper alloy bar for multiple times to obtain a bonding copper-silver alloy wire with the diameter of 10-50 mu m;
and annealing the bonding copper-silver alloy wire in the inert gas atmosphere to obtain the bonding copper-silver alloy wire.
6. The production method according to claim 5, wherein the annealing rate during the annealing treatment is 1 to 3 m/s.
7. The method according to claim 5 or 6, wherein the annealing temperature during the annealing treatment is 400-600 ℃, and the flow rate of the inert gas during the annealing treatment is 2-10L/min.
8. The preparation method according to claim 5, characterized in that in the homogenizing heat treatment and aging heat treatment, 5N inert gas is continuously introduced to maintain an oxygen-free environment, and the gas flow is controlled to be 3-5L/min;
the temperature during refining is 1250 ℃, the temperature of casting liquid during casting into ingots is 1050 ℃, the heating rate is 15 ℃/min, and the cooling rate is 10 ℃/min.
9. A bonded copper-silver alloy wire produced by the production method described in any one of claims 5 to 8.
10. Use of the bonded copper-silver alloy wire according to any one of claims 1 to 4 or the bonded copper-silver alloy wire prepared by the preparation method according to any one of claims 5 to 8 in the field of semiconductor packaging.
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| CN115341118A (en) * | 2022-08-19 | 2022-11-15 | 河北临泰电子科技有限公司 | High-reliability copper bonding wire for electronic packaging and preparation method thereof |
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