CN114250381A - High-conductivity copper-silver alloy wire material and preparation method thereof - Google Patents
High-conductivity copper-silver alloy wire material and preparation method thereof Download PDFInfo
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- CN114250381A CN114250381A CN202111572484.3A CN202111572484A CN114250381A CN 114250381 A CN114250381 A CN 114250381A CN 202111572484 A CN202111572484 A CN 202111572484A CN 114250381 A CN114250381 A CN 114250381A
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- copper
- silver
- silver alloy
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/0075—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for rods of limited length
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Abstract
The invention discloses a high-conductivity copper-silver alloy wire material and a preparation method thereof, and relates to the technical field of copper-silver alloy, wherein the high-conductivity copper-silver alloy wire material comprises the following raw material components in percentage by weight: 1 to 3 weight percent of silver, 0.001 to 0.04 weight percent of rare earth element and the balance of copper. The high-conductivity copper-silver alloy wire material provided by the invention has the advantages that the proportion of copper, silver and rare earth elements in the raw material components is reasonable, the gas content is low, the inclusion is less, the tissue components are uniform, macroscopic and microscopic defects such as Cu and Ag enrichment are avoided, and the high-conductivity copper-silver alloy wire material not only has high conductivity, but also has high strength.
Description
Technical Field
The invention relates to the technical field of copper-silver alloy, in particular to a high-conductivity copper-silver alloy wire material and a preparation method thereof.
Background
The copper-silver alloy has good prospects in large-scale industrial preparation and application due to stable and abundant raw material properties, huge electric conduction, high magnetic resistance effect and special physical properties. The copper-silver material has both high electrical conductivity and high magnetic permeability, and can inhibit or weaken an electric field and a magnetic field at the same time, and control radiation propagation of electromagnetic waves from one region to another region.
However, the existing copper-silver alloy material has the problems that the fusion between different elements is poor, the burning loss is easy to occur, and the alloy ingot has the macroscopic defects of inclusion, shrinkage, looseness and the like, so that the application requirement cannot be met.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the high-conductivity copper-silver alloy wire material and the preparation method thereof.
The high-conductivity copper-silver alloy wire material comprises the following raw material components in percentage by weight: 1 to 3 weight percent of silver, 0.001 to 0.04 weight percent of rare earth element and the balance of copper.
Preferably, the rare earth element is one or more of La and Ce.
Further preferably, the weight part ratio of La to Ce is 1: 1.
still further preferably, the high-conductivity copper-silver alloy wire material is composed of the following raw material components in percentage by weight: 2 wt% of silver, 0.02 wt% of rare earth element and the balance of copper.
Preferably, the silver is high-purity silver with the purity of more than or equal to 99.9990 percent.
Preferably, the copper is electrolytic copper with the purity of more than or equal to 99.9990%.
The invention also aims to protect the preparation method of the high-conductivity copper-silver alloy wire material, which comprises the following steps:
s1, weighing raw materials: weighing silver, rare earth elements and copper for later use;
s2, electric arc melting: putting the weighed silver, rare earth elements and copper into an electric arc melting furnace, melting by adopting an electric arc gun, uniformly stirring, and cooling by water to obtain a copper-silver intermediate alloy ingot;
s3, hot forging: carrying out heat preservation on the copper-silver intermediate alloy ingot, carrying out hot forging to a round rod shape by adopting an air hammer, and turning to obtain a copper-silver alloy rod;
s4, stress relief annealing: carrying out heat preservation on the copper-silver alloy rod to eliminate residual thermal stress generated in hot forging to obtain a copper-silver alloy rod subjected to stress relief annealing;
s5, drawing and forming: drawing the copper-silver alloy rod on a drawing machine;
s6, intermediate annealing: carrying out heat preservation to promote solid solution elements in copper and silver phases to be separated out, and preparing the alloy wire after intermediate annealing;
s7, continuously drawing: and drawing the annealed alloy wire on a wire drawing machine to obtain the high-conductivity copper-silver alloy wire material.
Preferably, in step S3, the heat preservation is 750-900 ℃ for 1-2 hours, and the diameter of the copper-silver alloy rod is 10 mm.
Preferably, in step S4, the heat preservation is 500 ℃ for 4-5 h; in step S6, the heat preservation is 400-600 ℃ for 0.5-2 hours.
Preferably, in step S5, the number of drawing is 6-17; in step S7, the number of drawing is 6-17.
The invention has the beneficial effects that:
(1) the high-conductivity copper-silver alloy wire material provided by the invention has the advantages that the proportion of copper, silver and rare earth elements in the raw material components is reasonable, the gas content is low, the inclusion is less, the tissue components are uniform, macroscopic and microscopic defects such as Cu and Ag enrichment are avoided, and the high-conductivity copper-silver alloy wire material not only has high conductivity, but also has high strength.
(2) The preparation method of the high-conductivity copper-silver alloy wire material provided by the invention has the advantages of easily available raw materials, stable technology, excellent performance of the prepared product and great commercial value.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.
It is to be noted that, unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the invention pertains.
Example 1
The embodiment provides a high-conductivity copper-silver alloy wire material which comprises the following raw material components in percentage by weight: 2 wt% of silver, 0.02 wt% of rare earth element and the balance of copper.
Wherein, the rare earth elements are La and Ce, and the weight part ratio of the La to the Ce is 1: 1;
the silver is high-purity silver with the purity of more than or equal to 99.9990 percent; the copper is electrolytic copper with the purity of more than or equal to 99.9990 percent.
The preparation method of the high-conductivity copper-silver alloy wire material comprises the following steps:
s1, weighing raw materials: weighing silver, rare earth elements and copper for later use;
s2, electric arc melting: putting the weighed silver, rare earth elements and copper into an electric arc melting furnace, melting by adopting an electric arc gun, uniformly stirring, and cooling by water to obtain a copper-silver intermediate alloy ingot;
s3, hot forging: carrying out heat preservation on the copper-silver intermediate alloy ingot, carrying out hot forging to a round rod shape by adopting an air hammer, and turning to obtain a copper-silver alloy rod;
s4, stress relief annealing: carrying out heat preservation on the copper-silver alloy rod to eliminate residual thermal stress generated in hot forging to obtain a copper-silver alloy rod subjected to stress relief annealing;
s5, drawing and forming: drawing the copper-silver alloy rod on a drawing machine;
s6, intermediate annealing: carrying out heat preservation to promote solid solution elements in copper and silver phases to be separated out, and preparing the alloy wire after intermediate annealing;
s7, continuously drawing: and drawing the annealed alloy wire on a wire drawing machine to obtain the high-conductivity copper-silver alloy wire material.
In step S3, the temperature is maintained at 900 ℃ for 1.5 hours, and the diameter of the copper-silver alloy rod is 10 mm.
In step S4, the temperature is maintained at 500 ℃ for 4.5 h.
In step S5, the number of times of drawing is 10.
In step S6, the temperature is maintained at 500 ℃ for 1 hour.
In step S7, the number of drawing times was 10, and the diameter of the highly conductive copper-silver alloy wire material was 0.5 mm.
Example 2
The embodiment provides a high-conductivity copper-silver alloy wire material which comprises the following raw material components in percentage by weight: 1 wt% of silver, 0.015 wt% of rare earth element and the balance of copper.
Wherein, the rare earth elements are La and Ce, and the weight part ratio of the La to the Ce is 1: 1;
the silver is high-purity silver with the purity of more than or equal to 99.9990 percent; the copper is electrolytic copper with the purity of more than or equal to 99.9990 percent.
The preparation method of the high-conductivity copper-silver alloy wire material comprises the following steps:
s1, weighing raw materials: weighing silver, rare earth elements and copper for later use;
s2, electric arc melting: putting the weighed silver, rare earth elements and copper into an electric arc melting furnace, melting by adopting an electric arc gun, uniformly stirring, and cooling by water to obtain a copper-silver intermediate alloy ingot;
s3, hot forging: carrying out heat preservation on the copper-silver intermediate alloy ingot, carrying out hot forging to a round rod shape by adopting an air hammer, and turning to obtain a copper-silver alloy rod;
s4, stress relief annealing: carrying out heat preservation on the copper-silver alloy rod to eliminate residual thermal stress generated in hot forging to obtain a copper-silver alloy rod subjected to stress relief annealing;
s5, drawing and forming: drawing the copper-silver alloy rod on a drawing machine;
s6, intermediate annealing: carrying out heat preservation to promote solid solution elements in copper and silver phases to be separated out, and preparing the alloy wire after intermediate annealing;
s7, continuously drawing: and drawing the annealed alloy wire on a wire drawing machine to obtain the high-conductivity copper-silver alloy wire material.
In step S3, the temperature is maintained at 900 ℃ for 1.5 hours, and the diameter of the copper-silver alloy rod is 10 mm.
In step S4, the temperature is maintained at 500 ℃ for 4.5 h.
In step S5, the number of times of drawing is 10.
In step S6, the temperature is maintained at 500 ℃ for 1 hour.
In step S7, the number of drawing times was 10, and the diameter of the highly conductive copper-silver alloy wire material was 0.5 mm.
Example 3
The embodiment provides a high-conductivity copper-silver alloy wire material which comprises the following raw material components in percentage by weight: 3 wt% of silver, 0.025 wt% of rare earth element and the balance of copper.
Wherein, the rare earth elements are La and Ce, and the weight part ratio of the La to the Ce is 1: 1;
the silver is high-purity silver with the purity of more than or equal to 99.9990 percent; the copper is electrolytic copper with the purity of more than or equal to 99.9990 percent.
The preparation method of the high-conductivity copper-silver alloy wire material comprises the following steps:
s1, weighing raw materials: weighing silver, rare earth elements and copper for later use;
s2, electric arc melting: putting the weighed silver, rare earth elements and copper into an electric arc melting furnace, melting by adopting an electric arc gun, uniformly stirring, and cooling by water to obtain a copper-silver intermediate alloy ingot;
s3, hot forging: carrying out heat preservation on the copper-silver intermediate alloy ingot, carrying out hot forging to a round rod shape by adopting an air hammer, and turning to obtain a copper-silver alloy rod;
s4, stress relief annealing: carrying out heat preservation on the copper-silver alloy rod to eliminate residual thermal stress generated in hot forging to obtain a copper-silver alloy rod subjected to stress relief annealing;
s5, drawing and forming: drawing the copper-silver alloy rod on a drawing machine;
s6, intermediate annealing: carrying out heat preservation to promote solid solution elements in copper and silver phases to be separated out, and preparing the alloy wire after intermediate annealing;
s7, continuously drawing: and drawing the annealed alloy wire on a wire drawing machine to obtain the high-conductivity copper-silver alloy wire material.
In step S3, the temperature is maintained at 900 ℃ for 1.5 hours, and the diameter of the copper-silver alloy rod is 10 mm.
In step S4, the temperature is maintained at 500 ℃ for 4.5 h.
In step S5, the number of times of drawing is 10.
In step S6, the temperature is maintained at 500 ℃ for 1 hour.
In step S7, the number of drawing times was 10, and the diameter of the highly conductive copper-silver alloy wire material was 0.5 mm.
Test examples
The high conductive copper-silver alloy wire material obtained in example 1 was tested for conductivity, strength and elongation, and the results are shown in table 1.
TABLE 1
From table 1, it can be seen that the tensile strength of the high-conductivity copper-silver alloy wire material prepared in example 1 of the present invention can reach up to 900MPa, the elongation thereof is 5%, and the conductivity thereof is 50% IACS.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention, and they should be construed as being included in the following claims and description.
Claims (10)
1. A high-conductivity copper-silver alloy wire material is characterized in that: the high-conductivity copper-silver alloy wire material comprises the following raw material components in percentage by weight: 1 to 3 weight percent of silver, 0.001 to 0.04 weight percent of rare earth element and the balance of copper.
2. The high-conductivity copper-silver alloy wire material according to claim 1, characterized in that: the rare earth element is one or more of La and Ce.
3. The high-conductivity copper-silver alloy wire material according to claim 2, characterized in that: the weight part ratio of the La to the Ce is 1: 1.
4. the high-conductivity copper-silver alloy wire material according to claim 3, characterized in that: the high-conductivity copper-silver alloy wire material comprises the following raw material components in percentage by weight: 2 wt% of silver, 0.02 wt% of rare earth element and the balance of copper.
5. The high-conductivity copper-silver alloy wire material according to claim 1, characterized in that: the silver is high-purity silver with the purity of more than or equal to 99.9990 percent.
6. The high-conductivity copper-silver alloy wire material according to claim 1, characterized in that: the copper is electrolytic copper with the purity of more than or equal to 99.9990 percent.
7. The method for preparing a high-conductivity copper-silver alloy wire material as recited in any one of claims 1 to 6, wherein: the preparation method comprises the following steps:
s1, weighing raw materials: weighing silver, rare earth elements and copper for later use;
s2, electric arc melting: putting the weighed silver, rare earth elements and copper into an electric arc melting furnace, melting by adopting an electric arc gun, uniformly stirring, and cooling by water to obtain a copper-silver intermediate alloy ingot;
s3, hot forging: carrying out heat preservation on the copper-silver intermediate alloy ingot, carrying out hot forging to a round rod shape by adopting an air hammer, and turning to obtain a copper-silver alloy rod;
s4, stress relief annealing: carrying out heat preservation on the copper-silver alloy rod to eliminate residual thermal stress generated in hot forging to obtain a copper-silver alloy rod subjected to stress relief annealing;
s5, drawing and forming: drawing the copper-silver alloy rod on a drawing machine;
s6, intermediate annealing: carrying out heat preservation to promote solid solution elements in copper and silver phases to be separated out, and preparing the alloy wire after intermediate annealing;
s7, continuously drawing: and drawing the annealed alloy wire on a wire drawing machine to obtain the high-conductivity copper-silver alloy wire material.
8. The method for preparing the high-conductivity copper-silver alloy wire material according to claim 7, wherein the method comprises the following steps: in step S3, the temperature is 750-900 ℃ for 1-2 hours, and the diameter of the copper-silver alloy rod is 10 mm.
9. The method for preparing the high-conductivity copper-silver alloy wire material according to claim 7, wherein the method comprises the following steps: in the step S4, the heat preservation is carried out for 4-5h at the temperature of 500 ℃; in step S6, the heat preservation is 400-600 ℃ for 0.5-2 hours.
10. The method for preparing the high-conductivity copper-silver alloy wire material according to claim 7, wherein the method comprises the following steps: in step S5, the drawing times are 6-17; in step S7, the number of drawing is 6-17.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130140084A1 (en) * | 2011-12-01 | 2013-06-06 | Heraeus Materials Technology Gmbh & Co. Kg | Alloyed 2N Copper Wires for Bonding in Microelectronics Devices |
| CN113549785A (en) * | 2021-07-27 | 2021-10-26 | 四川威纳尔特种电子材料有限公司 | Bonding copper-silver alloy wire and preparation method and application thereof |
-
2021
- 2021-12-21 CN CN202111572484.3A patent/CN114250381A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130140084A1 (en) * | 2011-12-01 | 2013-06-06 | Heraeus Materials Technology Gmbh & Co. Kg | Alloyed 2N Copper Wires for Bonding in Microelectronics Devices |
| CN113549785A (en) * | 2021-07-27 | 2021-10-26 | 四川威纳尔特种电子材料有限公司 | Bonding copper-silver alloy wire and preparation method and application thereof |
Non-Patent Citations (3)
| Title |
|---|
| 王浩伟，顾剑锋，董湘怀: "《材料加工原理 下》", 31 May 2019 * |
| 邢焰，王向轲编著: "《国之重器出版工程 航天器材料》", 31 May 2018 * |
| 陈金龙，高铁男编；蔡训织绘: "《工科化学教材改革专辑 工程机械介绍 第4辑》", 30 June 1992 * |
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Application publication date: 20220329 |