JPH06279894A - Copper alloy excellent in strength and electrical conductivity - Google Patents

Copper alloy excellent in strength and electrical conductivity

Info

Publication number
JPH06279894A
JPH06279894A JP5090832A JP9083293A JPH06279894A JP H06279894 A JPH06279894 A JP H06279894A JP 5090832 A JP5090832 A JP 5090832A JP 9083293 A JP9083293 A JP 9083293A JP H06279894 A JPH06279894 A JP H06279894A
Authority
JP
Japan
Prior art keywords
copper alloy
strength
subjected
copper
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5090832A
Other languages
Japanese (ja)
Other versions
JP3407054B2 (en
Inventor
Tokukazu Ishida
徳和 石田
Yoshiharu Mae
義治 前
Hitoshi Wada
仁 和田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
National Research Institute for Metals
Original Assignee
Mitsubishi Materials Corp
National Research Institute for Metals
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp, National Research Institute for Metals filed Critical Mitsubishi Materials Corp
Priority to JP09083293A priority Critical patent/JP3407054B2/en
Publication of JPH06279894A publication Critical patent/JPH06279894A/en
Application granted granted Critical
Publication of JP3407054B2 publication Critical patent/JP3407054B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PURPOSE:To obtain a copper allay excellent in strength and electrical conductivity and usable for the electrically conductive material of an ultrastrong magnetic field generating device by incorporating specified amounts of Ag and Cr into Cu and specifying its structure. CONSTITUTION:This copper alloy has a compsn. contg., by weight, 8.0 to 20.0% Ag and 0.1 to 1.0% Cr, and the balance Cu and has a structure in which the fine precipitates of Cr are dispersed into the basis in which primary crystals and eutectic crystals are fibrously oriented. Concerning this alloy, molten metal obtd. by melting electrolytic copper in an inert gas is added with Ag and Cr to regulate the componental compsn., which is cast to obtain an ingot. This ingot is subjected to hot forging at 600 to 700 deg.C or is subjected to hot rolling, is thereafter subjected to solution treatment and is furthermore repeatedly subjected to cold processing and aging treatment, by which the copper alloy is produced.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、超強磁場発生装置の
導電材料に用いられる強度および導電性に優れた銅合金
に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper alloy having excellent strength and conductivity which is used as a conductive material for a super strong magnetic field generator.

【0002】[0002]

【従来の技術】従来、超強磁場を発生せしめるマグネッ
トに用いられる導電材料は強磁場により発生する強い電
磁力に抗しうる強度および大電流を流してもジュール熱
発生の少ない高導電特性を有する材料が要求されてい
る。
2. Description of the Related Art Conventionally, a conductive material used for a magnet for generating a super strong magnetic field has a strength capable of withstanding a strong electromagnetic force generated by a strong magnetic field and a high conductive characteristic that a Joule heat is hardly generated even when a large current is applied. Material is required.

【0003】かかる材料として、近年、Ag:2〜60
重量%、残部:CuからなるAg含有銅合金が提案され
ている(例えば、日本金属学会誌 第55巻 第12号
(1991) P1382〜1391参照)。
As such a material, in recent years, Ag: 2 to 60
An Ag-containing copper alloy composed of weight% and balance: Cu has been proposed (see, for example, Journal of the Japan Institute of Metals, Vol. 55, No. 12 (1991) P1382-1391).

【0004】[0004]

【発明が解決しようとする課題】しかし、前記従来のA
g含有銅合金は、80T以上の強磁場発生時に生じる応
力に対して十分に耐えうる強度を有するものではなく、
なお一層優れた強度および導電性を有する銅合金が求め
られていた。
However, the conventional A
The g-containing copper alloy does not have sufficient strength to withstand the stress generated when a strong magnetic field of 80 T or more is generated,
There has been a demand for copper alloys having even higher strength and conductivity.

【0005】[0005]

【課題を解決するための手段】そこで、本発明者らは、
従来よりも高強度でかつ高導電性を有する銅合金を得る
べく研究を行った結果、Ag:8.0〜20.0重量
%、Cr:0.1〜1.0重量%を含有し、残りがCu
および不可避不純物からなる組成を有する銅合金鋳塊を
冷間加工と時効を繰り返すことにより得られた初晶およ
び共晶の2相が繊維状に配向した素地中にCrの微細な
析出物が分散している組織を有する銅合金は、前記従来
のAg含有銅合金に比べて強度および硬さが大幅に向上
するだけでなく、さらにその半軟化温度(加工材を1時
間焼鈍した時の強度が焼鈍しない加工材の強度の1/2
になる焼鈍温度)が高くなり耐熱性が向上するという知
見を得たのである。
Therefore, the present inventors have
As a result of research to obtain a copper alloy having higher strength and higher conductivity than before, Ag: 8.0 to 20.0 wt%, Cr: 0.1 to 1.0 wt% are contained, The rest is Cu
Fine precipitates of Cr are dispersed in a matrix having primary and eutectic two-phase fibrous orientation obtained by repeating cold working and aging of a copper alloy ingot having a composition of unavoidable impurities The copper alloy having a microstructure not only has a significantly improved strength and hardness as compared with the conventional Ag-containing copper alloy, but also has a semi-softening temperature (the strength when the worked material is annealed for 1 hour is 1/2 the strength of non-annealed material
It has been found that the annealing temperature) becomes higher and the heat resistance is improved.

【0006】この発明は、かかる知見にもとづいてなさ
れたものであって、Ag:8.0〜20.0重量%、C
r:0.1〜1.0重量%を含有し、残りがCuおよび
不可避不純物からなる組成、並びに初晶および共晶が繊
維状に配向した素地中にCrの微細な析出物が分散して
いる組織を有する強度および導電性に優れた銅合金、に
特徴を有するものである。
The present invention has been made on the basis of such knowledge, and Ag: 8.0 to 20.0% by weight, C
r: 0.1 to 1.0% by weight, the balance consisting of Cu and unavoidable impurities, and fine precipitates of Cr dispersed in a base material in which primary crystals and eutectics are oriented in a fibrous state. It is characterized by a copper alloy having a strong texture and excellent conductivity.

【0007】この発明の銅合金を製造するには、まず、
電気銅を不活性ガス中で溶解し、得られた溶湯にAgお
よびCrを添加して成分組成調整し、鋳造して鋳塊を製
造する。この鋳塊を600〜700℃で熱間鍛造もしく
は熱間圧延を施した後、溶体化処理し、さらに冷間加工
と時効処理を繰り返して施すことにより製造される。こ
のようにして得られたこの発明の銅合金は、Cu初晶お
よびCuとAg固溶体の共晶が繊維状に配向して強化さ
れた素地中にCrの微細な析出物が分散した組織を有し
ている。
To produce the copper alloy of the present invention, first,
Electrolytic copper is melted in an inert gas, Ag and Cr are added to the resulting molten metal to adjust the component composition, and the ingot is manufactured by casting. This ingot is hot-forged or hot-rolled at 600 to 700 ° C., solution-treated, and then repeatedly subjected to cold working and aging treatment. The thus obtained copper alloy of the present invention has a structure in which fine precipitates of Cr are dispersed in the base material reinforced by the primary crystal of Cu and the eutectic of Cu and Ag solid solution oriented in a fibrous shape. is doing.

【0008】つぎに、この発明の銅合金の成分組成を上
記のごとく限定した理由について説明する。
Next, the reason why the composition of the copper alloy of the present invention is limited as described above will be explained.

【0009】(a) Ag Agは、Cuに固溶あるいはCuとの共晶組織として晶
出され、合金の強度および硬さを向上させる作用がある
が、8.0重量%未満では素地がAg固溶体単相となっ
て特に繊維強化できないので好ましくなく、一方、2
0.0重量%を越えて含有しても、高温下での強度の著
しい向上は見られないので経済的にも好ましくない。し
たがって、Agの含有量は、8.0〜20.0重量%に
定めた。
(A) Ag Ag is crystallized as a solid solution in Cu or as a eutectic structure with Cu, and has the effect of improving the strength and hardness of the alloy, but if it is less than 8.0% by weight, the base material is Ag. It is not preferable because it becomes a solid solution single phase and cannot be particularly reinforced with fibers.
Even if the content is more than 0.0% by weight, the strength is not significantly improved at high temperatures, which is economically unfavorable. Therefore, the content of Ag is set to 8.0 to 20.0% by weight.

【0010】(b) Cr Crは、Agとともに素地に固溶し、その後の時効処理
によるCrの微細な析出により合金の強度および硬さを
改善する作用があり、さらに高温での強度を改善する作
用があるが、0.1重量%未満ではその効果がなく、一
方、1.0重量%を越えて含有すると、鋳造時に粗大な
Cr晶出物を生じやすく、強度の向上も期待できなく、
さらに導電率が低下するようになるので好ましくない。
したがって、Crの含有量は、0.1〜1.0重量%に
定めた。
(B) Cr Cr, together with Ag, forms a solid solution in the base material, and has a function of improving the strength and hardness of the alloy by fine precipitation of Cr by the subsequent aging treatment, and further improves the strength at high temperature. Although it has an effect, if it is less than 0.1% by weight, it has no effect. On the other hand, if it exceeds 1.0% by weight, coarse Cr crystallized substances are likely to occur during casting, and improvement in strength cannot be expected.
Further, the conductivity is lowered, which is not preferable.
Therefore, the content of Cr is set to 0.1 to 1.0% by weight.

【0011】[0011]

【実施例】つぎに、この発明の銅合金を実施例により具
体的に説明する。
EXAMPLES Next, the copper alloy of the present invention will be specifically described by way of examples.

【0012】Ar雰囲気中で溶解、鋳造し、表1に示さ
れる成分組成のCu合金鋳塊を製造し、このCu合金鋳
塊を圧下率:50%の冷間圧延を施し、さらに温度:4
00℃、1時間保持の中間時効処理を施し、この中間時
効処理施した本発明銅合金1〜6および比較銅合金1〜
3の組織をSEMで観察したところ、Cu初晶およびC
uとAgの共晶からなる2相の繊維状に配向した素地中
にCrの微細な析出が分散しているのが見られた。
Melt and cast in an Ar atmosphere to produce a Cu alloy ingot having the composition shown in Table 1. The Cu alloy ingot is subjected to cold rolling at a rolling reduction of 50% and further at a temperature of 4
The present invention copper alloys 1 to 6 and comparative copper alloys 1 to 6 subjected to the intermediate aging treatment of holding at 00 ° C. for 1 hour
When the structure of No. 3 was observed by SEM, Cu primary crystal and C
It was found that fine precipitates of Cr were dispersed in the two-phase fibrous matrix composed of a eutectic of u and Ag.

【0013】上記中間時効処理を施した本発明銅合金1
〜6、比較銅合金1〜3および従来銅合金をさらに圧下
率:95%の最終冷間圧延を施すことにより本発明銅合
金1〜6、比較銅合金1〜3および従来銅合金を製造し
た。上記比較銅合金1〜3は、成分含有量がこの発明の
範囲から外れたものである(表1において、この発明の
範囲から外れた値に*印しを付して示した)。
The copper alloy of the present invention 1 which has been subjected to the above-mentioned intermediate aging treatment.
~ 6, comparative copper alloys 1 to 3 and conventional copper alloy were further subjected to final cold rolling at a rolling reduction of 95% to produce inventive copper alloys 1 to 6, comparative copper alloys 1 to 3 and conventional copper alloy. . The comparative copper alloys 1 to 3 have component contents outside the range of the present invention (in Table 1, values outside the range of the present invention are marked with *).

【0014】これら本発明銅合金1〜6、比較銅合金1
〜3および従来銅合金のビッカース硬さ、導電率および
引張り強さを測定し、さらに加工材を1時間焼鈍した時
の強度が焼鈍しない加工材の強度の1/2になる焼鈍温
度を半軟化温度として求め、これらの測定結果も表1に
示した。
The present invention copper alloys 1 to 6 and comparative copper alloy 1
~ 3 and Vickers hardness, electrical conductivity and tensile strength of conventional copper alloys are measured, and the annealing temperature of the processed material for 1 hour is half softened at the annealing temperature, which is half the strength of the unannealed material. The temperature was determined and the results of these measurements are also shown in Table 1.

【0015】[0015]

【表1】 [Table 1]

【0016】表1に示される結果から、中間時効処理し
たのち最終冷間圧延した本発明銅合金1〜6は、いずれ
も中間時効処理したのち最終冷間圧延した従来銅合金に
比べて、導電率はほぼ同等であるが、ビッカース硬さお
よび引張り強さが格段に優れており、さらに半軟化温度
が大幅に向上していることから耐熱性にも優れているこ
とがわかる。また比較銅合金1〜3に見られるように、
成分組成がこの発明の範囲から外れると、ビッカース硬
さ、引張り強さ、導電率および半軟化温度のうち少なく
ともいずれかの性質が従来銅合金とほぼ同等または従来
銅合金よりも劣ったものとなることもわかる。
From the results shown in Table 1, the copper alloys 1 to 6 of the present invention, which were subjected to the intermediate aging treatment and then the final cold rolling, were more conductive than the conventional copper alloys which were subjected to the intermediate aging treatment and then the final cold rolling. Although the rates are almost the same, it can be seen that the Vickers hardness and the tensile strength are remarkably excellent, and the semi-softening temperature is significantly improved, so that the heat resistance is also excellent. Also, as seen in the comparative copper alloys 1 to 3,
If the component composition deviates from the range of the present invention, Vickers hardness, tensile strength, electrical conductivity and at least one of the semi-softening temperature properties are almost equal to or inferior to conventional copper alloys. I also understand that.

【0017】[0017]

【発明の効果】上述のように、冷間圧延と時効処理を繰
り返し、最終的に冷間圧延することにより得られた線材
または板材を用いて、従来よりも優れた特性を有する超
強磁場発生装置の導電コイルを製造することができ、工
業上優れた効果をもたらすものである。
As described above, by using the wire rod or plate obtained by repeating cold rolling and aging treatment and finally cold rolling, generation of an ultra-high magnetic field having characteristics superior to conventional ones. The conductive coil of the device can be manufactured, and the industrially excellent effect is brought about.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 和田 仁 茨城県つくば市千現1−2−1 科学技術 庁 金属材料技術研究所 筑波支所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hitoshi Wada 1-2-1 Sengen, Tsukuba, Ibaraki Prefectural Government, Science and Technology Agency, Research Institute for Metals, Tsukuba Branch

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 Ag:8.0〜20.0重量%、Cr:
0.1〜1.0重量%を含有し、残りがCuおよび不可
避不純物からなる組成、並びに初晶および共晶が繊維状
に配向した素地中にCrの微細な析出物が分散している
組織を有することを特徴とする強度および導電性に優れ
た銅合金。
1. Ag: 8.0 to 20.0% by weight, Cr:
Structure containing 0.1 to 1.0% by weight, the balance consisting of Cu and unavoidable impurities, and a structure in which fine precipitates of Cr are dispersed in a matrix in which primary crystals and eutectic are oriented in a fibrous state. A copper alloy excellent in strength and conductivity, characterized by having
JP09083293A 1993-03-25 1993-03-25 Copper alloy with excellent heat resistance, strength and conductivity Expired - Lifetime JP3407054B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP09083293A JP3407054B2 (en) 1993-03-25 1993-03-25 Copper alloy with excellent heat resistance, strength and conductivity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP09083293A JP3407054B2 (en) 1993-03-25 1993-03-25 Copper alloy with excellent heat resistance, strength and conductivity

Publications (2)

Publication Number Publication Date
JPH06279894A true JPH06279894A (en) 1994-10-04
JP3407054B2 JP3407054B2 (en) 2003-05-19

Family

ID=14009566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP09083293A Expired - Lifetime JP3407054B2 (en) 1993-03-25 1993-03-25 Copper alloy with excellent heat resistance, strength and conductivity

Country Status (1)

Country Link
JP (1) JP3407054B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1143021A1 (en) * 2000-04-05 2001-10-10 Ishikawajima-Harima Heavy Industries Co., Ltd. Copper base alloy and methods for producing casting and forging employing copper base alloy
EP1338662A1 (en) * 2002-02-21 2003-08-27 Ishikawajima-Harima Heavy Industries Co., Ltd. Cu-based alloy and method of manufacturing high strength and high thermal conductive forged article using the same
JP2008248325A (en) * 2007-03-30 2008-10-16 Nikko Kinzoku Kk High strength and high electric conductivity heat resistant copper alloy foil
JP2010070856A (en) * 2009-12-14 2010-04-02 Nippon Mining & Metals Co Ltd Copper alloy for electronic appliance
CN106676314A (en) * 2016-12-28 2017-05-17 北京有色金属研究总院 Preparation method for Cu-Ag alloy with high-strength and high-conductivity performance
CN115464406A (en) * 2022-08-30 2022-12-13 南京理工大学 High-strength high-conductivity CuCr copper intermediate alloy and preparation method thereof

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1143021A1 (en) * 2000-04-05 2001-10-10 Ishikawajima-Harima Heavy Industries Co., Ltd. Copper base alloy and methods for producing casting and forging employing copper base alloy
KR100415270B1 (en) * 2000-04-05 2004-01-14 이시카와지마-하리마 주고교 가부시키가이샤 Copper Base Alloy, and Methods for Producing Casting and Forging Employing Copper Base Alloy
US6679955B2 (en) 2000-04-05 2004-01-20 Ishikawajima-Harima Heavy Industries, Co., Ltd. Copper base alloy casting, and methods for producing casting and forging employing copper base alloy casting
US7204893B2 (en) 2000-04-05 2007-04-17 Ishikawajima-Harima Heavy Industries, Co., Ltd. Copper base alloy casting, and methods for producing casting and forging employing copper base alloy casting
EP1338662A1 (en) * 2002-02-21 2003-08-27 Ishikawajima-Harima Heavy Industries Co., Ltd. Cu-based alloy and method of manufacturing high strength and high thermal conductive forged article using the same
US7172665B2 (en) 2002-02-21 2007-02-06 Ishikawajima-Harima Heavy Industries Co., Ltd. Cu-based alloy and method of manufacturing high strength and high thermal conductive forged article using the same
JP2008248325A (en) * 2007-03-30 2008-10-16 Nikko Kinzoku Kk High strength and high electric conductivity heat resistant copper alloy foil
JP2010070856A (en) * 2009-12-14 2010-04-02 Nippon Mining & Metals Co Ltd Copper alloy for electronic appliance
CN106676314A (en) * 2016-12-28 2017-05-17 北京有色金属研究总院 Preparation method for Cu-Ag alloy with high-strength and high-conductivity performance
CN115464406A (en) * 2022-08-30 2022-12-13 南京理工大学 High-strength high-conductivity CuCr copper intermediate alloy and preparation method thereof
CN115464406B (en) * 2022-08-30 2023-08-04 南京理工大学 High-strength high-conductivity CuCr copper intermediate alloy and preparation method thereof

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