CN115029578A - High-strength bonding alloy belt and preparation method thereof - Google Patents
High-strength bonding alloy belt and preparation method thereof Download PDFInfo
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- CN115029578A CN115029578A CN202210465252.6A CN202210465252A CN115029578A CN 115029578 A CN115029578 A CN 115029578A CN 202210465252 A CN202210465252 A CN 202210465252A CN 115029578 A CN115029578 A CN 115029578A
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- bonding
- strip
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- alloy
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- 239000000956 alloy Substances 0.000 title claims abstract description 28
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 239000010931 gold Substances 0.000 claims abstract description 37
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052737 gold Inorganic materials 0.000 claims abstract description 27
- 238000005096 rolling process Methods 0.000 claims description 24
- 238000003723 Smelting Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 8
- 238000005491 wire drawing Methods 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910052790 beryllium Inorganic materials 0.000 claims description 6
- 229910052772 Samarium Inorganic materials 0.000 claims description 5
- 238000007872 degassing Methods 0.000 claims description 5
- 239000000155 melt Substances 0.000 claims description 5
- 238000007670 refining Methods 0.000 claims description 5
- 238000005266 casting Methods 0.000 claims description 4
- 238000005097 cold rolling Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000004321 preservation Methods 0.000 claims 2
- 238000004100 electronic packaging Methods 0.000 abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- 238000000137 annealing Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000006698 induction Effects 0.000 description 3
- 238000009740 moulding (composite fabrication) Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 235000013619 trace mineral Nutrition 0.000 description 2
- 239000011573 trace mineral Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/04—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/35—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/35—Manufacturing methods
- H01L2224/352—Mechanical processes
- H01L2224/3521—Pulling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/37001—Core members of the connector
- H01L2224/37099—Material
- H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/37138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/37144—Gold [Au] as principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Abstract
The invention discloses a high-strength bonding alloy strip and a preparation method thereof, belonging to the field of electronic packaging. The gold content is more than or equal to 99.99 percent, Be is 0-0.01 percent, Ni is 0-0.01 percent, Sm is: 0-0.01%, the bonding gold band provided by the invention has the advantages of high strength and high elongation, and can be widely applied to the electronic packaging industry.
Description
Technical Field
The invention belongs to the technical field of electronic packaging, and particularly relates to a high-strength bonding alloy strip and a preparation method thereof.
Background
The gold bonding wire for semiconductor package is one of five basic materials in package industry, and is mainly used as an inner lead of semiconductor discrete device and integrated circuit package. The requirements are high conductivity, high strength, easy processing into flat ribbons with almost no defects, good bonding performance and the like. The bonding alloy belt has a different use effect compared with a bonding gold wire. Because of the current skin effect, the gold wire and the gold belt with the same sectional area bear different currents, the gold belt bears higher current than the gold wire, and the electrical characteristics are better. The bond alloy belt is less for civil use at present and is more applied to the field of military electronics, the processing difficulty of the bond alloy belt is higher than that of a bonding gold wire, and the research on the bond alloy belt is less at present.
The performance of the integrated circuit is directly affected by the quality of the bonding effect, so that the bonding alloy strip needs to meet the bonding requirement, has high dimensional accuracy, uniformity, no bending, smooth surface, no contamination, no scratch, and proper tensile strength and elongation. The gold belt processed by pure gold only has the advantages of very soft property, lower strength and poor weldability, and can not meet the bonding requirement. Therefore, it is necessary to provide a gold band which can meet the bonding requirement, and the addition of metallic beryllium can refine grains, not only is beneficial to processing, but also can increase the recrystallization temperature, but the addition of a large amount can also make the gold wire become hard and brittle. The rare earth elements have high electronegativity and larger atomic radius, and the addition of a proper amount of rare earth elements in the gold can refine grains, improve the ingot blank structure and improve the processability and mechanical properties of the gold strip. The nickel is added, so that the strength of the gold strip can be provided, and the gold strip is easy to process.
Disclosure of Invention
The invention aims to provide a high-strength bonding alloy belt and a preparation method thereof, and the specific technical scheme is as follows:
a high-strength bonding alloy strip comprises, by mass, 0-0.01% of Be, 0-0.01% of Ni, 0-0.01% of Sm, and the balance of Au.
The preparation method of the high-strength alloy bonding belt is characterized by comprising the steps of smelting, casting and forming, rolling, heat treatment, wire drawing and precision rolling to prepare the high-strength alloy bonding belt.
The smelting in the preparation method of the high-strength bonding gold band comprises the following steps: gold with the purity of 99.999 percent is used for vacuum smelting, and then Be, Ni and Sm are added into a melt for refining and degassing.
Further, vacuumizing the smelting chamber, smelting Au in a vacuum induction intermediate frequency furnace according to the components of 0-0.01% of Be, 0-0.01% of Ag, 0-0.01% of Sm and the balance of Au, reducing the current, adding Be, Ni and Sm into the melt through a charging hopper after the metal is completely molten, and reducing the volatilization of trace elements in the uniformly distributed melt; and finally refining and degassing in a molten state to improve the compactness of the cast ingot.
The high-strength bonding gold strip is cast and formed by using a graphite crucible and a graphite mold in the preparation method of the high-strength bonding gold strip.
The rolling in the preparation method of the high-strength bonding gold strip is cold rolling, and the pass deformation is 2-5%; the rolling heat treatment comprises the following steps: when the rolling reduction rate reaches 70-90%, the annealing treatment is carried out at the temperature of 200-300 ℃ for 10-30 min.
The pass deformation of wire drawing in the preparation method of the high-strength bonding gold band is 5-10%; the drawing heat treatment comprises the following steps: when the drawing processing rate reaches 50-70%, the annealing treatment is carried out at the temperature of 200-300 ℃ for 10-30 min.
In the precision rolling in the preparation method of the high-strength bonding gold band, a precision rolling mill with a working roll diameter of 15mm and a roll length of 40mm is adopted to roll the bonding gold wire.
7. The breaking load of the bonding gold belt prepared by the method for preparing the high-strength bonding gold belt is more than or equal to 15cN, and the elongation is more than or equal to 8%.
The invention has the beneficial effects that:
(1) according to the invention, the strength of the bonding gold strip is enhanced by adding the trace elements Be, Ni and Sm, and meanwhile, higher elongation is kept;
(2) the preparation method of the bonding alloy belt provided by the invention has uniform content of Be, Ni and Sm, and the method for producing the belt material by precisely rolling the wire material has the advantages that the size of the belt material is easy to control, the processing precision is high, the requirements of the electronic packaging industry on the bonding gold belt can Be met, the electric performance of the bonding gold belt is superior to that of the bonding gold wire, and the reliability is higher.
Detailed Description
The present invention provides a high strength alloy ribbon and a method for preparing the same, and the present invention will be further described with reference to the following examples.
Example 1
A high strength bond alloy ribbon was prepared according to the following steps:
(1) melting
Vacuumizing a smelting chamber, smelting Au in a vacuum induction intermediate frequency furnace according to the composition of 0.002% of Be, 0.005% of Ni, 0.003% of Sm and the balance of Au, reducing current to add the Be, the Ni and the Sm into a melt through a charging hopper after the Au is completely molten, and finally refining and degassing in a molten state to improve the density of the cast ingot.
(2) Casting and forming to prepare an alloy ingot;
(3) rolling and rolling heat treatment
And (3) carrying out cold rolling on the alloy ingot obtained in the step (2), and annealing treatment at the temperature of 200 ℃ for 25min when the processing rate reaches 70% in the rolling process.
(4) Wire drawing and heat treatment
And in the wire drawing process, when the processing rate reaches 50%, annealing treatment is carried out at the temperature of 200 ℃ for 10min, and after the wire is drawn to the diameter of 5mm, the wire is directly drawn to the finished product of 0.0282mm at the temperature of 200 ℃ for 10 min.
(5) Precision rolling
And (4) rolling the wire prepared in the step (4) by using a precision rolling mill, wherein the thickness of a rolled finished product is 0.005mm, and the width of the finished product is 0.125 mm.
The tensile test of the alloy ribbon obtained in example 1 showed a breaking load of 15.5cN and an elongation of 8%.
Example 2
A high strength bond alloy strip was prepared as follows:
(4) melting
Vacuumizing a smelting chamber, smelting Au in a vacuum induction intermediate frequency furnace according to the composition of 0.0018% of Be, 0.0045% of Ni, 0.0037% of Sm and the balance of Au, reducing current to add the Be, the Ni and the Sm into a melt through a charging hopper after the Au is completely molten, and finally refining and degassing in a molten state to improve the compactness of an ingot.
(5) Casting and forming to prepare an alloy ingot;
(6) rolling and rolling heat treatment
And (3) carrying out annealing treatment at 280 ℃ for 20min when the processing rate reaches 70% in the rolling process by adopting the alloy ingot obtained in the cold rolling step (2).
(4) Wire drawing and heat treatment
In the wire drawing process, when the working rate reaches 50%, annealing treatment is carried out at the temperature of 200 ℃ for 12min, and after the wire is drawn to the diameter of 5mm, the wire is directly drawn to the diameter of 0.05529mm at the temperature of 200 ℃ for 10 min.
(5) Precision rolling
And (5) rolling the wire material prepared in the step (4) by using a precision rolling mill, wherein the thickness of a rolled finished product is 0.008mm, and the width of the finished product is 0.3 mm.
The tensile test of the alloy ribbon obtained in example 1 showed a breaking load of 15.8cN and an elongation of 8.2%.
Claims (6)
1. A high-strength bonding alloy belt is characterized in that Au is more than or equal to 99.99% by mass, and comprises 0-0.01% of Be, 0-0.01% of Ni, and Sm: 0-0.01%, the thickness of the gold bonding strip is 0.002-0.008 mm, the width is 0.02-0.8 mm, the breaking load is more than or equal to 15cN, and the elongation is more than or equal to 8%.
2. The method for preparing a high-strength alloy bonding strip according to claim 1, wherein the method comprises the steps of smelting, casting, rolling, heat treatment, wire drawing and precision rolling to prepare the high-strength alloy bonding strip.
3. The method of manufacturing according to claim 2, wherein the smelting is: gold with the purity of 99.999 percent is used for vacuum smelting, and then Be, Ni and Sm are added into a melt for refining and degassing.
4. The preparation method according to claim 2, wherein the rolling is cold rolling, the pass deformation is 2-5%, and the total deformation reaches 70-90%, and the heat treatment is carried out by: the heating temperature is 200 ℃ and 300 ℃, and the heat preservation time is 10-30 min.
5. The preparation method according to claim 2, wherein the pass deformation of the wire drawing is 5-10%, the total deformation reaches 50-70%, and the heat treatment of drawing is as follows: the heating temperature is 200 ℃ and 300 ℃, and the heat preservation time is 10-30 min. The final drawing size of the wire is determined by the size of a finished product of the strip, and the sectional area of the wire is consistent with that of the bonding gold strip.
6. The method for preparing the alloy strip according to claim 2, wherein the precision rolling is performed, the pass deformation is 5-10%, and the thickness of the finished alloy strip is 0.002-0.008 mm, the tolerance is +/-0.0001, the width is 0.02-0.8 mm, and the tolerance is +/-5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210465252.6A CN115029578A (en) | 2022-04-29 | 2022-04-29 | High-strength bonding alloy belt and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210465252.6A CN115029578A (en) | 2022-04-29 | 2022-04-29 | High-strength bonding alloy belt and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115029578A true CN115029578A (en) | 2022-09-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210465252.6A Pending CN115029578A (en) | 2022-04-29 | 2022-04-29 | High-strength bonding alloy belt and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN115029578A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62290835A (en) * | 1986-06-09 | 1987-12-17 | Mitsubishi Metal Corp | Au-alloy extra fine wire for semiconductor device bonding wire |
| KR19990065943A (en) * | 1998-01-14 | 1999-08-16 | 이재호 | Beryllium copper. Manufacturing method of high strength 24-gold brass decoration by adding titanium copper |
| JP2006147893A (en) * | 2004-11-22 | 2006-06-08 | Sumitomo Metal Mining Co Ltd | Bonding wire and its manufacturing method |
| CN1885531A (en) * | 2006-07-11 | 2006-12-27 | 中国印钞造币总公司 | Gold bonding wire and method for manufacturing same |
| CN110983093A (en) * | 2019-12-20 | 2020-04-10 | 有研亿金新材料有限公司 | Gold-based alloy electrical contact material and preparation method thereof |
| CN111763844A (en) * | 2020-05-20 | 2020-10-13 | 上杭县紫金佳博电子新材料科技有限公司 | Bonding gold belt and preparation method thereof |
-
2022
- 2022-04-29 CN CN202210465252.6A patent/CN115029578A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62290835A (en) * | 1986-06-09 | 1987-12-17 | Mitsubishi Metal Corp | Au-alloy extra fine wire for semiconductor device bonding wire |
| KR19990065943A (en) * | 1998-01-14 | 1999-08-16 | 이재호 | Beryllium copper. Manufacturing method of high strength 24-gold brass decoration by adding titanium copper |
| JP2006147893A (en) * | 2004-11-22 | 2006-06-08 | Sumitomo Metal Mining Co Ltd | Bonding wire and its manufacturing method |
| CN1885531A (en) * | 2006-07-11 | 2006-12-27 | 中国印钞造币总公司 | Gold bonding wire and method for manufacturing same |
| CN110983093A (en) * | 2019-12-20 | 2020-04-10 | 有研亿金新材料有限公司 | Gold-based alloy electrical contact material and preparation method thereof |
| CN111763844A (en) * | 2020-05-20 | 2020-10-13 | 上杭县紫金佳博电子新材料科技有限公司 | Bonding gold belt and preparation method thereof |
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Application publication date: 20220909 |