CN1885531A - Gold bonding wire and method for manufacturing same - Google Patents
Gold bonding wire and method for manufacturing same Download PDFInfo
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- CN1885531A CN1885531A CNA2006100213732A CN200610021373A CN1885531A CN 1885531 A CN1885531 A CN 1885531A CN A2006100213732 A CNA2006100213732 A CN A2006100213732A CN 200610021373 A CN200610021373 A CN 200610021373A CN 1885531 A CN1885531 A CN 1885531A
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- gold wire
- bonding gold
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- gold
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2924/01204—4N purity grades, i.e. 99.99%
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Continuous Casting (AREA)
Abstract
Description
Test piece number (Test pc No.) | Specimen finish | Maximum, force | Tensile strength | Percentage of total elongation when disconnected |
d(mm) | Fb(N) | σb(MPa) | 6t(%) | |
1 | 0.025 | 0.103 | 210.3 | 11.03 |
2 | 0.025 | 0.103 | 210.6 | 10.24 |
3 | 0.025 | 0.103 | 210.1 | 10.32 |
4 | 0.025 | 0.104 | 210.8 | 11.88 |
5 | 0.025 | 0.102 | 208.7 | 10.59 |
6 | 0.025 | 0.103 | 209.2 | 11.13 |
Mean value | 0.025 | 0.103 | 210.0 | 10.87 |
Intermediate value | 0.025 | 0.103 | 210.1 | 10.77 |
Test piece number (Test pc No.) | Specimen finish | Maximum, force | Tensile strength | Percentage of total elongation when disconnected |
d(mm) | Fb(N) | σb(MPa) | δt(%) | |
1 | 0.030 | 0.079 | 111.3 | 0.96 |
2 | 0.030 | 0.082 | 116.2 | 1.32 |
3 | 0.030 | 0.082 | 115.7 | 1.30 |
4 | 0.030 | 0.080 | 113.7 | 1.23 |
5 | 0.030 | 0.084 | 118.5 | 1.31 |
6 | 0.030 | 0.083 | 117.4 | 1.29 |
Mean value | 0.030 | 0.082 | 115.5 | 1.23 |
Intermediate value | 0.030 | 0.082 | 115.8 | 1.28 |
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006100213732A CN100394592C (en) | 2006-07-11 | 2006-07-11 | Gold bonding wire and method for manufacturing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006100213732A CN100394592C (en) | 2006-07-11 | 2006-07-11 | Gold bonding wire and method for manufacturing same |
Publications (2)
Publication Number | Publication Date |
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CN1885531A true CN1885531A (en) | 2006-12-27 |
CN100394592C CN100394592C (en) | 2008-06-11 |
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CNB2006100213732A Active CN100394592C (en) | 2006-07-11 | 2006-07-11 | Gold bonding wire and method for manufacturing same |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101607360B (en) * | 2008-06-17 | 2011-01-05 | 北京达博有色金属焊料有限责任公司 | Mass production method for ultra-fine bonding gold wire |
CN102127663A (en) * | 2010-12-30 | 2011-07-20 | 宁波康强电子股份有限公司 | Gold bonding wire and preparation method thereof |
CN101626006B (en) * | 2009-07-09 | 2012-06-20 | 烟台一诺电子材料有限公司 | Flexible bonding copper wire and preparation method thereof |
CN102776405A (en) * | 2012-07-25 | 2012-11-14 | 烟台招金励福贵金属股份有限公司 | Preparation method of bonded gold-silver alloy wire |
CN102115833B (en) * | 2009-12-30 | 2013-11-27 | 北京有色金属与稀土应用研究所 | Gold beryllium alloy material for semiconductor devices and preparation method and application thereof |
CN105002391A (en) * | 2015-05-27 | 2015-10-28 | 安徽捷澳电子有限公司 | Hyperfine gold flat silk ribbon and preparation method thereof |
CN109003903A (en) * | 2018-07-02 | 2018-12-14 | 上杭县紫金佳博电子新材料科技有限公司 | A kind of bonding gold wire and preparation method thereof |
CN111254311A (en) * | 2020-03-27 | 2020-06-09 | 上杭县紫金佳博电子新材料科技有限公司 | 4N gold bonding wire capable of being processed into 6-micron diameter by drawing and preparation method thereof |
CN114318045A (en) * | 2021-12-31 | 2022-04-12 | 广东佳博电子科技有限公司 | Fine bonding gold wire for enhancing crystal grain adhesion and preparation method thereof |
CN115029578A (en) * | 2022-04-29 | 2022-09-09 | 有研亿金新材料有限公司 | High-strength bonding alloy belt and preparation method thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0726167B2 (en) * | 1986-06-09 | 1995-03-22 | 三菱マテリアル株式会社 | Au alloy extra fine wire for bonding wire of semiconductor device |
JP2773202B2 (en) * | 1989-03-24 | 1998-07-09 | 三菱マテリアル株式会社 | Au alloy extra fine wire for semiconductor element bonding |
JP2814660B2 (en) * | 1990-03-06 | 1998-10-27 | 三菱マテリアル株式会社 | Gold alloy wire for bonding semiconductor devices |
-
2006
- 2006-07-11 CN CNB2006100213732A patent/CN100394592C/en active Active
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101607360B (en) * | 2008-06-17 | 2011-01-05 | 北京达博有色金属焊料有限责任公司 | Mass production method for ultra-fine bonding gold wire |
CN101626006B (en) * | 2009-07-09 | 2012-06-20 | 烟台一诺电子材料有限公司 | Flexible bonding copper wire and preparation method thereof |
CN102115833B (en) * | 2009-12-30 | 2013-11-27 | 北京有色金属与稀土应用研究所 | Gold beryllium alloy material for semiconductor devices and preparation method and application thereof |
CN102127663A (en) * | 2010-12-30 | 2011-07-20 | 宁波康强电子股份有限公司 | Gold bonding wire and preparation method thereof |
CN102776405A (en) * | 2012-07-25 | 2012-11-14 | 烟台招金励福贵金属股份有限公司 | Preparation method of bonded gold-silver alloy wire |
CN105002391A (en) * | 2015-05-27 | 2015-10-28 | 安徽捷澳电子有限公司 | Hyperfine gold flat silk ribbon and preparation method thereof |
CN109003903A (en) * | 2018-07-02 | 2018-12-14 | 上杭县紫金佳博电子新材料科技有限公司 | A kind of bonding gold wire and preparation method thereof |
CN111254311A (en) * | 2020-03-27 | 2020-06-09 | 上杭县紫金佳博电子新材料科技有限公司 | 4N gold bonding wire capable of being processed into 6-micron diameter by drawing and preparation method thereof |
CN114318045A (en) * | 2021-12-31 | 2022-04-12 | 广东佳博电子科技有限公司 | Fine bonding gold wire for enhancing crystal grain adhesion and preparation method thereof |
CN115029578A (en) * | 2022-04-29 | 2022-09-09 | 有研亿金新材料有限公司 | High-strength bonding alloy belt and preparation method thereof |
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Publication number | Publication date |
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CN100394592C (en) | 2008-06-11 |
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GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: The Great Wall Gold & Silver Refinery Assignor: CHINA BANKNOTE PRINTING AND MINTING Corp. Contract fulfillment period: 2008.6.13 to 2014.6.13 Contract record no.: 2009510000099 Denomination of invention: Gold bonding wire and method for manufacturing same Granted publication date: 20080611 License type: Exclusive license Record date: 20091013 |
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LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.6.13 TO 2014.6.13; CHANGE OF CONTRACT Name of requester: GREATWALL GOLD + SILVER REFINERY Effective date: 20091013 |
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CP01 | Change in the name or title of a patent holder |
Address after: 610000 No. 189, Golden Road, Wenjiang District, Sichuan, Chengdu Patentee after: China Banknote Printing and Minting Group Co.,Ltd. Address before: 610000 No. 189, Golden Road, Wenjiang District, Sichuan, Chengdu Patentee before: CHINA BANKNOTE PRINTING AND MINTING Corp. |
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CP01 | Change in the name or title of a patent holder |