CN109182826B - High-strength-toughness low-resistivity silver-gold alloy bonding wire - Google Patents
High-strength-toughness low-resistivity silver-gold alloy bonding wire Download PDFInfo
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- CN109182826B CN109182826B CN201811089586.8A CN201811089586A CN109182826B CN 109182826 B CN109182826 B CN 109182826B CN 201811089586 A CN201811089586 A CN 201811089586A CN 109182826 B CN109182826 B CN 109182826B
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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Abstract
The invention relates to a high-obdurability low-resistivity silver-gold alloy bonding wire, which comprises the following alloy components in percentage by weight: ag: 80% -100.0%, Au: 0-20.0 percent of the total weight of the alloy, trace two or more of Ce, Cu, Pd, Be, Mg and Ca are added, and the contents are as follows: 0 to 0.01 percent. The breaking load of the silver-gold alloy bonding wire is more than 10cN, the elongation is more than 18%, and the mechanical property is adjustable; the resistivity is less than 1.8 mu omega cm. Compared with the material cost of the existing gold bonding wire, the use cost of the silver-gold alloy bonding wire is reduced by more than 80%, and the silver-gold alloy bonding wire has excellent mechanical property, electrical property, oxidation resistance and bonding property, and can be widely applied to the field of packaging.
Description
Technical Field
The invention belongs to the field of alloys, and particularly relates to a silver-gold alloy bonding wire with high strength, toughness and low resistivity.
Background
With the upgrading of advanced semiconductor packaging technology and the development of novel electronic industry, bonding wires serving as one of key base materials of electronic packaging are required to be micronized, high in strength and low in cost, and meanwhile, the requirements of comprehensive performances such as stable lead radian, high bonding fastness, high stability and excellent conductivity in the bonding process of integrated circuits are met. The resistivity of the high-purity silver is 1.6 mu omega cm, the resistivity is the smallest in all metals, the conductivity is the best, the heat dissipation performance of the silver is better than that of the gold, but the pure silver wire is unstable in balling and easy to oxidize, and the use of the silver wire has great challenges. The resistivity of gold is 2.3 mu omega cm, and gold wire is one of the most widely used bonding wire materials due to the excellent thermal stability, uniformity, corrosion resistance and other properties of the gold wire, especially in high-end fields. However, the gold tool has the defects of high price, low strength, easy generation of brittle intermetallic compounds on the interface with the aluminum disc and the like, and in order to improve the performance of the bonding wire and reduce the production cost, related organizations of various countries develop extensive research and application development of the replaceable novel gold-silver-based alloy bonding wire, so that the gold tool becomes an ideal material for replacing the gold wire.
In terms of comprehensive performance, the breaking load of some novel alloy bonding wires on the market generally does not exceed 8cN, the elongation rate does not exceed 8%, and the resistivity is usually more than 2.3 mu omega cm. With the miniaturization, integration and modularization development of the electronic industry, the requirements of electrical parameters, strength parameters, balling parameters and the like of the bonding wire are higher and higher, and the wire diameter requirement of the bonding wire is thinner and thinner. How to develop a novel bonding wire with excellent mechanical property, conductivity, bonding property and superfine processability and lower cost becomes an urgent need in China.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the silver-gold alloy bonding wire with high obdurability, low resistivity and oxidation resistance. The silver-gold alloy bonding wire has the advantages of excellent processing performance, high toughness, excellent electric conduction energy and bonding performance and the like, the breaking load is greater than 10cN, the elongation is greater than 18%, and the mechanical property is adjustable; the resistivity is less than 1.8 mu omega cm.
The technical scheme for realizing the invention is as follows:
the silver-gold alloy bonding wire with high obdurability and low resistivity comprises the following components in percentage by weight: ag: ag is more than or equal to 80% and less than 100.0%, Au: au is more than 0% and less than or equal to 20.0%, and trace Ce, Cu, Pd, Be, Mg and Ca are added, wherein the total content is as follows: 0 percent is less than or equal to 0.01 percent.
The better technical scheme is that the alloy bonding wire comprises the following components in percentage by weight: ag: ag is more than or equal to 95% and less than 100.0%, Au: au is more than 0 percent and less than or equal to 5.0 percent, and trace two or more of Ce, Cu, Pd, Be, Mg and Ca are added, and the total content is within 1000 ppm.
The purity of gold in the alloy bonding wire is more than or equal to 99.995%, the purity of silver is more than or equal to 99.999%, and the purity of other elements is more than or equal to 99.99%.
The applicant tests and verifies that the alloy bonding wire has excellent conductivity and toughness, the breaking load is greater than 10cN, the elongation is greater than 18%, and the mechanical property is adjustable; the resistivity is less than 1.8 mu omega cm (the resistivity of comparable gold is about 2.3 mu omega cm, and the resistivity of common alloy wires in the market is more than or equal to 2.3 mu omega cm, so that the method has great advantages).
The alloy bonding wire provided by the invention takes silver as a main component, the content of the silver is higher than 80%, the oxidation resistance of the alloy is improved by adding Au, the conductivity is adjusted, the mechanical strength and the processability of the material can Be improved by adding trace elements such as Ce, Cu, Pd, Be, Mg and Ca, the processability of the material can Be greatly improved, and the component content of the alloy bonding wire is set and adjusted along with the purpose of regulating the mechanical property and the conductivity of the material.
The silver-gold alloy bonding wire with high obdurability and low resistivity solves the problem of matching of the high obdurability, the electrical property and the processability of the alloy, and has the advantages of wide application field and low cost.
Compared with the material cost of the existing gold bonding wire, the use cost of the silver-gold alloy bonding wire is reduced by more than 80%, and the silver-gold alloy bonding wire has excellent mechanical property, electrical property, oxidation resistance and bonding property, and can be widely applied to the field of packaging.
Drawings
FIG. 1 is a ball-shaped diagram of the bonding wire of the present invention.
Detailed Description
The invention is further illustrated by the following examples, which are not intended to limit the scope of the invention.
The proportion of each component of the silver-gold alloy bonding wire with high obdurability and low resistivity in the embodiments 1 to 3 is as follows:
example 1: 99.4% of Ag, 0.005% of Ce, 0.001% of Cu and the balance of Au;
example 2: the Ag content is 85%, the Ce content is 0.01%, the Cu content is 0.05%, the Pd content is 0.01%, the Ca content is 0.0005%, and the balance is Au;
example 3: the Ag content is 95%, the Ce content is 0.005%, the Cu content is 0.005%, the Be content is 0.005%, and the balance is Au;
the purity of the gold is high-purity gold with the purity not less than 99.995%, the purity of the silver is high-purity silver with the purity not less than 99.999%, and the purity of other elements is not less than 99.99%.
Taking the components described in the embodiments 1-3, preparing the silver-gold alloy bonding wire with high obdurability and low resistivity according to the following methods respectively:
1) high vacuum medium frequency induction smelting:
placing Au and part of Ag (the using amount of the Ag is less than one half of the total amount) in a high-vacuum medium-high frequency smelting furnace to carry out master alloy smelting at the smelting temperature of 1100-1300 ℃, introducing high-purity argon gas to protect the smelting process, refining for 10-30min, and cooling to obtain an alloy ingot; processing into Ag/Au master alloy plate, and cleaning for later use.
2) High vacuum continuous casting and smelting:
and taking a small amount of silver blocks, placing the added components on the silver blocks, mechanically folding the silver blocks into blocks, and wrapping the added components in the silver blocks to ensure that the added components do not contact with the external atmosphere to obtain the wrappage. The surplus silver is pressed into blocks through a press, and is placed in the order of silver-Ag/Au mother alloy-silver-wrappage-Ag/Au mother alloy (materials are placed according to the order because of different melting points of components, the maximum effect of mother alloy is fully exerted, so that the influence of multiple factors is changed into the influence of a single factor when the silver is melted, the loss of trace components is avoided and reduced to the utmost extent, thereby achieving the accurate control and homogenization of the components) to be smelted in a high-vacuum continuous casting machine, and the conditions are as follows: vacuum degree of 1X 10-2～1×10-3And Pa, introducing high-purity argon for protection, wherein the smelting temperature is 1100-1300 ℃, refining for 10-40min after complete melting, uniformly stirring, and drawing into an alloy rod material with the thickness of 6-10 mm.
3) Wire processing:
roughly drawing, middle drawing, fine drawing and fine drawing the alloy rod on a drawing machine, wherein the processing deformation is as follows: less than or equal to 20 percent, less than or equal to 15 percent, less than or equal to 10 percent and less than or equal to 5 percent; drawing into the silver-gold alloy bonding wire with the diameter phi of less than 25 mu m.
The bonding wire is drawn, the crystal grains are effectively crushed while the stress processing is carried out, the crystal grains are fine and uniform, the plastic processing is realized, the yield of the material is improved, and the wire material can be micronized.
4) Continuous cleaning, continuous annealing and packaging:
and (3) carrying out decontamination and impurity removal surface cleaning on the bonding wire by a continuous ultrasonic cleaner, carrying out continuous annealing and rewinding on the bonding wire to a take-up shaft under protective gas, wherein the annealing temperature is 200-500 ℃, and the annealing speed is 20-100 m/min. Sampling, performing performance detection, and vacuum packaging.
The continuous cleaning method comprises the following steps: the method is carried out on bonding wire surface cleaning equipment, surface cleaning for decontamination and impurity removal is carried out, an organic solvent such as absolute ethyl alcohol or acetone is selected as a decontamination medium, ultrasonic cleaning is carried out, the medium is deionized water, and the speed is 5-50 m/min.
Different media are selected according to different stages, and the surface of the wire material is cleaned by controlling the speed, interference factors are removed, and a high-quality bonding wire product is obtained. The wire material can be ensured to have better obdurability, the uniformity and the consistency of alloy structure can be ensured, the yield and the surface quality of the superfine wire material can be improved, and the bonding and the application performance of the wire material can be further improved by formulating a reasonable heat treatment system for continuous annealing.
The continuous annealing method comprises the following steps: the method is carried out in a tube annealing furnace, wherein the tube is a high-purity quartz tube with the length of 1-2 meters, continuous annealing and rewinding are carried out on a take-up shaft under protective gas, the annealing temperature is 200-500 ℃, and the annealing speed is 20-80 m/min.
And (3) performance testing:
through detection, when the material is drawn to phi 25 mu m, the bonding wire is tested, and has excellent conductivity and toughness, namely: the breaking load is more than 10cN, and simultaneously, the elongation is more than 18 percent, and the mechanical property is adjustable; the resistivity is less than 1.8 mu omega cm. The conventional gold bonding wire has a breaking load of about 6-8cN, an elongation of about 4-8% and a resistivity of about 2.3 mu omega cm, and the bonding wire of the present invention has good balling properties (see FIG. 1). The performance indexes of the invention are far higher than those of the traditional product. In addition, the material cost is reduced by 80%.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (3)
1. The high-strength-toughness low-resistivity silver-gold alloy bonding wire is characterized by comprising the following components in percentage by weight: ag: ag is more than or equal to 80% and less than 100.0%, Au: 0% < Au less than or equal to 20.0%, Ce: 0.005-0.01 percent, adding one or more of Cu, Pd, Be, Mg and Ca with the total content of 0 percent to less than or equal to 0.01 percent, wherein the breaking load of the alloy bonding wire is more than 10cN, the elongation is more than 18 percent, and the resistivity is less than 1.8 mu omega.cm; the alloy bonding wire is prepared by the following method:
1) high vacuum medium frequency induction smelting:
placing Au and Ag less than one half of the total amount of Ag in a high-vacuum medium-high frequency smelting furnace for smelting at the temperature of 1100-1300 ℃, under the protection of high-purity argon, refining for 10-30min, and cooling to obtain an alloy ingot; processing into an Ag/Au master alloy plate, and cleaning;
2) high vacuum continuous casting and smelting:
taking a small amount of silver blocks, placing the added components on the silver blocks, mechanically folding the silver blocks into blocks, wrapping the added components in the silver blocks, pressing the rest of silver into blocks, placing the blocks according to the sequence of silver-Ag/Au mother alloy-silver-wrappage-Ag/Au mother alloy, smelting in a high-vacuum continuous casting machine, and carrying out the conditions: vacuum degree of 1X 10-2～1×10-3Pa, filling high-purity argon at the smelting temperature of 1100-1300 ℃, completely melting, refining for 10-40min, uniformly stirring, and drawing into an alloy rod material with the thickness of 6-10 mm;
3) wire processing:
roughly drawing, middle drawing, fine drawing and fine drawing the alloy rod on a drawing machine, wherein the processing deformation is as follows: less than or equal to 20 percent, less than or equal to 15 percent, less than or equal to 10 percent and less than or equal to 5 percent; drawing into a silver-gold alloy bonding wire with the diameter phi of less than 25 mu m;
4) continuous cleaning and continuous annealing:
and (3) carrying out decontamination and impurity removal surface cleaning on the bonding wire by using a continuous ultrasonic cleaning machine, and continuously annealing under protective gas at the annealing temperature of 200-500 ℃ and the annealing speed of 20-100 m/min.
2. The silver-gold alloy bonding wire according to claim 1, wherein: the alloy bonding wire comprises the following components in percentage by weight: 99.4% of Ag, 0.005% of Ce, 0.001% of Cu and the balance of Au.
3. The silver-gold alloy bonding wire according to any one of claims 1 to 2, wherein: the purity of gold in the alloy bonding wire is more than or equal to 99.995%, the purity of silver is more than or equal to 99.999%, and the purity of other elements is more than or equal to 99.99%.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811089586.8A CN109182826B (en) | 2018-09-18 | 2018-09-18 | High-strength-toughness low-resistivity silver-gold alloy bonding wire |
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| CN201811089586.8A CN109182826B (en) | 2018-09-18 | 2018-09-18 | High-strength-toughness low-resistivity silver-gold alloy bonding wire |
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| CN109182826B true CN109182826B (en) | 2021-05-04 |
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| CN102912176B (en) * | 2012-09-21 | 2014-12-17 | 宁波康强电子股份有限公司 | High-end packaging silver alloy bonding wire and method for manufacturing same |
| JP5671512B2 (en) * | 2012-11-07 | 2015-02-18 | タツタ電線株式会社 | Bonding wire |
| CN103199073B (en) * | 2013-03-14 | 2015-11-18 | 江西蓝微电子科技有限公司 | Silver palladium alloy single crystal bonding wire and manufacture method thereof |
| CN104377185A (en) * | 2014-01-17 | 2015-02-25 | 江西蓝微电子科技有限公司 | Gold-plated palladium-silver alloy single crystal bonding wire and manufacturing method thereof |
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