CN111599783B - Silver-platinum bonding wire utilizing silver-platinum coating and preparation process thereof - Google Patents
Silver-platinum bonding wire utilizing silver-platinum coating and preparation process thereof Download PDFInfo
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- CN111599783B CN111599783B CN202010260486.8A CN202010260486A CN111599783B CN 111599783 B CN111599783 B CN 111599783B CN 202010260486 A CN202010260486 A CN 202010260486A CN 111599783 B CN111599783 B CN 111599783B
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- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
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- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
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- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
- H01L2224/438—Post-treatment of the connector
- H01L2224/4382—Applying permanent coating, e.g. in-situ coating
- H01L2224/43825—Plating, e.g. electroplating, electroless plating
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
- H01L2224/438—Post-treatment of the connector
- H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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Abstract
The invention belongs to the technical field of alloy wire materials, and particularly relates to a silver-platinum bonding wire utilizing a silver-platinum coating and a preparation process thereof. The silver-platinum bonding wire comprises the components of silver, platinum, tin, manganese and indium; the silver-platinum bonding wire formed by taking metal silver as a substrate and combining metal platinum with higher content can meet the requirements on thrust, tension, mechanical strength and the like, has better electric and thermal conductivity and reliability than the traditional homozygous gold wire, optimizes arc height, reduces breakage rate and meets higher use requirements of customers; the preparation process of the high-quality silver-platinum bonding wire is simple and easy to operate, the cost of the adopted raw materials and equipment is lower than that of the prior art, and the adopted fusion casting, surface activation treatment and platinum-silver alloy plated metal layers are beneficial to forming the bonding wire material with high tensile strength, high ductility and stable arc shape, and the preparation process is suitable for packaging in the microelectronic industry, direct insertion type, surface mounting, high-power LED packaging and triode and IC packaging.
Description
Technical Field
The invention belongs to the technical field of alloy wire materials, and particularly relates to a silver-platinum bonding wire utilizing a silver-platinum coating and a preparation process thereof.
Background
As one of important semiconductor packaging materials, with the upgrading of electronic product technology, the semiconductor packaging industry has been rapidly developed and the scale is continuously increased, and the requirements on the performance of the bonding wire material and the like are more and more stringent, and the bonding wire tends to develop in a high-performance and low-cost manner.
The bonding wire material needs to have excellent chemical properties and physical properties, wherein the chemical properties comprise oxidation resistance, stability, electric and heat conduction properties, electric conduction properties and the like, and the physical properties comprise tensile strength, breaking load, pushing force, pulling force and the like, and the service life.
Most of the traditional technologies adopt bonding alloy materials synthesized by metal gold, but because the cost is expensive and the performance cannot keep up with the development of the application of bonding wire materials, new metal substances are gradually developed to replace pure gold materials.
In the prior art, most copper-based alloys are used as base materials, and doped elements comprise zirconium, scandium, titanium and the like, so that the effects of enhancing the corrosion resistance and improving the mechanical properties of the alloy wire can be achieved, but the copper-based alloys are high in price and stable in chemical properties, so that the corresponding preparation process is complex and is not beneficial to popularization and application.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a silver-platinum bonding wire using a silver-platinum plating layer and a process for manufacturing the same, in which a bonding material based on silver metal and added with platinum metal meets high requirements for mechanical properties, corrosion resistance, high electrical and thermal conductivity, and the like.
The technical content of the invention is as follows:
the invention provides a silver-platinum bonding wire utilizing a silver-platinum coating, which comprises the following components of 86-89% of silver, 5-8% of platinum, 1-2% of tin, 1-2% of manganese and 1-2% of indium;
also comprises one or more than one of other trace elements of 0.01-1% of copper, 0.01-1% of calcium, 0.01-1% of boron and 0.001-1% of lanthanum;
the purity of the silver is more than or equal to 99.99 percent, and the purity of the platinum is more than or equal to 99.99 percent.
The invention also discloses a preparation process of the silver-platinum bonding wire by using the silver-platinum coating, which comprises the following steps:
1) pretreatment of raw materials: cleaning and drying the metal raw material for later use;
2) casting: under the hydrogen atmosphere, taking metal silver and metal platinum for vacuum melting, cooling to 740-800 ℃ after the temperature is 850-900 ℃, doping metal tin, metal manganese, metal indium and other trace elements, and carrying out vacuum melting to obtain a silver-platinum alloy material;
3) rough wire drawing: carrying out coarse wire drawing on the silver-platinum alloy material to obtain a silver-platinum bonding wire with the thickness of 1-5 mm;
4) surface activation treatment: deoxidizing the surface of the silver-platinum bonding wire by adopting a reducing carbon material, and then immersing the silver-platinum bonding wire into a mixed solution of acetic acid and nitric acid for activation treatment;
5) plating: melting metal silver and metal platinum at 1170-1200 ℃ to form electroplating liquid, and plating a silver-platinum alloy plating layer on the surface of the silver-platinum bonding wire;
6) drawing: carrying out wire drawing treatment on the plated silver-platinum bonding wire;
7) annealing the obtained silver-platinum bonding wire, winding and packaging;
the vacuum pressure condition of the vacuum melting in the step 2) is 10-2～10-4Pa, the melting point of the metal material can be reduced by adopting vacuum, the cost is reduced, and the anti-oxidation of the material in the synthesis process is further achieved;
step 4), the reduced carbon material comprises carbon monoxide or activated carbon so as to realize oxygen removal treatment of the molten alloy;
the mixing ratio of the acetic acid to the nitric acid is (4-7): (2-5), wherein the concentration of the acetic acid is 15-20 mol/L, and the concentration of the nitric acid is 5-8 mol/L;
the immersion temperature of the silver platinum bonding wire is 80-110 ℃, the immersion time is 5-10 s, the silver platinum bonding wire is subjected to surface activation treatment, the bonding capability of a metal material is promoted, and the bonding of the next plating process is promoted;
the thickness of the plating layer in the step 5) is 0.5-0.8 mm, and the current density of electroplating is 2.5-6.0A/dm2The electroplating speed is 15-30 m/min;
step 6), the wire drawing treatment comprises middle wire drawing, fine wire drawing and fine wire drawing, wherein the target wire diameter of the middle wire drawing is 0.5-1 mm, the target wire diameter of the fine wire drawing is 0.08-0.3 mm, the target wire diameter of the fine wire drawing is 0.01-0.05 mm, and the wire drawing speed is controlled at 100-300 m/min;
the annealing treatment in the step 7) comprises the steps of adopting a hydrogen-nitrogen mixed gas as an annealing atmosphere, placing the silver-platinum bonding wire in a heat treatment furnace, and carrying out continuous uniform annealing at the temperature of 300-350 ℃ and the annealing speed of 45-70 m/min; the wire winding adopts a special wire winding machine, the bonding wire is wound on a winding shaft with the diameter of two inches in a fixed length mode, and the wire winding speed is controlled to be 70-80 m/min.
The melting temperature of the silver and platinum is 1170-1200 ℃, the melting temperature of the doped other elements is 740-800 ℃, and in the temperature range, the internal crystal grains of the silver and platinum alloy can form an ordered structure, so that the doped other elements can form a uniform and compact structure in the alloy, and a good crystal grain structure appearance is formed.
Compared with the prior art, the invention has the following beneficial effects:
according to the high-quality silver-platinum bonding wire, the metal silver is used as a substrate, the metal platinum with high content is combined to form the silver-platinum bonding wire, the metal tin is doped, so that the melting point of a silver alloy material can be reduced, the feasibility of the process is improved, the plasticity of the bonding material can be improved, the melting point is reduced, the cost of the preparation process is reduced, the extensibility of the bonding material can be improved by doping the metal tin, the stability of the bonding process is improved, and other doped trace elements contribute to the stability of the internal structure of the bonding material; the silver-platinum bonding wire can meet the requirements on thrust, tension, mechanical strength and the like, has better electric and thermal conductivity and reliability than the traditional homozygous gold wire, optimizes arc height, reduces breakage rate and meets higher use requirements of customers;
the preparation process of the silver-platinum bonding wire is simple and easy to operate, the cost of the adopted raw materials and equipment is lower than that of the prior art, the adopted fusion casting, surface activation treatment and platinum-silver alloy plated metal layer are beneficial to forming the bonding wire material with high tensile strength, high ductility and stable arc shape, the manufacturing cost is reduced to a certain extent, and the obtained bonding material is suitable for packaging in the microelectronic industry, direct insertion type, surface mounting, high-power LED packaging and triode and IC packaging.
Detailed Description
The present invention is described in further detail in the following detailed description with reference to specific embodiments, which are intended to be illustrative only and not to be limiting of the scope of the invention, as various equivalent modifications of the invention will become apparent to those skilled in the art after reading the present invention and are intended to be included within the scope of the appended claims.
All the raw materials and reagents of the invention are conventional market raw materials and reagents unless otherwise specified.
Example 1
A preparation process of a silver-platinum bonding wire by using a silver-platinum coating comprises the following steps:
1) pretreatment of raw materials: cleaning and drying the metal raw material for later use;
2) casting: under the hydrogen atmosphere, 78% of metal silver Ag and 6% of metal platinum Pt are taken for vacuum melting, the temperature is 850 ℃, then the temperature is reduced to 740 ℃, 1% of metal tin Sn, 1.58% of metal manganese Mn, 1.72% of metal indium In and other trace elements of 1% of metal copper Cu, 0.5% of metal calcium Ca and 0.2% of metal boron B are doped, and the silver platinum alloy material is obtained by vacuum melting at constant temperature;
3) rough wire drawing: carrying out coarse wire drawing on the silver-platinum alloy material to obtain a 1mm silver-platinum bonding wire;
4) surface activation treatment: deoxidizing the surface of the silver-platinum bonding wire by adopting a reducing carbon material, and then immersing the silver-platinum bonding wire into a mixed solution of 15mol/L acetic acid and 5mol/L nitric acid for activation treatment, wherein the mixing ratio is 4:2, the immersion temperature of the silver-platinum bonding wire is 80-110 ℃, and the immersion time is 5-10 s;
5) plating: melting 8% of metal silver Ag and 2% of metal platinum Pt at 1170 ℃ to form electroplating solution, and plating a silver-platinum alloy plating layer on the surface of the silver-platinum bonding wire, wherein the current density of electroplating is 2.5A/dm2The electroplating speed is 15m/min, and the thickness of the plating layer is 0.5 mm;
6) drawing: carrying out wire drawing treatment on the plated silver-platinum bonding wire;
7) and annealing the obtained silver-platinum bonding wire, winding and packaging.
Example 2
A preparation process of a silver-platinum bonding wire by using a silver-platinum coating comprises the following steps:
1) pretreatment of raw materials: cleaning and drying the metal raw material for later use;
2) casting: in the hydrogen atmosphere, 79% of metal silver Ag and 5.5% of metal platinum Pt are taken for vacuum melting, the temperature is 860 ℃, then the temperature is reduced to 750 ℃, 1.25% of metal tin Sn, 2% of metal manganese Mn, 1.45% of metal indium In and other trace elements, namely 0.3% of metal boron B and 1% of metal lanthanum La are doped, and the silver-platinum alloy material is obtained by vacuum melting at constant temperature;
3) rough wire drawing: carrying out rough wire drawing on the silver-platinum alloy material to obtain a 2mm silver-platinum bonding wire;
4) surface activation treatment: deoxidizing the surface of the silver-platinum bonding wire by adopting a reducing carbon material, and then immersing the silver-platinum bonding wire into a mixed solution of 16mol/L acetic acid and 6mol/L nitric acid for activation treatment, wherein the mixing ratio is 6:4, the immersion temperature of the silver-platinum bonding wire is 80-110 ℃, and the immersion time is 5-10 s;
5) plating: melting 8% of metal silver Ag and 1.5% of metal platinum Pt at 1180 ℃ to form electroplating solution, and plating a silver-platinum alloy coating on the surface of the silver-platinum bonding wire, wherein the electroplating current density is 3A/dm2The electroplating speed is 16m/min, and the thickness of the plating layer is 0.6 mm;
6) drawing: carrying out wire drawing treatment on the plated silver-platinum bonding wire;
7) and annealing the obtained silver-platinum bonding wire, winding and packaging.
Example 3
A preparation process of a silver-platinum bonding wire by using a silver-platinum coating comprises the following steps:
1) pretreatment of raw materials: cleaning and drying the metal raw material for later use;
2) casting: in the hydrogen atmosphere, 80% of metallic silver Ag and 5% of metallic platinum Pt are taken for vacuum melting, the temperature is 865 ℃, then the temperature is reduced to 750 ℃, 1.6% of metallic tin Sn, 2% of metallic manganese Mn, 1.45% of metallic indium In and other trace elements, 0.27% of metallic calcium Ca and 0.5% of metallic lanthanum La are doped, and the silver-platinum alloy material is obtained by vacuum melting at constant temperature;
3) rough wire drawing: carrying out coarse wire drawing on the silver-platinum alloy material to obtain a silver-platinum bonding wire with the thickness of 3 mm;
4) surface activation treatment: deoxidizing the surface of the silver-platinum bonding wire by adopting a reducing carbon material, and then immersing the silver-platinum bonding wire into a mixed solution of 18mol/L acetic acid and 6mol/L nitric acid for activation treatment, wherein the mixing ratio is 5:3, the immersion temperature of the silver-platinum bonding wire is 80-110 ℃, and the immersion time is 5-10 s;
5) plating: melting 8% of metal silver Ag and 1% of metal platinum Pt at 1190 deg.C to form electroplating solution, and plating silver-platinum alloy coating on the surface of silver-platinum bonding wire with electroplating current density of 4.0A/dm2The electroplating speed is 25m/min, and the thickness of the plating layer is 0.7 mm;
6) drawing: carrying out wire drawing treatment on the plated silver-platinum bonding wire;
7) and annealing the obtained silver-platinum bonding wire, winding and packaging.
Example 4
A preparation process of a silver-platinum bonding wire by using a silver-platinum coating comprises the following steps:
1) pretreatment of raw materials: cleaning and drying the metal raw material for later use;
2) casting: in a hydrogen atmosphere, taking 80% of metal silver Ag and 4% of metal platinum Pt for vacuum melting, cooling to 775 ℃, doping with 2% of metal tin Sn, 1.85% of metal manganese Mn, 1% of metal indium In and other trace elements of 0.33% of Cu, 0.77% of metal calcium Ca, 0.55% of metal boron B and 0.5% of metal lanthanum La, and carrying out vacuum melting at a constant temperature to obtain a silver-platinum alloy material;
3) rough wire drawing: carrying out coarse wire drawing on the silver-platinum alloy material to obtain a silver-platinum bonding wire with the thickness of 4 mm;
4) surface activation treatment: deoxidizing the surface of the silver-platinum bonding wire by adopting a reducing carbon material, and then immersing the silver-platinum bonding wire into a mixed solution of 18mol/L acetic acid and 8mol/L nitric acid for activation treatment, wherein the mixing ratio is 4:4, the immersion temperature of the silver-platinum bonding wire is 80-110 ℃, and the immersion time is 5-10 s;
5) plating: melting 8% of metal silver Ag and 1% of metal platinum Pt at 1200 deg.C to form electroplating solution, and plating silver-platinum alloy coating on the surface of silver-platinum bonding wire with electroplating current density of 5.0A/dm2The electroplating speed is 28m/min, and the thickness of the plating layer is 0.8 mm;
6) drawing: carrying out wire drawing treatment on the plated silver-platinum bonding wire;
7) and annealing the obtained silver-platinum bonding wire, winding and packaging.
Example 5
A preparation process of a silver-platinum bonding wire by using a silver-platinum coating comprises the following steps:
1) pretreatment of raw materials: cleaning and drying the metal raw material for later use;
2) casting: in a hydrogen atmosphere, taking 80% of metal silver Ag and 4% of metal platinum Pt for vacuum melting, cooling to 800 ℃ after the temperature is 900 ℃, doping 1.75% of metal tin Sn, 1% of metal manganese Mn, 1.6% of metal indium In and other trace elements, namely 0.25% of metal copper Cu, 0.32% of metal calcium Ca and 0.08% of metal lanthanum La, and carrying out vacuum melting at a constant temperature to obtain a silver-platinum alloy material;
3) rough wire drawing: carrying out rough wire drawing on the silver-platinum alloy material to obtain a 5mm silver-platinum bonding wire;
4) surface activation treatment: deoxidizing the surface of the silver-platinum bonding wire by adopting a reducing carbon material, and then immersing the silver-platinum bonding wire into a mixed solution of 20mol/L acetic acid and 8mol/L nitric acid for activation treatment, wherein the mixing ratio is 7:5, the immersion temperature of the silver-platinum bonding wire is 110 ℃, and the immersion time is 10 s;
5) plating: melting 9% of metal silver Ag and 2% of metal platinum Pt at 1200 deg.C to form electroplating solution, and plating silver-platinum alloy coating on the surface of silver-platinum bonding wire with electroplating current density of 6.0A/dm2The electroplating speed is 30m/min, and the thickness of the plating layer is 0.8 mm;
6) drawing: carrying out wire drawing treatment on the plated silver-platinum bonding wire;
7) and annealing the obtained silver-platinum bonding wire, winding and packaging.
The vacuum pressure of the vacuum melting in the step 2) is 10-2～10-4Pa；
The wire drawing treatment in the step 6) comprises middle wire drawing, fine wire drawing and fine wire drawing, wherein the target wire diameter of the middle wire drawing is 0.5-1 mm, the target wire diameter of the fine wire drawing is 0.08-0.3 mm, the target wire diameter of the fine wire drawing is 0.01-0.05 mm, the wire drawing speed is controlled at 100-300 m/min, and the specific target wire diameter, the wire drawing speed and other operations can be adjusted by technicians in the field according to actual conditions;
the annealing treatment in the step 7) comprises the steps of adopting a hydrogen-nitrogen mixed gas as an annealing atmosphere, placing the silver-platinum bonding wire in a heat treatment furnace, and carrying out continuous uniform annealing at the temperature of 300-350 ℃ and the annealing speed of 45-70 m/min; the wire winding adopts a special wire winding machine, the bonding wire is wound on a winding shaft with the diameter of two inches in a fixed length mode, the wire winding speed is controlled to be 70-80 m/min, and all the technical personnel in the field can adjust the wire winding speed according to actual operation.
The silver-platinum bonding wires obtained in examples 1 to 5 were subjected to the following tests:
1. thrust test
An alloy wire with the wire diameter phi of 0.023mm is taken for testing, and a thruster is adopted for testing.
The standard of the positive pole thrust standard is set to be more than or equal to 30cN according to requirements, and the actual positive pole thrust value is shown in Table 1 (unit: cN).
TABLE 1 actual positive thrust value
| Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | |
| For the first time | 49.18 | 49.69 | 50.33 | 51.77 | 50.68 |
| For the second time | 49.65 | 50.46 | 51.12 | 50.45 | 51.23 |
| The third time | 49.77 | 49.68 | 51.34 | 52.13 | 50.78 |
As can be seen from table 1, the positive thrust of the silver-platinum bonding wires prepared in embodiments 1 to 5 of the present invention is far greater than the standard, and can meet the requirements of practical applications of products.
The standard of the negative thrust standard is set to be more than or equal to 35cN according to the actual requirement, and the actual negative thrust value is shown in Table 1 (unit: cN).
TABLE 2 actual cathode thrust values
| Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | |
| For the first time | 52.63 | 51.74 | 52.24 | 51.64 | 53.08 |
| For the second time | 53.48 | 51.58 | 51.87 | 52.41 | 52.77 |
| The third time | 52.99 | 52.13 | 51.42 | 52.10 | 52.49 |
As can be seen from table 1, the positive thrust of the silver-platinum bonding wires prepared in embodiments 1 to 5 of the present invention is far greater than the standard, and can meet the requirements of practical applications of products.
2. Mechanical Property test
The silver-platinum bonding wires of examples 1 to 5 were subjected to tests of mechanical strength and diffraction rate, and the results were as follows:
TABLE 3 mechanical Property data
Wherein the standard value of the mechanical strength is more than or equal to 6cN, and the standard of the elongation is 4-13%.
2. Product durability test
Carrying out cold and heat shock on the synthesized silver-platinum bonding wire for 500 rounds, wherein the cold and heat shock conditions are that the synthesized silver-platinum bonding wire is firstly kept for 15min at the high temperature of 100 ℃, kept for 5min at normal temperature and kept for 15min at the low temperature of-40 ℃, and the LED does not have the problem of lamp death;
qualified standard is 300 rounds cold and hot impact lamp that does not die, if appear after exceeding 300 rounds cold and hot impact lamp that dies, accords with practical application's service standard promptly, and under the lamp condition of not appearing dying, anti cold and hot impact round number is more, and the wire rod quality is better.
Therefore, the silver-platinum bonding wire can meet the requirements on thrust, tension, mechanical strength and the like, has better electric conduction, thermal conduction and reliability compared with the traditional homozygous gold wire, optimizes arc height, reduces breakage rate to meet higher use requirements of customers, and is suitable for packaging in the microelectronic industry, direct insertion type, surface mounting, high-power and other LED packaging and triode and IC packaging.
Claims (5)
1. A preparation process of a silver-platinum bonding wire by using a silver-platinum coating is characterized by comprising the following steps:
1) pretreatment of raw materials: cleaning and drying the metal raw material for later use;
2) casting: under the hydrogen atmosphere, taking metal silver and metal platinum for vacuum melting, cooling to 740-800 ℃ after the temperature is 850-900 ℃, doping metal tin, metal manganese, metal indium and other trace elements, and carrying out vacuum melting to obtain a silver-platinum alloy material;
3) rough wire drawing: carrying out coarse wire drawing on the silver-platinum alloy material to obtain a silver-platinum bonding wire with the thickness of 1-5 mm;
4) surface activation treatment: deoxidizing the surface of the silver-platinum bonding wire by adopting a reducing carbon material, and then immersing the silver-platinum bonding wire into a mixed solution of acetic acid and nitric acid for activation treatment;
the immersion temperature of the silver-platinum bonding wire is 80-110 ℃, and the immersion time is 5-10 s;
5) plating: melting metal silver and metal platinum at 1170-1200 ℃ to form electroplating liquid, and plating a silver-platinum alloy plating layer on the surface of the silver-platinum bonding wire;
the thickness of the plating layer is 0.5-0.8 mm, the current density of electroplating is 2.5-6.0A/dm 2, and the electroplating speed is 15-30 m/min;
6) drawing: carrying out wire drawing treatment on the plated silver-platinum bonding wire;
the wire drawing treatment comprises medium wire drawing, fine wire drawing and fine wire drawing, wherein the target wire diameter of the medium wire drawing is 0.5-1 mm, the target wire diameter of the fine wire drawing is 0.08-0.3 mm, the target wire diameter of the fine wire drawing is 0.01-0.05 mm, and the wire drawing speed of the wire drawing is controlled at 100-300 m/min;
7) annealing, winding and packaging the obtained silver-platinum bonding wire;
and (3) adopting a hydrogen-nitrogen mixed gas as an annealing atmosphere, placing the silver-platinum bonding wire in a heat treatment furnace, and carrying out continuous uniform annealing at the temperature of 300-350 ℃ and the annealing speed of 45-70 m/min.
2. The process for preparing a silver-platinum bonding wire by using a silver-platinum coating according to claim 1, wherein the mixing ratio of the acetic acid to the nitric acid in the step 4) is (4-7): (2-5), the concentration of the acetic acid is 15-20 mol/L, and the concentration of the nitric acid is 5-8 mol/L.
3. The process for preparing a silver-platinum bonding wire using a silver-platinum coating according to claim 1, wherein the silver-platinum bonding wire comprises 86-89% of silver, 5-8% of platinum, 1-2% of tin, 1-2% of manganese, and 1-2% of indium.
4. The process for preparing a silver-platinum bonding wire with a silver-platinum coating according to claim 1, wherein the silver-platinum bonding wire further comprises one or more of 0.01-1% of other trace elements such as copper, 0.01-1% of calcium, 0.01-1% of boron and 0.001-1% of lanthanum.
5. The process for preparing silver-platinum bonding wire using silver-platinum coating according to claim 1, wherein the purity of silver is not less than 99.99%, and the purity of platinum is not less than 99.99%.
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Denomination of invention: A silver platinum bonding wire using silver platinum coating and its preparation process Effective date of registration: 20221013 Granted publication date: 20220517 Pledgee: Guangzhou Caold financing Company limited by guarantee Pledgor: GUANGDONG JIABO ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2022980018175 |