CN114318051B - Multilayer annular bonding wire made of different materials and preparation method thereof - Google Patents
Multilayer annular bonding wire made of different materials and preparation method thereof Download PDFInfo
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Abstract
The invention relates to the technical field of bonding wires, and discloses a multi-layer annular bonding wire made of different materials, which consists of a wire core and a plurality of alloy layers arranged on the wire core, wherein the wire core contains Cu, au, ag and Pt, and the alloy layers contain Cu, au, ag, pt, al, ti, pd, si and B. Compared with the bonding wire with the existing single structure, the alloy layer has the advantages that the ratio difference between elements in all layers from inside to outside is smaller, the alloying degree is higher and higher, the strength is increased layer by layer, but the ratio of the wire core is far higher than the sum of all alloy layers, the alloy layer is equivalent to the reinforcing coating of the wire core, the stretching of the bonding wire is not influenced, the strength of the alloy layer is high, the ductility of the wire core is good when the bonding wire is stretched, and the two factors act together, so that the bonding wire with good internal and external uniformity, few surface microscopic defects and stable performance can be prepared.
Description
Technical Field
The invention relates to the technical field of bonding wires, in particular to a multi-layer annular bonding wire made of different materials and a preparation method thereof.
Background
The bonding wire is used as an important packaging material, and has high precision requirements on various indexes. The bonding wire is formed through a multistage drawing and casting process, for example, a bar is drawn from 8mm to 1mm through single-mode rough drawing, 25-30 dies are needed, each batch lasts for 2.5-3.5 hours, the bonding wire belongs to cold working, and the alloy is required to have enough strength and ductility.
The existing bonding wire is of a homogeneous structure of single alloy, the stretching characteristics are close to those of main element metal, the stretching performance can be estimated in the earlier component design, but the condition that the stress concentration or the stress deviation can be inevitably generated due to the fact that the blank is uniformly stressed everywhere on equipment in the long-time stretching and casting process cannot be guaranteed, when the abnormal stretching condition occurs, the stress on the outer part and the inner part of the blank is uneven, and the local overstretching condition can occur due to the alloy structure of the inner part and the outer part of the blank, so that microcracks are generated, and the performance of the bonding wire is affected.
Disclosure of Invention
In order to solve the problems, the invention provides a multi-layer annular bonding wire made of different materials, which consists of a bonding wire core and a multi-layer annular alloy layer taking the center of the wire core as the common center, wherein the wire core consists of four elements of Cu, au, ag and Pt, and the alloy layer consists of Cu, au, ag, pt, al, ti, pd, si and B. The wire core comprises the following elements in percentage by weight: cu 5-95%, au 2-10%, ag 2-90% and Pt 1-5%, the alloy layer comprises Cu 5-95%, au 2-10%, ag 2-90%, pt 1-5%, al 0.2-5%, ti 0.1-3%, pd 0.5-2%, si 0.1-1% and B0.1-0.5%.
The multi-layer annular bonding wire can be divided into copper bonding wires or silver bonding wires by core elements of the wire core. When the copper bonding wire is used, the composition of each element of the wire core is as follows: 70-95% of Cu, 2-10% of Au, 2-8% of Ag and 1-5% of Pt, wherein the content of Cu is reduced layer by layer, and the content of Au and Ag is increased layer by layer; when the silver bonding wire is used, the composition of each element of the wire core is as follows: cu 5-30%, au 2-10%, ag 45-90% and Pt 1-5%, and the content of Au and Ag is increased layer by layer from the alloy layer outside the wire core.
The alloy layer of the multilayer annular bonding wire is 2-5 layers, and the ratio of the outer layer is lower, specifically:
the alloy layer is 2 layers, the weight ratio of the wire core is 88-92%, the weight ratio of the inner alloy layer is 5-9%, and the weight ratio of the outer alloy layer is 1-5%;
the alloy layer is 3 layers, the weight ratio of the wire core is 76-84%, the weight ratio of the inner alloy layer is 7-15%, the weight ratio of the middle alloy layer is 2-10%, and the weight ratio of the outer alloy layer is 1-5%;
the alloy layer is 4 layers, the weight ratio of the wire core is 65-70%, the weight ratio of the inner layer alloy layer is 12-18%, the weight ratio of the secondary inner layer alloy layer is 5-10%, the weight ratio of the secondary outer layer alloy layer is 3-7%, and the weight ratio of the outer layer alloy layer is 1-3%;
the alloy layer is 5 layers, the weight ratio of the wire core is 58-62%, the weight ratio of the inner layer alloy layer is 16-20%, the weight ratio of the secondary inner layer alloy layer is 10-15%, the weight ratio of the middle layer alloy layer is 2-10%, the weight ratio of the secondary outer layer alloy layer is 2-4%, and the weight ratio of the outer layer alloy layer is 1-2%.
In the conventional bonding wire with a single structure, in the long-time fine drawing process, the linear speeds of the inner and the surface of the bonding wire are asynchronous due to the difference of the tensile forces exerted on the inner and the outer parts of the bonding wire, and the surface is easy to generate microscopic defects due to the friction force between the surface of the bonding wire and equipment. Compared with the bonding wire with the existing single structure, the alloy layer has the advantages that the ratio difference between elements in all layers from inside to outside is smaller, the alloying degree is higher and higher, the strength is increased layer by layer, but the ratio of the wire core is far higher than the sum of all alloy layers, the alloy layer is equivalent to the reinforcing coating of the wire core, the stretching of the bonding wire is not influenced, the strength of the alloy layer is high, the ductility of the wire core is good when the bonding wire is stretched, and the two factors act together, so that the bonding wire with good internal and external uniformity, few surface microscopic defects and stable performance can be prepared.
The preparation method of the multilayer annular bonding wire comprises the following steps: 1) Preparing alloy raw material mixtures according to the alloy proportion of the wire core and the alloy layer, drying at 60-80 ℃ for 2-4 hours, and respectively placing into a vacuum melting furnace for melting for later use; 2) Respectively linking each melting furnace to an injection molding machine with an annular discharge hole, and performing injection molding to obtain an alloy column blank with a multilayer annular structure; 3) Extruding the alloy column blank obtained in the step 2) into a cylindrical ingot with the diameter of 40-80mm and the length of 200-300mm at the temperature of 200-450 ℃ and the speed of 20-100mm/min under the protection of inert gas; 4) And 3) cold-drawing the cylindrical ingot obtained in the step 3) to the required fineness.
Detailed Description
The invention is described below in connection with examples which are given solely for the purpose of illustration and are not intended to limit the scope of the invention.
Example 1
The two-layer annular copper core bonding wire consists of an inner wire core and an outer 2-layer annular alloy layer, wherein the wire core (marked 0), the inner alloy layer (marked 1) and the outer alloy layer (marked 2) are composed of the following elements in percentage by weight:
example 2
The three-layer annular copper core bonding wire consists of an inner wire core and an outer 3-layer annular alloy layer, wherein the wire core (marked 0), the inner alloy layer (marked 1), the intermediate layer-by-layer alloy layer (marked 2) and the outer alloy layer (marked 3) are composed of the following elements in percentage by weight:
example 3
A four-layer annular copper core bonding wire consists of an inner wire core and an outer 4-layer annular alloy layer, wherein the wire core (marked 0), the inner alloy layer (marked 1), the secondary inner alloy layer (marked 2), the secondary outer alloy layer (marked 3) and the outer alloy layer (marked 4) are composed of the following elements in percentage by weight:
example 4
A five-layer annular copper core bonding wire consists of an inner wire core and an outer 5-layer annular alloy layer, wherein the wire core (marked 0), an inner alloy layer (marked 1), a secondary inner alloy layer (marked 2), an intermediate alloy layer (marked 3), a secondary outer alloy layer (marked 4) and an outer alloy layer (marked 5) are formed by the following elements in percentage by weight:
example 5
The two-layer annular silver core bonding wire consists of an inner wire core and an outer 2-layer annular alloy layer, wherein the wire core (marked 0), the inner alloy layer (marked 1) and the outer alloy layer (marked 2) are composed of the following elements in percentage by weight:
example 6
The three-layer annular silver core bonding wire consists of an inner wire core and an outer 3-layer annular alloy layer, wherein the wire core (marked 0), the inner alloy layer (marked 1), the intermediate layer alloy layer (marked 2) and the outer alloy layer (marked 3) are composed of the following elements in percentage by weight:
example 7
A four-layer annular silver core bonding wire consists of an inner wire core and an outer 4-layer annular alloy layer, wherein the wire core (marked 0), the inner alloy layer (marked 1), the secondary inner alloy layer (marked 2), the secondary outer alloy layer (marked 3) and the outer alloy layer (marked 4) are composed of the following elements in percentage by weight:
example 8
A five-layer annular silver core bonding wire consists of an inner wire core and an outer 5-layer annular alloy layer, wherein the wire core (marked 0), an inner alloy layer (marked 1), a secondary inner alloy layer (marked 2), an intermediate alloy layer (marked 3), a secondary outer alloy layer (marked 4) and an outer alloy layer (marked 5) are formed by the following elements in percentage by weight:
the preparation of the multilayer annular bonding wire of examples 1-8 included the following steps: 1) Preparing alloy raw material mixtures according to the alloy proportion of the wire core and the alloy layer, drying at 60-80 ℃ for 2-4 hours, and respectively placing into a vacuum melting furnace for melting for later use; 2) Respectively linking each melting furnace to an injection molding machine with an annular discharge hole, and performing injection molding to obtain an alloy column blank with a multilayer annular structure; 3) Extruding the alloy column blank obtained in the step 2) into a cylindrical ingot with the diameter of 40-80mm and the length of 200-300mm at the temperature of 200-450 ℃ and the speed of 20-100mm/min under the protection of inert gas; 4) And 3) cold-drawing the cylindrical ingot obtained in the step 3) to the required fineness.
Comparative examples 1-8 are the cores of examples 1-8, respectively, prepared by: preparing alloy raw material mixture according to a proportion, drying at 60-80 ℃ for 2-4 hours, and then placing into a vacuum melting furnace for melting for later use; 2) Linking a melting furnace with an injection molding machine, and performing injection molding to obtain an alloy column blank; 3) Extruding the alloy column blank obtained in the step 2) into a cylindrical ingot with the diameter of 40-80mm and the length of 200-300mm at the temperature of 200-450 ℃ and the speed of 20-100mm/min under the protection of inert gas; 4) And 3) cold-drawing the cylindrical ingot obtained in the step 3) to the required fineness.
The bonding wires obtained in examples 1 to 8 and comparative examples 1 to 8 were subjected to a stretching experiment, and the detection results are shown in Table 1.
TABLE 1 mechanical property test results of bonding wires obtained in examples 1-8 and comparative examples 1-8
As can be seen from the data in table 1, the tensile force increases significantly for the multi-layered annular bonding wire compared to the wire core, and the greater the number of layers, the greater the tensile force increases, but the limited degree of elongation decreases. Therefore, the multilayer annular bonding wire has stable stretchability and high surface strength during drawing and casting, and reduces the probability of micro-cracks caused by abnormal surface stretching during drawing and casting.
The foregoing description of the preferred embodiments of the invention is not intended to limit the invention to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the invention are intended to be included within the scope of the invention.
Claims (2)
1. The five-layer annular silver core bonding wire is characterized by comprising a wire core, an inner layer alloy layer, a secondary inner layer alloy layer, an intermediate layer alloy layer, a secondary outer layer alloy layer and an outer layer alloy layer from inside to outside;
the wire core, the inner layer alloy layer, the secondary inner layer alloy layer, the middle layer alloy layer, the secondary outer layer alloy layer and the outer layer alloy layer comprise the following elements in percentage by weight:
wire core: cu 10%, au 2%, ag 87%, pt 1%;
inner alloy layer: 16% of Cu, 4% of Au, 76% of Ag, 1.5% of Pt, 1% of Al, 0.5% of Ti, 0.5% of Pd, 0.3% of Si and 0.2% of B;
secondary inner layer alloy layer: cu 19%, au 6%, ag 68%, pt 2%, al 2%, ti 1%, pd 1%, si 0.5%, B0.5%;
an intermediate layer alloy layer: 24% of Cu, 7% of Au, 60% of Ag, 3% of Pt, 2.5% of Al, 1.5% of Ti, 1% of Pd, 0.6% of Si and 0.4% of B;
secondary outer alloy layer: 27% of Cu, 8% of Au, 53% of Ag, 4% of Pt, 3% of Al, 2.5% of Ti, 1.5% of Pd, 0.7% of Si and 0.3% of B;
an outer alloy layer: 30% of Cu, 10% of Au, 45% of Ag, 5% of Pt, 4% of Al, 3% of Ti, 2% of Pd, 0.5% of Si and 0.5% of B;
the weight ratio of the wire core, the inner layer alloy layer, the secondary inner layer alloy layer, the middle layer alloy layer, the secondary outer layer alloy layer and the outer layer alloy layer in the five-layer annular silver core bonding wire is respectively as follows: 60% of a wire core, 17% of an inner layer alloy layer, 12% of a secondary inner layer alloy layer, 7% of an intermediate layer alloy layer, 3% of a secondary outer layer alloy layer and 1% of an outer layer alloy layer;
the preparation method of the five-layer annular silver core bonding wire comprises the following steps:
1) Preparing alloy raw material mixtures according to the alloy proportion of the wire cores and the alloy layers, drying at 60-80 ℃ for 2-4 hours, and respectively placing into a vacuum melting furnace for melting for later use;
2) Respectively linking each melting furnace to an injection molding machine with an annular discharge hole, and performing injection molding to obtain an alloy column blank with a multi-layer annular structure;
3) Extruding the alloy column blank obtained in the step 2) into a cylindrical ingot with the diameter of 40-80mm and the length of 200-300mm at the temperature of 200-450 ℃ and the speed of 20-100mm/min under the protection of inert gas;
4) And 3) cold-drawing the cylindrical ingot obtained in the step 3) to the required fineness.
2. A method of making a five-layer annular silver core bonding wire as claimed in claim 1, comprising the steps of:
1) Preparing alloy raw material mixtures according to the alloy proportion of the wire cores and the alloy layers, drying at 60-80 ℃ for 2-4 hours, and respectively placing into a vacuum melting furnace for melting for later use;
2) Respectively linking each melting furnace to an injection molding machine with an annular discharge hole, and performing injection molding to obtain an alloy column blank with a multi-layer annular structure;
3) Extruding the alloy column blank obtained in the step 2) into a cylindrical ingot with the diameter of 40-80mm and the length of 200-300mm at the temperature of 200-450 ℃ and the speed of 20-100mm/min under the protection of inert gas;
4) And 3) cold-drawing the cylindrical ingot obtained in the step 3) to the required fineness.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5985127B1 (en) * | 2015-06-15 | 2016-09-06 | 日鉄住金マイクロメタル株式会社 | Bonding wires for semiconductor devices |
| CN111081670A (en) * | 2019-12-18 | 2020-04-28 | 浙江大学 | Low-cost silver-based bonding alloy wire and preparation method and application thereof |
| JP2020174185A (en) * | 2015-07-23 | 2020-10-22 | 日鉄マイクロメタル株式会社 | Bonding wire for semiconductor device |
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| US7969021B2 (en) * | 2000-09-18 | 2011-06-28 | Nippon Steel Corporation | Bonding wire for semiconductor device and method for producing the same |
| KR101016158B1 (en) * | 2005-01-05 | 2011-02-17 | 신닛테츠 마테리알즈 가부시키가이샤 | Bonding wire for semiconductor device |
| US8815019B2 (en) * | 2009-03-17 | 2014-08-26 | Nippon Steel & Sumikin Materials., Ltd. | Bonding wire for semiconductor |
| EP3147938A4 (en) * | 2015-07-23 | 2017-06-14 | Nippon Micrometal Corporation | Bonding wire for semiconductor device |
| CN111599783B (en) * | 2020-04-03 | 2022-05-17 | 广东佳博电子科技有限公司 | Silver-platinum bonding wire utilizing silver-platinum coating and preparation process thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5985127B1 (en) * | 2015-06-15 | 2016-09-06 | 日鉄住金マイクロメタル株式会社 | Bonding wires for semiconductor devices |
| JP2020174185A (en) * | 2015-07-23 | 2020-10-22 | 日鉄マイクロメタル株式会社 | Bonding wire for semiconductor device |
| CN111081670A (en) * | 2019-12-18 | 2020-04-28 | 浙江大学 | Low-cost silver-based bonding alloy wire and preparation method and application thereof |
Non-Patent Citations (1)
| Title |
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| 电子封装用铜及银键合丝研究进展;梁爽;黄福祥;彭成;钟明君;吴保安;唐会毅;;功能材料(第05期);全文 * |
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