CN115109908A - Preparation method of compact gold bonding wire - Google Patents
Preparation method of compact gold bonding wire Download PDFInfo
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- CN115109908A CN115109908A CN202210348160.XA CN202210348160A CN115109908A CN 115109908 A CN115109908 A CN 115109908A CN 202210348160 A CN202210348160 A CN 202210348160A CN 115109908 A CN115109908 A CN 115109908A
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- gold bonding
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- 229910052737 gold Inorganic materials 0.000 title claims abstract description 31
- 239000010931 gold Substances 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims abstract description 6
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910001961 silver nitrate Inorganic materials 0.000 claims abstract description 15
- 239000000839 emulsion Substances 0.000 claims abstract description 13
- 238000005406 washing Methods 0.000 claims abstract description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000000137 annealing Methods 0.000 claims abstract description 8
- 238000001035 drying Methods 0.000 claims abstract description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 5
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 150000001299 aldehydes Chemical class 0.000 claims description 11
- 239000000956 alloy Substances 0.000 claims description 11
- 229910045601 alloy Inorganic materials 0.000 claims description 11
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 claims description 10
- 229920002125 Sokalan® Polymers 0.000 claims description 7
- 239000004584 polyacrylic acid Substances 0.000 claims description 7
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 5
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- 239000008103 glucose Substances 0.000 claims description 5
- 229910001020 Au alloy Inorganic materials 0.000 claims description 4
- 239000003353 gold alloy Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 2
- 239000003513 alkali Substances 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 abstract description 11
- 239000004332 silver Substances 0.000 abstract description 9
- 238000005266 casting Methods 0.000 abstract description 8
- -1 silver ions Chemical class 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 abstract description 3
- 230000008021 deposition Effects 0.000 abstract description 3
- 239000007888 film coating Substances 0.000 abstract description 2
- 238000009501 film coating Methods 0.000 abstract description 2
- 230000035484 reaction time Effects 0.000 abstract description 2
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 abstract 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 239000000243 solution Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 239000002243 precursor Substances 0.000 description 5
- 230000014759 maintenance of location Effects 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000010622 cold drawing Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
- C21D8/06—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of rods or wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C1/00—Manufacture of metal sheets, metal wire, metal rods, metal tubes by drawing
- B21C1/003—Drawing materials of special alloys so far as the composition of the alloy requires or permits special drawing methods or sequences
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C43/00—Devices for cleaning metal products combined with or specially adapted for use with machines or apparatus provided for in this subclass
- B21C43/02—Devices for cleaning metal products combined with or specially adapted for use with machines or apparatus provided for in this subclass combined with or specially adapted for use in connection with drawing or winding machines or apparatus
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1632—Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1637—Composition of the substrate metallic substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/168—Control of temperature, e.g. temperature of bath, substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Abstract
The invention discloses a preparation method of a compact gold bonding wire, which comprises the following steps: annealing the semi-finished gold bonding wire with the diameter of 0.1-0.2mm, then guiding the semi-finished gold bonding wire into a primary superfine drawing container added with silver nitrate aqueous emulsion to draw the wire to 0.07-0.15mm to obtain primary superfine drawn wire, guiding the wire into a secondary superfine drawing container added with aldehyde dilute solution to draw the wire to 0.03-0.1mm, washing the wire with water to obtain secondary superfine drawn wire, heating the wire to 200-350 ℃ under the protection of nitrogen, then annealing, washing the wire with water and drying to obtain the gold bonding wire. According to the method, the silver ion deposition reaction is carried out when the bonding wire is finally formed by drawing and casting, the reaction time is long, the reaction condition is mild, the micro cracks can be fully filled by the reaction after the silver ions are infiltrated into the micro cracks of the bonding wire, the bonding wire with better compactness is prepared, and the problem that the micro cracks still exist under the coating of the bonding wire prepared by a film coating method is solved.
Description
Technical Field
The invention relates to the technical field of bonding wires, in particular to a preparation method of a compact gold bonding wire.
Background
The bonding wire is used as an important packaging material, and has high precision requirements on various indexes of the bonding wire. The last forming of the bonding wire is mostly drawing and casting forming, the existing bonding wire is mostly a homogeneous structure of single alloy, and the surface of the bonding wire with uneven internal and external stress can generate micro cracks during drawing.
The method mainly comprises two schemes for solving the problem of microcracks generated in the bonding wire forming process, wherein one scheme is to reduce the number of cold drawing and reduce the probability of microcracks from the probability; one is to perform a remedy, such as plating or tempering, after the molding. Chinese patent CN 114086021 a discloses a method for rapid directional casting of bonding wires, which adopts a process for reducing the number of times of multistage cold-drawing forming to achieve the purpose of rapid forming. However, the method cannot use the traditional bonding wire forming equipment, the investment cost is high on the premise, and a new process needs to be explored again. Chinese patent CN 110164776A discloses a method for manufacturing a protective coating of a bonding wire, which comprises drawing a precursor from 450-550 μm to 10-50 μm, and then depositing a film by laser induction to realize densification of the precursor after cold drawing. However, the coating is deposited on the surface layer of the precursor after the precursor is formed by laser induction, and the micro cracks of the precursor cannot be filled, so that the surface of the prepared bonding wire finished product is compact, but the micro cracks still exist under the coating.
Disclosure of Invention
Aiming at the problems, the invention provides a preparation method of a compact gold bonding wire, which comprises the following steps:
1) melting a gold bonding wire alloy, preparing a gold alloy ingot with a fixed size, and performing rough drawing, medium drawing and fine drawing on the gold alloy ingot to prepare a semi-finished wire with the diameter of 0.1-0.2 mm;
2) annealing the semi-finished wire obtained in the step 1), guiding the semi-finished wire into a first-stage superfine drawing container for primary superfine drawing, and drawing the wire to the diameter of 0.07-0.15mm to obtain a first-stage superfine drawn wire, adding silver nitrate aqueous emulsion into the first-stage superfine drawing container, and drying the first-stage superfine drawn wire at 50-70 ℃ after being guided out from the first-stage superfine drawing container;
3) guiding the primary superfine drawn wire dried in the step 2) into a secondary superfine drawing container, carrying out superfine drawing again, further drawing to 0.03-0.1mm, adding a dilute solution of aldehyde into the secondary superfine drawing container, guiding out the secondary superfine drawing container, and washing with water to obtain a secondary superfine drawn wire;
4) and (3) heating the secondary superfine wire obtained in the step 3) to 200-350 ℃ under the protection of nitrogen, annealing, washing with water after acid washing, and drying to obtain the compact gold bonding wire.
The method of the invention aims at the micro-crack prevention treatment of the semi-finished wire of the gold bonding wire in the superfine drawing step, so the gold bonding wire with the gold content not less than 85 wt% can be used as long as the bonding wire taking gold as the main alloy is applied by the method.
The principle of preparing the compact gold bonding wire is that the conventional superfine drawing is divided into a first-stage superfine drawing step and a second-stage superfine drawing step, the water-based emulsion of silver nitrate in a container of the first-stage superfine drawing step comprises 65-87 wt% of deionized water, 8-20 wt% of silver nitrate and 5-15 wt% of polyacrylic acid, silver ions can permeate into micro cracks generated in the process of drawing the semi-finished wire to 0.07-0.15mm, and the semi-finished wire can be sealed by the polyacrylic acid after being dried; and adding an aldehyde dilute solution into the secondary superfine drawing container, wherein the aldehyde dilute solution is an alkali solution of acetaldehyde and glucose, the concentration is 3-10 wt%, the pH value is 8-10, in the secondary superfine drawing process, polyacrylic acid can be dissolved again, and silver ions can be reduced into simple substance silver in the reducing aldehyde alkaline solution at a proper temperature to be deposited, so that the microcracks are filled.
The invention realizes that silver ions are reduced into simple substance silver in microcracks to deposit by controlling the conditions of primary superfine drawing and secondary superfine drawing: the residence time in the first-stage superfine drawing container is 10-20min, and the residence time in the second-stage superfine drawing container is 15-60 min; the temperature of the silver nitrate water-based emulsion is constant at 30-50 ℃, and the temperature of the aldehyde dilute solution is constant at 50-80 ℃.
According to the method, the silver ion deposition reaction is carried out when the bonding wire is finally formed by drawing and casting, the reaction time is long, the reaction condition is mild, the micro cracks can be fully filled by the reaction after the silver ions are infiltrated into the micro cracks of the bonding wire, the bonding wire with better compactness is prepared, and the problem that the micro cracks still exist under the coating of the bonding wire prepared by a film coating method is solved. In addition, the method can be partially improved on the basis of the existing bonding wire production line, and the equipment modification can be completed by adding a silver ion sizing pool on the final drawing and casting equipment and then connecting a deposition reaction pool and auxiliary washing and drying equipment.
Drawings
FIG. 1 is a schematic view of an alternative structure of a first-stage ultra-fine drawing container and a second-stage ultra-fine drawing container used in the present invention.
Reference numbers in the figures: 1. a first-stage superfine drawing container, a second-stage superfine drawing container, and 3 a guide roller.
Detailed Description
The present invention is described below with reference to examples, which are provided for illustration only and are not intended to limit the scope of the present invention.
Example 1
A method for preparing a compact gold bonding wire comprises the following alloy components: au 87%, Cu 10%, Ag 2% and Pt 1%, adopting the existing drawing and casting process to roughly draw, middle-drawn and fine-drawn the alloy ingot to prepare a semi-finished wire with the diameter of 0.2mm, annealing and guiding the semi-finished wire into a first-level superfine drawing container (1), wherein the first-level superfine drawing container (1) is 80cm high, 60cm wide, 60cm long and 200cm long, and is provided with a plurality of guide rollers (3) filled with silver nitrate water-based emulsion, and the alloy ingot drawing device is composed of: 80 wt% of deionized water, 10 wt% of silver nitrate and 10 wt% of polyacrylic acid, wherein the temperature of the emulsion is 45 ℃; and (2) enabling the semi-finished wire to pass through each roller, controlling the speed difference among the rollers, drawing the semi-finished wire to be 0.1mm, enabling the semi-finished wire to stay for 20min totally, drying the semi-finished wire after the semi-finished wire is taken out of a primary superfine drawing container (1) by using nitrogen at 60 ℃, guiding the semi-finished wire into a secondary superfine drawing container (2), enabling the secondary superfine drawing container (2) to be 80cm high, 60cm wide, 60cm long and 200cm long, arranging a plurality of guide rollers (3), containing dilute aldehyde solution which is 5 wt% of acetaldehyde and glucose in a mass ratio of 1:3, adding sodium hydroxide to adjust the pH value to be 9, controlling the temperature to be 70 ℃, controlling the speed difference among the rollers, further drawing the semi-finished wire to be 0.05mm, enabling the total stay time to be 40min, taking the semi-finished wire out of the secondary superfine drawing container (2), washing the semi-finished wire with water, heating the semi-finished wire under the protection of nitrogen to be 300 ℃, annealing after washing with 3% dilute hydrochloric acid, and drying to obtain the compact gold bonding wire.
Example 2
A method for preparing a compact gold bonding wire comprises the following alloy components: au of 90 percent, Cu of 5 percent, Ag of 4 percent and Pt of 1 percent, adopting the prior casting process to carry out rough drawing, middle drawing and fine drawing on the alloy ingot to prepare a semi-finished wire with the diameter of 0.15mm, adopting the equipment of the embodiment 1, and the water-based emulsion of silver nitrate in the first-stage superfine drawing container (1) comprises the following components: 70 wt% of deionized water, 20 wt% of silver nitrate and 10 wt% of polyacrylic acid, wherein the emulsion temperature is 50 ℃, the mixture is drawn to 0.1mm in a first-stage superfine drawing container (1), and the total retention time is 10 min; the dilute solution of aldehyde in the secondary ultra-fine drawing container (2) is a 15 wt% aqueous solution of acetaldehyde and glucose with the mass ratio of 1:1, sodium hydroxide is added to adjust the pH value to 10, the temperature is 50 ℃, the drawing is carried out to 0.06mm, and the retention time is 60 min.
Example 3
A method for preparing a compact gold bonding wire comprises the following alloy components: au 90%, Ag 3%, Cu 1.5%, Pt 1%, Al 1.5%, Pd 1%, Ti 1%, Si 0.5% and B0.5%, roughly drawing, middle drawing and fine drawing the alloy ingot by adopting the prior drawing and casting process to prepare a semi-finished wire with the diameter of 0.1mm, and adopting the equipment of example 1, wherein the aqueous emulsion of silver nitrate in the first-stage ultra-fine drawing container (1) comprises the following components: 65 wt% of deionized water, 20 wt% of silver nitrate and 15 wt% of polyacrylic acid, wherein the emulsion temperature is 30 ℃, the mixture is drawn to 0.07mm in a first-stage superfine drawing container (1), and the total retention time is 15 min; the dilute solution of aldehyde in the secondary ultra-fine drawing container (2) is an 8 wt% aqueous solution of acetaldehyde and glucose with the mass ratio of 1:2, sodium hydroxide is added to adjust the pH to 8, the temperature is 80 ℃, the fine drawing is carried out to 0.04mm, and the retention time is 15 min.
Comparative examples 1-3 are semi-finished wires of examples 1-3, respectively, directly ultra-fine drawn to gold bonding wires of corresponding diameters.
The results of testing the gold bonding wires obtained in examples 1 to 3 and comparative examples 1 to 3 are shown in table 1. The data in table 1 show that, compared with the traditional method, the fineness of the gold bonding wire prepared by the method is improved to a certain extent, which indicates that the method can deposit silver ions on the surface of the gold bonding wire through reaction, and the mechanical property of the gold bonding wire obtained by the method is also improved to a certain extent, which indicates that the deposited silver simple substance is filled in the microcracks, and the tensile strength and the elongation property of the gold bonding wire are enhanced.
TABLE 1 test results of gold bonding wires of examples 1-3 and comparative examples 1-3
| Breaking force B.L (gf) | Elongation percentage EL (%) | Fineness (D) | |
| Example 1 | 40.33 | 14.84 | 2.8554 |
| Comparative example 1 | 37.62 | 14.15 | 2.6207 |
| Example 2 | 52.07 | 17.55 | 4.7157 |
| Comparative example 2 | 47.68 | 16.42 | 4.5534 |
| Example 3 | 32.84 | 12.33 | 2.1495 |
| Comparative example 3 | 27.95 | 11.86 | 2.0311 |
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the scope of the present invention, which is intended to cover any modifications, equivalents, improvements, etc. within the spirit and scope of the present invention.
Claims (6)
1. A preparation method of a compact gold bonding wire is characterized by comprising the following steps:
1) melting the gold bonding wire alloy, preparing a gold alloy ingot with a fixed size, and performing rough drawing, intermediate drawing and fine drawing on the gold alloy ingot to prepare a semi-finished wire with the diameter of 0.1-0.2 mm;
2) annealing the semi-finished wire obtained in the step 1), guiding the semi-finished wire into a first-stage superfine drawing container for primary superfine drawing, and drawing the wire to the diameter of 0.07-0.15mm to obtain a first-stage superfine drawn wire, adding silver nitrate aqueous emulsion into the first-stage superfine drawing container, and drying the first-stage superfine drawn wire at 50-70 ℃ after being guided out from the first-stage superfine drawing container;
3) guiding the primary superfine drawn wire dried in the step 2) into a secondary superfine drawing container, carrying out superfine drawing again, further drawing to 0.03-0.1mm, adding a dilute solution of aldehyde into the secondary superfine drawing container, guiding out the secondary superfine drawing container, and washing with water to obtain a secondary superfine drawn wire;
4) and (3) heating the secondary superfine wire obtained in the step 3) to 200-350 ℃ under the protection of nitrogen, annealing, washing with water after acid washing, and drying to obtain the compact gold bonding wire.
2. The method of claim 1, wherein the gold content of the gold bonding wire is not less than 85 wt%.
3. The method according to claim 1 or 2, characterized in that the composition of the aqueous emulsion of silver nitrate comprises the following components in weight ratio: 65-87% of deionized water, 8-20% of silver nitrate and 5-15% of polyacrylic acid.
4. The method according to claim 1 or 2, wherein the dilute solution of aldehyde is an alkali solution of acetaldehyde and glucose, having a concentration of 3 wt% to 10 wt%, and having a pH of 8 to 10.
5. The method according to claim 1 or 2, wherein the residence time in the primary ultrafine-drawing vessel is 10-20 min; the residence time in the second-stage superfine drawing container is 15-60 min.
6. The process according to claim 1 or 2, characterized in that the temperature of the aqueous emulsion of silver nitrate is constant between 30 and 50 ℃ and the temperature of the dilute solution of aldehyde is constant between 50 and 80 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210348160.XA CN115109908B (en) | 2022-03-31 | 2022-03-31 | Preparation method of compact gold bonding wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210348160.XA CN115109908B (en) | 2022-03-31 | 2022-03-31 | Preparation method of compact gold bonding wire |
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| CN101667566A (en) * | 2009-09-20 | 2010-03-10 | 宁波康强电子股份有限公司 | Gold-coated-sliver base bonding silk thread and manufacture method thereof |
| CN101707194A (en) * | 2009-11-11 | 2010-05-12 | 宁波康强电子股份有限公司 | Palladium-plated bonded copper wire and production method thereof |
| CN104862678A (en) * | 2015-04-23 | 2015-08-26 | 丽水学院 | Chemical silver plating solution for microhole filling |
| CN104862677A (en) * | 2015-05-13 | 2015-08-26 | 电子科技大学 | Method for achieving chemical nickel plating by activating surface of PCB |
| CN105586795A (en) * | 2014-11-10 | 2016-05-18 | 弘德产业株式会社 | Steel cord for rubber reinforcement and method for manufacturing the same |
| CN111326491A (en) * | 2020-02-13 | 2020-06-23 | 河南理工大学 | Gold-plated bonding aluminum wire and preparation method thereof |
| CN210936489U (en) * | 2019-07-24 | 2020-07-07 | 宁波耐美嘉新材料有限公司 | Be applied to mould subassembly that metal was drawn |
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| CN101667566A (en) * | 2009-09-20 | 2010-03-10 | 宁波康强电子股份有限公司 | Gold-coated-sliver base bonding silk thread and manufacture method thereof |
| CN101707194A (en) * | 2009-11-11 | 2010-05-12 | 宁波康强电子股份有限公司 | Palladium-plated bonded copper wire and production method thereof |
| CN105586795A (en) * | 2014-11-10 | 2016-05-18 | 弘德产业株式会社 | Steel cord for rubber reinforcement and method for manufacturing the same |
| CN104862678A (en) * | 2015-04-23 | 2015-08-26 | 丽水学院 | Chemical silver plating solution for microhole filling |
| CN104862677A (en) * | 2015-05-13 | 2015-08-26 | 电子科技大学 | Method for achieving chemical nickel plating by activating surface of PCB |
| CN210936489U (en) * | 2019-07-24 | 2020-07-07 | 宁波耐美嘉新材料有限公司 | Be applied to mould subassembly that metal was drawn |
| CN111326491A (en) * | 2020-02-13 | 2020-06-23 | 河南理工大学 | Gold-plated bonding aluminum wire and preparation method thereof |
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