CN105428257A - 一种针对大尺寸rfid标签倒封装工艺 - Google Patents
一种针对大尺寸rfid标签倒封装工艺 Download PDFInfo
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- CN105428257A CN105428257A CN201510922620.5A CN201510922620A CN105428257A CN 105428257 A CN105428257 A CN 105428257A CN 201510922620 A CN201510922620 A CN 201510922620A CN 105428257 A CN105428257 A CN 105428257A
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- 238000012536 packaging technology Methods 0.000 title abstract 2
- 239000003292 glue Substances 0.000 claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 238000007731 hot pressing Methods 0.000 claims abstract description 18
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- 238000005516 engineering process Methods 0.000 abstract description 5
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/03—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
Abstract
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CN201510922620.5A CN105428257B (zh) | 2015-12-11 | 2015-12-11 | 一种针对大尺寸rfid标签倒封装工艺 |
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CN201510922620.5A CN105428257B (zh) | 2015-12-11 | 2015-12-11 | 一种针对大尺寸rfid标签倒封装工艺 |
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CN105428257A true CN105428257A (zh) | 2016-03-23 |
CN105428257B CN105428257B (zh) | 2017-10-20 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108039330A (zh) * | 2017-10-26 | 2018-05-15 | 东莞智得电子制品有限公司 | Led料盘自动化组装的控制方法及系统 |
CN113257719A (zh) * | 2021-06-15 | 2021-08-13 | 中科长光精拓智能装备(苏州)有限公司 | 封装装置及其封装方法 |
CN115511034A (zh) * | 2022-09-09 | 2022-12-23 | 深圳市建和智能卡技术有限公司 | 一种双芯片超高频rfid电子标签生产方法 |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080174435A1 (en) * | 2007-01-23 | 2008-07-24 | Wen-Cheng Yin | RFID assembly |
CN101961701A (zh) * | 2010-09-08 | 2011-02-02 | 中国科学院长春光学精密机械与物理研究所 | 射频电子标签封装过程中的预点胶控制装置 |
US20110024036A1 (en) * | 2009-07-28 | 2011-02-03 | Ask S.A. | Radio frequency identification device support for hybrid card and its manufacturing method |
CN102324393A (zh) * | 2011-09-19 | 2012-01-18 | 广东宝丽华服装有限公司 | 大幅面张装rfid倒装贴片方法及装置 |
CN202695395U (zh) * | 2011-04-22 | 2013-01-23 | 深圳才纳半导体设备有限公司 | Rfid标签封装热压装置 |
CN103295035A (zh) * | 2013-05-08 | 2013-09-11 | 华中科技大学 | 一种rfid电子标签在线检测方法及装置 |
CN103434134A (zh) * | 2013-08-12 | 2013-12-11 | 华中科技大学 | 一种用于rfid标签封装的热压头 |
CN103730333A (zh) * | 2013-12-23 | 2014-04-16 | 华中科技大学 | 一种多顶针芯片剥离装置 |
CN103721893A (zh) * | 2013-12-16 | 2014-04-16 | 华中科技大学 | 一种用于rfid标签生产的点胶控制系统 |
CN104369408A (zh) * | 2014-10-13 | 2015-02-25 | 华中科技大学 | 一种制备超高频rfid标签的热压固化装置 |
CN104681468A (zh) * | 2015-02-11 | 2015-06-03 | 上海博应信息技术有限公司 | 一种rfid电子标签倒封装热压装置 |
JP2015170246A (ja) * | 2014-03-10 | 2015-09-28 | 株式会社リコー | Rfidタグ付きパッケージの製造方法、及びrfidタグ付きパッケージ |
JP2015170247A (ja) * | 2014-03-10 | 2015-09-28 | 株式会社リコー | Rfidタグ付きパッケージ、及びrfidタグ付きパッケージの製造方法 |
-
2015
- 2015-12-11 CN CN201510922620.5A patent/CN105428257B/zh active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080174435A1 (en) * | 2007-01-23 | 2008-07-24 | Wen-Cheng Yin | RFID assembly |
US20110024036A1 (en) * | 2009-07-28 | 2011-02-03 | Ask S.A. | Radio frequency identification device support for hybrid card and its manufacturing method |
CN101961701A (zh) * | 2010-09-08 | 2011-02-02 | 中国科学院长春光学精密机械与物理研究所 | 射频电子标签封装过程中的预点胶控制装置 |
CN202695395U (zh) * | 2011-04-22 | 2013-01-23 | 深圳才纳半导体设备有限公司 | Rfid标签封装热压装置 |
CN102324393A (zh) * | 2011-09-19 | 2012-01-18 | 广东宝丽华服装有限公司 | 大幅面张装rfid倒装贴片方法及装置 |
CN103295035A (zh) * | 2013-05-08 | 2013-09-11 | 华中科技大学 | 一种rfid电子标签在线检测方法及装置 |
CN103434134A (zh) * | 2013-08-12 | 2013-12-11 | 华中科技大学 | 一种用于rfid标签封装的热压头 |
CN103721893A (zh) * | 2013-12-16 | 2014-04-16 | 华中科技大学 | 一种用于rfid标签生产的点胶控制系统 |
CN103730333A (zh) * | 2013-12-23 | 2014-04-16 | 华中科技大学 | 一种多顶针芯片剥离装置 |
JP2015170246A (ja) * | 2014-03-10 | 2015-09-28 | 株式会社リコー | Rfidタグ付きパッケージの製造方法、及びrfidタグ付きパッケージ |
JP2015170247A (ja) * | 2014-03-10 | 2015-09-28 | 株式会社リコー | Rfidタグ付きパッケージ、及びrfidタグ付きパッケージの製造方法 |
CN104369408A (zh) * | 2014-10-13 | 2015-02-25 | 华中科技大学 | 一种制备超高频rfid标签的热压固化装置 |
CN104681468A (zh) * | 2015-02-11 | 2015-06-03 | 上海博应信息技术有限公司 | 一种rfid电子标签倒封装热压装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108039330A (zh) * | 2017-10-26 | 2018-05-15 | 东莞智得电子制品有限公司 | Led料盘自动化组装的控制方法及系统 |
CN108039330B (zh) * | 2017-10-26 | 2020-12-22 | 东莞智得电子制品有限公司 | Led料盘自动化组装的控制方法及系统 |
CN113257719A (zh) * | 2021-06-15 | 2021-08-13 | 中科长光精拓智能装备(苏州)有限公司 | 封装装置及其封装方法 |
CN113257719B (zh) * | 2021-06-15 | 2021-09-28 | 中科长光精拓智能装备(苏州)有限公司 | 封装装置及其封装方法 |
CN115511034A (zh) * | 2022-09-09 | 2022-12-23 | 深圳市建和智能卡技术有限公司 | 一种双芯片超高频rfid电子标签生产方法 |
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Address after: 436070 Ezhou Economic Development Zone, Gedian Economic Development Zone, West Renmin Road, No. 6 Patentee after: Hubei huaweike intelligent Limited by Share Ltd Address before: 436070 Ezhou Economic Development Zone, Gedian Economic Development Zone, West Renmin Road, No. 6 Patentee before: HUBEI HUAWEIKE INTELLIGENT TECHNOLOGY CO., LTD. |
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Denomination of invention: Large-size RFID tag inverted packaging technology Effective date of registration: 20180213 Granted publication date: 20171020 Pledgee: Ezhou SME credit Company limited by guarantee Pledgor: Hubei huaweike intelligent Limited by Share Ltd Registration number: 2018420000005 |
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Denomination of invention: Large-size RFID tag inverted packaging technology Effective date of registration: 20190107 Granted publication date: 20171020 Pledgee: Ezhou SME credit Company limited by guarantee Pledgor: Hubei huaweike intelligent Limited by Share Ltd Registration number: 2019420000001 |
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