CN105374726B - 一种封装拾取芯片的定位方法 - Google Patents
一种封装拾取芯片的定位方法 Download PDFInfo
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CN105374726A CN105374726A (zh) | 2016-03-02 |
CN105374726B true CN105374726B (zh) | 2018-02-27 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109449096B (zh) * | 2018-11-08 | 2021-12-03 | 科为升视觉技术(苏州)有限公司 | 识别检测晶元芯片的方法 |
GB2590048B (en) | 2019-03-29 | 2023-08-30 | Sino Ic Tech Co Ltd | Halo test method for an optical chip in an integrated circuit |
CN111816599B (zh) * | 2020-07-14 | 2021-05-18 | 长江存储科技有限责任公司 | 晶粒定位器及晶粒的定位方法 |
CN113451274B (zh) * | 2020-10-28 | 2022-08-05 | 重庆康佳光电技术研究院有限公司 | Led芯片组件、显示面板及制备方法 |
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EP1217654A2 (de) * | 2000-12-22 | 2002-06-26 | Infineon Technologies AG | Verfahren zum Überwachen der Herstellung integrierter Schaltkreise abhängig von einem Wafer zu Waferlayoutversatz, zugehörige Anlagen und zugehöriges Programm |
CN101097905A (zh) * | 2006-06-30 | 2008-01-02 | 富士通株式会社 | 半导体器件及其制造方法 |
CN101964316A (zh) * | 2009-07-24 | 2011-02-02 | 中芯国际集成电路制造(上海)有限公司 | 晶圆测试方法 |
CN104795317A (zh) * | 2015-04-17 | 2015-07-22 | 上海华虹宏力半导体制造有限公司 | 晶圆定位方法 |
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Publication number | Priority date | Publication date | Assignee | Title |
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EP1217654A2 (de) * | 2000-12-22 | 2002-06-26 | Infineon Technologies AG | Verfahren zum Überwachen der Herstellung integrierter Schaltkreise abhängig von einem Wafer zu Waferlayoutversatz, zugehörige Anlagen und zugehöriges Programm |
CN101097905A (zh) * | 2006-06-30 | 2008-01-02 | 富士通株式会社 | 半导体器件及其制造方法 |
CN101964316A (zh) * | 2009-07-24 | 2011-02-02 | 中芯国际集成电路制造(上海)有限公司 | 晶圆测试方法 |
CN104795317A (zh) * | 2015-04-17 | 2015-07-22 | 上海华虹宏力半导体制造有限公司 | 晶圆定位方法 |
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Address after: No. 0611-06, 6 / F, block D, Tsinghua Tongfang science and technology building, No. 1 courtyard, Wangzhuang Road, Haidian District, Beijing 100083 Patentee after: ZIGUANG TONGXIN MICROELECTRONICS CO.,LTD. Address before: 100083 18 floor, West Tower, block D, Tongfang science and Technology Plaza, 1 Wang Zhuang Road, Wudaokou, Haidian District, Beijing. Patentee before: BEIJING TONGFANG MICROELECTRONICS Co.,Ltd. |
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Effective date of registration: 20220927 Address after: In Xinxing Electronic Industrial Park, Yutian County, Tangshan City, Hebei Province, 063000 (west of Yuzun West Road) Patentee after: Tangshan jiezhun core measurement information technology Co.,Ltd. Address before: No. 0611-06, 6 / F, block D, Tsinghua Tongfang science and technology building, No. 1 courtyard, Wangzhuang Road, Haidian District, Beijing 100083 Patentee before: ZIGUANG TONGXIN MICROELECTRONICS CO.,LTD. |