CN105336832B - 一种led灯丝 - Google Patents
一种led灯丝 Download PDFInfo
- Publication number
- CN105336832B CN105336832B CN201510633662.7A CN201510633662A CN105336832B CN 105336832 B CN105336832 B CN 105336832B CN 201510633662 A CN201510633662 A CN 201510633662A CN 105336832 B CN105336832 B CN 105336832B
- Authority
- CN
- China
- Prior art keywords
- led
- lamp bar
- glass tube
- led lamp
- transparent glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 241000218202 Coptis Species 0.000 claims abstract description 14
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 14
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- 239000003822 epoxy resin Substances 0.000 claims description 7
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- 229920002379 silicone rubber Polymers 0.000 claims description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 8
- 230000032683 aging Effects 0.000 abstract description 4
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- 241001391944 Commicarpus scandens Species 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 15
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 238000005286 illumination Methods 0.000 description 8
- 238000000605 extraction Methods 0.000 description 6
- 239000000084 colloidal system Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000004020 luminiscence type Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
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- 239000006185 dispersion Substances 0.000 description 3
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- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920001281 polyalkylene Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000010257 thawing Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
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- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- -1 diphenyl ether Diamines Chemical class 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 210000004209 hair Anatomy 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- 239000011342 resin composition Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (7)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510633662.7A CN105336832B (zh) | 2015-09-29 | 2015-09-29 | 一种led灯丝 |
CN201710681761.1A CN107452724B (zh) | 2015-09-29 | 2015-09-29 | 一种led灯丝的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510633662.7A CN105336832B (zh) | 2015-09-29 | 2015-09-29 | 一种led灯丝 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710681761.1A Division CN107452724B (zh) | 2015-09-29 | 2015-09-29 | 一种led灯丝的制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105336832A CN105336832A (zh) | 2016-02-17 |
CN105336832B true CN105336832B (zh) | 2017-09-22 |
Family
ID=55287246
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710681761.1A Active CN107452724B (zh) | 2015-09-29 | 2015-09-29 | 一种led灯丝的制备方法 |
CN201510633662.7A Active CN105336832B (zh) | 2015-09-29 | 2015-09-29 | 一种led灯丝 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710681761.1A Active CN107452724B (zh) | 2015-09-29 | 2015-09-29 | 一种led灯丝的制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (2) | CN107452724B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109860343A (zh) * | 2019-01-03 | 2019-06-07 | 胡春阳 | 一种轻武器荧光管的制备方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106025044B (zh) * | 2016-04-19 | 2019-07-26 | 苏州星烁纳米科技有限公司 | 波长转换器件、背光单元和显示装置 |
CN107492545A (zh) * | 2016-06-09 | 2017-12-19 | 王定锋 | 立体的多面发光的led线路板封装模组及制作方法 |
CN109411589B (zh) * | 2018-09-17 | 2019-08-27 | 旭宇光电(深圳)股份有限公司 | 一种led灯丝 |
CN112467010B (zh) * | 2020-11-13 | 2022-03-22 | 中山市聚明星电子有限公司 | 二极管封装工艺及封装二极管 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102751274A (zh) * | 2012-07-18 | 2012-10-24 | 上海顿格电子贸易有限公司 | 一种立体包覆封装的led芯片 |
CN103545437A (zh) * | 2013-10-11 | 2014-01-29 | 杭州恒诚光电科技有限公司 | 可折弯式led发光元件 |
CN203733792U (zh) * | 2013-12-24 | 2014-07-23 | 深圳市源磊科技有限公司 | Led灯丝 |
CN203733838U (zh) * | 2014-03-03 | 2014-07-23 | 江西联创光电科技股份有限公司 | 全角度发光封装发光二极管 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203771343U (zh) * | 2014-04-08 | 2014-08-13 | 李成学 | 塑料连接底座式超薄led透镜背光灯条 |
CN104157638B (zh) * | 2014-08-27 | 2017-06-13 | 江苏华英光宝科技股份有限公司 | 正装芯片倒装360度发光可任意环绕led灯丝及其制备方法 |
-
2015
- 2015-09-29 CN CN201710681761.1A patent/CN107452724B/zh active Active
- 2015-09-29 CN CN201510633662.7A patent/CN105336832B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102751274A (zh) * | 2012-07-18 | 2012-10-24 | 上海顿格电子贸易有限公司 | 一种立体包覆封装的led芯片 |
CN103545437A (zh) * | 2013-10-11 | 2014-01-29 | 杭州恒诚光电科技有限公司 | 可折弯式led发光元件 |
CN203733792U (zh) * | 2013-12-24 | 2014-07-23 | 深圳市源磊科技有限公司 | Led灯丝 |
CN203733838U (zh) * | 2014-03-03 | 2014-07-23 | 江西联创光电科技股份有限公司 | 全角度发光封装发光二极管 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109860343A (zh) * | 2019-01-03 | 2019-06-07 | 胡春阳 | 一种轻武器荧光管的制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN107452724A (zh) | 2017-12-08 |
CN105336832A (zh) | 2016-02-17 |
CN107452724B (zh) | 2019-06-18 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Lin Jintian Inventor after: Cai Jinlan Inventor after: Li Chao Inventor after: Lu Shufen Inventor after: Zhao Wen Inventor before: Cui Jiamin Inventor before: Wu Jianfeng |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170831 Address after: Sunshine Industrial Park A1 building 7th floor 2-3 No. 518000 Guangdong city of Shenzhen province Baoan District Xixiang Hok Chau Industrial Zone South Applicant after: Xuyu Optoelectronics (Shenzhen) Limited by Share Ltd Address before: The business park of Jianggan District economic and Technological Development Zone in Hangzhou city of Zhejiang Province, 310018 college students of Hangzhou Dianzi University No. 2, room 137 Applicant before: HANGZHOU PAINIAO ELECTRONIC TECHNOLOGY CO., LTD. |
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EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20160217 Assignee: Guangdong Xuyu optoelectronics Co. Ltd. Assignor: Xuyu Optoelectronics (Shenzhen) Limited by Share Ltd Contract record no.: 2018440020053 Denomination of invention: LED lamp filament and illumination device Granted publication date: 20170922 License type: Common License Record date: 20180515 |