CN105319622B - 光学元件阵列和包括该阵列的固态成像装置 - Google Patents

光学元件阵列和包括该阵列的固态成像装置 Download PDF

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Publication number
CN105319622B
CN105319622B CN201510796237.XA CN201510796237A CN105319622B CN 105319622 B CN105319622 B CN 105319622B CN 201510796237 A CN201510796237 A CN 201510796237A CN 105319622 B CN105319622 B CN 105319622B
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China
Prior art keywords
optical element
array
height
along
center
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Expired - Fee Related
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CN201510796237.XA
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English (en)
Chinese (zh)
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CN105319622A (zh
Inventor
川端成
川端一成
伊庭润
和田全平
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Canon Inc
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Canon Inc
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • G02B3/0006Arrays
    • G02B3/0037Arrays characterized by the distribution or form of lenses
    • G02B3/0056Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • G02B3/0006Arrays
    • G02B3/0037Arrays characterized by the distribution or form of lenses
    • G02B3/0043Inhomogeneous or irregular arrays, e.g. varying shape, size, height
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • G02B3/0006Arrays
    • G02B3/0037Arrays characterized by the distribution or form of lenses
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • G02B3/02Simple or compound lenses with non-spherical faces
    • G02B3/04Simple or compound lenses with non-spherical faces with continuous faces that are rotationally symmetrical but deviate from a true sphere, e.g. so called "aspheric" lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/806Optical elements or arrangements associated with the image sensors
    • H10F39/8063Microlenses

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Lenses (AREA)
CN201510796237.XA 2013-06-28 2014-06-27 光学元件阵列和包括该阵列的固态成像装置 Expired - Fee Related CN105319622B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013137050A JP5791664B2 (ja) 2013-06-28 2013-06-28 光学素子アレイ、及び固体撮像装置
JP2013-137050 2013-06-28
CN201410299663.8A CN104252013B (zh) 2013-06-28 2014-06-27 光学元件阵列和包括该阵列的固态成像装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201410299663.8A Division CN104252013B (zh) 2013-06-28 2014-06-27 光学元件阵列和包括该阵列的固态成像装置

Publications (2)

Publication Number Publication Date
CN105319622A CN105319622A (zh) 2016-02-10
CN105319622B true CN105319622B (zh) 2018-06-12

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CN201510796237.XA Expired - Fee Related CN105319622B (zh) 2013-06-28 2014-06-27 光学元件阵列和包括该阵列的固态成像装置
CN201410299663.8A Active CN104252013B (zh) 2013-06-28 2014-06-27 光学元件阵列和包括该阵列的固态成像装置

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US (2) US9285510B2 (enExample)
EP (1) EP2819172B1 (enExample)
JP (1) JP5791664B2 (enExample)
CN (2) CN105319622B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016058538A (ja) * 2014-09-09 2016-04-21 キヤノン株式会社 固体撮像装置およびカメラ
JP6506614B2 (ja) 2015-05-14 2019-04-24 キヤノン株式会社 固体撮像装置およびカメラ
CN110192127B (zh) * 2016-12-05 2021-07-09 弗托斯传感与算法公司 微透镜阵列
JPWO2020122032A1 (ja) * 2018-12-13 2021-10-28 凸版印刷株式会社 固体撮像素子及び固体撮像素子の製造方法
US10777609B1 (en) * 2019-04-01 2020-09-15 Visera Technologies Company Limited Optical devices with light collection elements formed in pixels
JP7353834B2 (ja) 2019-07-12 2023-10-02 キヤノン株式会社 表示装置および表示システム
US12279476B2 (en) 2019-07-12 2025-04-15 Canon Kabushiki Kaisha Light emitting device, exposure system, imaging display device, imaging device, electronic device, and lighting device
JP7711400B2 (ja) 2021-03-15 2025-07-23 オムロン株式会社 表示切替装置

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JPH11317836A (ja) * 1998-02-02 1999-11-16 Sharp Corp 光導波路型縮小光学イメ―ジセンサ
JP2007335723A (ja) * 2006-06-16 2007-12-27 Fujifilm Corp 固体撮像素子用マイクロレンズ及びその製造方法
CN101796443A (zh) * 2007-09-06 2010-08-04 3M创新有限公司 具有提供输出光区域控制的光提取结构的光导装置
CN101820237A (zh) * 2010-03-16 2010-09-01 香港应用科技研究院有限公司 小型光伏装置

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JPH04252579A (ja) 1991-01-28 1992-09-08 Sony Corp 固体撮像装置
JP2000039503A (ja) 1998-07-22 2000-02-08 Matsushita Electric Ind Co Ltd レンズアレイ
JP2002120230A (ja) * 2000-10-13 2002-04-23 Canon Inc マイクロ構造体、及びその作製方法
JP4161602B2 (ja) * 2002-03-27 2008-10-08 セイコーエプソン株式会社 マイクロレンズアレイおよびその製造方法並びに光学装置
JP5031173B2 (ja) * 2003-03-26 2012-09-19 大日本印刷株式会社 撮像装置と撮像装置におけるマイクロレンズの形成方法
JP2004347693A (ja) 2003-05-20 2004-12-09 Seiko Epson Corp マイクロレンズアレイ、空間光変調装置、プロジェクタ及びマイクロレンズアレイの製造方法
JP4796287B2 (ja) * 2004-08-06 2011-10-19 パナソニック株式会社 固体撮像装置
JP4882224B2 (ja) * 2004-11-26 2012-02-22 ソニー株式会社 固体撮像装置の製造方法
KR100693927B1 (ko) * 2005-02-03 2007-03-12 삼성전자주식회사 마이크로 렌즈 제조방법, 마이크로 렌즈 어레이 제조방법및 이미지 센서 제조방법
JP2008244225A (ja) 2007-03-28 2008-10-09 Matsushita Electric Ind Co Ltd 固体撮像装置,グレースケールマスクおよびカラーフィルタならびにマイクロレンズ
US8228606B2 (en) * 2008-01-08 2012-07-24 United Microelectronics Corp. Contiguous microlens array and photomask for defining the same
JP5269454B2 (ja) * 2008-03-25 2013-08-21 株式会社東芝 固体撮像素子
JP5233404B2 (ja) * 2008-05-19 2013-07-10 凸版印刷株式会社 濃度分布マスクの製造方法及びマイクロレンズアレイの製造方法
JP5131164B2 (ja) 2008-11-19 2013-01-30 凸版印刷株式会社 マイクロレンズアレイと濃度分布マスク及びその設計装置
JP2010245202A (ja) 2009-04-03 2010-10-28 Panasonic Corp 固体撮像装置およびその製造方法
JP5365353B2 (ja) 2009-06-08 2013-12-11 凸版印刷株式会社 濃度分布マスク
DE102009049387B4 (de) 2009-10-14 2016-05-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung, Bildverarbeitungsvorrichtung und Verfahren zur optischen Abbildung
JP5591851B2 (ja) * 2012-03-15 2014-09-17 株式会社東芝 固体撮像装置および携帯情報端末

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11317836A (ja) * 1998-02-02 1999-11-16 Sharp Corp 光導波路型縮小光学イメ―ジセンサ
JP2007335723A (ja) * 2006-06-16 2007-12-27 Fujifilm Corp 固体撮像素子用マイクロレンズ及びその製造方法
CN101796443A (zh) * 2007-09-06 2010-08-04 3M创新有限公司 具有提供输出光区域控制的光提取结构的光导装置
CN101820237A (zh) * 2010-03-16 2010-09-01 香港应用科技研究院有限公司 小型光伏装置

Also Published As

Publication number Publication date
JP5791664B2 (ja) 2015-10-07
EP2819172A1 (en) 2014-12-31
EP2819172B1 (en) 2017-03-22
US9599754B2 (en) 2017-03-21
CN105319622A (zh) 2016-02-10
US20150001662A1 (en) 2015-01-01
CN104252013B (zh) 2016-05-25
CN104252013A (zh) 2014-12-31
US20160146981A1 (en) 2016-05-26
JP2015012488A (ja) 2015-01-19
US9285510B2 (en) 2016-03-15

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