CN105308138B - 粘合片、使用该粘合片的半导体装置的制造方法、使用该粘合片的热式空气流量传感器的制造方法、以及热式空气流量传感器 - Google Patents

粘合片、使用该粘合片的半导体装置的制造方法、使用该粘合片的热式空气流量传感器的制造方法、以及热式空气流量传感器 Download PDF

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CN105308138B
CN105308138B CN201480033607.8A CN201480033607A CN105308138B CN 105308138 B CN105308138 B CN 105308138B CN 201480033607 A CN201480033607 A CN 201480033607A CN 105308138 B CN105308138 B CN 105308138B
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bonding sheet
semiconductor element
barrier film
manufacture method
semiconductor
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CN105308138A (zh
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池尾聪
佐川俊文
土井良介
菊地广
椋野秀树
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Hitachi Astemo Ltd
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Hitachi Automotive Systems Ltd
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    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
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Abstract

为提供测量精度得到提高的热式空气流量計及其制造方法、以及其使用的粘合片，本发明的粘合片是相对于一枚被粘合体至少被分割为2枚以上的、厚度大概为0.1mm以下的粘合片，其特征在于，对应于被粘合体的形状而分割粘合片，利用来自外部的能量使粘合性或粘附性产生或增加。

Description

粘合片、使用该粘合片的半导体装置的制造方法、使用该粘合 片的热式空气流量传感器的制造方法、以及热式空气流量传 感器
技术领域
本发明涉及半导体装置的制造方法，尤其涉及适合设置于汽车引擎的吸气系统以检测引擎的吸入空气量的热式空气流量传感器的制造方法、以及热式流量传感器和它们使用的粘合片(adhesive sheet)。
背景技术
以往，作为设置于汽车等的内燃机的空气吸入通路、对吸入空气量进行测定的空气流量传感器，热式的空气流量传感器由于能够直接测定以质量(mass)计量的空气量而成为主流。
最近，利用半导体微加工技术在硅基板上堆积电阻和绝缘层膜后，利用以KOH等为代表的溶剂去除硅基板的一部分以形成薄膜部(Diaphragm；隔膜)的空气流量传感器因具有高速响应性、利用该响应性的速度也能够实施反向流量检测而引人注目。而且近年来，以减少基板部(印刷电路基板、陶瓷基板等)的零件为目的，将上述空气流量传感器安装于引线框架、对其外周部利用树脂进行模塑成型的传递模塑封装(トランスファーモールドパッケージ)的研究正在进行。
另一方面，实施LSI或微机等的半导体电路元件的模塑成型的情况下，电路元件与引线框架往往利用粘合片粘合。粘合片的一般使用方法，是在半导体电路晶圆的状态下在背面侧粘贴粘合片，通过切割工序将其单片化时，粘合片层也同时切断，从而成为半导体电路芯片整个背面粘贴着粘合片的状态。借助于此，能够将单片化后的半导体电路元件原封不动地安装于引线框架上，因此具有能够省去像使用溶剂式粘合剂时那样印刷溶剂的工序这样的优点。
现有技术文献
专利文献
专利文献1：日本特开2001-85360号公报
发明内容
发明要解决的课题
但是，粘合片虽然使用于各种各样的用途，但是在使用于半导体元件的情况下，主要使用于以IC芯片等为代表的、尚未实施背面加工的集成电路芯片，在专利文献1记载的技术中，没有考虑到对半导体元件上形成有隔膜部的物理量传感器进行粘合时特有的问题。下面对该特有的问题进行说明。
尤其是将在半导体元件上形成有薄膜部的热式空气流量传感器安装于支持基板时，若隔膜部背面的区域处于密封状态，则伴随温度变化和压力变化，隔膜部背面的被密封的区域内的空气发生膨胀、收缩，因而体积发生变化。其结果是，隔膜部发生变形，检测空气流量时有可能产生误差。因此，为了不将隔膜部背面的区域密封，考虑例如在安装有半导体元件的支持基板上设置通气口以使空气与外部连通。但是，为了安装具有隔膜部的半导体元件和形成有通气口的支持基板而通过粘合片粘接时，有必要在该粘合片上也设置通气口。专利文献1中，记载了预先在粘贴带上形成切槽，对任意芯片粘贴粘贴带的加工方法，但是对薄半导体晶圆进行加工时以剥离任意芯片为目的，没有设想在形成有隔膜部的半导体元件上粘贴具有通气口的粘合片。因此，在专利文献1中，半导体元件上形成的隔膜部与粘合片所包围的区域就成为密闭状态，检测空气流量时有可能发生误差。
因此，本发明的目的在于，提供能够提高测量精度的热式空气流量計及其制造方法、以及其使用的粘合片。
用于解决问题的手段
为了实现上述目的，本发明的粘合片例如是相对于一枚被粘合体，至少被分割为2枚以上，厚度大概为0.1mm以下的粘合片，所述粘合片构成为，与被粘合体的形状相对应地被分割，利用来自外部的能量使粘合性或粘附性产生或增加。
发明效果
如果采用本发明，则能够提供测量精度得到提高的热式空气流量計及其制造方法、以及其使用的粘合片。
附图说明
图1是本发明的粘合片的切槽分割的概略说明图。
图2是形成有薄膜的半导体元件的概略说明图。
图3是粘贴粘合片的概略说明图。
图4是本发明的粘合片的切槽分割的概略说明图。
图5是粘贴粘合片的概略说明图。
图6是隔膜的概略说明图。
图7是捡拾元件的情况的概略说明图。
图8是通向本发明的粘合片的通气口形成的一实施形态的说明图。
图9是本发明的热式空气流量传感器的一实施形态的说明图。
图10是本发明的热式空气流量传感器的一实施形态的说明图。
图11是模塑成型的概略说明图。
图12是本发明的热式空气流量传感器的一实施形态的说明图。
图13是模塑成型的概略说明图。
图14是将本发明的热式空气流量传感器安装于吸气管道的剖面图。
具体实施方式
实施例1
下面对本发明一实施例即采用了粘合片的通气口形成方法的热式空气流量传感器进行说明。
参照附图对粘合片的通气口形成方法进行说明。图1表示粘合片的切槽分割方法。
图1的(a)表示粘合片102被分割之前的带粘合片的切割蓝膜(dicing tape)101被贴在切割环100上的状态。这时，相当于切割环100与带粘合片的切割蓝膜101的粘贴面的部位，如图1的(b)所示，可以粘贴在粘合片102一侧，也可以如图1的(c)所示，粘贴在切割蓝膜103一侧。
图1的(d)表示在图1的(a)的状态下，利用切割装置实施对粘合片102的切槽分割的状态。如图1的(d)所示，例如以P1、P3的间距实施切割，其后，以P2、P4的间隔实施切割，从而能够将粘合片102切剩在切割蓝膜103上，以尺寸Dx、Dy实施等间距分割。这时可按任意切割顺序进行分割。
图2表示本发明第1实施例的形成有薄膜的半导体元件122。图2的(a)是半导体元件122的平面图，图2的(b)是半导体元件122的剖面图。如图2所示，流量检测元件是在硅等半导体基板122上形成绝缘膜层的叠层结构膜，用氢氧化钾等将半导体基板122的背面侧部分去除以形成隔膜123。
下面利用图1～3对在形成有薄膜123的半导体元件122上粘贴粘合片102的粘贴方法进行说明。图1的(d)所示的切槽间距与图3的(b)所示的半导体元件晶圆200的芯片间距P5、P6对应，使P1＝P2＝P5，P3＝P4＝P6。又，将带粘合片的切割蓝膜103粘贴粘合在半导体元件晶圆200上，以使图1的(d)内的切割剩余尺寸Dx、Dy所包围的区域收容于图2所示的开口区域内。这时，使图1的(d)所示的Dx、Dy尺寸形成Dx＜开口尺寸x，Dy＜开口尺寸y的关系。
借助于此，如图5所示，被分割的粘合片(s)201处于薄膜123正下方，与半导体元件晶圆没有接点，因此与其不粘合。也就是，换句话说，在隔膜123的背面侧的空洞部的区域内通过切割形成有切槽。
图4是粘合片102的切槽分割的概略图。
粘合片102是加热时会软化产生粘性的糊状材料、在热或紫外线、光、电磁波作用下使母材固化的引发剂、以及填料的混合物，在与被粘合体贴在一起的状态下加热，同时施加压力或超声波以增加与被粘合体的接点同时使其粘接固化。通过在糊状材料不具备粘性的状态下实施切割加工，可减小加工时的切削阻力，防止异物附着。对被粘合体加热受到限制的情况下，通过选择引发剂，利用紫外线或光、电磁波使母材固化。填料通过混入硅石微粒增加固化后的強度，通过混入金属微粒使其具备导电性等，提高粘合片102的功能。
在粘合片102的粘贴中，例如组装到半导体装置中的半导体元件122与粘合片102间封入有气泡的情况下，半导体元件122有可能由于气泡的影响而发生倾斜，性能下降。又，由于气泡会因温度变化而膨胀收缩，因此有可能引起使连接部的疲劳，降低半导体装置的耐久性。
在本发明中，在薄膜123的背面侧的空洞部的区域内通过切割形成有切槽，如图8所示，在粘合片102上切割形成的切槽构成通气路径，因此粘贴时气泡不容易卷入粘合面，粘合时粘合片产生的气体容易逃离。
接着，如图6所示，将半导体元件晶圆200单片化。与硅相比，粘合片102在切割加工时切割阻力较大，容易引起切割刀片的堵塞。因此粘合片102的厚度大约取0.1mm以下，防止切割时半导体元件晶圆200背面产生崩碎或粘合片102产生毛刺。
其后，捡拾单片化后的半导体元件122，由此，如图7所示，被分割的粘合片(s)201被留在切割蓝膜上。从而，捡拾起的半导体元件122的背面如图8所示，粘合有被分割的粘合片102，在半导体元件122上的薄膜部正下方，不存在粘合片102，而形成有通气口。
从而，加工不需要像激光加工机那样昂贵的设备，可以共用芯片单片化所使用的切割设备，因此可以不需要专用设备。
又，作为一般的加工方法，考虑采用打孔加工机对切割蓝膜103实施贯通孔加工以形成通气口，但是在形成有薄膜123的半导体晶圆200上粘贴开有贯通孔的切割蓝膜103并进行切割时，担心薄膜123受到破坏。又，也担心孔的周边部发生变形和加工屑的产生。作为另一加工方法，也考虑激光打孔加工，但是担心粘合片厚度的偏差难于应对、孔的周边的热变形及粘合性差，而且担心产生燃烧垃圾。
而本加工方法在加工通气口时可以不在切割蓝膜103上开贯通孔地进行加工，通气口按照切割的加工精度形成，因此能够对于半导体晶圆200内的半导体元件122，以准确的间距设置通气口。又，粘合片102的厚度偏差对加工精度的影响微小，厚度的变动不会导致孔的周边部的变形和突起的产生。而且，加工产生的切削屑利用清洗能够容易地去除。
下面用图9～图11对采用本发明的粘合片102的通气口形成方法的热式空气流量传感器进行说明。图9表示作为热式流量传感器的一实施形态的半导体元件的安装结构。图9的(a)是从横向观察的情况下的剖面图，图9的(b)是从正上方观察的情况下的俯视图。
如图9所示，流量检测元件15构成为，在硅等半导体基板20上形成有绝缘膜层和电阻层的叠层结构膜26，通过利用氢氧化钾(KOH)等部分去除半导体基板20的背面侧，来形成隔膜25。在隔膜25上形成有发热电阻21、上游侧测温电阻22、下游侧测温电阻23。又，在半导体基板20表面形成有电极垫40，通过金线等引线键合部50与半导体基板20的外部实现电连接。该流量检测元件15由粘合片102固定于引线框架10上。
然后在引线框架10上形成以隔膜背面的换气为目的的换气孔11。再在隔膜背面开口端部24与引线框架10上形成的换气孔11一致的区域的一部分(从而，在图9中相当于11的区域)上，形成在粘合片102上形成的换气孔35。
从而，在图9所示的结构体中，隔膜背面能够通过两个个换气孔(11、35)与外部空气连通。
下面利用图10对用树脂通过传递模塑将图9的结构体密封而形成的模塑结构进行说明。图9的结构体的外周部利用模塑树脂60密封，但是在隔膜25的表面侧，形成有以使隔膜25部分地从模塑树脂60露出为目的的开口部61。又，在引线框架10上形成的换气孔11的背面侧上，形成有以换气为目的的开口部62。借助于此，即使在利用模塑树脂60将流量检测元件15和引线框架10密封了的情况下，隔膜25的背面也能够与外部空气连通，能够避免形成密封状态。
下面利用图11对图10说明的模塑结构(以下称为“传递模塑封装”)的制造方法进行说明。
利用模塑树脂60将流量检测元件15模塑成型而成的传递模塑封装，在检测流量时，必须使检测空气流量的隔膜25从模塑树脂60部分露出，曝露于测定介质。作为其实现方法，利用下模80与上模81将安装了流量检测元件15的引线框架10夹入其中。这时，不管是下模80还是上模81，都设置有流入模塑树脂的插入口82。而且为了使隔膜25部分露出，采取将有别于上模81的另一模具即嵌入块83插入上模81的结构，从上部施加负荷使该嵌入块83与流量检测元件15的表面紧贴。又，在下模80形成突起部，以使模塑树脂60不流入引线框架10上形成的换气孔11，使该突起部和引线框架10与包含换气孔11的区域紧贴。在该状态下如果使树脂从插入口82流入，则能够制造图10所示的模塑结构体的半导体封装。
实施例2
以下对采用了实施例1中说明的本发明的粘合片102的通气口形成方法的热式空气流量传感器的第2实施例进行说明。
图12表示热式流量传感器模塑成型之前的半导体元件的安装结构。图12的(a)是从横向观察的情况下的剖面图，图12的(b)是从正上方观察的情况下的俯视图。
如图12所示，与第1实施例不同之处在于，在半导体基板20与引线框架10之间存在作为另一零件的支持基板70。又，在第2实施例中，引线框架10上没有形成换气孔。
作为这样的结构体的优点，在半导体基板20与另一支持构件全面粘合的情况下，在图10所示的、形成于引线框架10上形成的换气孔11背面侧的以换气为目的的开口部62被密封等情况下是有效的。如图12所示，隔着作为另一零件的支持基板70，在隔膜25的背面侧形成的空洞区域上形成换气孔71，在半导体基板20一侧形成换气的另一换气孔72，各换气孔71、72相互之间通过槽73连通，从而能够与半导体基板20一侧换气。
还有，利用图12的说明中，是槽73形成于作为另一零件的支持基板70的结构，但是形成于引线框架10的情况也能够得到相同的效果。
而且在图12所示的结构中，在粘合片102上也形成隔膜25的区域与支持基板70上形成的换气孔71的区域一致的换气孔35，因而隔膜区域25和与半导体基板一侧换气的另一换气孔72能够完全连通。
又，利用图13对用树脂通过传递模塑将图12的结构体密封而形成的模塑结构进行说明。与图10的不同点是，形成于支持基板70的换气孔72也没有被传递模塑树脂所覆盖。因此可以通过换气孔72与外部换气。
又，用图14对换气孔72不是开口于元件背面、而是开口于别的地方的效果进行说明。图14是将图13所示的安装了传递模塑封装的热式空气流量传感器安装于吸气管道5的图。如图14所示，连接器端子8的一端向电路室16延伸，在电路室16内与半导体封装2电连接，另一端向连接器部12的嵌合部延伸，与外部端子电连接。
外壳3由电路室16与连通连接器部12的嵌合部的连通孔9构成。借助于连通孔9，将电路室16与吸气管外连通，防止电路室16被密封。
在这里，支持基板70上形成的换气孔72向与导入吸入气体的旁路通道6不同的空间16(电路室)换气。旁路通道6与电路室16以不连通的方式被隔离开来。又，电路室16通过外壳3上形成的换气孔9与外部空气连通，因此隔膜背面可避免被密封。又，由于旁路通道6与电路室16被隔离，因此流过旁路通道6的油和炭等污物不会堵塞支持基板70上形成的换气孔72，因此可靠性提高。
符号说明
10···引线框架(基板支持构件)
11···引线框架上形成的换气孔
15···流量检测元件
20···半导体基板
21···发热电阻
22···上游侧测温电阻
23···下游侧测温电阻
24···隔膜背面开口端部
25···隔膜
26···绝缘膜层及电阻层的叠层结构膜
27···半导体元件背面外周部
28···隔膜背面开口端到半导体元件背面外周部的最小尺寸
30···粘合片
35···粘合片上形成的换气孔
60···模塑树脂
61···在表面侧形成的模塑开口部
62···在背面侧形成的模塑开口部
70···基板支持构件
71···基板支持构件上形成的换气孔
72···基板支持构件上形成的换气孔
73···连通换气孔(71、72)的槽
102···粘合片
103···切割蓝膜
122···半导体元件(半导体基板)
123···薄膜(隔膜)
124···开口区域
200···半导体元件晶圆
201···被分割的粘合片(s)
202···切割形成的切槽E
203···切割形成的切槽F
210···单片化后的半导体元件
220···捡拾嘴。

Claims (8)

1.一种半导体装置的制造方法，其至少包含利用切割装置将半导体元件晶圆单片化的工序，其中，所述切割装置将具有对半导体基板进行部分地薄壁加工而设置的隔膜的半导体元件晶圆和粘贴有粘合片的切割蓝膜使用于所述半导体元件晶圆的加工中，所述半导体装置的制造方法的特征在于，包括：
在将粘贴有所述粘合片的切割蓝膜上的粘合片粘贴在所述半导体元件晶圆上之前，利用由所述切割装置形成的切槽进行分割，以便以被收容在所述半导体元件晶圆的所述隔膜的背面侧的开口区域内的大小形成切割剩余区域的工序；以及
捡拾单片化后的半导体元件的捡拾工序，
所述半导体装置的制造方法还包括伴随着所述捡拾工序，通过所述切割剩余区域留在所述切割蓝膜上而在所述粘合片上形成通气口的工序。
2.根据权利要求1所述的半导体装置的制造方法，其特征在于，
所述粘合片上设置有至少具有3个以上的边的多边形形状的通气口。
3.根据权利要求1所述的半导体装置的制造方法，其特征在于，
所述粘合片上形成的通气口的最大尺寸比半导体元件的背面的隔膜背面开口尺寸小。
4.根据权利要求2所述的半导体装置的制造方法，其特征在于，
所述粘合片在所形成的所述多边形形状的通气口的各边的延长线上设置有成为通气路径的切槽。
5.一种半导体装置，其特征在于，包括：
半导体元件，其具有半导体基板进行了部分地薄壁化而成的隔膜；
支持构件，其具备换气孔；以及
粘合片，其将所述半导体元件固定在所述支持构件上，
所述粘合片具有被收容在所述隔膜的背面侧的空洞部的开口区域内的大小的通气口，并且在被配置于所述空洞部的区域内的所述粘合片上，形成有切槽，
以所述粘合片的通气口与所述支持构件的换气孔的开口区域连通且将所述隔膜的背面侧的空洞部的一方相对于外部空气开口的方式，隔着所述粘合片将所述半导体元件与所述支持构件粘合。
6.一种热式空气流量传感器的制造方法，其至少包含使用切割装置将半导体元件晶圆分别单片化为流量检测元件的工序，其中，所述切割装置将由多个流量检测元件构成的半导体元件晶圆和粘贴有粘合片的切割蓝膜使用于所述半导体元件晶圆的加工中，所述多个流量检测元件具有对半导体基板进行部分地薄壁加工而设置的隔膜，并在所述隔膜上具备发热电阻及相对于所述发热电阻在空气流的上游侧、下游侧分别设置的测温电阻，
所述热式空气流量传感器的制造方法的特征在于，包括：
在将粘贴有所述粘合片的切割蓝膜上的粘合片粘合于所述半导体元件晶圆之前，利用由所述切割设备形成的切槽进行分割，以便以被收容在所述半导体元件晶圆的所述隔膜的背面侧的开口区域内的大小形成切割剩余区域的工序；
捡拾单片化后的流量检测元件的捡拾工序；
伴随着所述捡拾工序，通过所述切割剩余区域留在所述切割蓝膜上而在所述粘合片上形成通气口的工序；以及
在具备换气孔的支持构件上将捡拾的且在粘合片上形成有通气口的流量检测元件以该换气孔与所述通气口连通的方式进行搭载的工序。
7.根据权利要求6所述的热式空气流量传感器的制造方法，其特征在于，
所述支持构件由引线框架构成。
8.一种热式空气流量传感器，其特征在于，包括：
半导体元件，其具有：半导体基板部分地薄壁化而在背面侧具有空洞部的隔膜、设置于所述隔膜上的发热电阻、和在所述隔膜上且相对于所述发热电阻在空气流的上游侧、下游侧分别设置的测温电阻；
支持构件，其具备换气孔；以及
粘合片，将所述半导体元件固定在所述支持构件上，
所述粘合片具有被收容在所述隔膜的背面侧的空洞部的开口区域内的大小的通气口，并且在被配置于所述空洞部的区域内的所述粘合片上形成有切槽，
以所述粘合片的通气口与所述支持构件的换气孔的开口区域连通且将所述隔膜的背面侧的空洞部的一方相对于外部空气开口的方式，隔着所述粘合片将所述半导体元件与所述支持构件粘合。
CN201480033607.8A 2013-06-13 2014-04-18 粘合片、使用该粘合片的半导体装置的制造方法、使用该粘合片的热式空气流量传感器的制造方法、以及热式空气流量传感器 Active CN105308138B (zh)

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