CN105280793A - Electric-thermal separated, LED chip integrated and high-reflectivity circuit board and manufacture method thereof - Google Patents
Electric-thermal separated, LED chip integrated and high-reflectivity circuit board and manufacture method thereof Download PDFInfo
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- CN105280793A CN105280793A CN201410275362.1A CN201410275362A CN105280793A CN 105280793 A CN105280793 A CN 105280793A CN 201410275362 A CN201410275362 A CN 201410275362A CN 105280793 A CN105280793 A CN 105280793A
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- Prior art keywords
- led chip
- led
- circuit board
- circuit
- separated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The invention relates to an electric-thermal separated, LED chip integrated and high-reflectivity circuit board. The circuit comprises a circuit layer, an insulating layer and a heat radiation layer, the circuit layer, the insulating layer and the heat radiation layer are successively laminated, the circuit layer includes at least one slot communicated to the heat radiation layer, the internal of the slot is filled with a high-conductivity material, one end of the high-conductivity material is connected to the heat radiation layer, the other end of the high-conductivity material is provided with an LED chip, the circuit layer is provided with at least one LED welding point, the LED welding point is arranged outside the slot, poles P and N of the LED chip are connected to the LED welding point via gold threads respectively, and an anode and a cathode are connected with each LED welding point via the circuit layer. The invention also provides a manufacture method of the electric-thermal separated, LED chip integrated and high-reflectivity circuit board.
Description
Technical field
The present invention relates to LED and manufacture field, particularly relate to a kind of LED circuit board.
Background technology
Along with the progress of LED technology, heat radiation becomes the important bottleneck that restriction LED technology continues development.In traditional handicraft, LED-baseplate has and be divided into aluminium lamination, insulating barrier and copper foil layer; Copper and aluminium possess good thermal conductivity as metal material, but due to the existence of insulating barrier, the thermal conductivity of this bi-material reduces greatly, and therefore causing the heat that LED chip produces cannot distribute in time, the long high temperature serious curtailment life-span of LED chip.
Meanwhile, in traditional LED manufacture craft, each LED core all needs to connect after both positive and negative polarity and encapsulates separately, and causing cost of manufacture increases, and positive pole and negative pole can block the light that a part of LED chip sends, and cause luminous efficiency to reduce.
Summary of the invention
Technical problem underlying to be solved by this invention is to provide a kind of LED circuit board, can realize high heat conduction and without the need to encapsulating separately each LED chip, add the luminous efficiency of LED chip.
In order to solve above-mentioned technical problem, the invention provides a kind of electric heating and being separated and the circuit board of integrated LED chip, comprising:
The circuit layer of pressing, insulating barrier and heat dissipating layer successively; Described circuit layer possesses the hole slot that at least one is communicated to heat dissipating layer;
Highly heat-conductive material is filled with in described hole slot; One end of described highly heat-conductive material is connected on described heat dissipating layer; The other end of described highly heat-conductive material is provided with at least one LED chip;
Described circuit layer is provided with at least one LED solder joint, and described LED solder joint is mutually independent and be arranged on the outside of described hole slot; The P pole of described LED chip is connected with described LED solder joint respectively by gold thread with N pole; And
Described circuit layer is also provided with a positive pole and a negative pole, described positive pole is connected with LED solder joint described in each by circuit with negative pole.
In a preferred embodiment: the material of described Heat Conduction Material is plated metal or changes metal.
In a preferred embodiment: the material of described circuit layer is Copper Foil; The material of described insulating barrier is epoxy resin; The material of described heat dissipating layer is aluminium.
In a preferred embodiment: the gap viscose glue between described hole slot and described Heat Conduction Material is filled.
In a preferred embodiment: described LED chip is flip LED chips.
Electric heating is separated and a manufacture method for the circuit board of integrated LED chip, comprises the following steps:
1) traditional handicraft is adopted substrate to be carried out to the printing treatment of circuit layer; Described circuit layer comprises at least one LED solder joint, circuit, a positive pole and a negative pole; Described each LED solder joint is independent mutually, and described positive pole is connected with LED solder joint described in each by circuit with negative pole;
2) on described circuit layer, the hole slot that at least one is communicated to heat dissipating layer is made; The outside of described hole slot is distributed with described LED solder joint;
3) in described hole slot, fill highly heat-conductive material, one end of described highly heat-conductive material is connected with the heat dissipating layer of described substrate;
4) install fixed L ED chip at the other end of described highly heat-conductive material, the P pole of described LED chip is connected with described LED solder joint respectively by gold thread with N pole.
In a preferred embodiment: described hole slot is made by the mode of laser drill.
In a preferred embodiment: described highly heat-conductive material is filled by the mode of deposition.
In a preferred embodiment: described highly heat-conductive material is plated metal or changes metal.
In a preferred embodiment: described LED chip adopts reverse installation process fixed installation.
Compared to prior art, technical scheme of the present invention possesses following beneficial effect:
1. technical scheme provided by the invention achieves electric heating separation, thus is directly delivered in heat dissipating layer by the heat that LED chip produces by highly heat-conductive material, greatly improves heat-conducting effect.
2. in technical scheme provided by the invention, LED chip shares a positive pole and a negative pole, so without the need to encapsulating separately LED chip, has saved cost.It also avoid positive pole and negative pole blocking LED chip luminescence, improve luminous efficiency.
3. in technical scheme provided by the invention, LED chip adopts reverse installation process fixed installation, further increases luminous efficiency.
Accompanying drawing explanation
Fig. 1 is the hierarchical diagram of circuit board in the preferred embodiment of the present invention;
Fig. 2 is the overall structure figure of circuit board in the preferred embodiment of the present invention.
Embodiment
Hereafter the present invention will be further described with embodiment by reference to the accompanying drawings.
With reference to figure 1, Fig. 2.Electric heating is separated and a circuit board for integrated LED chip, comprising:
The circuit layer 1 of pressing, insulating barrier 2 and heat dissipating layer 3 successively; Described circuit layer 1 possesses the hole slot 11 that at least one is communicated to heat dissipating layer 3; In the present embodiment, described circuit layer 1 is Copper Foil, and insulating barrier 2 is epoxy resin, and heat dissipating layer is aluminium.
Be filled with highly heat-conductive material 12 in described hole slot 11, in the present embodiment, described highly heat-conductive material 12 selects electro-coppering; One end of described highly heat-conductive material 12 is connected on described heat dissipating layer 3; The other end of described highly heat-conductive material 12 is provided with at least one LED chip 13; In the present embodiment, described LED chip 13 is flip LED chips.
Described circuit layer is provided with at least one LED solder joint 14, and described LED solder joint arranges 14 in the outside of described hole slot 11, and in the present embodiment, described LED solder joint 14 and described hole slot 11 are in circular distribution; The P pole of described LED chip 13 is connected with described LED solder joint 14 respectively by gold thread 15 with N pole; And
Described circuit layer 1 is also provided with positive pole 16 and a negative pole 17, described positive pole 16 is connected with LED solder joint 14 described in each by circuit with negative pole 17.
Technical scheme provided by the invention achieves electric heating and is separated, thus is directly delivered in heat dissipating layer 3 by highly heat-conductive material 12 by the heat that LED chip produces, and greatly improves heat-conducting effect.In addition LED chip 13 shares a positive pole 16 and a negative pole 17, so without the need to encapsulating separately LED chip 13, saved cost.It also avoid positive pole and negative pole blocking LED chip luminescence, improve luminous efficiency.LED chip 13 adopts reverse installation process to fixedly mount, and further increases luminous efficiency.
Electric heating is separated and a manufacture method for the circuit board of integrated LED chip, comprises the following steps:
1) adopt traditional handicraft substrate to be carried out to the printing treatment of circuit layer 1, specifically comprise printing and the Copper Foil corrosion of circuit layer 1; Described circuit layer 1 comprises at least one LED solder joint 14, circuit, positive pole 16 and a negative pole 17; Described each LED solder joint 14 is independent mutually, and described positive pole 16 is connected with LED solder joint 14 described in each by circuit with negative pole 17;
2) on described circuit layer 1, at least one hole slot 11 being communicated to heat dissipating layer 3 is made; The outside of described hole slot 11 is distributed with described LED solder joint 14; Hole slot 11 described in the present embodiment adopts the mode of laser drill to be made; Described LED solder joint 14 and described hole slot 11 are in circular distribution.
3) in described hole slot 11, fill highly heat-conductive material 12, one end of described highly heat-conductive material 12 is connected with the heat dissipating layer 3 of described substrate; In the present embodiment, described highly heat-conductive material 12 selects electro-coppering, and realizes filling by the mode of deposition.
4) install fixed L ED chip 13 at the other end of described highly heat-conductive material 12, the P pole of described LED chip 13 is connected with described LED solder joint respectively by gold thread 15 with N pole; In the present embodiment, described LED chip 13 adopts the process Installation of upside-down mounting to fix.
The above, be only invention preferred embodiment, not the technical scope of invention imposed any restrictions, therefore every any trickle amendment above example done according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (9)
1. electric heating is separated and a circuit board for integrated LED chip, it is characterized in that comprising:
The circuit layer of pressing, insulating barrier and heat dissipating layer successively; Described circuit layer possesses the hole slot that at least one is communicated to heat dissipating layer;
Highly heat-conductive material is filled with in described hole slot; One end of described highly heat-conductive material is connected on described heat dissipating layer; The other end of described highly heat-conductive material is provided with at least one LED chip;
Described circuit layer is provided with at least one LED solder joint, and described LED solder joint is mutually independent and be arranged on the outside of described hole slot; The P pole of described LED chip is connected with described LED solder joint respectively by gold thread with N pole;
Described circuit layer is also provided with a positive pole and a negative pole, described positive pole is connected with LED solder joint described in each by circuit with negative pole.
2. a kind of electric heating according to claim 1 is separated and the circuit board of integrated LED chip, it is characterized in that: the material of described Heat Conduction Material is plated metal or changes metal.
3. a kind of electric heating according to claim 1 is separated and the circuit board of integrated LED chip, it is characterized in that: the material of described circuit layer is Copper Foil; The material of described insulating barrier is epoxy resin; The material of described heat dissipating layer is aluminium.
4. a kind of electric heating according to claim 1 is separated and the circuit board of integrated LED chip, it is characterized in that: described LED chip is flip LED chips.
5. electric heating is separated and a manufacture method for the circuit board of integrated LED chip, it is characterized in that comprising the following steps:
1) traditional handicraft is adopted substrate to be carried out to the printing treatment of circuit layer; Described circuit layer comprises at least one LED solder joint, circuit, a positive pole and a negative pole; Described each LED solder joint is independent mutually, and described positive pole is connected with LED solder joint described in each by circuit with negative pole;
2) on described circuit layer, the hole slot that at least one is communicated to heat dissipating layer is made; The outside of described hole slot is distributed with described LED solder joint;
3) in described hole slot, fill highly heat-conductive material, one end of described highly heat-conductive material is connected with the heat dissipating layer of described substrate;
4) install fixed L ED chip at the other end of described highly heat-conductive material, the P pole of described LED chip is connected with described LED solder joint respectively by gold thread with N pole.
6. a kind of electric heating according to claim 5 is separated and the manufacture method of the circuit board of integrated LED chip, it is characterized in that: described hole slot is made by the mode of laser drill.
7. a kind of electric heating according to claim 5 is separated and the manufacture method of the circuit board of integrated LED chip, it is characterized in that: described highly heat-conductive material is filled by the mode of deposition.
8. a kind of electric heating according to claim 5 is separated and the manufacture method of the circuit board of integrated LED chip, it is characterized in that: described highly heat-conductive material is plated metal or changes metal.
9. a kind of electric heating according to claim 5 is separated and the manufacture method of the circuit board of integrated LED chip, it is characterized in that: described LED chip adopts reverse installation process fixed installation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410275362.1A CN105280793A (en) | 2014-06-19 | 2014-06-19 | Electric-thermal separated, LED chip integrated and high-reflectivity circuit board and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410275362.1A CN105280793A (en) | 2014-06-19 | 2014-06-19 | Electric-thermal separated, LED chip integrated and high-reflectivity circuit board and manufacture method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN105280793A true CN105280793A (en) | 2016-01-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410275362.1A Pending CN105280793A (en) | 2014-06-19 | 2014-06-19 | Electric-thermal separated, LED chip integrated and high-reflectivity circuit board and manufacture method thereof |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101789480A (en) * | 2010-01-26 | 2010-07-28 | 温二黑 | High heat conduction metal-based circuit board |
| CN102332527A (en) * | 2011-07-22 | 2012-01-25 | 东莞市万丰纳米材料有限公司 | Light source module |
| CN102711367A (en) * | 2012-05-14 | 2012-10-03 | 景旺电子（深圳）有限公司 | Heat-conducting aluminum base plate and manufacturing method of heat-conducting aluminum base plate |
| CN202534680U (en) * | 2012-01-19 | 2012-11-14 | 厦门光莆电子股份有限公司 | Substrate structure of chip on light-emitting diode (LED) panel |
| CN203434195U (en) * | 2013-07-30 | 2014-02-12 | 郑州森源新能源科技有限公司 | Thermoelectricity-separation COB packaging structure |
| CN204011480U (en) * | 2014-06-19 | 2014-12-10 | 厦门汇耕电子工业有限公司 | A kind of electric heating separates the also circuit board of integrated LED chip |
-
2014
- 2014-06-19 CN CN201410275362.1A patent/CN105280793A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101789480A (en) * | 2010-01-26 | 2010-07-28 | 温二黑 | High heat conduction metal-based circuit board |
| CN102332527A (en) * | 2011-07-22 | 2012-01-25 | 东莞市万丰纳米材料有限公司 | Light source module |
| CN202534680U (en) * | 2012-01-19 | 2012-11-14 | 厦门光莆电子股份有限公司 | Substrate structure of chip on light-emitting diode (LED) panel |
| CN102711367A (en) * | 2012-05-14 | 2012-10-03 | 景旺电子（深圳）有限公司 | Heat-conducting aluminum base plate and manufacturing method of heat-conducting aluminum base plate |
| CN203434195U (en) * | 2013-07-30 | 2014-02-12 | 郑州森源新能源科技有限公司 | Thermoelectricity-separation COB packaging structure |
| CN204011480U (en) * | 2014-06-19 | 2014-12-10 | 厦门汇耕电子工业有限公司 | A kind of electric heating separates the also circuit board of integrated LED chip |
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Application publication date: 20160127 |