CN105199615B - 用于使两个基板相结合的方法、结构及装置 - Google Patents

用于使两个基板相结合的方法、结构及装置 Download PDF

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Publication number
CN105199615B
CN105199615B CN201510688638.3A CN201510688638A CN105199615B CN 105199615 B CN105199615 B CN 105199615B CN 201510688638 A CN201510688638 A CN 201510688638A CN 105199615 B CN105199615 B CN 105199615B
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Prior art keywords
substrate
substrates
box dam
adhesive
combined
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Chinese (zh)
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CN105199615A (zh
Inventor
赵春玲
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SUZHOU TONGLI OPTOELECTRONICS Co.,Ltd.
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Suzhou Industrial Park Yusu Electronic Co Ltd
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Priority to CN201510688638.3A priority Critical patent/CN105199615B/zh
Priority to PCT/CN2015/094500 priority patent/WO2017067031A1/fr
Publication of CN105199615A publication Critical patent/CN105199615A/zh
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN201510688638.3A 2015-10-22 2015-10-22 用于使两个基板相结合的方法、结构及装置 Active CN105199615B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201510688638.3A CN105199615B (zh) 2015-10-22 2015-10-22 用于使两个基板相结合的方法、结构及装置
PCT/CN2015/094500 WO2017067031A1 (fr) 2015-10-22 2015-11-13 Procédé, structure et dispositif pour lier deux substrats

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510688638.3A CN105199615B (zh) 2015-10-22 2015-10-22 用于使两个基板相结合的方法、结构及装置

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CN105199615A CN105199615A (zh) 2015-12-30
CN105199615B true CN105199615B (zh) 2018-02-06

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CN (1) CN105199615B (fr)
WO (1) WO2017067031A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111161631A (zh) * 2020-01-14 2020-05-15 重庆烯宇新材料科技有限公司 一种显示器围坝水胶全贴合工艺

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202570485U (zh) * 2012-05-29 2012-12-05 张建宇 一种气囊压力注胶器

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101418985B (zh) * 2008-12-02 2011-04-06 上海海立特种制冷设备有限公司 一种地铁空调钣金件的连接密封工艺
CN102469730B (zh) * 2010-11-16 2014-08-20 富泰华工业(深圳)有限公司 粘接组件及其粘接方法
GB201104675D0 (en) * 2011-03-18 2011-05-04 Aston Martin Lagonda Ltd Methods of forming bonded structures and bonded structures formed thereby
CN102153954B (zh) * 2011-04-11 2013-11-20 福州华映视讯有限公司 多对象的黏合方法及黏合机台
CN102527580A (zh) * 2012-03-09 2012-07-04 深圳市轴心自控技术有限公司 一种全自动高速在线式非接触底部填充机
CN203659924U (zh) * 2013-12-31 2014-06-18 广州市鸿利光电股份有限公司 一种led封装基板
CN204536265U (zh) * 2015-04-17 2015-08-05 杨利平 一次性凝胶板
CN205115359U (zh) * 2015-10-22 2016-03-30 苏州工业园区宇速电子有限公司 用于使两个基板相结合的结构及装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202570485U (zh) * 2012-05-29 2012-12-05 张建宇 一种气囊压力注胶器

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WO2017067031A1 (fr) 2017-04-27
CN105199615A (zh) 2015-12-30

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Effective date of registration: 20210113

Address after: Room 214, building 23, North District, Suzhou nano City, No. 99, Jinjihu Avenue, Suzhou Industrial Park, Jiangsu Province

Patentee after: SUZHOU TONGLI OPTOELECTRONICS Co.,Ltd.

Address before: 215000 No.9, kuanan Road, Weiting Town, Suzhou Industrial Park, Jiangsu Province

Patentee before: SUZHOU INDUSTRIAL PARK YUSU ELECTRONIC Co.,Ltd.

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