CN105180124A - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- CN105180124A CN105180124A CN201510483420.4A CN201510483420A CN105180124A CN 105180124 A CN105180124 A CN 105180124A CN 201510483420 A CN201510483420 A CN 201510483420A CN 105180124 A CN105180124 A CN 105180124A
- Authority
- CN
- China
- Prior art keywords
- heat
- fin
- conductive pipe
- super
- conducting disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
Abstract
The invention discloses a heat dissipation device. The heat dissipation device comprises a heat conducting disc used for installation of a heat source, wherein a plurality of superconductive tubes are arranged on the heat conducting disc, and a cooling fin is arranged on each superconductive tube. Each cooling fin comprises a cooling fin body with the longitudinal length larger than the horizontal width, wherein an installation hole extending in the longitudinal direction of the cooling fin body is formed in the middle of the cooling fin body, and the corresponding superconductive tube is installed in the installation hole in a penetrating mode. Thus, in the process that heat is transmitted from one end of each superconductive tube to the other end of the superconductive tube, heat is also quickly transmitted from the middle of each cooling fin to the edges of the two sides of the cooling fin and to every part of the cooling fin, and then heat can be quickly dissipated outwards through the whole surface of each cooling fin and the heat dissipation capacity of the heat dissipation device is improved greatly. In this way, the requirement of people for heat dissipation of the heat dissipation device can be well met.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly a kind of heat abstractor for LED heat radiation.
Background technology
As everyone knows, LED due to its energy consumption low, long service life and be subject to the favor of people, but LED in use can produce a large amount of heats, those heats must be distributed in time, effectively could ensure the service life of LED, otherwise can cause reduce widely the service life of LED.
The existing high-power LED lamp overwhelming majority is all equipped with heat abstractor, although a part of heat produced when those LED can work by those heat abstractors distributes in time, but radiating effect is still not ideal enough, the heat produced when can not those LED be worked in time all distributes, and therefore the radiating effect of those heat abstractors still fails to meet the demand of people.
Summary of the invention
In order to solve the problem, the object of the present invention is to provide a kind of structure simple, simultaneously the heat abstractor of good heat dissipation effect.
The present invention is the technical scheme that its technical problem of solution adopts:
A kind of heat abstractor, comprise one for installing the heat conducting disk of thermal source, described heat conducting disk is provided with some super heat-conductive pipes, every root super heat-conductive pipe is provided with a fin, described fin comprises the heat sink body that a longitudinal length is greater than its transverse width, the center of this heat sink body is provided with an installing hole extended along its longitudinal direction, and described super heat-conductive pipe is threaded onto in described installing hole.
As the improvement of technique scheme, the profile of described super heat-conductive pipe roughly in " one " font, one end of super heat-conductive pipe through described heat conducting disk sidewall and extend into the inside of heat conducting disk.
As the further improvement of technique scheme, the profile of described super heat-conductive pipe is roughly L-shaped, one end of super heat-conductive pipe through described heat conducting disk sidewall and extend into the inwall of heat conducting disk.
In the present invention, described fin is one-body molded by extruded aluminium, and described installing hole is the complete closed through hole of a circumference.
Preferably, described fin is by a lamellar body through punching press bending forming, and described installing hole is the notched through hole of a circumference.
Further, between described super heat-conductive pipe and described installing hole be interference fit.
Further again, be provided with heat-conducting daub between described super heat-conductive pipe and described installing hole.
In the present invention, the scolding tin of heat conduction is provided with between described super heat-conductive pipe and described installing hole.
Further, described heat conducting disk is at least provided with one for locking the fixed mount of the spacing between two pieces of adjacent fin, described fixed mount offers the fixing hole that several are corresponding with some pieces of fin respectively, the position of the corresponding described fixing hole in heat sink body outer peripheral edge of every block fin is provided with the spacer that can insert this fixing hole.
Further again, described spacer be bent to form after being inserted through described fixing hole one can with the kink of described fixing hole phase clamping.
The invention has the beneficial effects as follows: because the present invention is by the carrier of employing one heat conducting disk as installation thermal source, when being installed on the thermal source operational heat in heat conducting disk, heat can be passed on fin by super heat-conductive pipe by heat conducting disk rapidly, simultaneously because the present invention adopts longitudinal length to be greater than the fin of its transverse width, and the center of fin is provided with the installing hole extended along its longitudinal direction, super heat-conductive pipe is threaded onto in described installing hole, therefore heat transmits the process of its other end from one end of super heat-conductive pipe, heat is also simultaneously promptly passed to each position of fin to its both sides outer rim transmission from the middle part of fin, therefore heat can distribute outward readily through the whole surface of fin, improve the heat-sinking capability of heat abstractor of the present invention widely, therefore the cooling requirements of people to heat abstractor can be met well, the fixed mount of the present invention by being provided with in heat conducting disk for locking the spacing between two pieces of adjacent fin in addition, two pieces of adjacent fin can be prevented close to each other or be close to, ensure to there is enough gaps so that air takes away heat from the surface of fin between two pieces of adjacent fin, and then the radiating effect of heat abstractor of the present invention can be ensured.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Fig. 1 is the surface structure schematic diagram of first preferred embodiment of the invention;
Fig. 2 is the surface structure schematic diagram of another angle of first preferred embodiment of the invention;
Fig. 3 is the assembling schematic diagram of fin and super heat-conductive pipe in first preferred embodiment of the invention;
Fig. 4 is the STRUCTURE DECOMPOSITION schematic diagram of fin and super heat-conductive pipe in first preferred embodiment of the invention;
Fig. 5 is the part drawing of the fin adopted in first preferred embodiment of the invention;
Fig. 6 is the surface structure schematic diagram of second preferred embodiment of the invention;
Fig. 7 is the part drawing of the fin adopted in second preferred embodiment of the invention;
The surface structure schematic diagram of third preferred embodiment of the invention in Fig. 8;
Fig. 9 is the surface structure schematic diagram of another angle of third preferred embodiment of the invention;
Figure 10 is the part drawing of the super heat-conductive pipe adopted in third preferred embodiment of the invention;
Figure 11 is the surface structure schematic diagram of four preferred embodiment of the invention;
Figure 12 is structural representation when having installed fixed mount in fifth preferred embodiment of the invention;
Figure 13 is the structural representation of another angle of having installed fixed mount in fifth preferred embodiment of the invention;
Figure 14 is the part drawing of fixed mount in fifth preferred embodiment of the invention;
Figure 15 is the part drawing of fin in fifth preferred embodiment of the invention;
Figure 16 is the enlarged diagram at A place in Figure 13;
Figure 17 is the enlarged diagram at B place in Figure 14.
Detailed description of the invention
Referring to figs. 1 through Fig. 5, first preferred embodiment of heat abstractor of the present invention, comprise one for installing the heat conducting disk 10 of thermal source, in the present invention, above-mentioned heat conducting disk 10 is preferentially processed into disc-shape, described heat conducting disk 10 is provided with some super heat-conductive pipes 20, in the present embodiment, the profile of above-mentioned super heat-conductive pipe 20 is roughly in " one " font, one end of super heat-conductive pipe 20 through described heat conducting disk 10 sidewall and extend into the inside of heat conducting disk 10, every root super heat-conductive pipe 20 is provided with a fin 30, described fin 30 comprises the heat sink body 300 that a longitudinal length is greater than its transverse width, the center of this heat sink body 300 is provided with an installing hole 301 extended along its longitudinal direction, described super heat-conductive pipe 20 is threaded onto in described installing hole 301, in order to make the radiating effect of fin 30 better, preferably, described fin 30 adopts aluminum to make, further, fin 30 can be transferred heat to better to make super heat-conductive pipe 20, preferably, be interference fit between described super heat-conductive pipe 20 and described installing hole 301, owing to being interference fit between super heat-conductive pipe 20 and installing hole 301, therefore between super heat-conductive pipe 20 with installing hole 301 for directly to contact, therefore heat can directly be passed on fin 30 and not need by transfer of air, accelerates heat transmission speed, also can be provided with heat-conducting daub between certain described super heat-conductive pipe 20 and described installing hole 301, by heat-conducting daub, heat is passed on fin 30 from super heat-conductive pipe 20.In the present invention, also can carry out transferring heat by the scolding tin arranging heat conduction between described super heat-conductive pipe 20 and described installing hole 301, the object of quick transferring heat can be reached equally.
Because the present invention is by the carrier of employing one heat conducting disk 10 as installation thermal source, when being installed on the thermal source operational heat in heat conducting disk 10, heat can be passed on fin 30 by super heat-conductive pipe 20 by heat conducting disk 10 rapidly, simultaneously because the present invention adopts longitudinal length to be greater than the fin 30 of its transverse width, and the center of fin 30 is provided with the installing hole 301 extended along its longitudinal direction, super heat-conductive pipe 20 is threaded onto in described installing hole 301, therefore heat transmits the process of its other end from one end of super heat-conductive pipe 20, heat is also promptly passed to each position of fin 30 to its both sides outer rim transmission from the middle part of fin 30, therefore heat can distribute outward readily through the whole surface of fin 30, improve the heat-sinking capability of heat abstractor of the present invention widely, therefore the cooling requirements of people to heat abstractor can be met well.
For the ease of the production and processing of fin 30, preferably, described fin 30 is one-body molded by extruded aluminium, and described installing hole 301 is the complete closed through hole of a circumference.
With reference to Fig. 6 and Fig. 7, second preferred embodiment of heat abstractor of the present invention, the difference of itself and the first preferred embodiment is, described fin 30 is by a lamellar body through punching press bending forming, and described installing hole 301 is the notched through hole of a circumference, preferably, described lamellar body is metal sheet, further preferably, described lamellar body is aluminium flake, and certain described lamellar body is that copper sheet or other sheet metals are also fine.
With reference to Fig. 8 to Figure 10,3rd preferred embodiment of heat abstractor of the present invention, the difference of itself and the first preferred embodiment is, the profile of described super heat-conductive pipe 20 is roughly L-shaped, one end of super heat-conductive pipe 20 through described heat conducting disk 10 sidewall and extend into the inwall of heat conducting disk 10.
With reference to Figure 11, the 4th preferred embodiment of heat abstractor of the present invention, the difference of itself and the 3rd preferred embodiment is, described fin 30 is by a lamellar body through punching press bending forming, and described installing hole 301 is the notched through hole of a circumference.
With reference to Figure 12 to Figure 17, 5th preferred embodiment of heat abstractor of the present invention, the difference of itself and the 4th preferred embodiment is, described heat conducting disk 10 is at least provided with one for locking the fixed mount 40 of the spacing between two pieces of adjacent fin 30, in the present embodiment, described heat conducting disk 10 is provided with two fixed mounts 40, one of them fixed mount 40 is fixed in described heat conducting disk 10 by some fixed installation bars 50, this fixed mount 40 is also connected with another one fixed mount 40 by some stationary links 42 simultaneously, two above-mentioned fixed mounts 40 are arranged at the both sides of described fin 30 respectively, described fixed mount 40 offers several fixing holes corresponding with some pieces of fin 30 respectively 41, the position of the corresponding described fixing hole 41 in heat sink body 300 outer peripheral edge of every block fin 30 is provided with the spacer 31 that can insert this fixing hole 41.
The fixed mount 40 of the present invention by being provided with in heat conducting disk 10 for locking the spacing between two pieces of adjacent fin 30, two pieces of adjacent fin 30 can be prevented close to each other or be close to, ensure to there is enough gaps so that air takes away heat from the surface of fin 30 between two pieces of adjacent fin 30, and then the radiating effect of heat abstractor of the present invention can be ensured.
Here, in order to prevent locating hole 31 from deviating from from fixing hole 41, preferably, described spacer 31 be bent to form after being inserted through described fixing hole 41 one can with the kink 32 of described fixing hole 41 phase clamping.By above-mentioned kink 32 and the clamping of fixing hole 41 phase, can prevent spacer 31 from deviating from from fixing hole 41, therefore fin 30 can not change with the relative position of fixed mount 40, and then ensure that the spacing between two pieces of adjacent fin 30 immobilizes, so that heat radiation, ensure that the radiating effect of heat abstractor of the present invention.
The foregoing is only preferred embodiments of the present invention, as long as the technical scheme realizing the object of the invention with basic same approach all belongs within protection scope of the present invention.
Claims (10)
1. a heat abstractor, it is characterized in that: comprise one for installing the heat conducting disk (10) of thermal source, described heat conducting disk (10) is provided with some super heat-conductive pipes (20), every root super heat-conductive pipe (20) is provided with a fin (30), described fin (30) comprises the heat sink body (300) that a longitudinal length is greater than its transverse width, the center of this heat sink body (300) is provided with an installing hole extended along its longitudinal direction (301), and described super heat-conductive pipe (20) is threaded onto in described installing hole (301).
2. a kind of heat abstractor according to claim 1, it is characterized in that: the profile of described super heat-conductive pipe (20) roughly in " one " font, one end of super heat-conductive pipe (20) through described heat conducting disk (10) sidewall and extend into the inside of heat conducting disk (10).
3. a kind of heat abstractor according to claim 1, is characterized in that: the profile of described super heat-conductive pipe (20) is roughly L-shaped, one end of super heat-conductive pipe (20) through described heat conducting disk (10) sidewall and extend into the inwall of heat conducting disk (10).
4. a kind of heat abstractor according to claim 1 or 2 or 3, is characterized in that: described fin (30) is one-body molded by extruded aluminium, and described installing hole (301) is the complete closed through hole of a circumference.
5. a kind of heat abstractor according to claim 1 or 2 or 3, is characterized in that: described fin (30) is by a lamellar body through punching press bending forming, and described installing hole (301) is the notched through hole of a circumference.
6. a kind of heat abstractor according to claim 1 or 2 or 3, is characterized in that: be interference fit between described super heat-conductive pipe (20) and described installing hole (301).
7. a kind of heat abstractor according to claim 1 or 2 or 3, is characterized in that: be provided with heat-conducting daub between described super heat-conductive pipe (20) and described installing hole (301).
8. a kind of heat abstractor according to claim 1 or 2 or 3, is characterized in that: the scolding tin being provided with heat conduction between described super heat-conductive pipe (20) and described installing hole (301).
9. a kind of heat abstractor according to claim 1 or 2 or 3, it is characterized in that: described heat conducting disk (10) is at least provided with one for locking the fixed mount (40) of the spacing between two pieces of adjacent fin (30), described fixed mount (40) offers the fixing hole (41) that several are corresponding with some pieces of fin (30) respectively, the position of the corresponding described fixing hole (41) in heat sink body (300) outer peripheral edge of every block fin (30) is provided with the spacer (31) that can insert this fixing hole (41).
10. a kind of heat abstractor according to claim 9, is characterized in that: described spacer (31) be bent to form after being inserted through described fixing hole (41) one can with the kink (32) of described fixing hole (41) phase clamping.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510483420.4A CN105180124B (en) | 2015-03-30 | 2015-08-03 | A kind of radiator |
| PCT/CN2015/088810 WO2017020390A1 (en) | 2015-03-30 | 2015-09-02 | Heat dissipation device |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2015201894196 | 2015-03-30 | ||
| CN201520189419 | 2015-03-30 | ||
| CN201510483420.4A CN105180124B (en) | 2015-03-30 | 2015-08-03 | A kind of radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105180124A true CN105180124A (en) | 2015-12-23 |
| CN105180124B CN105180124B (en) | 2019-03-08 |
Family
ID=54902397
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510483420.4A Active CN105180124B (en) | 2015-03-30 | 2015-08-03 | A kind of radiator |
| CN201520594268.2U Active CN204943415U8 (en) | 2015-03-30 | 2015-08-03 | A kind of heat abstractor |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520594268.2U Active CN204943415U8 (en) | 2015-03-30 | 2015-08-03 | A kind of heat abstractor |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN105180124B (en) |
| WO (1) | WO2017020390A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105180124B (en) * | 2015-03-30 | 2019-03-08 | 特能传热科技（中山）有限公司 | A kind of radiator |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10303347A (en) * | 1997-04-24 | 1998-11-13 | Furukawa Electric Co Ltd:The | Heat sink for cooling semiconductor element |
| CN201041334Y (en) * | 2006-11-03 | 2008-03-26 | 陈德忠 | Irradiation device of high-power light-emitting diode |
| CN103307582A (en) * | 2013-06-21 | 2013-09-18 | 深圳市耀嵘科技有限公司 | Lamp radiator and LED lamp for industrial use |
| CN203980975U (en) * | 2014-05-28 | 2014-12-03 | 中山市久能光电科技有限公司 | A kind of temperature-uniforming plate heat-pipe radiator |
| CN204176606U (en) * | 2014-10-15 | 2015-02-25 | 深圳市日晶照明技术有限公司 | A kind of radiator structure and mine lamp |
| CN204943415U (en) * | 2015-03-30 | 2016-01-06 | 特能传热科技（中山）有限公司 | A kind of heat abstractor |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020080582A1 (en) * | 2000-12-27 | 2002-06-27 | Kai-Cheng Chang | Heat pipe heat dissipating device |
| JP4391366B2 (en) * | 2003-09-12 | 2009-12-24 | 古河電気工業株式会社 | Heat sink with heat pipe and method of manufacturing the same |
| CN2763976Y (en) * | 2004-12-30 | 2006-03-08 | 富准精密工业(深圳)有限公司 | Heat radiator |
| CN100464408C (en) * | 2005-12-01 | 2009-02-25 | 富准精密工业(深圳)有限公司 | Radiating apparatus |
| US20110056658A1 (en) * | 2009-09-04 | 2011-03-10 | Kuo-Len Lin | Heat pipe assembly and heat dissipation device having the same |
-
2015
- 2015-08-03 CN CN201510483420.4A patent/CN105180124B/en active Active
- 2015-08-03 CN CN201520594268.2U patent/CN204943415U8/en active Active
- 2015-09-02 WO PCT/CN2015/088810 patent/WO2017020390A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10303347A (en) * | 1997-04-24 | 1998-11-13 | Furukawa Electric Co Ltd:The | Heat sink for cooling semiconductor element |
| CN201041334Y (en) * | 2006-11-03 | 2008-03-26 | 陈德忠 | Irradiation device of high-power light-emitting diode |
| CN103307582A (en) * | 2013-06-21 | 2013-09-18 | 深圳市耀嵘科技有限公司 | Lamp radiator and LED lamp for industrial use |
| CN203980975U (en) * | 2014-05-28 | 2014-12-03 | 中山市久能光电科技有限公司 | A kind of temperature-uniforming plate heat-pipe radiator |
| CN204176606U (en) * | 2014-10-15 | 2015-02-25 | 深圳市日晶照明技术有限公司 | A kind of radiator structure and mine lamp |
| CN204943415U (en) * | 2015-03-30 | 2016-01-06 | 特能传热科技（中山）有限公司 | A kind of heat abstractor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN204943415U8 (en) | 2017-11-07 |
| CN204943415U (en) | 2016-01-06 |
| WO2017020390A1 (en) | 2017-02-09 |
| CN105180124B (en) | 2019-03-08 |
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