JPH10303347A - Heat sink for cooling semiconductor element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To release heat efficiently and to miniaturize by attaching a fin material to fin plates protruding, in a plurality in parallel above a substrate, while providing a heat pipe insert hole where both sides of a tip of U-shape heat pipe. SOLUTION: On a substrate 10, fin plates 20 are protruded in parallel, in a plurality with the fin plates 20 attached with a fin material 30, respectively, and a heat pipe insert hole 40 where both sides of a tip of a U-shaped heat pipe 50 are inserted is provided. When the U-shaped heat pipe 50 is inserted into the heat pipe insert hole 40, a heat-radiation is more efficiently performed since a heat-transportation with the heat pipe so can be utilized. Since one end side of the heat pipe 50 is not externally positioned, a compact heat sink for cooling a semiconductor element is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a heat sink for cooling a semiconductor device.

[0002]

2. Description of the Related Art Conventionally, as described in Japanese Utility Model Laid-Open Publication No. 61-83095, one end of an L-shaped heat pipe can be inserted into a main body provided with a large number of fins as a heat sink for cooling a semiconductor element. The thing provided with the small hole is known.

In this semiconductor element cooling heat sink, one end of an L-shaped heat pipe is inserted into a small hole, and the other end of the heat pipe is positioned outside a case to cool the semiconductor element.

Further, as described in Japanese Patent Application Laid-Open No. 3-108747, a heat sink for cooling a semiconductor element having a heat pipe insertion hole through which a rod-shaped heat pipe can be inserted into the substrate of a main body composed of a substrate and a fin. It has been known.

This semiconductor element cooling heat sink cools a semiconductor element by inserting a rod-shaped heat pipe into a heat pipe insertion hole.

[0006]

However, the structure disclosed in Japanese Utility Model Laid-Open Publication No. Sho 61-83095 has a structure in which the other end of the heat pipe is located outside the case. There is a problem that a space for locating the other end is required.

Further, in the device described in Japanese Patent Application Laid-Open No. 3-108747, it is not necessary to provide a space outside the case because a rod-shaped heat pipe is inserted into the substrate, but the heat pipe is arranged horizontally. In this case, there is a problem that heat transfer in the heat pipe is not effectively performed, and the amount of heat radiation is extremely reduced.

[0008]

SUMMARY OF THE INVENTION The present invention provides a heat sink for cooling a semiconductor device which solves the above-mentioned problems. The invention according to claim 1 is characterized in that a plurality of fin plates are projected in parallel from a substrate. The fin material is attached to each of the plurality of fin plates, and a heat pipe insertion hole is provided for inserting both ends of a U-shaped heat pipe.

According to a second aspect of the present invention, there is provided a heat sink for cooling a semiconductor element, wherein both ends of a U-shaped heat pipe are inserted into heat pipe insertion holes of one fin plate or diagonal lines of two fin plates. It is characterized by being inserted into each of the pipe insertion holes.

As described above, a plurality of fin plates project in parallel from the substrate, and a fin material is attached to each of the plurality of fin plates, and a heat pipe insertion hole through which both ends of a U-shaped heat pipe can be inserted. Is provided,
The heat generated by the semiconductor element can be efficiently radiated through the fin materials attached to the plurality of fin plates. In particular, when a U-shaped heat pipe is inserted into the heat pipe insertion hole, the heat transfer of the heat pipe can be utilized, so that heat can be more efficiently radiated and the heat pipe is compact because one end of the heat pipe is not located outside. A heat sink for cooling a semiconductor element can be obtained. When the U-shaped heat pipes are inserted into the diagonal heat pipe insertion holes of the two fin plates, respectively, the heat pipes can be inclined, so that the heat transfer capability of the heat pipes can be prevented from lowering. .

[0011]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 show a first embodiment of the present invention. FIG. 1 is a front view, and FIG. 2 is a perspective view. The semiconductor element cooling heat sink has a structure in which a plurality of fin plates 20 project from the substrate 10 in parallel, and a fin material 30 is attached to the plurality of fin plates 20.

The plurality of fin plates 20 are manufactured integrally with the substrate 10 by using an extruded material such as aluminum. The fin material 30 attached to the fin plate 20 is corrugated and fixed by brazing.

Each fin plate 20 has a heat pipe insertion hole 4 into which both ends of a U-shaped heat pipe can be inserted.
0 is formed. As shown in FIGS. 3 and 4, both ends 51 and 52 of a U-shaped heat pipe 50 are inserted into the heat pipe insertion hole 40 and used. The lower heat pipe insertion hole 40 is provided at a position where the open end 52 of the inserted heat pipe 50 contacts the substrate 10.

As shown in FIG. 4, the semiconductor element cooling heat sink having the above structure is used by attaching it to the upper surface of a semiconductor element 60 which generates heat on the substrate 10 side. As described above, when the substrate 10 is mounted on the upper surface of the semiconductor element 60 that generates heat, the plurality of fin plates 20 and the U-shaped heat pipe 50 are positioned vertically.

Heat generated by the semiconductor element 60 is collected by the substrate 10 and the evaporator (52) of the U-shaped heat pipe 50 and is radiated through the fins 30. At this time, the heat absorbed by the evaporating section (52) of the heat pipe 50 is radiated by the upper heat radiating section (51), so that the heat can be efficiently transported to the upper part of the fin 30. Therefore, the amount of heat radiation can be increased.

When the heat value of the semiconductor element is small, it is not necessary to insert the U-shaped heat pipes 50 in all the fin plates 20. The heat pipe 50 may be inserted or used without inserting the U-shaped heat pipe 50 into all the fin plates 20.

FIG. 5 shows different use states of the heat sink for cooling a semiconductor element of the present invention, in which a plurality of fin plates 20 are used in a horizontal state. In this case, when the U-shaped heat pipes 50 are inserted into the respective fin plates 20, the U-shaped heat pipes 50 are in a horizontal state, and the heat transport in the heat pipes 50 is not performed smoothly. There is fear. Therefore, in the present invention, the both ends of the U-shaped heat pipe 50 are
Heat pipe insertion holes 4 on the diagonal of the fin plates
0, each having a difference in elevation between both ends 51 and 52 of the U-shaped heat pipe 50. That is, the heat pipe 50 is disposed such that the evaporating portion (portion of 52) is on the lower side and the heat radiating portion (portion of 51) is on the upper side. Is attached.

As described above, when a difference in height is provided between both ends of the U-shaped heat pipe 50, heat transfer in the heat hype can be performed efficiently, and the cooling efficiency can be improved. .

FIGS. 6A and 6B are front views showing different embodiments of the fin plate 20. FIG. 6A shows two U-shaped heat pipes 40 attached in parallel. Is formed by mounting two U-shaped heat pipes 50 in series. By attaching a plurality of U-shaped heat pipes 40 to one fin plate 20 in this manner, there is an advantage that heat can be more efficiently radiated. The U-shaped heat pipe 5 attached to one fin plate 20
The number of zeros is not limited to two, and is appropriately selected in consideration of the heat generation amount and the like.

The U-shaped heat pipe 50 used in the present invention is manufactured by using a groove pipe.
A heat pipe 40 having various structures such as a wick using a mesh can be used. In addition, the heat sink for cooling a semiconductor element according to the present invention includes an MCM (
), And can be used for cooling any semiconductor device such as a CPU () of a desktop personal computer. Further, the U-shaped heat pipe used in the present invention also includes a heat pipe having a shape whose both ends are open, such as a U-shaped heat pipe.

[0021]

As described above, the heat sink for cooling a semiconductor device according to the present invention comprises a plurality of fin plates projecting in parallel from a substrate, and attaching a fin material to each of the plurality of fin plates and forming a U-shaped heat sink. Characterized in that a heat pipe insertion hole into which both ends of the heat pipe can be inserted is provided, and both ends of the U-shaped heat pipe are inserted into a heat pipe insertion hole of one fin plate, or The heat pipes are inserted into diagonal heat pipe insertion holes of two fin plates, respectively. Therefore, according to the present invention, the heat generated by the semiconductor element can be efficiently radiated through the fin members attached to the plurality of fin plates. In particular, when a U-shaped heat pipe is inserted into the heat pipe insertion hole, heat transfer of the heat pipe can be used, so that heat can be more efficiently radiated and the heat pipe is compact because one end of the heat pipe is not located outside. A heat sink for cooling a semiconductor element can be obtained. . When the U-shaped heat pipes are inserted into the diagonal heat pipe insertion holes of the two fin plates, respectively, the heat pipes can be inclined, so that the heat transfer capability of the heat pipes can be prevented from lowering. There is an advantage.

[Brief description of the drawings]

FIG. 1 is a front view showing one embodiment of a heat sink for cooling a semiconductor element according to the present invention.

FIG. 2 is a perspective view of FIG. 1;

FIG. 3 is a perspective view showing a state where a heat pipe is attached.

FIG. 4 is a side view of FIG. 3;

FIG. 5 is a front view when the semiconductor element cooling heat sink according to the present invention is used in a horizontal state.

FIGS. 6A and 6B are front views showing different embodiments of a fin plate used in the present invention, respectively.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Substrate 20 Fin plate 30 Fin material 40 Heat pipe insertion hole 50 U-shaped heat pipe 51, 52 Both ends of U-shaped heat pipe end 60 Semiconductor element

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[Procedure amendment]

[Submission date] July 25, 1997

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0020

[Correction method] Change

[Correction contents]

The U-shaped heat pipe 50 used in the present invention is manufactured by using a groove pipe.
A heat pipe 40 having various structures such as a wick using a mesh can be used. Further, the heat sink for cooling a semiconductor element according to the present invention can be used for cooling all semiconductor elements such as an MCM and a CPU of a desktop personal computer. Further, the U-shaped heat pipe used in the present invention also includes a heat pipe having a shape whose both ends are open, such as a U-shaped heat pipe.

Claims (2)

[Claims] 1. A plurality of fin plates projecting in parallel from a substrate, and a fin material is attached to each of the plurality of fin plates, and a heat pipe insertion hole is provided for inserting both ends of a U-shaped heat pipe. A heat sink for cooling a semiconductor element, comprising: 2. The U-shaped heat pipe has both ends at one end.
In the heat pipe insertion hole of the fin plate or 2
2. The heat sink for cooling a semiconductor device according to claim 1, wherein said heat sinks are inserted into diagonal heat pipe insertion holes of said plurality of fin plates.