CN204084289U - A kind of heat dissipation device of LED lamp - Google Patents
A kind of heat dissipation device of LED lamp Download PDFInfo
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- CN204084289U CN204084289U CN201420633429.XU CN201420633429U CN204084289U CN 204084289 U CN204084289 U CN 204084289U CN 201420633429 U CN201420633429 U CN 201420633429U CN 204084289 U CN204084289 U CN 204084289U
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Abstract
The utility model relates to LED field of radiating, be specifically related to a kind of oeverall quality light, heat dissipation device of LED lamp that radiating efficiency is high.Heat dissipation device of LED lamp described in the utility model, comprise at least one LED light source, LED light source is installed on first substrate, first substrate is installed in the installation groove of external heat sink, the upper surface of first substrate is provided with multiple louvre, described first substrate inside is provided with at least one first heat dissipation channel running through first substrate, external heat sink is also provided with and installs the connecting portion that groove is connected and the heat dissipating housing be connected with connecting portion, graphite heat-conducting fin is provided with between described first substrate and connecting portion, the inside of described connecting portion is provided with at least one second heat dissipation channel running through connecting portion.Heat dissipation device of LED lamp described in the utility model is applicable to the LED lamp of high-power illumination, and structure is simple, production cost is low, oeverall quality is light, radiating efficiency is high.
Description
Technical field
The utility model relates to LED field of radiating, is specifically related to the LED heat abstractor that a kind of oeverall quality is light, heat radiation total surface area is large, radiating efficiency is high.
Background technology
The features such as profile is flexible owing to having for LED, brightness is large, save electric energy, environmentally friendly and applied range, the market share that it is occupied in illumination market is increasing.But along with in the use procedure of LED, the heat dissipation problem of LED lamp, and LED light declines, becomes the key factor that a restriction LED service life and LED apply.Especially in high-powered LED lamp, input power only has the electric energy conversion of 15% ~ 20% to be that luminous energy exports, and all the other then convert heat energy to, if these heats fail to discharge the external world in good time, the luminous efficiency of light fixture not only can be made to reduce, and LED chip Yin Wendu may be caused too high and lost efficacy rapidly.
At present, the method for LED lamp heat radiation has a lot, is all mainly that the mode applying heat transfer or thermal convection current improves LED-baseplate or the heat conduction of LED radiator that is connected with substrate or heat dispersion.Such as, the passage that heating load exchange liquid (water, fluoride cold-producing medium) circulates is provided with in LED-baseplate inside; Or extra radiator fan is installed in LED-baseplate, this heat abstractor is while improving substrate heat radiation, increase considerably overall weight and the size of LED lamp, then make the risk that LED lamp production cost raises, practicality reduces, install and use increase.Such as: the suspension LED illumination lamp of larger quality, under severe natural conditions, especially run into the weather such as hurricane, heavy rain, just probably produce accident, so while the heat radiation of solution LED lamp, also to will consider that the weight of LED lamp and cost consideration are interior.In addition, that improves the radiator structure of radiator also has a lot, but its structure of the good heat abstractor of most of radiating effect is all comparatively complicated, and the cost produced needed for heat abstractor is higher.
In addition, the heat dissipation problem of aggregate analysis LED lamp from prior art, we find on the installation base plate that the heat dissipation problem that major part solves LED lamp has all concentrated on LED lamp source and external heat sink, and solving the heat dissipation problem of LED wafer substrate or LED grain thermal source, to derive the technology of problem little, this is also the bottleneck place solving LED heat dissipation problem at present.
Summary of the invention
Technical problem to be solved in the utility model is to provide a kind of that be applicable to high-power illumination, that structure is simple, production cost is low, oeverall quality is light, radiating efficiency is high heat dissipation device of LED lamp.
The utility model solves the problems of the technologies described above adopted technical scheme: a kind of heat dissipation device of LED lamp, comprise at least one LED light source, LED light source is installed on first substrate, first substrate upper surface is provided with multiple louvre, first substrate inside is provided with at least one first heat dissipation channel running through first substrate, described first substrate is installed in the installation groove of external heat sink, described external heat sink is also provided with and installs the connecting portion that groove is connected and the heat dissipating housing be connected with connecting portion, graphite heat-conducting fin is provided with between described connecting portion and first substrate, described connecting portion is provided with at least one second heat dissipation channel running through connecting portion.Heat dissipation device of LED lamp described in the utility model, by offering the mode of multiple heat dissipation channel and increase Heat Conduction Material, accelerate the contact area of heat transfer and increase heat and air, while raising radiating efficiency, also significantly alleviate the oeverall quality of LED lamp, then reduce the risk that LED lamp is installed and used.
Further, described LED light source is made up of LED wafer.LED wafer comprises LED grain and the second substrate for installing LED grain.Wherein, LED grain is linked on second substrate to beat gold thread, eutectic or to cover crystal type.As preferably, described second substrate is aluminium base or ceramic substrate, and aluminium base or ceramic substrate upper surface and lower surface are equipped with graphite guide thermosphere.Graphite heat conducting material is as a kind of novel heat conduction and heat radiation material, and it is lighter weight not only, and has low thermal resistance, feature that thermal conductivity factor is higher.It being directly arranged at the surface of the second substrate for installing LED grain, the conduction velocity of temperature to the first substrate for installing LED wafer of LED wafer inside can being increased considerably, thus realize the heat dissipation problem improving LED lamp from source.
As preferably, described first substrate is aluminium base, and upper surface and the lower surface of aluminium base are equipped with copper clad layers, and the thickness of copper clad layers is 2-4mm.In heat dissipation metal material, the heat dispersion of metallic copper higher than aluminium, but due to metallic copper have than great, not easily process, so the installation base plate of LED wafer is the aluminium section being easy to processing and manufacturing usually.Meanwhile, be provided with on the surface of metal aluminum substrate the heat conductivility that copper clad layers can further improve aluminium base, when the thickness of copper clad layers is 2-3mm, the heat dispersion of first substrate is best.
As preferably, the installation groove of described external heat sink, connecting portion and heat dissipating housing are aluminium matter integrative-structure.Because metallic aluminium had both had higher heat conductivility, there is again the feature being easy to processing and manufacturing simultaneously.
As preferably, the heat dissipating housing inside of described external heat sink is hollow structure.The heat dissipating housing of hollow structure, to a certain extent, significantly reduces the oeverall quality of external heat sink.
As preferably, the axle cross section of described heat dissipating housing is trapezoidal, and heat dissipating housing axle cross-sectional area contacts with connecting portion comparatively greatly.One end larger for heat dissipating housing is contacted with connecting portion, is of value to the area expanding heat conduction and heat radiation, then realizes heat better from connecting portion to the transmission of heat dissipating housing.
The utility model compared with the existing technology has the following advantages and effect: 1, arrange multiple louvre on the surface of first substrate and arrange at least one heat dissipation channel running through first substrate in the inside of first substrate, while the contact area increasing heat and air, alleviate the oeverall quality of first substrate, especially need the quality of the high power LED substrate installing multiple LED light source; 2, graphite guide thermosphere being set on the second substrate for installing LED grain, having increased substantially the heat conduction rate of LED wafer internal temperature to first substrate; 3, between first substrate and connecting portion, arrange graphite heat-conducting fin, the connecting portion that then improve the heat phase external heat sink on first substrate carries out the speed of conducting; 4, hollow structure heat dissipating housing and be provided with the connecting portion of at least one the second heat dissipation channel, significantly alleviate the oeverall quality of external heat sink on the whole; 5, heat dissipation device of LED lamp described in the utility model, not only radiating effect is better, and oeverall quality is comparatively light simultaneously, then reduces the risk that LED lamp uses and installs.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of heat dissipation device of LED lamp described in the utility model;
Label declaration: 1, LED light source; 2, first substrate; 3, louvre; 4, the first heat dissipation channel; 5, graphite heat-conducting fin; 6, connecting portion; 7, the second heat dissipation channel; 8, heat dissipating housing; 9, external heat sink; 10, groove is installed.
Detailed description of the invention
Be described in further detail the utility model below in conjunction with embodiment, following examples are that the utility model is not limited to following examples to explanation of the present utility model.
Embodiment 1: as shown in Figure 1, a kind of heat dissipation device of LED lamp described in the present embodiment 1, comprise at least one LED light source 1, LED light source 1 is installed on first substrate 2, the upper surface of first substrate 2 is provided with multiple louvre 3, the inside of first substrate 2 is provided with at least one first heat dissipation channel 4 running through first substrate 2, described LED light source 1 is LED wafer, LED wafer comprise LED grain and and second substrate for installing LED grain, the upper surface of second substrate and lower surface are provided with graphite guide thermosphere, described first substrate 2 is connected with external heat sink 9, external heat sink 9 comprises installs groove 10, the connecting portion 6 be connected with installation groove 10, the inside be connected with connecting portion 6 is the heat dissipating housing 8 of hollow structure, first substrate 2 is installed in the installation groove 10 of external heat sink 9, graphite heat-conducting fin 5 is provided with between first substrate 2 and connecting portion 6, connecting portion 6 is provided with at least one second heat dissipation channel 7 running through connecting portion 6, the axle cross section of described heat dissipating housing 8 is trapezoidal, and its larger one end is connected with connecting portion 6, described installation groove 10, connecting portion 6, heat dissipating housing 8 is aluminium matter integrative-structure, described first substrate 2 is aluminium base.Heat dissipation device of LED lamp described in the utility model embodiment 1, by establishing multiple louvre 3 on the surface of first substrate 2, establish at least one to run through the first heat dissipation channel 5 of first substrate 2 in first substrate 2 inside, and set at least one the second heat dissipation channel 7 running through connecting portion 6 and inner heat dissipating housing 8 as hollow structure at the connecting portion 6 of external heat sink 9, amass at realization increase thermal source and air contact surfaces, while improving radiating efficiency, also significantly alleviate the weight of first substrate 2 and external heat sink 9, then reduce installation and the application risk of LED lamp.In addition, at the second substrate for installing LED grain, if graphite guide thermosphere, the conduction velocity of LED wafer internal temperature to first substrate 2 can be accelerated.Meanwhile, between first substrate 2 and connecting portion 6, establish graphite heat-conducting fin 5, the conduction velocity of the heat on first substrate 2 to connecting portion 6 can be accelerated.
Embodiment 2: as shown in Figure 1, a kind of heat dissipation device of LED lamp described in the present embodiment 2 and the difference of embodiment 1 are, upper surface and the lower surface of first substrate 2 are equipped with copper clad layers, and the thickness of copper clad layers is 2-3mm, when the thickness of copper clad layers is 2-3mm, the heat transfer efficiency of first substrate 2 is best.
In addition, it should be noted that, the specific embodiment described in this description, the shape, institute's title of being named etc. of its parts and components can be different.All equivalences of doing according to structure, feature and the principle described in the utility model inventional idea or simple change, be included in the protection domain of the utility model patent.The utility model person of ordinary skill in the field can make various amendment or supplements or adopt similar mode to substitute to described specific embodiment; only otherwise depart from structure of the present utility model or surmount this scope as defined in the claims, protection domain of the present utility model all should be belonged to.
Claims (6)
1. a heat dissipation device of LED lamp, comprise at least one LED light source (1), described LED light source (1) is installed on first substrate (2), first substrate (2) is installed in the installation groove (10) of external heat sink (9), it is characterized in that, the upper surface of described first substrate (2) is provided with at least one louvre (3), described first substrate (2) inside is provided with at least one first heat dissipation channel (4) running through first substrate (2), described external heat sink (9) is also provided with and installs the connecting portion (6) that groove (10) is connected and the heat dissipating housing (8) be connected with connecting portion (6), graphite heat-conducting fin (5) is provided with between described first substrate (2) and connecting portion (6), the inside of described connecting portion (6) is provided with at least one second heat dissipation channel (7) running through connecting portion (6).
2. heat dissipation device of LED lamp according to claim 1, it is characterized in that, described LED light source (1) comprises LED wafer, LED wafer comprises LED grain and the second substrate for installing LED grain, described second substrate is aluminium base or ceramic substrate, and aluminium base or ceramic substrate upper surface and lower surface are equipped with graphite guide thermosphere.
3. heat dissipation device of LED lamp according to claim 1, is characterized in that, described first substrate (2) is aluminium base, and upper surface and the lower surface of aluminium base are equipped with copper clad layers, and the thickness of copper clad layers is 2-3mm.
4. heat dissipation device of LED lamp according to claim 1, is characterized in that, described installation groove (10), connecting portion (6) are aluminium matter integrative-structure with heat dissipating housing (8).
5. heat dissipation device of LED lamp according to claim 1, is characterized in that, described heat dissipating housing (8) inside is hollow structure.
6. heat dissipation device of LED lamp according to claim 1 or 5, it is characterized in that, the shape of the axle cross section of described heat dissipating housing (8) is trapezoidal, and one end that cross section is larger is connected with connecting portion (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420633429.XU CN204084289U (en) | 2014-10-28 | 2014-10-28 | A kind of heat dissipation device of LED lamp |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420633429.XU CN204084289U (en) | 2014-10-28 | 2014-10-28 | A kind of heat dissipation device of LED lamp |
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| CN204084289U true CN204084289U (en) | 2015-01-07 |
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| CN201420633429.XU Active CN204084289U (en) | 2014-10-28 | 2014-10-28 | A kind of heat dissipation device of LED lamp |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104279536A (en) * | 2014-10-28 | 2015-01-14 | 浙江中博光电科技有限公司 | Heat dissipation device applied to LED lamps |
| CN107835916A (en) * | 2015-05-15 | 2018-03-23 | 莫门蒂夫性能材料股份有限公司 | The light-emitting diode component of heat management is carried out using pyrolytic graphite |
-
2014
- 2014-10-28 CN CN201420633429.XU patent/CN204084289U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104279536A (en) * | 2014-10-28 | 2015-01-14 | 浙江中博光电科技有限公司 | Heat dissipation device applied to LED lamps |
| CN107835916A (en) * | 2015-05-15 | 2018-03-23 | 莫门蒂夫性能材料股份有限公司 | The light-emitting diode component of heat management is carried out using pyrolytic graphite |
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