CN203165948U - Improved LED superconductive heat radiation module - Google Patents
Improved LED superconductive heat radiation module Download PDFInfo
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- CN203165948U CN203165948U CN 201320121910 CN201320121910U CN203165948U CN 203165948 U CN203165948 U CN 203165948U CN 201320121910 CN201320121910 CN 201320121910 CN 201320121910 U CN201320121910 U CN 201320121910U CN 203165948 U CN203165948 U CN 203165948U
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Abstract
The utility model belongs to the technical field of electronic equipment fittings, and especially relates to an improved LED superconductive heat radiation module which solves technical problems that the design is not reasonably enough and the heat radiation effect is poor in the prior art. The improved LED superconductive heat radiation module comprises a heat radiator, wherein a temperature-equalizing plate is disposed on the heat radiator. The improved LED superconductive heat radiation module is characterized in that the temperature-equalizing plate includes a flat base body having a cavity; a heat radiation fluid is arranged in the cavity; at least one filling opening communicated with the cavity is disposed in the base body; a plurality of support columns which are mutually parallel and have two ends respectively press against the base body are disposed in the cavity; a plurality of heat diffusion channels which penetrate through the support columns and are circumferentially uniformly distributed are disposed in the support columns. Compared with the prior art, the improved LED superconductive heat radiation module has the advantages that 1) the design is more reasonable and the structure is simpler; 2) the heat energy dispersion effect is good and thus maintenance cost is invisibly reduced; 3) the service life is long.
Description
Technical field
The utility model belongs to electronic equipment accessory technical field, especially relates to a kind of modified form LED superconduction heat radiation module.
Background technology
Along with constantly progressing greatly of socioeconomic continuous development and industrial technology, in high-performance, under the high efficiency demand, the meaning of its representative is the just lifting of operating rate not, so electronic equipment has adopted multiple electronic building brick now, the relative increase of electronic building brick that its unit volume is contained, and this electronic component namely produces thermal source in operation, in the process that performance constantly promotes, the problem that its caloric value causes is serious day by day, and when the electronic building brick caloric value increases day by day, difference because of the design of electronic building brick usefulness, the heat flux distribution inequality on the electronic building brick surface of feasible heating also because of the local temperature difference, and can form so-called focus from the teeth outwards, cause the too high phenomenon of local temperature, and the operating temperature of electronic building brick and its reliability, useful life etc. are closely bound up.Mostly existing temperature-uniforming plate is to exist following defective: 1, design is unreasonable, and the excessive effect of loosing of heat energy is relatively poor.2, structure is comparatively complicated, and manufacturing cost is higher.3, shortened the useful life of various electronic equipments virtually.
For this reason, people have carried out long-term exploration, have proposed various solutions.For example, Chinese patent literature discloses a kind of temperature-uniforming plate module [application number: 200620123659.7], this temperature-uniforming plate comprises temperature-uniforming plate body and a plurality of heat pipe, the one side of this temperature-uniforming plate body has along first depressed part of first direction extension and second depressed part that extends along second direction, first depressed part that this extends along first direction and second depressed part that extends along second direction are interlaced with each other, and first, second depressed part forms the level potential difference, and these heat pipes place first respectively, in second depressed part, be attached to the thermal source place with this temperature-uniforming plate body, by a plurality of heat pipes of overlapping setting, working fluid and the capillary structure used in the heat pipe form the temperature-uniforming plate module.
Above-mentioned scheme has been improved prior art to a certain extent, and diffusing effect is relatively poor but the heat energy of this scheme overflows, and can not effectively reduce the temperature of various electronic equipments, has shortened the useful life of various electronic equipments virtually.
The utility model content
The purpose of this utility model is at the problems referred to above, provides a kind of design more reasonable, and heat energy overflows diffusing effective, the modified form LED superconduction heat radiation module of long service life.
For achieving the above object, the utility model has adopted following technical proposal: this modified form LED superconduction heat radiation module comprises radiator, be provided with temperature-uniforming plate at radiator, it is characterized in that, described temperature-uniforming plate comprises having cavity and be flat-shaped matrix, in cavity, be provided with the heat radiation fluid, be provided with the geat that at least one is communicated with described cavity at matrix, in cavity, be provided with some two ends and be resisted against on the matrix respectively and the support cylinder that is arranged in parallel, be provided with some equally distributed heat diffusion grooves of described support cylinder and circumference that all axially run through at support cylinder.Obviously, it is effective that heat energy of the present utility model overflow to loose, and reduced maintenance cost virtually,, long service life meets consumers in general's demand.
In above-mentioned modified form LED superconduction heat radiation module, described matrix comprises the base that is arranged on the radiator, at the base fastening lid is arranged, form above-mentioned cavity between described base and the lid, described support cylinder two ends are resisted against respectively on base and the lid, are provided with capillary structure body at base or lid inwall.
In above-mentioned modified form LED superconduction heat radiation module, described capillary structure body is coated on the cover body, and described capillary structure body links to each other by syndeton with support cylinder.
In above-mentioned modified form LED superconduction heat radiation module, described syndeton comprises the ennation that is arranged on described support cylinder one end, be provided with the capillary through holes that the described ennation of some confessions inserts one by one at capillary structure body, the external diameter of described ennation is less than the external diameter of support cylinder.
In above-mentioned modified form LED superconduction heat radiation module, described base and lid are made by the high-termal conductivity material.Further optimize radiating effect.
In above-mentioned modified form LED superconduction heat radiation module, described radiator comprises heat-radiating substrate, is provided with some intervals evenly and the radiating fin that is parallel to each other at heat-radiating substrate, and forms the heat circulation passage between two adjacent radiating fins.Convenient heat radiation.
In above-mentioned modified form LED superconduction heat radiation module, described heat-conducting substrate and temperature-uniforming plate are connected by removable structure.Removable structure is prior art, does not just further give unnecessary details here.Installing/dismounting simply just.
In above-mentioned modified form LED superconduction heat radiation module, described heat radiation fluid is pure water.Draw materials conveniently, cost is low.
Compared with prior art, the advantage of this modified form LED superconduction heat radiation module is: 1, design is more reasonable, and structure is simpler.2, heat energy is excessive diffusing effective, has reduced maintenance frequency and maintenance cost.3, long service life meets consumers in general's demand.
Description of drawings
Fig. 1 is the structural representation that the utility model provides.
Fig. 2 is the sectional structure schematic diagram that the utility model provides.
Fig. 3 is the equalizing plate structure schematic diagram that the utility model provides.
Fig. 4 is the support cylinder structural representation that the utility model provides.
Among the figure, radiator 1, heat-radiating substrate 11, radiating fin 12, heat circulation passage 13, matrix 2, cavity 2a, geat 2b, base 21, lid 22, support cylinder 3, heat diffusion groove 31, ennation 32, capillary structure body 4, capillary through holes 41.
Embodiment
The utility model is described in more detail below in conjunction with the drawings and specific embodiments.
Shown in Fig. 1-4, this modified form LED superconduction heat radiation module comprises radiator 1, prioritization scheme, this radiator 1 comprises heat-radiating substrate 11, be provided with some intervals evenly and the radiating fin 12 that is parallel to each other at heat-radiating substrate 11, and form heat circulation passage 13 between two adjacent radiating fins 12, heat-radiating substrate 11 and temperature-uniforming plate are connected by removable structure, removable structure is prior art, here just further do not give unnecessary details, be provided with temperature-uniforming plate at radiator 1, the temperature-uniforming plate of present embodiment comprises having cavity 2a and be flat-shaped matrix 2, in cavity 2a, be provided with the heat radiation fluid, this heat radiation fluid is pure water, be provided with the geat 2b that at least one is communicated with described cavity 2a at matrix 2, in cavity 2a, be provided with the support cylinder 3 that some two ends are resisted against on the matrix 2 respectively and are arranged in parallel, be provided with some described support cylinder 3 and equally distributed heat diffusion grooves 31 of circumference of all axially running through at support cylinder 3.Obviously, the heat energy of present embodiment overflows and looses effect carefully, has reduced maintenance cost virtually, and long service life meets the requirement of current enterprise long-run development and the demand that meets consumers in general equally.
Specifically, the matrix 2 of present embodiment comprises the base 21 that is arranged on the radiator 1, at base 21 fastenings lid 22 is arranged, here base 21 and lid 22 are made by the high-termal conductivity material, form above-mentioned cavity 2a between described base 21 and the lid 22, described support cylinder 3 two ends are resisted against respectively on base 21 and the lid 22, are provided with capillary structure body 4 at base 21 or lid 22 inwalls.Prioritization scheme, the capillary structure body 4 of present embodiment is coated on the inwall of lid 22, and described capillary structure body 4 and support cylinder 3 link to each other by syndeton.
Further, the syndeton of present embodiment comprises the ennation 32 that is arranged on described support cylinder 3 one ends, be provided with the capillary through holes 41 that the described ennation 32 of some confessions inserts one by one at capillary structure body 4, the external diameter of described ennation 32 is less than the external diameter of support cylinder 3.
Specific embodiment described herein only is that the utility model spirit is illustrated.The utility model person of ordinary skill in the field can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present utility model or surmount the defined scope of appended claims.
Although this paper has used terms such as radiator 1, heat-radiating substrate 11, radiating fin 12, heat circulation passage 13, matrix 2, cavity 2a, geat 2b, base 21, lid 22, support cylinder 3, heat diffusion groove 31, ennation 32, capillary structure body 4, capillary through holes 41 morely, do not get rid of the possibility of using other term.Using these terms only is in order to describe and explain essence of the present utility model more easily; They are construed to any additional restriction all is contrary with the utility model spirit.
Claims (8)
1. modified form LED superconduction heat radiation module, comprise radiator (1), be provided with temperature-uniforming plate at radiator (1), it is characterized in that, described temperature-uniforming plate comprises having cavity (2a) and be flat-shaped matrix (2), in cavity (2a), be provided with the heat radiation fluid, be provided with the geat (2b) that at least one is communicated with described cavity (2a) at matrix (2), in cavity (2a), be provided with some two ends and be resisted against the support cylinder (3) that matrix (2) is gone up and is arranged in parallel respectively, be provided with some described support cylinder (3) and equally distributed heat diffusion grooves of circumference (31) of all axially running through at support cylinder (3).
2. modified form LED superconduction according to claim 1 heat radiation module, it is characterized in that, described matrix (2) comprises the base (21) that is arranged on the radiator (1), at base (21) fastening lid (22) is arranged, form above-mentioned cavity (2a) between described base (21) and the lid (22), described support cylinder (3) two ends are resisted against respectively on base (21) and the lid (22), are provided with capillary structure body (4) at base (21) or lid (22) inwall.
3. modified form LED superconduction heat radiation module according to claim 2 is characterized in that described capillary structure body (4) is coated on the inwall of lid (22), and described capillary structure body (4) links to each other by syndeton with support cylinder (3).
4. modified form LED superconduction according to claim 3 heat radiation module, it is characterized in that, described syndeton comprises the ennation (32) that is arranged on described support cylinder (3) one ends, be provided with the capillary through holes (41) that the described ennation of some confessions (32) inserts one by one at capillary structure body (4), the external diameter of described ennation (32) is less than the external diameter of support cylinder (3).
5. modified form LED superconduction heat radiation module according to claim 2 is characterized in that described base (21) and lid (22) are made by the high-termal conductivity material.
6. modified form LED superconduction according to claim 1 heat radiation module, it is characterized in that, described radiator (1) comprises heat-radiating substrate (11), be provided with some intervals evenly and the radiating fin (12) that is parallel to each other at heat-radiating substrate (11), and form heat circulation passage (13) between adjacent two radiating fins (12).
7. modified form LED superconduction heat radiation module according to claim 6 is characterized in that described heat-radiating substrate (11) and temperature-uniforming plate are connected by removable structure.
8. modified form LED superconduction heat radiation module according to claim 1 is characterized in that described heat radiation fluid is pure water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320121910 CN203165948U (en) | 2013-03-15 | 2013-03-15 | Improved LED superconductive heat radiation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320121910 CN203165948U (en) | 2013-03-15 | 2013-03-15 | Improved LED superconductive heat radiation module |
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| Publication Number | Publication Date |
|---|---|
| CN203165948U true CN203165948U (en) | 2013-08-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201320121910 Expired - Fee Related CN203165948U (en) | 2013-03-15 | 2013-03-15 | Improved LED superconductive heat radiation module |
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| CN (1) | CN203165948U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104422322A (en) * | 2013-08-29 | 2015-03-18 | 讯强电子(惠州)有限公司 | Uniform-temperature plate and manufacturing method thereof |
| CN106531732A (en) * | 2016-10-31 | 2017-03-22 | 努比亚技术有限公司 | Substrate assembly and terminal |
-
2013
- 2013-03-15 CN CN 201320121910 patent/CN203165948U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104422322A (en) * | 2013-08-29 | 2015-03-18 | 讯强电子(惠州)有限公司 | Uniform-temperature plate and manufacturing method thereof |
| CN104422322B (en) * | 2013-08-29 | 2016-08-10 | 讯强电子(惠州)有限公司 | Temperature-uniforming plate and manufacture method thereof |
| CN106531732A (en) * | 2016-10-31 | 2017-03-22 | 努比亚技术有限公司 | Substrate assembly and terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: HANGZHOU WOXIN WONENG TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: HANGZHOU LONGSHANG PHOTOELECTRIC CO., LTD. Effective date: 20150720 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zheng Huawei Inventor before: Tian Menglong |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: TIAN MENGLONG TO: ZHENG HUAWEI |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20150720 Address after: 311121, Hangzhou Road, Yuhang District, Zhejiang, Haishu, No. 2 Patentee after: Hangzhou I can Technology Co., Ltd. Address before: Yuhang District, Hangzhou City, Zhejiang Province, 311121 West No. 1500 building 3 room 109 Patentee before: Hangzhou Longshang Photoelectric Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130828 Termination date: 20190315 |