CN106531732A - Substrate assembly and terminal - Google Patents
Substrate assembly and terminal Download PDFInfo
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- CN106531732A CN106531732A CN201610934153.2A CN201610934153A CN106531732A CN 106531732 A CN106531732 A CN 106531732A CN 201610934153 A CN201610934153 A CN 201610934153A CN 106531732 A CN106531732 A CN 106531732A
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- unit
- substrate
- luminescence unit
- support column
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Abstract
The invention discloses a substrate assembly and a terminal. Through arranging at least one supporting column on the surface of the substrate as a supporting unit to support a light emitting unit and arranging the circuit layer of an excited light emitting unit in the substrate, the supporting column only needs to play a role of physical support on the light emitting unit, no circuit needs to be arranged inside, the phenomenon that a small substrate with a circuit layer is used additionally to realize light emitting excitation on the light emitting unit is avoided, a process of carrying out wiring on the small substrate is omitted, the process in the production is greatly simplified, and the production cost is reduced.
Description
Technical field
The present invention relates to field of terminal, more particularly, it relates to a kind of board unit and terminal.
Background technology
With development and the fast growth of mobile Internet of intelligent terminal, people are also got over to the configuration requirement of mobile terminal
Come higher, nowadays, flash lamp substantially into the standard configuration of intelligent terminal, in the flash component on existing intelligent terminal
Luminescence unit often limited height, therefore often at this when the luminescence unit and intelligent terminal's main substrate are realized electrically connecting
One little substrate of lower section pad of light unit, it is common practice to connect up on the little substrate, realizes little substrate and intelligent terminal master
The electrical connection of substrate and the electrical connection of little substrate and luminescence unit, therefore, luminescence unit and main substrate are realized by the method
Electrical connection, it is necessary to additionally make a little substrate, and need to connect up on little substrate, increased the complexity of technological process
Degree, and increased cost.
The content of the invention
The technical problem to be solved in the present invention is：Additionally make little substrate and electrically connect with main substrate realizing luminescence unit
When, cause the technological process of production complicated, the technical problem that cost increases
For solving above-mentioned technical problem, the present invention provides a kind of board unit, including：Substrate and support unit；Described
It is arranged on the substrate surface below support unit, top is used for installing luminescence unit；The luminescence unit be arranged on institute
The line layer stated in substrate is electrically connected with, and the luminescence unit is for luminous under the exciting of the line layer；It is described to support single
Unit includes at least one support column.
Wherein, the support column is made up of conductive material；The lower section of the support column is electrically connected with the line layer, institute
The top and the luminescence unit for stating support column is electrically connected with.
Wherein, the support column is made up of metal material.
Wherein, board unit also includes at least one conductor wire, and the substrate has line layer；One end of the conductor wire
It is electrically connected with the line layer, the other end is electrically connected with the luminescence unit；The luminescence unit is in the circuit
Light under the exciting of layer.
Wherein, the luminescence unit includes LED chip group, and the LED chip group includes at least one LED chip.
Wherein, the support column is structure as a whole with the substrate.
Wherein, the substrate includes pcb board.
Wherein, the lower section of the support column is fixedly installed on the substrate surface by way of welding.
Wherein, the board unit also includes being arranged on the reflecting layer of the substrate surface；The setting position in the reflecting layer
Put and be adapted with the light-emitting zone of the luminescence unit, for reflecting to the light that the luminescence unit sends.
Further, present invention also offers a kind of terminal, including shell, and the display group being installed in the shell
Part, camera assembly, flash component and the substrate in any one board unit as described above, the flash component include appointing as described above
Anticipate the luminescence unit being arranged in a kind of board unit on the support unit；The shell includes assemblnig fore shell with after
Shell, the fore shell is with by the viewing area of the display module exposed hollow region；The back cover has will be described
The exposed hollow region in output optical zone domain of flash component, and will be the view area of the camera assembly exposed in
Dummy section；The output optical zone domain of the flash component includes the light-emitting zone of the luminescence unit.
Wherein, the luminescence unit is pressed together in the board unit when fore shell and back cover are additionally operable to close and is supported
The top of post.
Beneficial effect
Board unit and terminal that the embodiment of the present invention is proposed, by arranging at least one support column on the surface of the substrate
Luminescence unit is supported as support unit, and the line layer of excitation luminescence unit is arranged in the middle of substrate, therefore,
Support column only needs to play the physical support effect to luminescence unit, need not arrange circuit in addition, therefore invention is implemented inside which
The scheme that example is provided avoid it is extra using a little substrate with line layer realizing the light excitation to luminescence unit, from
And this process connected up on little substrate is also just eliminated, the technological process in production is not only enormously simplify, and is reduced
The cost of production.
Description of the drawings
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing：
Fig. 1 is the hardware architecture diagram for realizing the optional mobile terminal of each embodiment one of the invention；
Fig. 2 is the first structure schematic diagram of board unit in the embodiment of the present invention one；
Fig. 3 is the second structural representation of board unit in the embodiment of the present invention one；
Fig. 4 is the 3rd structural representation of board unit in the embodiment of the present invention one；
Fig. 5 is the 4th structural representation of board unit in the embodiment of the present invention one；
Fig. 6 is the 5th structural representation of board unit in the embodiment of the present invention one；
Fig. 7 is the 6th structural representation of board unit in the embodiment of the present invention one；
Fig. 8 is the first structure schematic diagram of board unit in the embodiment of the present invention two；
Fig. 9 is the second structural representation of board unit in the embodiment of the present invention two；
Figure 10 is the first structure schematic diagram of terminal in the embodiment of the present invention three；
Figure 11 is the second structural representation of terminal in the embodiment of the present invention three.
Specific embodiment
It should be appreciated that specific embodiment described herein is not intended to limit the present invention only to explain the present invention.
The mobile terminal of each embodiment of the invention is realized referring now to Description of Drawings.In follow-up description, use
For representing the suffix of such as " module ", " part " or " unit " of element only for being conducive to the explanation of the present invention, itself
Not specific meaning.Therefore, " module " mixedly can be used with " part ".
Terminal can be implemented in a variety of manners.For example, the present invention described in terminal can include such as mobile phone,
Smart phone, notebook computer, digit broadcasting receiver, PDA (personal digital assistant), PAD（Panel computer）, PMP it is (portable
Multimedia player), the mobile terminal of guider etc. and the such as fixed terminal of numeral TV, desk computer etc..
Hereinafter it is assumed that terminal is mobile terminal, however, it will be understood by those skilled in the art that, except being used in particular for moving purpose
Outside element, construction according to the embodiment of the present invention can also apply to the terminal of fixed type.
Fig. 1 is the hardware architecture diagram for realizing the optional mobile terminal of each embodiment one of the invention.
Mobile terminal 1 00 can include A/V (audio/video) input block 110, user input unit 120, output unit
130th, memorizer 140, controller 150 and power subsystem 160 etc..Fig. 1 shows the mobile terminal with various assemblies, but
It should be understood that, it is not required that implement all components for illustrating, can alternatively implement more or less of component, will be below
Describe the element of mobile terminal in detail.
A/V input blocks 110 are used for receiving audio or video signal.A/V input blocks 110 can include camera 111, phase
Static images or the image of video that 111 pairs, machine is obtained by image capture apparatus in Video Capture pattern or image capture mode
Data are processed.Picture frame after process is may be displayed on display module 131.Picture frame Jing after the process of camera 111 can
To be stored in memorizer 140 (or other storage mediums), two or more cameras can be provided according to the construction of mobile terminal
111。
User input unit 120 can generate key input data to control each of mobile terminal according to the order of user input
Plant operation.User input unit 120 allows the various types of information of user input, and can include keyboard, metal dome, touch
Plate (for example, detection is due to the sensitive component of the change of touched and caused resistance, pressure, electric capacity etc.), roller, rocking bar etc.
Deng.Especially, when touch pad is superimposed upon on display module 131 in the form of layer, touch screen can be formed.
Output unit 130 can include display module 131.Display module 131 is processed in may be displayed on mobile terminal 1 00
Information.For example, when mobile terminal 1 00 is in telephone calling model, display module 131 can show and converse or other are logical
Letter (for example, text messaging, multimedia file download etc.) related user interface (UI) or graphic user interface
(GUI).When mobile terminal 1 00 is in video calling pattern or image capture mode, display module 131 can show capture
Image and/or reception image, UI or GUI of video or image and correlation function etc. are shown.
Meanwhile, when the display module 131 and touch pad touch screen with formation superposed on one another in the form of layer, display module
131 can serve as input equipment and output device.Display module 131 can include liquid crystal display (LCD), thin film transistor (TFT)
In LCD (TFT-LCD), Organic Light Emitting Diode (OLED) display, flexible display, three-dimensional (3D) display etc. at least
It is a kind of.Some in these display may be constructed such that transparence to allow user from outside viewing, and this is properly termed as transparent
Display, typical transparent display can be, for example, TOLED (transparent organic light emitting diode) display etc..According to specific
The embodiment wanted, mobile terminal 1 00 can include two or more display modules (or other display devices), for example, move
Dynamic terminal can include outside display module (not shown) and internal display module (not shown).Touch screen can be used for detection and touch
Input pressure and touch input position and touch input area.
Memorizer 140 can store software program for the process and control operation performed by controller 150 etc., Huo Zheke
With the data (for example, telephone directory, message, still image, video etc.) for temporarily storing own Jing outputs or will export.And
And, memorizer 140 can be storing the vibration of various modes with regard to exporting when touching and being applied to touch screen and audio signal
Data.
The overall operation of the generally control mobile terminal of controller 150.For example, controller 150 is performed and voice call, data
The related control of communication, video calling etc. and process.In addition, controller 150 can be included for reproducing (or playback) many matchmakers
The multi-media module 151 of volume data, multi-media module 151 can be constructed in controller 150, or it is so structured that and control
Device 150 is separated.Controller 150 can be with execution pattern identifying processing, by the handwriting input for performing on the touchscreen or picture
Draw input and be identified as character or image.
Power subsystem 160 receives external power or internal power under control of the controller 150 and provides operation each unit
Appropriate electric power needed for part and component.
Various embodiments described herein can be with use such as computer software, hardware or its any combination of calculating
Machine computer-readable recording medium is implementing.For hardware is implemented, embodiment described herein can be by using application-specific IC
(ASIC), digital signal processor (DSP), digital signal processing device（DSPD）, programmable logic device (PLD), scene can
Programming gate array (FPGA), processor, controller, microcontroller, microprocessor, it is designed to perform function described herein
At least one in electronic unit implementing, in some cases, can be implemented in controller 150 by such embodiment.
For software is implemented, the embodiment of such as process or function can with allow to perform the single of at least one function or operation
Software module is implementing.Software code can be come by the software application (or program) write with any appropriate programming language
Implement, perform during software code can be stored in memorizer 140 and by controller 150.
Based on the hardware configuration of above-mentioned mobile terminal, the present invention provides a kind of board unit and terminal.
It is described in detail below by way of specific embodiment.
Embodiment one
A kind of board unit is present embodiments provided, including substrate 21 and support unit 22, the lower section of support unit 22 sets
Put on 21 surface of substrate, specifically may refer to shown in Fig. 2, the top of support unit 22 is used for installing luminescence unit 31, has
Body is may refer to shown in Fig. 3, it should be noted that the support unit 22 in the present embodiment includes at least one support column, example
Can such as there is a support column, it is possibility to have two or more support columns.Support unit 22 in the present embodiment can also be
Other forms, for example can also be bracing frame or can also be other can play support luminescence unit 31 firmware.Its
In, luminescence unit 31 is electrically connected with the line layer being arranged in substrate 21, and luminescence unit 31 is for swashing in line layer
Give luminous；
It should be appreciated that the shape on 21 surface of substrate in the present embodiment can be arbitrary shape, for example, can be
The various regular shapes such as square, rectangle, parallel four deformation, or it is other various irregularly shaped.
In addition it should be noted that electric connection in order to realize luminescence unit 31 and substrate 21, in the present embodiment
Dagger can be made up of conductive material, and now, the lower section of support column can be electrically connected with the line layer on substrate 21, support column
Top can also be electrically connected with luminescence unit 31, and luminescence unit 31 under the exciting of line layer light.When
When dagger is made for conductive material, support column specifically can be made up of metal material, that is to say the support column in the present embodiment
Can be made up of various conducting metals, for example, it may be supporting made by support column made by metallic copper, or metallic aluminium
Post, or can also be support column made by metallic nickel.Of course, the metal material in the present embodiment is not limited to above-mentioned enumerating
Metal material.
21 component of substrate in the present embodiment can also include at least one conductor wire, of course, and the quantity of conductor wire can
Specifically to be arranged by developer according to the difference of actual current needs or application scenarios, now, there is line on substrate 21
Road floor, wherein, one end and the line layer of conductor wire are electrically connected with, and the other end and the luminescence unit 31 of conductor wire are electrically connected with, and
Luminescence unit 31 is for luminous under the exciting of line layer.It is understood that when the support column in the present embodiment is non-conductive
Material when making, conductor wire just becomes the important component part for realizing that luminescence unit 31 is electrically connected with 21 line layer of substrate.
It should be appreciated that the luminescence unit 31 in the present embodiment can be LED（Light Emitting Diode, send out
Optical diode）Chipset, wherein, LED chip group includes at least one LED chip, of courses, the luminous list in the present embodiment
Unit 31 can also be light emitting package body or luminous pedestal, for example, it may be LED package or LED base, of course, LED
Packaging body can be surface mount LED, or pinned LED.
It should be noted that the support column in the present embodiment can be structure as a whole with substrate 21, namely support column and base
Plate 21 is the structure that entirety is fixed, and so, easily facilitates modularized production, improves productivity ratio, when will set on the base plate (21
When putting luminescence unit 31, it is possible to directly luminescence unit 31 is fixed on support column, without setting on the base plate (21 again
The support column that can support luminescence unit 31 is put, manpower can be saved.It should be appreciated that the support column and base in the present embodiment
Plate 21 can also be independent, when arranging luminescence unit 31 on the base plate (21, first can fix support column on the base plate (21,
Luminescence unit 31 is arranged on into 21 surface of substrate by support column again.It should be appreciated that in the present embodiment support column lower section
Can be fixedly installed on 21 surface of substrate by way of welding, or can also be by other dismountable mechanical connections
Mode is arranged on support column on 21 surface of substrate；It is of course also possible to by luminescence unit 31 and support column by way of welding
Link together, or luminescence unit 31 and support column are linked together by other dismountable mechanical connection manners.
Moreover, it is to be understood that the substrate 21 in the present embodiment can be PCB（Printed Circuit Board, print
Circuit processed）21 component of substrate in plate, and the present embodiment can also include the reflecting layer 41 being arranged on 21 surface of substrate, tool
Body is may refer to shown in Fig. 4, and wherein the set location in reflecting layer 41 is adapted with the light-emitting zone of luminescence unit 31, for right
The light that luminescence unit 31 sends is reflected, so, light that transmitter unit sends as much as possible could reflect with by with
Family makes full use of, it is possible thereby to reduce the loss of light.
When 21 component of substrate in the present embodiment has reflecting layer 41, the reflecting layer 41 in the present embodiment can be ink
Layer, can specifically be reflective ink layer, and reflective ink is the ink being made into by ultra micron glass dust, and wherein, ink layer is in lamp
Under the irradiation of light, the high light of high reflectance can be produced, and the ink layer in certain the present embodiment can be formed for white ink,
White ink layer does not produce dazzle, can preferably lift the experience of user.It should be noted that the ink layer in the present embodiment
21 surface of substrate can be arranged on by modes such as printing, press molds.Of course, the reflecting layer 41 in the present embodiment can also be gold
Category layer, now, the metal level has the exposed metallic region on 21 surface of substrate, it is to be understood that the metal level can be with
It is same layer structure with line layer, certainly, the metal level can also be located at the either above or below of line layer, when in the present embodiment
Substrate 21 have multiple structure when, the metal level in the present embodiment can be any layer of metal in multilayer structure substrate 21
Layer, such as metal level can be layers of copper.
In the present embodiment, luminescence unit 31 can be arranged on the same surface of substrate 21 with reflecting layer 41, specific to send out
Light unit 31 with the set-up mode in reflecting layer 41 can be：Reflecting layer 41 is arranged on the lower section of luminescence unit 31 and extends luminous
Outside 31 overlay areas of unit, specifically may refer to shown in Fig. 5, in order to embody the overlay area of emission layer, do not have in Fig. 5
Luminescence unit 31 is drawn on support unit 22.Of course, it is to be understood that when reflecting layer 41 is covered on line layer
When, line layer is including but not limited to all covered by the overlay area that reflecting layer 41 extends out below luminescence unit 31, or
Circuit layer segment is covered by person, it should be appreciated that developer can be flexibly arranged according to the light-emitting zone in practical application
The overlay area area that reflecting layer 41 extends out below luminescence unit 31.
It is in the present embodiment, when luminescence unit 31 is arranged on the same surface of substrate 21 with reflecting layer 41, specific luminous
Unit 31 with the set-up mode in reflecting layer 41 can also be：Reflecting layer 41 is arranged around 31 surrounding of luminescence unit, 41 shape of reflecting layer
Into closed loop, specifically may refer to shown in Fig. 6, in order to embody the overlay area of emission layer, not by luminescence unit 31 in Fig. 6
It is drawn on support unit 22.When the reflecting layer 41 in the present embodiment is covered on line layer, reflecting layer 41 is around luminous single
The region of first 31 surroundings can all be covered line layer, or cover circuit layer segment.
It is in the present embodiment, when luminescence unit 31 is arranged on the same surface of substrate 21 with reflecting layer 41, specific luminous
Unit 31 with reflection 3 set-up mode can also be：Reflecting layer 41 is arranged adjacent to the one side or surface of luminescence unit 31,
Specifically may refer to shown in Fig. 7, in order to embody the overlay area of emission layer, in Fig. 7, luminescence unit 31 is not drawn in into substrate
On support unit 22.It should be appreciated that the specific set location of emission layer can be by developer according to reality in the present embodiment
Light-emitting zone in the application of border is specifically arranging.
And in the present embodiment, in order to protect luminescence unit 31, can be with 21 component of substrate that the present embodiment is provided
Including translucent cover, that is to say can be in the present embodiment substrate 21 on translucent cover is installed, for luminescence unit 31 is hidden
Cover, when 21 component of substrate includes reflecting layer 41, then this it is transparent can be used for luminescence unit 31 and reflecting layer 41 together shade,
For example, the translucent cover in the present embodiment can be soft light cover, can change into the harder direct light that luminescence unit 31 sends
Soft scattered light, can play a part of softening intense light, can further improve the experience of user.
The board unit that the present embodiment is provided, is used as support unit by arranging at least one support column on the surface of the substrate
To be supported to luminescence unit, and the line layer of excitation luminescence unit is arranged in the middle of substrate, therefore, support column is only needed to
Play and the physical support of luminescence unit is acted on, circuit need not be set inside which in addition, therefore the scheme that inventive embodiments are provided
Avoid it is extra using a little substrate with line layer realizing the light excitation to luminescence unit, so as to also just eliminate
This process connected up on little substrate, not only enormously simplify the technological process in production, and reduces the cost of production.
Embodiment two
In order to be better understood from the present invention, the present embodiment provides a kind of more specific board unit, including pcb board 81 with
And support unit 22, the lower section of the support unit 22 in the present embodiment is arranged on 81 surface of pcb board, wherein, in the present embodiment
Support unit 22 include at least one support column, said so that support unit 22 includes four support columns as an example in the present embodiment
It is bright, may refer to shown in Fig. 8, the top of support unit 22 is used for installing LED chip group 91, may refer to shown in Fig. 9, Ke Yili
Solution be the shape of pcb board 81 in the present embodiment can be arbitrary shape, for example, can be positive way, rectangle, parallel
The various regular shapes such as four deformations, or it is other various irregularly shaped.
In order to realize the electric connection of LED chip group 91 and pcb board 81, the pcb board 81 in the present embodiment has line layer,
When the support unit 22 in the present embodiment is that non electrically conductive material is made, can be with 81 component of pcb board in the present embodiment
Including at least one conductor wire, one end and the line layer of conductor wire are electrically connected with, and the other end of conductor wire is electric with LED chip group 91
Property connection；When the support unit 22 in the present embodiment is made for conductive material, can be directly real by support unit 22
The electric connection of existing LED chip group 91 and pcb board 81 is without using wire, it is possible to reduce in production, technique is numerous and diverse
Degree, of course, when support column has it is multiple when, can be made using conductive material with a part of support column, another part support column
Made using electrically non-conductive material, specifically for example, in the present embodiment, can have two according to material into original selection
Individual support column is made using metal material, and two other support column is made using electrically non-conductive material.
In addition it should be noted that the support column of support unit 22 in the present embodiment can be made up of various conducting metals,
For example, it may be support column made by support column made by metallic copper, or metallic aluminium, or can also be metallic nickel system
Into support column.Of course, the metal material in the present embodiment is not limited to the above-mentioned metal material enumerated.
Support column in the present embodiment can be a non-removable entirety with pcb board 81, specifically can be by making
Support column is linked together with pcb board 81 with the mode of welding.
81 component of pcb board in the present embodiment can also include the reflecting layer being arranged on 81 surface of pcb board, wherein reflect
The set location of layer is adapted with the light-emitting zone of LED chip group 91, for reflecting to the light that LED chip group 91 sends,
So, the light that LED chip group 91 sends as much as possible could be reflected to be made full use of by user, it is possible thereby to reduce light
The loss of line.
When 81 component of pcb board in the present embodiment has reflecting layer, the reflecting layer in the present embodiment can be ink layer,
Can specifically be reflective ink layer, wherein, line layer can be completely covered by the ink layer in the present embodiment, it is also possible to line
Road floor is arranged parallel, is of coursed, and the reflecting layer in the present embodiment can also be metal level, now, the metal level have it is exposed
Metallic region on 81 surface of pcb board, it is to be understood that the metal level can be same layer structure with line layer, certainly, should
Metal level can also be located at the either above or below of line layer, when the pcb board 81 in the present embodiment has multiple structure, this reality
It can be any one layer of metal level in multiple structure pcb board 81 to apply the metal level in example, and such as metal level can be layers of copper.
It should be appreciated that in the present embodiment, LED chip group 91 can have various with the set location in reflecting layer, for example,
In the present embodiment, reflecting layer can be adjacent to the one side of LED chip group 91 or surface, it should be appreciated that in the present embodiment
The specific set location of emission layer can be specifically arranged according to the light-emitting zone in practical application by developer.
And in the present embodiment, in order to protect LED chip group 91, may be used also in 81 component of pcb board that the present embodiment is provided
With including soft light cover, for by LED chip group 91 and reflecting layer together shade, wherein, soft light cover can be by LED chip group 91
The harder direct light for going out changes into soft scattered light, can play a part of softening intense light, can further improve use
The experience at family.
The substrate board component that the present embodiment is provided, it is to avoid it is extra using a little pcb board come realize LED chip group with
The electric connection of pcb board, so as to also just eliminate this process connected up on little pcb board, not only enormously simplify in production
Technological process, and reduce the cost of production.
Embodiment three
The present embodiment provides a kind of terminal, including shell, and be installed in shell display module, camera assembly, sudden strain of a muscle
Substrate in optical assembly and the above-mentioned board unit of any one, it should be noted that the terminal that the present embodiment is provided can be
Various types of terminals, for example, it may be mobile phone, panel computer etc., it is, of course, also possible to be the terminal of fixed type.
Flash component in the present embodiment is arranged on the support unit in including above-mentioned any one board unit
Luminescence unit, the shell in the present embodiment include fore shell and back cover.Wherein, fore shell 1001 is with by the display of display module 1002
The exposed hollow region in region, specifically may refer to shown in Figure 10, and back cover 1101 is with going out light by flash component 1102
The exposed hollow region in region, and by the view area of camera assembly 1103 exposed hollow region, should manage
Solution, when the fore shell 1001 and back cover in the present embodiment can be also used for closing is pressed together on luminescence unit in board unit and props up
The top of dagger.Specifically may refer to shown in Figure 11, wherein, substrate is in terminal inner, so not showing in Figure 10, Figure 11
Go out.The output optical zone domain of flash component 1102 includes the light-emitting zone of luminescence unit.
It should be noted that reflecting layer is also provided with substrate surface in the present embodiment in terminal, and now, flash of light
The output optical zone domain of component can just include the light-emitting zone of luminescence unit and the reflector space in reflecting layer.
In addition it is also necessary to explanation, in the present embodiment, the size of the hollow region that fore shell 1001 has can be according to aobvious
Show the exposed size in outer portion of component 1002 to arrange, likewise, two hollow regions that the present embodiment back cover 1101 has
Size can also respectively according to the exposed size and camera assembly 1103 in outer portion in the output optical zone domain of flash component 1102
The exposed size in outer portion of view area is arranging.
Display module 1002 in the present embodiment can include display floater, wherein it is possible to pass through using various liquid crystals
Show the forms such as device, light emitting diode to configure display floater, the camera assembly 1103 in the present embodiment includes photographic head, Yong Huke
To carry out shooting of finding a view by the photographic head of terminal.
The terminal that the present embodiment is provided, by installing luminescence unit in the top of support unit, it is to avoid extra to use one
Individual little substrate realizing the electric connection of luminescence unit and substrate, so as to also just eliminate this mistake connected up on little substrate
Journey, not only enormously simplify the technological process in production, and reduces the cost of production.
It should be noted that herein, term " including ", "comprising" or its any other variant are intended to non-row
His property is included, so that a series of process, method, article or device including key elements not only include those key elements, and
And also include other key elements being not expressly set out, or also include for this process, method, article or device institute inherently
Key element.In the absence of more restrictions, the key element for being limited by sentence "including a ...", it is not excluded that including being somebody's turn to do
Also there is other identical element in the process of key element, method, article or device.
The embodiments of the present invention are for illustration only, do not represent the quality of embodiment.
Through the above description of the embodiments, those skilled in the art can be understood that above-described embodiment side
Method can add the mode of required general hardware platform to realize by software, naturally it is also possible to by hardware, but in many cases
The former is more preferably embodiment.Based on such understanding, technical scheme is substantially done to prior art in other words
The part for going out contribution can be embodied in the form of software product, and the computer software product is stored in a storage medium
（Such as ROM/RAM, magnetic disc, CD）In, use so that a station terminal equipment including some instructions（Can be mobile phone, computer, clothes
Business device, air-conditioner, or network equipment etc.）Perform the method described in each embodiment of the invention.
Embodiments of the invention are described above in conjunction with accompanying drawing, but be the invention is not limited in above-mentioned concrete
Embodiment, above-mentioned specific embodiment are only schematic, rather than restricted, one of ordinary skill in the art
Under the enlightenment of the present invention, in the case of without departing from present inventive concept and scope of the claimed protection, can also make a lot
Form, these are belonged within the protection of the present invention.
Claims (11)
1. a kind of board unit, it is characterised in that include：Substrate and support unit；Institute is arranged on below the support unit
State on substrate surface, top is used for installing luminescence unit；The luminescence unit is electrical with the line layer being arranged in the substrate
Connection, the luminescence unit is for luminous under the exciting of the line layer；The support unit includes at least one support column.
2. board unit as claimed in claim 1, it is characterised in that the support column is made up of conductive material；The support
The lower section of post is electrically connected with the line layer, and the top of the support column is electrically connected with the luminescence unit.
3. board unit as claimed in claim 2, it is characterised in that the support column is made up of metal material.
4. board unit as claimed in claim 1, it is characterised in that also including at least one conductor wire, the substrate has
Line layer；One end of the conductor wire is electrically connected with the line layer, and the other end is electrically connected with the luminescence unit；It is described
Luminescence unit is for luminous under the exciting of the line layer.
5. board unit as claimed in claim 1, it is characterised in that the luminescence unit includes LED chip group, the LED
Chipset includes at least one LED chip.
6. board unit as claimed in claim 1, it is characterised in that the support column is structure as a whole with the substrate.
7. board unit as claimed in claim 1, it is characterised in that the substrate includes pcb board.
8. board unit as claimed in claim 1, it is characterised in that the lower section of the support column is fixed by way of welding
It is arranged on the substrate surface.
9. the board unit as described in any one of claim 1-8, it is characterised in that also including being arranged on the substrate surface
Reflecting layer；The set location in the reflecting layer is adapted with the light-emitting zone of the luminescence unit, for the luminescence unit
The light for sending is reflected.
10. a kind of terminal, it is characterised in that including shell, and be installed in the shell display module, camera assembly,
Substrate in flash component and the board unit as described in any one of claim 1-9, the flash component include that right such as will
The luminescence unit being arranged in seeking the board unit described in any one of 1-9 on the support unit；The shell includes can be assembled
Fore shell and back cover, the fore shell is with by the viewing area of the display module exposed hollow region；The back cover
With by the exposed hollow region in output optical zone domain of the flash component, and will be the view area of the camera assembly naked
The hollow region for exposing outside；The output optical zone domain of the flash component includes the light-emitting zone of the luminescence unit.
11. terminals as claimed in claim 10, it is characterised in that will be described luminous when the fore shell and back cover are additionally operable to close
Unit is pressed together on the top of support column in the board unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610934153.2A CN106531732A (en) | 2016-10-31 | 2016-10-31 | Substrate assembly and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610934153.2A CN106531732A (en) | 2016-10-31 | 2016-10-31 | Substrate assembly and terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106531732A true CN106531732A (en) | 2017-03-22 |
Family
ID=58292784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610934153.2A Pending CN106531732A (en) | 2016-10-31 | 2016-10-31 | Substrate assembly and terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106531732A (en) |
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| CN106653787A (en) * | 2016-11-21 | 2017-05-10 | 努比亚技术有限公司 | Substrate assembly and terminal |
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Application publication date: 20170322 |