CN105143985A - Lithographic device, lithographic exposure device, recording medium having program recorded thereon, and lithographic process - Google Patents

Abstract

This lithographic device is provided with: an acquisition unit for acquiring coordinate data indicating first locations constituting the designed locations of a plurality of reference marks furnished on an exposed substrate, coordinate data indicating a lithographic pattern defined on the basis of the first locations, to be produced on the exposed substrate, and coordinate data indicating second locations which are the actual locations of the plurality of reference marks; a derivation unit for deriving a physical quantity indicating the magnitude of strain of the exposed substrate, doing so on the basis of the first locations and the second locations, and for deriving, for each of the plurality of reference marks, a correction level in relation to misalignment of the first locations and the second locations; a reducing unit for reducing, by a greater amount for a greater physical quantity, each of the correction levels derived by the derivation unit; and a correction unit for correcting the coordinate data indicating the lithographic pattern, doing so on the basis of the correction levels reduced by the reducing unit, when the lithographic pattern is produced on the exposed substrate on the basis of the second locations.

Description

Drawing apparatus, exposure plotting device, the recording medium had program recorded thereon and plotting method

Technical field

The present invention relates to drawing apparatus, exposure plotting device, recording medium and plotting method, particularly to substrate describe depicting pattern drawing apparatus, to substrate by exposure describe depicting pattern exposure plotting device, record the program performed by above-mentioned drawing apparatus recording medium and the plotting method of depicting pattern is described to substrate.

Background technology

In the past, known there is the preimpregnation material obtained carrying out glass cloth dip treating to make it dry, sheet metal etc. that rigid function is excellent is set to core substrate and the multi-layer wire substrate of multi-layer circuit structure resin bed and wiring layer stacked multilayer obtained on these core substrates.In addition, in recent years, slimming and space saving is required, so propose the slim multi-layer wire substrate without core layer for this multi-layer wire substrate.

In these multi-layer wire substrates, the substrate generation warpage due to chemical treatment, or substrate deforms because intensity is not enough, thus the position alignment of the interlayer of the depicting pattern (wiring pattern) sometimes described at each layer becomes difficulty.However, due to the densification of depicting pattern, terminal pad (land) diameter in depicting pattern and aperture by microminiaturization, so require the position alignment of high-precision interlayer.

In order to meet this requirement, propose to make according to the crooked of the substrate produced due to the warpage of substrate and distortion depicting pattern be out of shape after on substrate, carry out the technology described.According to this technology, the precision of the position alignment of interlayer improves, but whenever by ply, crooked accumulation, so likely deviate from mutually with the shape of the depicting pattern in design in the shape of the depicting pattern of upper layer description, is difficult to electronic unit to be installed on substrate.

In addition, it is also proposed and will represent that the Iamge Segmentation of depicting pattern becomes multiple region, crooked according to substrate, in each cut zone, make the technology of above-mentioned image rotation movement.According to this technology, in each cut zone, the shape of the depicting pattern in design reduces with the side-play amount of the shape of the depicting pattern in fact described.But, in the art, there is image procossing and become complicated such problem and need to be formed for the such problem of the mechanism of the pilot hole connecting depicting pattern between layers for each cut zone.

As the technology solving these problems, in Japanese Unexamined Patent Publication 2005-157326 publication and Japanese Unexamined Patent Publication 2011-95742 publication, disclose and can suppress described depicting pattern and the drawing apparatus of the skew of the depicting pattern in design under the condition that image procossing does not become complicated.

Namely, the drawing apparatus of above-mentioned JP 2005-157326 publication obtains the deformation information of substrate in advance, according to this deformation information, conversion raster data, to make depicting pattern that substrate after deformation records identical with the depicting pattern shape represented by this raster data.Then, carry out before being deformed substrate according to the raster data be converted on record depicting pattern.

In addition, the drawing apparatus of above-mentioned patent documentation 2 uses and has regulation as the position coordinates in the region of rendered object and the description data of the position of reference point that arrange in above-mentioned zone, according to the position of the displacement mode correction reference point of the position coordinates of substrate.Then, according to the position of the reference point corrected, under the state of shape maintaining above-mentioned zone, correct each coordinate in this region.

Summary of the invention

Invent problem to be solved

In technology disclosed in above-mentioned Japanese Unexamined Patent Publication 2005-157326 publication, according to acquired deformation information, depicting pattern is out of shape significantly, so be enhanced to the installation of the electronic unit of the substrate finally obtained, but existence likely worsens such problem with the precision of the position alignment of lower floor.

In addition, in technology disclosed in above-mentioned Japanese Unexamined Patent Publication 2011-95742 publication, size along with the region as rendered object changes relative to the size in the region before correction, the position that the electrode of installation pad and electronic unit also likely finally occurs offsets, and is difficult to electronic unit to be installed on substrate.

The present invention completes in view of above-mentioned problem, its object is to, there is provided a kind of and while the spacing of the electrode suppressing installation pad and electronic unit offsets, the drawing apparatus of the position alignment of high-precision interlayer, exposure plotting device, program and plotting method can be realized.

For solving the technical scheme of problem

In order to achieve the above object, drawing apparatus of the present invention possesses: obtaining section, obtain represent position in the design being exposed multiple reference marks that substrate is arranged and primary importance coordinate data, represent determine using described primary importance as benchmark be exposed the coordinate data of the depicting pattern that substrate is described described and represent the position of described multiple reference mark reality separately and the coordinate data of the second place; Leading-out portion, the physical quantity of the crooked size being exposed substrate described in expression is derived according to described primary importance and the described second place, and each for described multiple reference mark, leading-out needle is to the correcting value of the skew of described primary importance and the described second place; Reduction portion, from each correcting value of being derived by described leading-out portion, reduces more amounts when described physical quantity is larger; And correction unit, when using the described second place as benchmark described be exposed substrate describes described depicting pattern, correct according to the correcting value after being reduced by described reduction portion the coordinate data representing described depicting pattern.

According to drawing apparatus of the present invention, by obtaining section, obtain represent position in the design being exposed multiple reference marks that substrate is arranged and primary importance coordinate data, represent determine using above-mentioned primary importance as benchmark be exposed the coordinate data of the depicting pattern that substrate is described above-mentioned and represent the position of above-mentioned multiple reference mark reality separately and the coordinate data of the second place.In addition, pass through leading-out portion, derive according to above-mentioned primary importance and said second position and represent the above-mentioned physical quantity being exposed the crooked size of substrate, and for each reference mark of above-mentioned multiple reference mark, leading-out needle is to the correcting value of the skew of above-mentioned primary importance and said second position.

Herein, in drawing apparatus of the present invention, by reduction portion, from each correcting value of being derived by above-mentioned leading-out portion, reduce the larger then more amounts of above-mentioned physical quantity.

In addition, in drawing apparatus of the present invention, by correction unit, using said second position as benchmark when above-mentioned be exposed substrate describes above-mentioned depicting pattern, according to the correcting value reduced by above-mentioned reduction portion, correct the coordinate data representing above-mentioned depicting pattern.

Namely, in each correcting value that drawing apparatus of the present invention is derived from the side-play amount according to the position the design of reference mark and actual position, reduce the larger then more amounts of above-mentioned physical quantity, the correcting value according to reducing corrects the coordinate data representing above-mentioned depicting pattern.

Like this, according to drawing apparatus of the present invention, the crooked size being exposed substrate is larger, makes correcting value less, its result, the shape of the depicting pattern after correction is close to the crooked shape being exposed substrate, while the spacing of the electrode suppressing installation pad and electronic unit offsets, the position alignment of high-precision interlayer can be realized.

In addition, in drawing apparatus of the present invention, also can by described leading-out portion derive in the respective mean value of each described primary importance of described multiple reference mark and the maximal value of the side-play amount of the described second place, described side-play amount and described side-play amount aggregate-value separately at least one, be used as described physical quantity.In addition, in drawing apparatus of the present invention, at least one in the respective mean value of the mutual distance that also can derive described multiple reference mark that obtain according to described primary importance by described leading-out portion and the maximal value of the difference of the mutual distance of the described multiple reference mark obtained according to the corresponding described second place, described difference and described difference aggregate-value separately, is used as described physical quantity.Be used as above-mentioned physical quantity by the maximal value deriving reference mark side-play amount separately, thus can correct more reliably.In addition, by deriving the mean value of reference mark side-play amount separately, the generation that the mistake caused by special skew corrects can be suppressed.And then, by deriving the aggregate-value of reference mark side-play amount separately, the correction reflecting all side-play amounts can be carried out.

In addition, in drawing apparatus of the present invention, also can be that described reduction portion is larger by carrying out making each correcting value of being derived by described leading-out portion be multiplied by described physical quantity, less lower than 1 on the occasion of, larger divided by described physical quantity, the larger value more than 1 and to deduct described physical quantity larger, larger and be less than at least a kind in these computings of this correcting value, and from each correcting value of being derived by described leading-out portion, reduce more amounts when described physical quantity is larger.Thereby, it is possible to reduce correcting value by simple calculations.

In addition, drawing apparatus of the present invention can described depicting pattern be also the circuit pattern representing that electronics connects up, described correction unit, when the first correcting value that the mode being greater than to make conducting through hole be accommodated in the inside of the terminal pad in described depicting pattern by the correcting value after the reduction of described reduction portion is determined, corrects the coordinate data representing described depicting pattern according to this first correcting value.Thereby, it is possible to prevent from becoming the terminal pad breach (conducting through hole is to bloating outside terminal pad) being exposed the bad reason of substrate.

In addition, in drawing apparatus of the present invention, also can described depicting pattern be the soldering-resistant pattern representing the open pore that the parts of solder mask are installed, described correction unit, when be greater than to make described open pore to be contained in the second correcting value that the mode for the inside of the conductor pad with components bonding determines of the correcting value after being reduced by described reduction portion, corrects the coordinate data representing described depicting pattern according to this second correcting value.Thereby, it is possible to the position preventing from becoming the conductor pad and open pore being exposed the bad reason of substrate offsets.

In addition, in drawing apparatus of the present invention, also can be described leading-out portion according to deduct in the side-play amount from described primary importance and the described second place by described be exposed substrate move in parallel cause skew, by rotating the skew caused and the side-play amount obtained by least one in the flexible skew caused, derive described correcting value.Thereby, it is possible to suppress the spacing of the electrode of installation pad and electronic unit to offset more reliably.

In addition, in drawing apparatus of the present invention, still receiving unit can be possessed, this receiving unit accepts the input of the reduction information be mapped respectively by the reduced rate of described physical quantity and described correcting value, described reduction portion is used in the reduced rate be mapped with the described physical quantity derived by described leading-out portion in the reduction information accepted by described receiving unit, reduces the correcting value of being derived by described leading-out portion.Thereby, it is possible to easily set the degree of the reduction of correcting value, its result, can improve the convenience for user.

On the other hand, in order to achieve the above object, exposure plotting device of the present invention possesses: drawing apparatus of the present invention; And exposure portion, according to the coordinate data that the described correction unit by described drawing apparatus corrects, carry out exposure to describe to described depicting pattern described being exposed on substrate.

Therefore, according to exposure plotting device of the present invention, play a role in the same manner as drawing apparatus of the present invention, so in the same manner as this drawing apparatus, while the spacing of the electrode suppressing installation pad and electronic unit offsets, the position alignment of high-precision interlayer can be realized.

In addition, in exposure plotting device of the present invention, still control part can be possessed, this control part when when described be exposed the depicting pattern of laminated multi-layer on substrate and describe, control described obtaining section, described leading-out portion, described reduction portion, described correction unit and described exposure portion, for every layer of described multilayer, the exposure carried out the derivation obtaining, implemented by described leading-out portion implemented by described obtaining section, the reduction implemented by described reduction portion, the correction implemented by described correction unit respectively and implemented by described exposure portion.Thus, even if when describing in stacked multiple depicting pattern, also while the spacing of the electrode suppressing installation pad and electronic unit offsets, the position alignment of high-precision interlayer can be realized.

In addition, in exposure plotting device of the present invention, still storage part can be possessed, this storage part storage list is shown as the crooked size that is exposed substrate for described and by the tolerance information of the MAD of the upper limit of allowing and described physical quantity, described control part, when the described physical quantity derived by described leading-out portion is greater than the MAD represented by described tolerance information, is forbidden by described exposure portion the described exposure being exposed substrate and implementing.Thereby, it is possible to avoid the enforcement of unhelpful exposure.

In addition, in order to achieve the above object, the program recorded in recording medium of the present invention makes below computing machine execution process: the coordinate data obtaining position and the primary importance represented in the design being exposed multiple reference marks that substrate is arranged, what expression was determined using described primary importance as benchmark is exposed the coordinate data of the depicting pattern that substrate is described described and represent the position of described multiple reference mark reality separately and the coordinate data of the second place, the physical quantity of the crooked size being exposed substrate described in expression is derived according to described primary importance and the described second place, and each for described multiple reference mark, leading-out needle is to the correcting value of the skew of described primary importance and the described second place, from correcting value described in derived each, more amounts are reduced when described physical quantity is larger, when using the described second place as benchmark described be exposed substrate describes described depicting pattern, the coordinate data representing described depicting pattern is corrected according to the described correcting value after reducing.

Therefore, according to the program recorded in recording medium of the present invention, computing machine can be made to play a role in the same manner as drawing apparatus of the present invention, so in the same manner as this drawing apparatus, while the spacing of the electrode suppressing installation pad and electronic unit offsets, the position alignment of high-precision interlayer can be realized.

And then, in order to achieve the above object, plotting method of the present invention obtains the coordinate data of position and the primary importance represented in the design being exposed multiple reference marks that substrate is arranged, what expression was determined using described primary importance as benchmark is exposed the coordinate data of the depicting pattern that substrate is described described and represent the position of described multiple reference mark reality separately and the coordinate data of the second place, the physical quantity of the crooked size being exposed substrate described in expression is derived according to described primary importance and the described second place, and each for described multiple reference mark, leading-out needle is to the correcting value of the skew of described primary importance and the described second place, from correcting value described in derived each, more amounts are reduced when described physical quantity is larger, when using the described second place as benchmark described be exposed substrate describes described depicting pattern, the coordinate data representing described depicting pattern is corrected according to the described correcting value after reducing.

Therefore, according to plotting method of the present invention, play a role in the same manner as drawing apparatus of the present invention, so in the same manner as this drawing apparatus, while the spacing of the electrode suppressing installation pad and electronic unit offsets, the position alignment of high-precision interlayer can be realized.

Invention effect

According to the present invention, while the spacing of the electrode suppressing installation pad and electronic unit offsets, realize the position alignment of high-precision interlayer.

Accompanying drawing explanation

Fig. 1 is the stereographic map of the outward appearance of the exposure plotting device that embodiment is shown.

Fig. 2 is the stereographic map of the formation of the major part of the exposure plotting device that embodiment is shown.

Fig. 3 is the stereographic map of the formation of the photohead of the exposure plotting device that embodiment is shown.

Fig. 4 illustrates in the exposure plotting device of embodiment at the vertical view being exposed the exposure area that substrate is formed.

Fig. 5 is the block diagram of the formation of the electrical system of the exposure plotting device that embodiment is shown.

Fig. 6 A illustrates the crooked vertical view being exposed an example of substrate does not occur.

Fig. 6 B illustrates to there occurs the crooked vertical view being exposed an example of substrate.

Fig. 7 is the vertical view of the deriving method illustrated for illustration of the crooked amount in the spectrum assignment process of embodiment.

Fig. 8 is the vertical view of another example of the deriving method illustrated for illustration of the crooked amount in the spectrum assignment process of embodiment.

Fig. 9 is the schematic diagram of an example of the reduction information that embodiment is shown.

Figure 10 is the diagram that the expression illustrated in the spectrum assignment process of embodiment is exposed the physical quantity of crooked size of substrate and an example of the relation of reduced rate.

Figure 11 A illustrates to be set as the vertical view to an example in the region of the object of the crooked corresponding coordinate conversion being exposed substrate in the exposure plotting device of embodiment.

Figure 11 B illustrates to be set as the vertical view to another example in the region of the object of the crooked corresponding coordinate conversion being exposed substrate in the exposure plotting device of embodiment.

Figure 11 C illustrates to be set as the vertical view to another example in the region of the object of the crooked corresponding coordinate conversion being exposed substrate in the exposure plotting device of embodiment.

Figure 12 is the process flow diagram of the flow process of the process of the spectrum assignment handling procedure that the first embodiment is shown.

Figure 13 be illustrate for illustration of in the spectrum assignment process of embodiment to the vertical view of method of crooked corresponding coordinate conversion being exposed substrate.

Figure 14 A illustrates in the exposure plotting device of the first embodiment not carrying out the vertical view to an example of object images when being exposed the crooked corresponding coordinate conversion of substrate.

Figure 14 B illustrates in the exposure plotting device of the first embodiment making correcting value reduce to carry out the vertical view to an example of the object images after coordinate conversion when being exposed the crooked corresponding coordinate conversion of substrate simultaneously.

Figure 15 illustrates in the exposure plotting device of the first embodiment being exposed the cut-open view being exposed an example of substrate when substrate describing to multilayer depicting pattern.

Figure 16 illustrates in the exposure plotting device of the first embodiment being exposed the vertical view of an example of the object images described at each layer when substrate describing to multilayer depicting pattern.

Figure 17 is the vertical view for illustration of annular ring.

Figure 18 is the process flow diagram of the flow process of the process of the spectrum assignment handling procedure that the second embodiment is shown.

Figure 19 illustrates in the exposure plotting device of the second embodiment making correcting value reduce to carry out the amplification plan view to an example of the object images after coordinate conversion when being exposed the crooked corresponding coordinate conversion of substrate simultaneously.

Figure 20 be illustrate in the exposure plotting device of the second embodiment when do not limit do not carry out with reducing correcting value to an example (left figure) of the object images after coordinate conversion when being exposed the crooked corresponding coordinate conversion of substrate and limit reduce correcting value carry out simultaneously with coordinate conversion when being exposed the crooked corresponding coordinate conversion of substrate after the vertical view of an example (right figure) of object images.

Embodiment

(the first embodiment)

Below, use accompanying drawing, describe the exposure plotting device of embodiment in detail.In the present embodiment, for apply the present invention to be exposed substrate (described later be exposed substrate C) expose with light beam describe circuit pattern, the situation of the exposure plotting device of the depicting pattern such as the soldering-resistant pattern of open pore that the parts that represent solder mask are installed is described.In addition, as being exposed substrate, the flat panel substrate such as printed circuit board, glass substrate for plane display device is illustrated.In addition, in the exposure plotting device of present embodiment, be set to as exposure plotting object be exposed the shape that substrate presents rectangle.

As shown in Figure 1 and Figure 2, the exposure plotting device 10 of present embodiment possesses the flat objective table 12 for being fixedly exposed substrate C.At the upper surface of objective table 12, be provided with the multiple inlet holes sucking air.Thus, when be placed with at the upper surface of objective table 12 be exposed substrate C time, by sucking the air that is exposed between substrate C and objective table 12, be exposed substrate C by vacuum suction in objective table 12.

The objective table 12 of present embodiment is supported on the flat base station 16 that can arrange movably at the upper surface of the matrix 14 of table-like.That is, at the upper surface of matrix 14, the guide rail 18 of one or more (being two in the present embodiment) is provided with.Base station 16, can be supported on guide rail 18 along the mode of guide rail 18 freely movement, is driven by the driving mechanism (objective table drive division 42 described later) be made up of motor, hydraulic pump etc. and moves.Therefore, objective table 12 moves along guide rail 18 in linkage with the movement of base station 16.

In addition, as shown in Figure 2, below, the direction of objective table 12 movement is decided to be Y-direction, direction orthogonal with this Y-direction in surface level is decided to be X-direction, direction orthogonal with Y-direction in vertical guide is decided to be Z-direction.

At the upper surface of matrix 14, the mode being provided with to stride across two guide rails 18 erects the door 20 of setting.The substrate C that is exposed that objective table 12 is placed moves in the mode of the peristome along guide rail 18 inlet/outlet 20.On the top of the peristome of door 20, be provided with and carry out towards this peristome light beam the exposure portion 22 that exposes.By this exposure portion 22, when objective table 12 moves along guide rail 18 and is positioned at above-mentioned peristome, the upper surface light beam being exposed substrate C that objective table 12 is placed is exposed.

The exposure portion 22 of present embodiment is configured to comprise multiple (being 10 in the present embodiment) photohead 22a.In addition, exposure portion 22 is connected to the optical fiber 26 of drawing from light source cell 24 described later and the signal cable 30 of drawing from graphics processing unit 28 described later.

Photohead 22a has the digital micro-mirror device (DMD) of the spatial optical modulation element as reflection-type respectively.On the other hand, exposure plotting device 10 possesses the light source cell 24 of photohead 22a outgoing beam and the graphics processing unit 28 to photohead 22a output image information.Photohead 22a according to the image information control DMD inputted from graphics processing unit 28, thus modulates the light beam from light source cell 24.Exposure plotting device 10 by by the light beam irradiation of this modulation to being exposed substrate C, carry out the exposure for being exposed substrate C.In addition, spatial optical modulation element is not limited to reflection-type, also can be the spatial optical modulation element of the transmission-types such as liquid crystal.

At the upper surface of matrix 14, the mode being also provided with to stride across two guide rails 18 erects the door 32 of setting.The substrate C that is exposed that objective table 12 is placed moves in the mode of the peristome along guide rail 18 inlet/outlet 32.

On the top of the peristome of door 32, the photography portion 34 for one or more (being two in the present embodiment) of photographing to this peristome is installed.Photography portion 34 is the ccd video cameras etc. being built-in with the extremely short stroboscope of fluorescent lifetime once.In addition, on the top of the peristome of door 32, arrange track 34a along direction (X-direction) vertical with the moving direction (Y-direction) of objective table 12 in surface level, photography portion 34 is configured to guided by track 34a and move respectively.By this photography portion 34, when objective table 12 moves along guide rail 18 and is positioned at above-mentioned peristome, the upper surface being exposed substrate C that objective table 12 is placed is photographed.

Then, the exposure-processed that the photohead 22a of present embodiment implements is described.

As shown in Figure 3, the image-region 22b in the region exposed as the photohead 22a by present embodiment is the wherein rectangular shape that tilts with predetermined pitch angle relative to the moving direction (Y-direction) of objective table 12 of a limit.In addition, when objective table 12 moves at the peristome place of door 20, if exposed by photohead 22a light beam, then along with the movement of objective table 12, be exposed the 22c of exposure area substrate C being formed band shape by each photohead 22a.

In addition, as shown in FIG. 2 and 3, photohead 22a arranges respectively in exposure portion 22 rectangularly, as shown in Figure 4, in the X direction, be in staggered configuration every a distance that the length on the long limit of image-region 22b expansion nature several times (being 1 times in the present embodiment) is obtained.Then, exposure area 22c is partially overlapping formed with the adjacent 22c of exposure area respectively.

Then, the formation of the electrical system of the exposure plotting device 10 of present embodiment is described.

As shown in Figure 5, in exposure plotting device 10, the systems control division 40 that the portion each with device respectively that arrange is electrically connected, by this systems control division 40, intensively controls each portion of exposure plotting device 10.In addition, exposure plotting device 10 has objective table drive division 42, operating means 44, photography drive division 46 and outside input and output portion 48.

Systems control division 40 has CPU (CentralProcessingUnit, CPU (central processing unit)), RAM (RandomAccessMemory, random access memory), ROM (ReadOnlyMemory, ROM (read-only memory)) and HDD (HardDiskDrive, hard disk drive) 40A.In addition, systems control division 40, by above-mentioned CPU, from light source cell 24 outgoing beam, and exports corresponding image information by graphics processing unit 28 under the timing corresponding to the movement of objective table 12, thus controls the exposure for the light beam being exposed substrate C.

Objective table drive division 42 is described above, has the driving mechanism consisted of motor, hydraulic pump etc., by the control of systems control division 40, objective table 12 is moved.

Operating means 44 is had and shows the display part of various information by the control of systems control division 40 and inputted the input part of various information by user operation.

Photography drive division 46 has the driving mechanism consisted of motor, hydraulic pump etc., by the control of systems control division 40, photography portion 34 is moved.

Outside input and output portion 48 and the signal conditioning package such as the personal computer that is connected with exposure plotting device 10 between, carry out the input and output of various information.

But as shown in Figure 2, being exposed on substrate C in present embodiment, is provided with multiple (being 4 in the present embodiment) alignment mark (hereinafter referred to as " reference mark ") M of the benchmark as the location when rendering image.As an example, as shown in Figure 6A, in the exposure plotting device 10 of present embodiment, in each bight being exposed substrate C, be provided with reference mark M1 to M4 and (below, also 4 be collectively referred to as " reference mark M ".)。Specifically, the position of front view upper left of Fig. 6 A being exposed substrate C is provided with reference mark M1, the position of upper right is provided with reference mark M2, is provided with reference mark M3 in the position of lower-left and the position of bottom right is provided with reference mark M4.

The exposure plotting device 10 of present embodiment is being exposed on substrate C, relative to images (hereinafter referred to as " object images ") 62 such as the depicting pattern that each reference mark M is represented by image information in predetermined relative position description.In the exposure plotting device 10 of present embodiment, the contour shape of object images 62 is rectangular shape, but is not limited to this, also can be the arbitrary shape such as elliptical shape, star shapes.

Exposure plotting device 10, when rendered object image 62, for being exposed before substrate C light beam exposes, is photographed to each reference mark M by photography portion 34, from photographs measurement reference mark M position separately.Then, exposure plotting device 10 according to the reference mark M position separately that measures, determine the region of rendered object image 62, rendered object image 62 in determined region.

In addition, as an example, as shown in Figure 6B, as existing exposure plotting device 10, have when being exposed device substrate C being exposed the crooked amount of substrate C before rendered object image 62 according to reference mark M position derivation separately.Then, in this existing exposure plotting device 10, the shape of calibration object image 62 is carried out according to derived crooked size.

Now, the precision of the installation of electronic unit reduces in order to prevent that the shape due to the object images 62 in design from deviating from mutually with the shape of described object images 62 for the exposure plotting device 10 of present embodiment, reduction object images 62 for the crooked correcting value being exposed substrate C.Now, the exposure plotting device 10 of present embodiment, from the correcting value (hereinafter referred to as " pure correcting value ") corresponding with reference mark M side-play amount separately, reduces the larger then more amounts of physical quantity representing and be exposed the crooked size of substrate C.Thus, the distortion relative to the shape in design of object images 62 is suppressed.Then, the exposure plotting device 10 of present embodiment, according to the reference mark M correcting value separately (hereinafter referred to as " reduction correcting value ") reduced, makes object images 62 be out of shape.

In addition, as an example, as shown in Figure 7, in the exposure plotting device 10 of present embodiment, as above-mentioned physical quantity, use the position in the design of each reference mark M and the maximal value passing through the side-play amount de measuring the position (actual position) obtained.In the figure 7, connect with solid line and the reference mark M position separately in design is shown, connect with dotted line and illustrate by measuring the reference mark M position separately obtained.In addition, if the front view left and right directions of Fig. 7 is set to x direction, front view above-below direction is set to y direction, the side-play amount relative to x direction is set to side-play amount dx, be set to side-play amount dy by relative to the side-play amount on y direction, then side-play amount de is represented by following (1) formula.

[mathematical expression 1]

$de=\sqrt{{\mathrm{dx}}^2+{\mathrm{dy}}^2}...\left(1\right)$

Like this, in the exposure plotting device 10 of present embodiment, the maximal value of above-mentioned side-play amount is used as above-mentioned physical quantity, but is not limited to this, also this side-play amount mean value separately or this side-play amount aggregate-value separately can be used as above-mentioned physical quantity.In addition, also the multiple combination of above-mentioned maximal value, above-mentioned mean value, above-mentioned aggregate-value can be used as above-mentioned physical quantity.

Or, as an example, as shown in Figure 8, also the distance Pa1 to Pa6 in the mutual design of reference mark M1 to M4 can be used as above-mentioned physical quantity with the maximal value of the corresponding distance difference each other by measuring the distance Pb1 to Pb6 obtained.In addition, in fig. 8, in the same manner as Fig. 7, connect with solid line and the reference mark M position separately in design is shown, connect with dotted line and illustrate by measuring the reference mark M position separately obtained.In addition, also above-mentioned difference mean value separately or above-mentioned difference aggregate-value separately can be used as above-mentioned physical quantity.And then, also the multiple combination of above-mentioned maximal value, above-mentioned mean value and above-mentioned aggregate-value can be used as above-mentioned physical quantity.

On the other hand, the positional information of the reference mark M position separately represented by coordinate data in design and reduction information 50, in order to derive reduction correcting value, are stored in advance in the presumptive area of the HDD40A of systems control division 40 by the exposure plotting device 10 of present embodiment.

As an example, as shown in Figure 9, the reduction information 50 of present embodiment be by the physical quantity information representing above-mentioned physical quantity, represent the reduced rate when reducing pure correcting value reduced rate information and represent the information be mapped respectively for the process content information of the contents processing being exposed substrate C.In addition, as shown in Figure 9, in above-mentioned reduced rate information, when reduced rate represents by scope, represent that reduced rate becomes large within the scope of this linearity or curve-like.

In addition, in the reduction information 50 of present embodiment, as above-mentioned process content information, be stored in the exposure plotting process that is exposed rendered object image 62 on substrate C and discharge being exposed on substrate C not rendered object image 62 that to be exposed in the error handle of substrate C some.Exposure plotting device 10 is when the contents processing that the process content information by being mapped with above-mentioned physical quantity in reduction information 50 represents is exposure plotting process, after the reduced rate represented with the reduced rate information by being mapped with this physical quantity reduces pure correcting value, perform exposure plotting process.On the other hand, exposure plotting device 10, when the contents processing that the process content information by being mapped with above-mentioned physical quantity in reduction information 50 represents being error handle, not carrying out exposure plotting process and being exposed substrate C from exposure plotting device 10 discharge.But the contents processing of error handle is not limited to this, also can be set to fixed value by for the reduced rate being exposed substrate C, after carrying out exposure plotting process, be exposed on substrate C describe represent there occurs mistake information.In addition, in the exposure plotting device 10 of present embodiment, as shown in Figure 9, in reduction information 50, the contents processing when above-mentioned physical quantity is more than 100 μm is set as error handle.

Herein, as an example, as shown in Fig. 9 and Figure 10, in the exposure plotting device 10 of present embodiment, in reduction information 50, above-mentioned physical quantity is larger, then make above-mentioned reduced rate larger.This means that above-mentioned physical quantity is larger, more greatly, namely reduce correcting value relative to the reducing amount of pure correcting value less.In this case, with do not use reduce correcting value situation compared with, object images 62 is deformed into the shape close to the crooked shape being exposed substrate C from the shape the design of object images 62.Thereby, it is possible to suppress the position of the electrode of installation pad and electronic unit to offset.

In addition, in the exposure plotting device 10 of present embodiment, as shown in Figure 10, above-mentioned physical quantity is larger, then make reduced rate larger in a stage-like manner, the method that reduced rate is increased is not limited to this.Such as, also can be that above-mentioned physical quantity is larger, then linearly make reduced rate larger.In addition, also can be larger according to above-mentioned physical quantity, the curve-like that the recruitment of reduced rate is larger or above-mentioned physical quantity larger, the curve-like that the recruitment of reduced rate is less makes reduced rate change.

The exposure plotting device 10 of present embodiment uses above-mentioned physical quantity and reduction information 50 to decide reduced rate, derives reduce correcting value according to pure correcting value and reduced rate.Then, exposure plotting device 10 comes correction reference mark M position separately according to derived reduction correcting value, and the reference mark M position separately according to correcting makes object images 62 be out of shape, and is being exposed the object images 62 substrate C describing be out of shape.

In addition, in the exposure plotting device 10 of present embodiment, accept the input of the reduction information 50 of being carried out via the input part of operating means 44 by user, the reduction information 50 accepted is stored into the HDD40A of systems control division 40.But, be not limited to this, such as, also each information in reduction information 50 can be set to fixed value, be stored in advance in the HDD40A of systems control division 40.

In addition, in the exposure plotting device 10 of present embodiment, when making object images 62 be out of shape, as an example, as shown in Figure 11 A, the region of object images 62 entirety is set to the subject area (by the region shown in dot pattern in Figure 11 A and Figure 11 B) 64 of the object as coordinate conversion.But subject area 64 is not limited to this, as an example, as shown in Figure 11 B, also subject area 64 can be set to by using the position of the center of gravity of 4 reference mark M1 to M4 as the region of the rectangular shape of angle point.Or, as an example, both as shown in Figure 11 C the whole face as exposure object being exposed substrate C can be set to subject area 64, or also the region of a part for object images 62 can be set to subject area 64.

In addition, be exposed the end etc. of substrate C, sometimes describe the image be exposed beyond the circuit patterns such as the identiflication number of substrate C, but in this case, also can not carry out coordinate conversion about the description region of this image, and only coordinate conversion be carried out to the description region of circuit pattern.This be due to: representing that the image being exposed the character strings such as the identiflication number of substrate C is regardless of the crooked situation being exposed substrate C, is all more easily confirm when not deforming to describe content.

Then, with reference to Figure 12, the effect of the exposure plotting device 10 of present embodiment is described.In addition, Figure 12 is the process flow diagram of the flow process that the process that to have input the spectrum assignment handling procedure performed by the systems control division 40 of exposure plotting device 10 when performing instruction at the input part via operating means 44 is shown.This program is stored in advance in the presumptive area of above-mentioned ROM by systems control division 40.

In addition, in order to easy explanation, be described for situation about being stored in the HDD40A of systems control division 40 as the image information of the coordinate data (being vector data in the present embodiment) representing object images 62.In addition, in the exposure plotting device 10 of present embodiment, above-mentioned image information is the vector data representing depicting pattern, but is not limited to this, also can be raster data.

First, in step S101, by reading out the image information obtained as the coordinate data representing the object images 62 described from HDD40A.But, systems control division 40 also can by via outside input and output portion 48 from outside input image information, obtain image information.

In following step S103, obtain the above-mentioned positional information being represented the reference mark M position separately in design by coordinate data by reading out from HDD40A.

Like this, in the exposure plotting device 10 of present embodiment, systems control division 40 obtains above-mentioned positional information by reading out from HDD40A, but adquisitiones is not limited to this, also can be via the method for outside input and output portion 48 from outside input position information.

In following step S105, moving stage 12, to be comprised in position in the photographing region in photography portion 34 to make to be exposed substrate C by each reference mark M.

In following step S107, the reference mark M position separately that measurement is actual.Now, the barycentric coordinates in the region of extracting, from utilizing the region that the photographs in photography portion 34, extraction is corresponding with each reference mark M, derive as the respective position coordinates of reference mark M by systems control division 40.Like this, in the exposure plotting device 10 of present embodiment, use above-mentioned photographs to measure reference mark M position separately, but be not limited to this, also can carry out this measurement by external device (ED), represent the information of measurement result via outside input and output portion 48 from outside input.

In following step S109, according to the position separately of the reference mark M in the design obtained in the process of step S103 and the side-play amount of the reference mark M position separately measured of falling into a trap in the process of step S107, derive the rotation amount, amount of bias, the flexible multiplying power that are exposed substrate C respectively.In addition, above-mentioned rotation amount alleged be herein predetermined orthogonal coordinate system (in the present embodiment, as an example, be the x-y coordinate system shown in Fig. 9) in from the position of the reference mark M design to the anglec of rotation of the position of the reference mark M of the reality of correspondence.In addition, alleged herein above-mentioned amount of bias is the amount of parallel movement from the position of the reference mark M design to the position of the reference mark M of the reality of correspondence in above-mentioned orthogonal coordinate system.And then above-mentioned flexible multiplying power alleged is herein the enlargement ratio from the position of the reference mark M design to the position of the reference mark M of the reality of correspondence in above-mentioned orthogonal coordinate system or reduction magnification.

Systems control division 40, by using the least square method of reference mark M position coordinates separately, is exposed substrate C for each and derives the amount of bias ofsx in x direction, each parameter such as amount of bias ofsy, the flexible multiplying power kx in x direction, the flexible multiplying power ky in y direction and rotation amount θ in y direction.

That is, when deriving above-mentioned each parameter, do not consider to be exposed the crooked of substrate C, assuming that the respective position of reference mark M in design and measurement to the respective position of reference mark M between comprise above-mentioned each parameter and there is well-determined relation.Then, be that minimum mode determines above-mentioned each parameter (as an example, with reference to Japanese Laid-Open Patent Publication 61-44429 publication etc.) using the average deviation of above-mentioned each parameter.The method of the above-mentioned each parameter of this decision is the known method using affine conversion etc., so omit the description.

In following step S111, change according to the rotation amount of deriving in the process of above-mentioned steps S109, amount of bias and flexible multiplying power and to fall into a trap the reference mark M position coordinates separately measured in the process of step S107.Thus, eliminate due to the side-play amount in the reference mark M position separately that the skew of the allocation position be exposed when substrate C is configured at objective table 12 is caused.

Like this, in the exposure plotting device 10 of present embodiment, change to fall into a trap the reference mark M position coordinates separately measured in the process of step S107, so be not limited thereto according to being exposed the rotation amount of substrate C, amount of bias and flexible multiplying power respectively.Such as, both can change according to be exposed in the rotation amount of substrate C, amount of bias and flexible multiplying power some, also can change according to multiple combination.

In following step S113, the reference mark M position coordinates separately according to having carried out coordinate conversion in the process of above-mentioned steps S111 derives pure correcting value.Below, reference mark M1, M2, M3, M4 pure correcting value is separately expressed as (dx0, dy0), (dx1, dy1), (dx2, dy2), (dx3, dy3).

In following step S114, according to the above-mentioned positional information obtained in above-mentioned steps S103 and the reference mark M position coordinates separately having carried out coordinate conversion in the process of above-mentioned steps S111, derive above-mentioned physical quantity (being the maximal value of reference mark M side-play amount separately in the present embodiment).

In following step S115, read reduction information 50 from the HDD40A of systems control division 40.

In following step S117, judge whether the contents processing that the process content information by being mapped with the physical quantity information of the physical quantity derived in the process represented at above-mentioned steps S114 in the reduction information 50 read represents is exposure plotting process.

When judging for affirmative in step S117, transfer to step S119.On the other hand, in step S117 for negative judge, transfer to step S135, as error handle, objective table 12 moved to be exposed the position that substrate C dismantle from objective table 12, terminate this spectrum assignment of execution handling procedure.In this case, be exposed substrate C and do not dismantle from objective table 12 with not carrying out exposure plotting process, and be discharged to the outside of exposure plotting device 10.

On the other hand, in step S119, the reduced rate N using the reduced rate information by being mapped with the physical quantity information of the physical quantity derived in the process represented at above-mentioned steps S114 in the reduction information 50 read to represent reduces pure correcting value, thus derives reduction correcting value.Below, reference mark M1, M2, M3, M4 reduction correcting value is separately expressed as (dx0 ', dy0 '), (dx1 ', dy1 '), (dx2 ', dy2 '), (dx3 ', dy3 ').

In the exposure plotting device 10 of present embodiment, reduction correcting value (dx0 ', dy0 ') to (dx3 ', dy3 ') be for pure correcting value (dx0, dy0) be multiplied by reduced rate N to (dx3, dy3) to obtain, represented by following (2) formula.

[mathematical expression 2]

(dx，dy)＝{dx0，dy0)，(dx1，dy1)，(dx2，dy2)，(dx3，dy3)}

dx′＝N×dx，

dy′＝N×dy，

…(2)

In following step S127, use the reduction correcting value (dx ', dy ') obtained by the process of step S119, carry out the coordinate conversion of each coordinate in the subject area 64 of object images 62.

Herein, the method for the coordinate conversion of each coordinate in the subject area 64 of the object images 62 in the exposure plotting device 10 of present embodiment is described.First, systems control division 40 as an example, as shown in figure 13, according to the coordinate of object being set as coordinate conversion, object images 62 is divided into the region of multiple (being 4 in the present embodiment), derives the area SA0 to SA3 of each cut zone.Now, as shown in figure 13, in the inside of object images 62, draw parallel with each limit and by the straight line of the coordinate that is set as converting objects, thus object images 62 is divided into 4 regions.

In addition, respectively about each cut zone, be SA0 using the cartographic represenation of area in region of front view bottom right of Figure 10 in the region (namely comprising the region of reference mark M4) as relative with reference mark M1 10.In addition, be SA1 by the cartographic represenation of area in the region of the lower-left in the region (namely comprising the region of reference mark M3) relative with reference mark M2.In addition, be SA2 by the cartographic represenation of area in the region of the upper right in the region (namely comprising the region of reference mark M2) relative with reference mark M3.And then, be SA3 by the cartographic represenation of area in the region of the upper left in the region (namely comprising the region of reference mark M1) relative with reference mark M4.

In addition, systems control division 40 by the area of the cut zone SA0 to SA3 obtained like this and obtained by the process of step S115 reduction correcting value (dx0 ', dy0 ') to (dx3 ', dy3 ') substitute into following (3) formula.The value obtained thus become the coordinate of the object being set as above-mentioned coordinate conversion, for the crooked correcting value (ddx, ddy) being exposed substrate C.

[mathematical expression 3]

$\begin{array}{c}SS=SA0+SA1+SA2+SA3\\ ddx=\frac{SA0\×dx{0}^{\′}+SA1\×dx{1}^{\′}+SA2\×dx{2}^{\′}+SA3\×dx{3}^{\′}}{SS}\\ ddy=\frac{SA0\×dy{0}^{\′}+SA1\×dy{1}^{\′}+SA2\×dy{2}^{\′}+SA3\×dy{3}^{\′}}{SS}\end{array}...\left(3\right)$

Such as, as shown in figure 13, when dx0 '=1, dx1 '=2, dx2 '=5, dx3 '=10, SA0=3, SA1=9, SA2=3, SA3=1, SS=16, ddx=(3 × 1+9 × 2+3 × 5+1 × 10)/16 ≈ 2.9 is had.

In addition, the deriving method for the crooked correcting value (ddx, ddy) being exposed substrate C is not limited to this.That is, the vertical line relative to each limit of object images 62 is drawn from position A (x, y) in the precalculated position as the object images 62 before coordinate conversion, thus by each limit of object images 62 point.Thus, proportion by subtraction in each limit relative to the object images 62 of position A is obtained.Also in the object images 62 after coordinate conversion, the position B corresponding with proportion by subtraction in it can be determined, the side-play amount of position A and position B be defined as correcting value (ddx, ddy).

And then, the flexible multiplying power kx in the amount of bias ofsy in the amount of bias ofsx in the correcting value (ddx, ddy) of each coordinate in object images 62, x direction, y direction, x direction, the flexible multiplying power ky in y direction and rotation amount θ are substituted into (4) formula below by systems control division 40.By this (4) formula, obtain the coordinate (xm, ym) after about the coordinate conversion of each coordinate (xl, yl) of the object being set as coordinate conversion.

[mathematical expression 4]

xm＝(kx×xl+ddx)×cosθ-(ky×yl+ddy)×sinθ+ofsx

ym＝(kx×xl+ddx)×sinθ-(ky×yl+ddy)×cosθ+ofsy

…(4)

In following step S129, control objective table drive division 42, the position moving to the light beam by penetrating from exposure portion 22 to make objective table 12 upper surface being exposed substrate C is exposed.

In following step S131, control photohead 22a via light source cell 24 and graphics processing unit 28, be exposed rendered object image 62 on substrate C to use the coordinate (xm, ym) after coordinate conversion.Now, systems control division 40 controls objective table drive division 42 and moves with predetermined speed to make objective table 12, thus while making to be exposed substrate C movement, controls photohead 22a to be exposed rendered object image 62 on substrate C.

In following step S133, objective table 12 is moved to be exposed the position that substrate C dismantles from objective table 12, terminate to perform this spectrum assignment handling procedure.

Like this, in the exposure plotting device 10 of present embodiment, as an example, as shown in Figure 14 A, when above-mentioned reduced rate is 0% (N=0), systems control division 40 does not reduce the crooked correcting value ground rendered object image 62 for being exposed substrate C.

On the other hand, as an example, as shown in Figure 14B, when above-mentioned reduced rate is greater than 0% (N>0), systems control division 40, after reduce for the crooked correcting value being exposed substrate C according to reduced rate, makes object images 62 be out of shape and describe.In addition, in Figure 14 A and Figure 14 B, for the depicting pattern being set as rendered object, in order to easily know the position relationship of terminal pad 66 and conducting through hole 68, be provided with terminal pad 66 in the position of reference mark M of the layer being set as rendered object, be provided with conducting through hole 68 in the position of the reference mark M of other layers.

In general exposure plotting device, such as, as shown in figure 15, when when be exposed substrate C stacks gradually multilayer (such as 4 layers) depicting pattern 62A to 62D from the next side and describes, whenever terminating the description of each layer, carry out developing, etch, the chemical treatment such as stripping.In addition, in general exposure plotting device, in order to carry out overlap to layer further, carry out the lamination etc. of the processing of stacked, the conducting through hole of the prepreg bed of material, filling vias coating, coarsening process, DFR (DryFilmphotoResist, dry film photoresist).Therefore, as shown in figure 16, imagine whenever carrying out stacked for the depicting pattern 62A of ground floor, the depicting pattern 62B of the second layer, the depicting pattern 62C of third layer, the depicting pattern 62D of the 4th layer, the crooked change being exposed substrate C is large.

But in the exposure plotting device 10 of present embodiment, when describing depicting pattern, at every one deck, above-mentioned physical quantity is larger, makes reducing amount larger, reduces the crooked correcting value for being exposed substrate C simultaneously.Thereby, it is possible to accurately electronic unit is installed on substrate.

In addition, in the exposure plotting device 10 of present embodiment, by reference mark M correcting value is separately multiplied by be less than 1 on the occasion of (reduced rate), reduce pure correcting value, but be not limited to this.That is, also can by by pure correcting value divided by the value more than 1, or deduct from pure correcting value on the occasion of, reduce pure correcting value.Or also can reduce pure correcting value by the multiple combination of above-mentioned multiplication, division, subtraction.

And then, when describing when being exposed stacked multiple depicting pattern on substrate C, and when the layer of the lowermost position being exposed substrate C describes depicting pattern, also can not carry out the crooked correction being exposed substrate C.

Then, about the exposure plotting device 10 of present embodiment, describe and apply the present invention to expose being exposed substrate C light beam and describing the situation of the exposure plotting device 10 of depicting pattern, but be not limited to this.That is, basis can be applied the present invention at the arbitrary drawing apparatus being described to be set as the image of rendered object by the position describing the reference mark M arranged in body.In addition, the laser processing device of the conducting through hole that is electrically connected etc. and Drilling operation device between the layer that also can apply the present invention to each layer formed describing depicting pattern.In addition, the exposure plotting device for forming member erection opening in the solder mask of the depicting pattern for the protection of substrate and processing unit (plant) can be also applied to.Thereby, it is possible to accurately electronic unit is installed on substrate.

(the second embodiment)

Below, the exposure plotting device 10 of the second embodiment of the present invention is described.

The exposure plotting device 10 of the second embodiment has the formation identical with the exposure plotting device 10 of the first embodiment, so omit the explanation of each formation.

The exposure plotting device 10 of the second embodiment is carrying out timing according to being exposed the crooked of substrate C, comes to arrange restriction to reduction correcting value (dx ', dy ') according to the value of annular ring.As shown in figure 17, annular ring is the annular section of the whole circumference of encirclement conducting through hole 68 when conducting through hole 68 has been dug in the inside of terminal pad 66, and the width of annular section when terminal pad diameter being set to D, when aperture being set to d and the width L of annular ring are represented by L=(D-d)/2.

In the exposure plotting device 10 of present embodiment, in the HDD40A of systems control division 40, prestore the information representing the terminal pad diameter D of the terminal pad 66 and aperture d of conducting through hole 68.

Then, with reference to Figure 18, the effect of the exposure plotting device 10 of present embodiment is described.In addition, Figure 18 is the process flow diagram of the flow process of the process that the spectrum assignment handling procedure performed by the systems control division 40 of the exposure plotting device 10 of the second embodiment when have input via operating means 44 and performing instruction is shown.This program is stored in advance in the presumptive area of above-mentioned ROM of systems control division 40.In addition, in the step of the process that carrying out in figure 18 is identical with Figure 12, additional identical with Figure 12 number of steps, the description thereof will be omitted as far as possible.

In the exposure plotting device 10 of this second embodiment, after the process carrying out above-mentioned steps S119, transfer to step S121.

In step S121, obtain the information of the width L representing annular ring.In the exposure plotting device 10 of present embodiment, the information representing the terminal pad diameter D of the terminal pad 66 and aperture d of conducting through hole 68 is read from the HDD40A of systems control division 40, the value of terminal pad diameter D and aperture d is substituted into (5) formula below, thus derive the width L of annular ring.

[mathematical expression 5]

$L=\frac{D-d}{2}...\left(5\right)$

In addition, terminal pad diameter D and aperture d also according to being exposed the kind of substrate C, the design load of depicting pattern, can be inputted via operating means 44 by user.

In addition, the adquisitiones of the width L of annular ring is not limited to this.This adquisitiones also can be such as the method inputted via outside input and output portion 48 from the signal conditioning package be connected with outside.In addition, this adquisitiones also can be the method that the information of the width L (such as 30 μm) representing annular ring is stored in advance in the storage parts such as RAM, HDD40A of systems control division 40, is read from this storage part.In addition, also can consider the error etc. of the error of the placement location being exposed substrate C, the position of description, make the value of the width L of annular ring narrower than material object, thus surplus is set bloats from terminal pad 66 to avoid conducting through hole 68.

In following step S123, judge from pure correcting value (dx0, dy0) in (dx3, dy3), deduct the width L reducing value that correcting value (dx0 ', dy0 ') obtains to (dx3 ', dy3 ') and whether be greater than annular ring.Now, about each reference mark M, judging, certainly judging even if also make when there being one to meet this condition.When judging for negative in step S123, transfer to above-mentioned steps S127, on the other hand, when transferring to step S126 for when certainly judgement.

In step S126, in order to offset with the position of conducting through hole 68 by avoiding that for the crooked correction being exposed substrate C terminal pad 66 occurs, restriction reduction correcting value (dx0 ', dy0 ') to (dx3 ', dy3 ').Now, by pure correcting value (dx0, dy0) substitute into following (6) formula and the value that obtains to the width L of (dx3, dy3), annular ring to be set as and to reduce correcting value (dx0 ', dy0 ') to (dx3 ', dy3 ').

[mathematical expression 6]

$\begin{array}{c}(dx,dy)=\left\{\right(dx0,dy0),(dx1,dy1),(dx2,dy2),(dx3,dy3\left)\right\}\\ {\mathrm{dx}}^{\′}=dx-dx\×\frac{L}{de}\\ {\mathrm{dy}}^{\′}=dy-dy\×\frac{L}{de}\\ {\mathrm{de}}^{\′}=\sqrt{{\mathrm{dx}}^{\′2}+{\mathrm{dy}}^{\′2}}=de-L\end{array}...\left(6\right)$

In addition, in above-mentioned (6) formula, as mentioned above, will reduce by restriction the side-play amount that correcting value (dx0 ', dy0 ') obtains to (dx3 ', dy3 ') and be set to side-play amount de '.

Thus, as shown in figure 19, while guaranteeing the correcting value for the minimum being exposed substrate C, in the mode making conducting through hole 68 be accommodated in the inside of terminal pad 66, reduce for after the crooked correcting value being exposed substrate C, make above-mentioned anamorphose.Thus, conducting through hole 68 is accommodated in the inside of terminal pad 66, electronic unit can be installed to accurately and be exposed on substrate C.

As an example, as shown in FIG. 20 to the left, be set to when reduced rate N is set to 40% derive reduce correcting value (reduce correcting value=de × 0.4) and object images 62 be out of shape, the position of terminal pad 66 and conducting through hole 68 offsets.In this case, as shown in the right figure of Figure 20, reducing correcting value (reducing correcting value=de-L) by limiting according to the width L of annular ring, conducting through hole 68 can be made to be accommodated in the inside of terminal pad 66.In addition, in fig. 20, for the depicting pattern being set as rendered object, in order to easily know the position relationship of terminal pad 66 and conducting through hole 68, be provided with terminal pad 66 in the position of reference mark M of the layer being set as rendered object, be provided with conducting through hole 68 in the position of the reference mark M of other layers.

Various process for realizing the spectrum assignment process implemented by the exposure plotting device 10 formed as described above also can, by executive routine, utilize computing machine to be realized by software configuration.But, be not limited to the realization based on software configuration, also can be realized by the combination of hardware configuration, hardware configuration and software configuration.

The whole of No. 2013-074227, Japanese patent application disclose by referring to being incorporated in this instructions.

The all document recorded in this manual, patented claim and technical standard with specifically and describe by referring in the same manner as the situation being incorporated to each document, patented claim and technical standard respectively, by referring to being incorporated in this instructions.

Claims (13)

1. a drawing apparatus, possesses:

Obtaining section, obtain represent position in the design being exposed multiple reference marks that substrate is arranged and primary importance coordinate data, represent determine using described primary importance as benchmark be exposed the coordinate data of the depicting pattern that substrate is described described and represent the position of described multiple reference mark reality separately and the coordinate data of the second place;

Leading-out portion, the physical quantity of the crooked size being exposed substrate described in expression is derived according to described primary importance and the described second place, and each for described multiple reference mark, leading-out needle is to the correcting value of the skew of described primary importance and the described second place;

Reduction portion, from each correcting value of being derived by described leading-out portion, reduces more amounts when described physical quantity is larger; And

Correction unit, when using the described second place as benchmark described be exposed substrate describes described depicting pattern, correct according to the correcting value after being reduced by described reduction portion the coordinate data representing described depicting pattern.

2. drawing apparatus according to claim 1, wherein,

Described leading-out portion derives at least one in the respective mean value of each described primary importance of described multiple reference mark and the maximal value of the side-play amount of the described second place, described side-play amount and described side-play amount aggregate-value separately, is used as described physical quantity.

3. drawing apparatus according to claim 1, wherein,

At least one in the respective mean value of the described leading-out portion mutual distance that derives the described multiple reference mark obtained according to described primary importance and the maximal value of the difference of the mutual distance of the described multiple reference mark obtained according to the corresponding described second place, described difference and described difference aggregate-value separately, is used as described physical quantity.

4. the drawing apparatus according to any one in claims 1 to 3, wherein,

Described reduction portion is larger by carrying out making each correcting value of being derived by described leading-out portion be multiplied by described physical quantity, less lower than 1 on the occasion of, larger divided by described physical quantity, the larger value more than 1 and to deduct described physical quantity larger, larger and be less than at least a kind in these computings of this correcting value, and from each correcting value of being derived by described leading-out portion, reduce more amounts when described physical quantity is larger.

5. the drawing apparatus according to any one in claims 1 to 3, wherein,

Described depicting pattern is the circuit pattern representing that electronics connects up,

Described correction unit, when the first correcting value that the mode being greater than to make conducting through hole be accommodated in the inside of the terminal pad in described depicting pattern by the correcting value after the reduction of described reduction portion is determined, corrects the coordinate data representing described depicting pattern according to this first correcting value.

6. the drawing apparatus according to any one in claims 1 to 3, wherein,

Described depicting pattern is the soldering-resistant pattern representing the open pore that the parts of solder mask are installed,

Described correction unit, when be greater than to make described open pore to be contained in the second correcting value that the mode for the inside of the conductor pad with components bonding determines of the correcting value after being reduced by described reduction portion, corrects the coordinate data representing described depicting pattern according to this second correcting value.

7. the drawing apparatus according to any one in claims 1 to 3, wherein,

Described leading-out portion, according to deducting in the side-play amount from described primary importance and the described second place by the described side-play amount moving in parallel the skew caused, the skew caused by rotation and obtained by least one in the flexible skew caused being exposed substrate, derives described correcting value.

8. the drawing apparatus according to any one in claims 1 to 3, wherein,

Also possess receiving unit, this receiving unit accepts the input of the reduction information be mapped respectively by the reduced rate of described physical quantity and described correcting value,

Described reduction portion is used in the reduced rate be mapped with the described physical quantity derived by described leading-out portion in the reduction information accepted by described receiving unit, reduces the correcting value of being derived by described leading-out portion.

9. an exposure plotting device, possesses:

Drawing apparatus described in any one in claims 1 to 3; And

Exposure portion, according to the coordinate data that the described correction unit by described drawing apparatus corrects, carries out exposure to describe to described depicting pattern described being exposed on substrate.

10. exposure plotting device according to claim 9, wherein, also possesses:

Control part, when when described be exposed the depicting pattern of laminated multi-layer on substrate and describe, control described obtaining section, described leading-out portion, described reduction portion, described correction unit and described exposure portion, for every layer of described multilayer, the exposure carried out the derivation obtaining, implemented by described leading-out portion implemented by described obtaining section, the reduction implemented by described reduction portion, the correction implemented by described correction unit respectively and implemented by described exposure portion.

11. exposure plotting devices according to claim 10, wherein,

Also possess storage part, this storage part storage list is shown as the crooked size that is exposed substrate for described and by the tolerance information of the MAD of the upper limit of allowing and described physical quantity,

Described control part, when the described physical quantity derived by described leading-out portion is greater than the MAD represented by described tolerance information, is forbidden by described exposure portion the described exposure being exposed substrate and implementing.

12. 1 kinds of recording mediums, record the program for making computing machine perform following process:

Obtain represent position in the design being exposed multiple reference marks that substrate is arranged and primary importance coordinate data, represent determine using described primary importance as benchmark be exposed the coordinate data of the depicting pattern that substrate is described described and represent the position of described multiple reference mark reality separately and the coordinate data of the second place

Derive the physical quantity of the crooked size being exposed substrate described in expression according to described primary importance and the described second place, and each for described multiple reference mark, leading-out needle to the correcting value of the skew of described primary importance and the described second place,

From correcting value described in derived each, reduce more amounts when described physical quantity is larger,

When using the described second place as benchmark described be exposed substrate describes described depicting pattern, correct according to the described correcting value after reducing the coordinate data representing described depicting pattern.

13. 1 kinds of plotting methods,

Obtain represent position in the design being exposed multiple reference marks that substrate is arranged and primary importance coordinate data, represent determine using described primary importance as benchmark be exposed the coordinate data of the depicting pattern that substrate is described described and represent the position of described multiple reference mark reality separately and the coordinate data of the second place

Derive the physical quantity of the crooked size being exposed substrate described in expression according to described primary importance and the described second place, and each for described multiple reference mark, leading-out needle to the correcting value of the skew of described primary importance and the described second place,

From correcting value described in derived each, reduce more amounts when described physical quantity is larger,

When using the described second place as benchmark described be exposed substrate describes described depicting pattern, correct according to the described correcting value after reducing the coordinate data representing described depicting pattern.