JP2014199298A - Drawing apparatus, light exposure drawing apparatus, program and drawing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a drawing apparatus, a light exposure drawing apparatus, a program and a drawing method which can realize interlayer positioning with high accuracy while suppressing pitch deviation between a pad for packaging and an electrode of an electronic part.SOLUTION: A drawing method comprises: acquiring coordinate data representing first design positions of a plurality of reference marks arranged on a to-be-exposed substrate, coordinate data representing a drawing pattern to be drawn on the to-be-exposed substrate with the first positions as reference and coordinate data representing second real positions of the individual marks (S103 and S107); calculating physical values representing the magnitude of strain of the to-be-exposed substrate on the basis of the first and second positions; calculating corrections to the first and second positions for each of the reference marks (S113 and S114); reducing the calculated corrections more as the physical values increase more (S119); and correcting coordinate data representing the drawing pattern on the basis of the reduced corrections (S127).

Description

  The present invention relates to a drawing apparatus, an exposure drawing apparatus, a program, and a drawing method, and in particular, a drawing apparatus that draws a drawing pattern on a substrate, an exposure drawing apparatus that draws a drawing pattern on a substrate by exposure, and the drawing apparatus And a drawing method for drawing a drawing pattern on a substrate.

  Conventionally, a prepreg obtained by impregnating glass cloth and drying, or a metal plate with excellent rigidity function as a core substrate, and a multilayer wiring structure in which resin layers and wiring layers are stacked in multiple layers on these core substrates A multilayer wiring board having the following is known. In recent years, since the multilayer wiring board is required to be thin and space-saving, a thin multilayer wiring board having no core layer has been proposed.

  In these multilayer wiring boards, it is difficult to align the layers of the drawing patterns (wiring patterns) drawn on each layer because the board is warped by chemical treatment or the board is deformed due to insufficient strength. There is a case. Nevertheless, since the land diameter and hole diameter in the drawing pattern are miniaturized by increasing the density of the drawing pattern, highly accurate alignment between layers is required.

  In order to satisfy this requirement, a technique has been proposed in which a drawing pattern is deformed in accordance with substrate distortion caused by warping and deformation of the substrate and then drawn on the substrate. According to this technology, the accuracy of alignment between layers improves, but distortion accumulates each time the layers are stacked, so the shape of the drawing pattern drawn on the upper layer deviates from the shape of the designed drawing pattern, and the substrate There is a concern that it is difficult to mount electronic components on top.

  In addition, a technique has been proposed in which an image showing a drawing pattern is divided into a plurality of regions, and the image is rotated for each divided region in accordance with the distortion of the substrate. According to this technique, the amount of deviation between the shape of the designed drawing pattern and the shape of the drawing pattern actually drawn is reduced in each divided region. However, this technique has a problem that image processing becomes complicated and a mechanism that forms a positioning hole for connecting drawing patterns between layers is required.

  As a technique for solving these problems, Patent Document 1 and Patent Document 2 can suppress a deviation of a drawn drawing pattern from a designed drawing pattern without complicating image processing. A drawing device is disclosed.

  That is, the drawing device of Patent Document 1 previously acquires deformation information of the substrate, and based on the deformation information, the drawing pattern recorded on the substrate after deformation has the same shape as the drawing pattern indicated by the raster data The raster data is converted so that Then, a drawing pattern is recorded on the substrate before deformation based on the converted raster data.

  Further, the drawing apparatus of Patent Document 2 uses a drawing data having a position coordinate that defines an area to be drawn and a position of a reference point provided in the area, to change the displacement mode of the position coordinate of the substrate. Based on this, the position of the reference point is corrected. Then, based on the corrected position of the reference point, each coordinate in the area is corrected while maintaining the shape of the area.

JP 2005-157326 A JP 2011-95742 A

  In the technique disclosed in Patent Document 1, since the drawing pattern is greatly deformed based on the acquired deformation information, the mounting of the electronic component on the finally obtained substrate is improved, but the alignment with the lower layer is improved. There is a problem that the accuracy of the system may deteriorate.

  Further, even in the technique disclosed in Patent Document 2, the mounting pad, the electrode of the electronic component, and the like are finally obtained as the size of the region to be drawn changes from the size of the region before correction. Misalignment may occur, making it difficult to mount the electronic component on the substrate.

  The present invention has been made in view of the above problems, and a drawing apparatus and an exposure drawing apparatus capable of realizing highly accurate alignment between layers while suppressing a pitch shift between a mounting pad and an electrode of an electronic component. An object is to provide a program and a drawing method.

  In order to achieve the above object, a drawing apparatus according to the present invention uses coordinate data indicating a first position, which is a design position of a plurality of reference marks provided on a substrate to be exposed, as a reference based on the first position. An acquisition unit that acquires coordinate data indicating a drawing pattern to be drawn on the substrate to be exposed and defined as coordinate data indicating a second position that is an actual position of each of the plurality of reference marks; A physical quantity indicating the magnitude of distortion of the substrate to be exposed is derived on the basis of the position and the second position, and the first position and the second position are determined for each of the plurality of reference marks. A deriving unit for deriving a correction amount for deviation, a reduction unit for reducing a larger amount as the physical quantity increases from each of the correction amounts derived by the deriving unit, and the substrate to be exposed with the second position as a reference To the above drawing pattern When drawing the emissions, and a, a correction unit for correcting the coordinate data representing the drawing pattern based on the correction amount is reduced by the reduction unit.

  According to the drawing apparatus of the present invention, the acquisition unit determines the coordinate data indicating the first position, which is the design position of the plurality of reference marks provided on the substrate to be exposed, based on the first position. The coordinate data indicating the drawing pattern to be drawn on the exposed substrate and the coordinate data indicating the second position which is the actual position of each of the plurality of reference marks are acquired. Further, the deriving unit derives a physical quantity indicating the magnitude of distortion of the substrate to be exposed based on the first position and the second position, and for each of the plurality of reference marks, the first quantity is derived. And a correction amount for the shift of the second position is derived.

  Here, in the drawing apparatus according to the present invention, the amount that is increased as the physical amount increases is reduced by the reduction unit from each of the correction amounts derived by the deriving unit.

  Further, in the drawing apparatus according to the present invention, when the correction unit draws the drawing pattern on the substrate to be exposed with the second position as a reference, the drawing pattern is based on the correction amount reduced by the reduction unit. The coordinate data indicating is corrected.

  That is, the drawing apparatus according to the present invention reduces the amount of correction from each of the correction amounts derived from the deviation amount between the design position of the reference mark and the actual position, and the reduced correction amount as the physical quantity increases. Based on the above, the coordinate data indicating the drawing pattern is corrected.

  As described above, according to the drawing apparatus according to the present invention, as the magnitude of the distortion of the exposed substrate increases, the correction amount decreases, so that the shape of the corrected drawing pattern approaches the distortion shape of the exposed substrate, It is possible to achieve highly accurate alignment between layers while suppressing a pitch shift between the mounting pad and the electrode of the electronic component.

  In the drawing apparatus according to the present invention, the derivation unit may use the maximum value of the deviation amount of the first position and the second position for each of the plurality of reference marks as the physical quantity, and the deviation amount. You may make it derive | lead-out at least 1 of each average value and each integrated value of said deviation | shift amount. Further, in the drawing apparatus according to the present invention, the derivation unit is based on the distance between the plurality of reference marks obtained as the physical quantity based on the first position and the corresponding second position. It is also possible to derive at least one of a maximum value of a difference from the distance between the plurality of reference marks obtained in this way, an average value of each of the differences, and an integrated value of each of the differences. By deriving the maximum deviation amount for each of the reference marks as the physical quantity, correction can be performed more reliably. In addition, by deriving the average value of the deviation amounts for each of the reference marks, it is possible to suppress the occurrence of erroneous correction due to a peculiar deviation. Further, by deriving the integrated value of the deviation amounts for each of the reference marks, it is possible to perform correction reflecting all the deviation amounts.

  In the drawing apparatus according to the present invention, the reducing unit multiplies each of the correction amounts derived by the deriving unit by a positive value less than 1 as the physical amount increases, and the physical amount increases. Each of the correction amounts derived by the deriving unit by performing at least one of dividing by a larger value exceeding 1 and subtracting a positive value that is larger as the physical amount is larger and smaller than the correction amount. Therefore, the larger the physical quantity, the smaller the quantity may be reduced. Thereby, the correction amount can be reduced by a simple calculation.

  In the drawing apparatus according to the present invention, the drawing pattern is a circuit pattern indicating an electronic wiring, and the correction unit reduces the correction amount reduced by the reduction unit to the inside of the land in the drawing pattern. If the value is larger than the first correction amount determined to fall within the range, the coordinate data indicating the drawing pattern may be corrected based on the first correction amount. As a result, it is possible to prevent the chipping of the land that causes the defective substrate to be exposed (the protrusion of the conductive via to the outside of the land).

  In the drawing apparatus according to the present invention, the drawing pattern is a solder resist pattern indicating an opening hole for component mounting of the solder resist layer, and the correction unit has a correction amount reduced by the reduction unit described above. When the opening hole is larger than a second correction amount determined to be accommodated in the conductor pad for joining with the component, the coordinate data indicating the drawing pattern is corrected based on the second correction amount. May be. As a result, it is possible to prevent positional deviation between the conductor pad and the opening hole, which causes a defect in the substrate to be exposed.

  In the drawing apparatus according to the present invention, the derivation unit may detect a deviation due to the parallel movement of the substrate to be exposed, a deviation due to rotation, and a deviation due to expansion / contraction from the deviation amount of the first position and the second position. The correction amount may be derived based on a shift amount obtained by subtracting at least one. Thereby, the pitch shift | offset | difference of the pad for mounting and the electrode of an electronic component can be suppressed more reliably.

  The drawing apparatus according to the present invention further includes a reception unit that receives input of reduction information in which the physical quantity and the reduction rate of the correction amount are associated with each other, and the reduction unit receives the reduction received by the reception unit. The correction amount derived by the deriving unit may be reduced using a reduction rate associated with the physical quantity derived by the deriving unit in the information. As a result, the degree of reduction of the correction amount can be easily set, so that convenience for the user can be improved.

  On the other hand, in order to achieve the above object, the exposure drawing apparatus according to the present invention includes the drawing apparatus according to the present invention and the drawing on the substrate to be exposed based on the coordinate data corrected by the correction unit of the drawing apparatus. Exposure means for exposing and drawing a pattern.

  Therefore, according to the exposure drawing apparatus according to the present invention, since it operates in the same manner as the drawing apparatus according to the present invention, as in the drawing apparatus, while suppressing the pitch deviation between the mounting pad and the electrode of the electronic component, High-precision alignment between layers can be realized.

  The exposure drawing apparatus according to the present invention provides the acquisition unit, the derivation unit, the reduction unit, the correction unit, and the exposure when drawing a plurality of layers of drawing patterns on the substrate to be exposed. A control unit that controls each of the plurality of layers to perform acquisition by the acquisition unit, derivation by the derivation unit, reduction by the reduction unit, correction by the correction unit, and exposure by the exposure unit May be further provided. As a result, even when a plurality of drawing patterns are stacked and drawn, it is possible to realize highly accurate alignment between layers while suppressing a pitch shift between the mounting pad and the electrode of the electronic component.

  The exposure drawing apparatus according to the present invention further includes a storage unit that stores allowable amount information indicating a maximum allowable amount of the physical quantity that is an upper limit allowed as a magnitude of distortion of the exposed substrate, and the control unit However, when the physical quantity derived by the deriving unit is larger than the maximum allowable amount indicated by the allowable amount information, the exposure by the exposure unit on the substrate to be exposed may be prohibited. Thereby, useless exposure can be avoided.

  In order to achieve the above object, a program according to the present invention causes a computer to perform coordinate data indicating a first position which is a design position of a plurality of reference marks provided on a substrate to be exposed; An acquisition unit for acquiring coordinate data indicating a drawing pattern to be drawn on the substrate to be exposed, which is defined with respect to the position of the reference position, and coordinate data indicating a second position that is an actual position of each of the plurality of reference marks; A physical quantity indicating a magnitude of distortion of the substrate to be exposed is derived based on the first position and the second position, and the first position and the second position are determined for each of the plurality of reference marks. A deriving unit for deriving a correction amount for the position shift of 2, a reduction unit for reducing a larger amount as the physical quantity increases from each of the correction amounts derived by the deriving unit, and the second position as a reference the above When drawing the drawing pattern on the exposed substrate, and a correcting unit for correcting the coordinate data representing the drawing pattern based on the correction amount is reduced by the reduction unit, to function as a.

  Therefore, according to the program according to the present invention, the computer can be operated in the same manner as the drawing apparatus according to the present invention, so that the pitch deviation between the mounting pad and the electrode of the electronic component is suppressed as in the drawing apparatus. However, highly accurate alignment between layers can be realized.

  Furthermore, in order to achieve the above object, the drawing method according to the present invention includes coordinate data indicating a first position, which is a design position of a plurality of reference marks provided on a substrate to be exposed, the first position. An acquisition step of acquiring coordinate data indicating a drawing pattern to be drawn on the substrate to be exposed and defined as a reference, and coordinate data indicating a second position that is an actual position of each of the plurality of reference marks; A physical quantity indicating the magnitude of distortion of the exposed substrate is derived based on the first position and the second position, and for each of the plurality of reference marks, the first position and the second position are derived. A derivation step for deriving a correction amount for positional deviation, a reduction step for reducing a larger amount as the physical quantity increases from each of the correction amounts derived in the derivation step, and the second position as a reference When drawing the drawing pattern on the substrate to be exposed Te, and a, a correction step of correcting the coordinate data representing the drawing pattern based on the correction amount is reduced by the reduction step.

  Therefore, the drawing method according to the present invention operates in the same manner as the drawing apparatus according to the present invention. Therefore, as in the case of the drawing apparatus, the pitch deviation between the mounting pad and the electrode of the electronic component is suppressed and Accurate alignment between layers can be realized.

  According to the present invention, it is possible to achieve highly accurate alignment between layers while suppressing a pitch shift between a mounting pad and an electrode of an electronic component.

It is a perspective view which shows the external appearance of the exposure drawing apparatus which concerns on embodiment. It is a perspective view which shows the structure of the principal part of the exposure drawing apparatus which concerns on embodiment. It is a perspective view which shows the structure of the exposure head of the exposure drawing apparatus which concerns on embodiment. It is a top view which shows the exposed area | region formed in a to-be-exposed board | substrate in the exposure drawing apparatus which concerns on embodiment. It is a block diagram which shows the structure of the electric system of the exposure drawing apparatus which concerns on embodiment. It is a top view which shows an example of the to-be-exposed board | substrate which has not generate | occur | produced distortion. It is a top view which shows an example of the to-be-exposed board | substrate which has generate | occur | produced distortion. It is a top view with which it uses for description of the derivation | leading-out method of the distortion amount in the exposure control processing which concerns on embodiment. It is a top view with which it uses for description of another example of the derivation | leading-out method of the distortion amount in the exposure control processing which concerns on embodiment. It is a schematic diagram which shows an example of the reduction information which concerns on embodiment. It is a graph which shows an example of the relationship between the physical quantity which shows the magnitude | size of the distortion of the to-be-exposed board | substrate in the exposure control processing which concerns on embodiment, and a reduction rate. In the exposure drawing apparatus which concerns on embodiment, it is a top view which shows an example of the area | region used as the object of the coordinate transformation according to the distortion of a to-be-exposed board | substrate. In the exposure drawing apparatus which concerns on embodiment, it is a top view which shows another example of the area | region used as the object of the coordinate transformation according to the distortion of a to-be-exposed board | substrate. In the exposure drawing apparatus which concerns on embodiment, it is a top view which shows another example of the area | region used as the object of the coordinate transformation according to the distortion of a to-be-exposed board | substrate. It is a flowchart which shows the flow of a process of the exposure control processing program which concerns on 1st Embodiment. It is a top view with which it uses for description of the method of the coordinate transformation according to the distortion of the to-be-exposed board | substrate in the exposure control processing which concerns on embodiment. In the exposure drawing apparatus which concerns on 1st Embodiment, it is a top view which shows an example of the target image when not performing coordinate conversion according to distortion of a to-be-exposed board | substrate. In the exposure drawing apparatus which concerns on 1st Embodiment, it is a top view which shows an example of the target image after coordinate conversion at the time of performing coordinate conversion according to distortion of a to-be-exposed board | substrate, reducing a correction amount. It is sectional drawing which shows an example of the to-be-exposed board | substrate at the time of drawing the drawing pattern in multiple layers on the to-be-exposed board | substrate in the exposure drawing apparatus which concerns on 1st Embodiment. It is a top view which shows an example of the target image drawn by each layer at the time of drawing a drawing pattern in multiple layers on the to-be-exposed board | substrate in the exposure drawing apparatus which concerns on 1st Embodiment. It is a top view with which it uses for description of an annular ring. It is a flowchart which shows the flow of a process of the exposure control processing program which concerns on 2nd Embodiment. In the exposure drawing apparatus which concerns on 2nd Embodiment, it is an enlarged plan view which shows an example of the target image after coordinate conversion at the time of performing coordinate conversion according to distortion of a to-be-exposed substrate, reducing a correction amount. In the exposure drawing apparatus according to the second embodiment, an example of an object image after coordinate conversion (left figure) and reduction when coordinate conversion according to distortion of the substrate to be exposed is performed without limiting the reduction correction amount. It is a top view which shows an example (right figure) of the target image after coordinate conversion at the time of performing while restrict | limiting a correction amount.

[First Embodiment]
Hereinafter, an exposure drawing apparatus according to an embodiment will be described in detail with reference to the accompanying drawings. In the present embodiment, the present invention relates to a drawing pattern such as a circuit pattern, a solder resist pattern showing an opening hole for component mounting of a solder resist layer by exposing a light beam to a substrate to be exposed (exposed substrate C described later). A case where the present invention is applied to an exposure drawing apparatus for drawing will be described as an example. In addition, as a to-be-exposed board | substrate, flat board | substrates, such as a printed wiring board and a glass substrate for flat panel displays, are illustrated. In the exposure drawing apparatus according to the present embodiment, the substrate to be exposed as an exposure drawing target has a rectangular shape.

  As shown in FIGS. 1 and 2, the exposure drawing apparatus 10 according to this embodiment includes a flat plate stage 12 for fixing the substrate C to be exposed. A plurality of suction holes (not shown) for sucking air are provided on the upper surface of the stage 12. As a result, when the exposed substrate C is placed on the upper surface of the stage 12, the exposed substrate C is vacuum-sucked to the stage 12 by sucking air between the exposed substrate C and the stage 12.

  The stage 12 according to the present embodiment is supported by a flat base 16 that is movably provided on the upper surface of a table-like base 14. That is, one or a plurality of (in this embodiment, two) guide rails 18 are provided on the upper surface of the base body 14. The base 16 is supported by the guide rail 18 so as to be freely movable along the guide rail 18, and is moved by being driven by a drive mechanism (stage drive unit 42 described later) constituted by a motor, a hydraulic pump, and the like. To do. Therefore, the stage 12 moves along the guide rail 18 in conjunction with the movement of the base 16.

  As shown in FIG. 2, in the following, the direction in which the stage 12 moves is defined as the Y direction, the direction perpendicular to the Y direction in the horizontal plane is defined as the X direction, and is orthogonal to the Y direction in the vertical plane. The direction to do is defined as the Z direction.

  A gate-shaped gate 20 is provided on the upper surface of the base 14 so as to straddle the two guide rails 18. The exposed substrate C placed on the stage 12 moves so as to enter and exit the opening of the gate 20 along the guide rail 18. An exposure unit 22 that exposes a light beam toward the opening is attached to the upper part of the opening of the gate 20. When the stage 12 moves along the guide rail 18 and is positioned in the opening by the exposure unit 22, the light beam is exposed on the upper surface of the exposure target substrate C placed on the stage 12.

  The exposure unit 22 according to the present embodiment includes a plurality (ten in the present embodiment) of exposure heads 22a. Further, an optical fiber 26 drawn from a light source unit 24 described later and a signal cable 30 drawn from an image processing unit 28 described later are connected to the exposure unit 22.

  Each of the exposure heads 22a has a digital micromirror device (DMD) as a reflective spatial light modulation element. On the other hand, the exposure drawing apparatus 10 includes a light source unit 24 that emits a light beam to the exposure head 22a, and an image processing unit 28 that outputs image information to the exposure head 22a. The exposure head 22 a modulates the light beam from the light source unit 24 by controlling the DMD based on the image information input from the image processing unit 28. The exposure drawing apparatus 10 exposes the substrate C to be exposed by irradiating the substrate C with this modulated light beam. The spatial light modulation element is not limited to the reflection type, and may be a transmission type spatial light modulation element such as liquid crystal.

  On the upper surface of the base 14, a gate-type gate 32 erected so as to straddle the two guide rails 18 is provided. The exposed substrate C placed on the stage 12 moves so as to enter and exit the opening of the gate 32 along the guide rail 18.

  One or a plurality of (two in the present embodiment) photographing units 34 for photographing the opening are attached to the upper part of the opening of the gate 32. The photographing unit 34 is a CCD camera or the like having a built-in strobe with a very short light emission time. In addition, rails 34a are provided at the upper part of the opening of the gate 32 along a direction (X direction) perpendicular to the moving direction (Y direction) of the stage 12 in the horizontal plane. It is provided so that it can move by being guided by 34a. When the stage 12 moves along the guide rail 18 and is positioned at the opening, the imaging unit 34 images the upper surface of the substrate C to be exposed placed on the stage 12.

  Next, exposure processing by the exposure head 22a according to the present embodiment will be described.

  As shown in FIG. 3, an image area 22 b that is an area exposed by the exposure head 22 a according to the present embodiment has one side with a predetermined inclination angle with respect to the moving direction (Y direction) of the stage 12. It is a rectangular shape inclined at. When the light beam is exposed by the exposure head 22a while the stage 12 is moving through the opening of the gate 20, a strip-shaped exposure is performed on the substrate C to be exposed for each exposure head 22a as the stage 12 moves. Region 22c is formed.

  Further, as shown in FIGS. 2 and 3, each of the exposure heads 22a is arranged in a matrix in the exposure unit 22, and as shown in FIG. 4, the length of the long side of the image region 22b is set in the X direction. They are shifted by a distance that is a natural number times (in this embodiment, 1 time). Each of the exposed regions 22c is formed so as to partially overlap the adjacent exposed region 22c.

  Next, the configuration of the electrical system of the exposure drawing apparatus 10 according to the present embodiment will be described.

  As shown in FIG. 5, the exposure drawing apparatus 10 is provided with a system control unit 40 that is electrically connected to each part of the apparatus. The system control unit 40 controls each part of the exposure drawing apparatus 10. Be controlled. The exposure drawing apparatus 10 includes a stage drive unit 42, an operation device 44, a shooting drive unit 46, and an external input / output unit 48.

  The system control unit 40 includes a central processing unit (CPU), a random access memory (RAM), a read only memory (ROM), and a hard disk drive (HDD) 40A. Further, the system control unit 40 causes the CPU to emit a light beam from the light source unit 24 and output corresponding image information at a timing according to the movement of the stage 12 by the image processing unit 28. Control the exposure of the light beam to C.

  As described above, the stage drive unit 42 has a drive mechanism including a motor, a hydraulic pump, and the like, and moves the stage 12 under the control of the system control unit 40.

  The operation device 44 includes a display unit that displays various types of information under the control of the system control unit 40, and an input unit that inputs various types of information through user operations.

  The imaging drive unit 46 has a drive mechanism configured by a motor, a hydraulic pump, and the like, and moves the imaging unit 34 under the control of the system control unit 40.

  The external input / output unit 48 inputs / outputs various information to / from an information processing apparatus such as a personal computer connected to the exposure drawing apparatus 10.

  By the way, as shown in FIG. 2, a plurality of (four in this embodiment) alignment marks (hereinafter, referred to as the positioning reference when an image is drawn) are provided on the exposed substrate C according to the present embodiment. "Reference mark") M is provided. As an example, as shown in FIG. 6A, in the exposure drawing apparatus 10 according to the present embodiment, reference marks M1 to M4 (hereinafter, four are collectively referred to as “reference mark M”) at each corner of the substrate C to be exposed. .) Is provided. Specifically, the reference mark M1 is located at the upper left position of the substrate C to be exposed in FIG. 6A, the reference mark M2 is located at the upper right position, the reference mark M3 is located at the lower left position, and the reference mark M4 is located at the lower right position. Is provided.

  The exposure drawing apparatus 10 according to the present embodiment has an image such as a drawing pattern (hereinafter referred to as “target image”) indicated by image information at a predetermined relative position with respect to each of the reference marks M on the substrate C to be exposed. .) 62 is drawn. In the exposure drawing apparatus 10 according to the present embodiment, the outline shape of the target image 62 is a rectangular shape, but is not limited thereto, and may be an arbitrary shape such as an elliptical shape or a star shape.

  When the exposure drawing apparatus 10 draws the target image 62, the exposure unit 10 photographs each of the reference marks M by the photographing unit 34 before exposing the light beam to the substrate C to be exposed, and each of the reference marks M from the photographed image. Measure the position of. Then, the exposure drawing apparatus 10 determines an area in which the target image 62 is drawn based on each position of the measured reference mark M, and draws the target image 62 in the determined area.

  As an example, as shown in FIG. 6B, in the conventional exposure drawing apparatus 10, before drawing the target image 62 on the exposed substrate C, the distortion amount of the exposed substrate C is calculated from each position of the reference mark M. There was something to derive. In the conventional exposure drawing apparatus 10, the shape of the target image 62 is corrected in accordance with the derived distortion magnitude.

  At this time, the exposure / drawing apparatus 10 according to the present embodiment prevents a reduction in the accuracy of mounting the electronic component due to a difference between the shape of the design target image 62 and the shape of the drawn target image 62. Therefore, the correction amount for the distortion of the substrate C to be exposed in the target image 62 is reduced. At this time, the exposure drawing apparatus 10 according to the present embodiment determines the magnitude of distortion of the substrate C to be exposed from the correction amount corresponding to each shift amount of the reference mark M (hereinafter referred to as “pure correction amount”). As the physical quantity shown increases, the larger quantity is reduced. Thereby, the deformation | transformation from the design shape of the target image 62 is suppressed. Then, the exposure / drawing apparatus 10 according to the present embodiment deforms the target image 62 in accordance with each correction amount of the reduced reference mark M (hereinafter referred to as “reduction correction amount”).

  As an example, as shown in FIG. 7, the exposure drawing apparatus 10 according to the present embodiment uses, as the physical quantity, a design position for each reference mark M and a position (actual position) obtained by measurement. The maximum value of the shift amount de is used. In FIG. 7, the positions of the design reference marks M are shown connected by solid lines, and the positions of the reference marks M obtained by measurement are shown connected by dotted lines. Further, assuming that the front view left and right direction in FIG. 7 is the x direction, the front view vertical direction is the y direction, the deviation amount with respect to the x direction is the deviation amount dx, and the deviation amount with respect to the y direction is the deviation amount dy, the deviation amount de is (1).

このように、本実施形態に係る露光描画装置１０では、上記ずれ量の最大値を上記物理量として用いるが、これに限定されず、当該ずれ量の各々の平均値、または当該ずれ量の各々の積算値を上記物理量として用いても良い。また、上記最大値、上記平均値、上記積算値の複数の組み合わせを上記物理量として用いても良い。

As described above, in the exposure drawing apparatus 10 according to the present embodiment, the maximum value of the shift amount is used as the physical quantity. However, the present invention is not limited to this, and each average value of the shift amounts or each shift amount is used. An integrated value may be used as the physical quantity. Further, a plurality of combinations of the maximum value, the average value, and the integrated value may be used as the physical quantity.

  Alternatively, as shown in FIG. 8 as an example, the maximum value of the difference between the corresponding distances between the design distances Pa1 to Pa6 between the reference marks M1 to M4 and the distances Pb1 to Pb6 obtained by the measurement is described above. It may be used as a physical quantity. In FIG. 8, as in FIG. 7, the positions of the design reference marks M are shown connected by solid lines, and the positions of the reference marks M obtained by measurement are shown connected by dotted lines. Yes. Note that an average value of each difference or an integrated value of each difference may be used as the physical quantity. Furthermore, a plurality of combinations of the maximum value, the average value, and the integrated value may be used as the physical quantity.

  On the other hand, in order to derive the reduction correction amount, the exposure drawing apparatus 10 according to the present embodiment uses position information in which each position of the design reference mark M is represented by coordinate data and reduction information 50 as a system. The information is stored in advance in a predetermined area of the HDD 40A of the control unit 40.

  As an example, as illustrated in FIG. 9, the reduction information 50 according to the present embodiment includes physical quantity information indicating the physical quantity, reduction ratio information indicating a reduction ratio when the net correction amount is reduced, and processing on the substrate C to be exposed. The processing content information indicating the content is associated with each other. As shown in the figure, when the reduction rate is indicated by a range in the reduction rate information, it indicates that the reduction rate increases linearly or curvedly within the range.

  In the reduction information 50 according to the present embodiment, as the processing content information, the exposure drawing process for drawing the target image 62 on the substrate C to be exposed, and the substrate to be exposed without drawing the target image 62 on the substrate C to be exposed. Either one of the error processes for discharging C is stored. When the processing content indicated by the processing content information associated with the physical quantity in the reduction information 50 is the exposure drawing process, the exposure drawing apparatus 10 uses the reduction rate indicated by the reduction rate information associated with the physical quantity. The exposure drawing process is executed after reducing the pure correction amount. On the other hand, when the processing content indicated by the processing content information associated with the physical quantity in the reduction information 50 is an error process, the exposure drawing apparatus 10 removes the exposed substrate C from the exposure drawing apparatus without performing the exposure drawing process. 10 to discharge. However, the processing content of the error processing is not limited to this, and the reduction rate with respect to the exposed substrate C is set to a fixed value, and after performing the exposure drawing processing, information indicating that an error has occurred is drawn on the exposed substrate C. You may do it. In the exposure drawing apparatus 10 according to the present embodiment, as shown in FIG. 9, in the reduction information 50, the processing content when the physical quantity is 100 μm or more is an error process.

  Here, as an example, as illustrated in FIGS. 9 and 10, in the exposure / drawing apparatus 10 according to the present embodiment, in the reduction information 50, the reduction rate increases as the physical quantity increases. This means that as the physical quantity increases, the reduction amount with respect to the pure correction amount increases, that is, the reduction correction amount decreases. In this case, the target image 62 is deformed to a shape closer to the distortion shape of the substrate C to be exposed than the design shape of the target image 62, compared to the case where the reduction correction amount is not used. Thereby, the position shift with the pad for mounting and the electrode of an electronic component is suppressed.

  In the exposure drawing apparatus 10 according to the present embodiment, as shown in FIG. 10, the reduction rate is increased stepwise as the physical quantity increases, but the method of increasing the reduction rate is not limited to this. . For example, the reduction rate may be increased linearly as the physical quantity increases. Alternatively, the amount of increase in the reduction rate may be increased as the physical amount increases, or the amount of increase in the reduction rate may be decreased as the physical amount increases.

  The exposure drawing apparatus 10 according to the present embodiment determines the reduction rate using the physical quantity and the reduction information 50, and derives the reduction correction amount from the pure correction amount and the reduction rate. Then, the exposure drawing apparatus 10 corrects each position of the reference mark M according to the derived reduction correction amount, deforms the target image 62 based on each corrected position of the reference mark M, and deformed the target. An image 62 is drawn on the substrate C to be exposed.

  In the exposure drawing apparatus 10 according to the present embodiment, the user receives input of the reduction information 50 via the input unit of the operation device 44, and stores the received reduction information 50 in the HDD 40A of the system control unit 40. However, the present invention is not limited to this. For example, each piece of information in the reduction information 50 may be stored in advance in the HDD 40A of the system control unit 40 as a fixed value.

  Further, in the exposure drawing apparatus 10 according to the present embodiment, when the target image 62 is deformed, as shown in FIG. 11A as an example, the entire region of the target image 62 is converted into a target region (FIG. 11A) that is a target of coordinate conversion. And a region indicated by a dot pattern in FIG. 11B) 64. However, the target area 64 is not limited to this, and as an example, as shown in FIG. 11B, a rectangular area whose corner points are the positions of the centers of gravity of the four reference marks M1 to M4 may be used as the target area 64. Alternatively, as an example, as shown in FIG. 11C, the entire surface to be exposed of the substrate C to be exposed may be the target region 64, or a part of the target image 62 may be the target region 64.

Further, an image other than the circuit pattern such as the identification number of the substrate C to be exposed may be drawn on the edge of the substrate C to be exposed. In this case, coordinate conversion is performed on the drawing region of the image. Instead, it is preferable to perform coordinate conversion only on the drawing area of the circuit pattern. This is because the image showing the character string such as the identification number of the substrate C to be exposed does not depend on the state of distortion of the substrate C to be exposed, and it is easier to confirm the drawing contents if it is not deformed. The operation of the exposure drawing apparatus 10 according to this embodiment will be described with reference to FIG. FIG. 12 is a flowchart showing the flow of processing of an exposure control processing program executed by the system control unit 40 of the exposure drawing apparatus 10 when an execution instruction is input via the input unit of the operation device 44. The program is stored in advance in the predetermined area of the ROM in the system control unit 40.

  Further, in order to avoid complications, an example in which image information that is coordinate data indicating the target image 62 (vector data in the present embodiment) is stored in the HDD 40A of the system control unit 40 will be described as an example. . In the exposure drawing apparatus 10 according to the present embodiment, the image information is vector data indicating a drawing pattern, but is not limited thereto, and may be raster data.

  First, in step S101, image information which is coordinate data indicating the target image 62 to be drawn is acquired by reading from the HDD 40A. However, the system control unit 40 may acquire image information by inputting image information from the outside via the external input / output unit 48.

  In the next step S103, the position information in which each position of the design reference mark M described above is represented by coordinate data is read out from the HDD 40A.

  As described above, in the exposure drawing apparatus 10 according to the present embodiment, the system control unit 40 acquires the position information by reading the position information from the HDD 40A. However, the acquisition method is not limited to this, and the external input / output unit 48 is used. Alternatively, a method of inputting position information from the outside may be used.

  In the next step S105, the stage 12 is moved so that the substrate to be exposed C passes through the position where each of the reference marks M is included in the imaging region of the imaging unit 34.

  In the next step S107, the actual position of each reference mark M is measured. At this time, the system control unit 40 extracts a region corresponding to each of the reference marks M from the photographed image by the photographing unit 34 and derives the barycentric coordinates of the extracted regions as the position coordinates of each of the reference marks M. As described above, in the exposure drawing apparatus 10 according to the present embodiment, each position of the reference mark M is measured using the captured image. However, the measurement is not limited to this, and the measurement is performed by an external apparatus. Information to be shown may be input from the outside via the external input / output unit 48.

  In the next step S109, the rotation of the substrate C to be exposed is determined based on the deviation amount between each position of the design reference mark M acquired in the process of step S103 and each position of the reference mark M measured in the process of step S107. Each of the amount, the offset amount, and the expansion / contraction magnification is derived. Note that the rotation amount referred to here is an actual value corresponding to the position of the design reference mark M in a predetermined orthogonal coordinate system (in this embodiment, the xy coordinate system shown in FIG. 9 as an example). This is the rotation angle to the position of the reference mark M. The offset amount here is a parallel movement amount from the position of the designed reference mark M to the corresponding position of the actual reference mark M in the orthogonal coordinate system. Furthermore, the expansion / contraction magnification here is an enlargement or reduction magnification from the position of the designed reference mark M to the corresponding position of the actual reference mark M in the orthogonal coordinate system.

  The system control unit 40 performs an x-direction offset amount ofsx, an y-direction offset amount ofsy, an x-direction expansion / contraction magnification kx, a y-direction expansion / contraction magnification ky, by a least-squares method using each position coordinate of the reference mark M. And the parameter of the rotation amount θ are derived for each of the exposed substrates C.

  That is, when deriving each parameter, the position of the design reference mark M and the position of each measured reference mark M include the parameters without considering the distortion of the substrate C to be exposed. Assume that there is a unique relationship. Then, the parameters are determined so that the average deviation of the parameters is minimized (see, for example, JP-A-61-44429). Since the method for determining each of the parameters is a known method used in affine transformation or the like, further explanation here is omitted.

  In the next step S111, each position coordinate of the reference mark M measured in the process of step S107 is converted based on the rotation amount, the offset amount, and the expansion / contraction magnification derived in the process of step S109. Thereby, the displacement amount of each position of the reference mark M due to the displacement of the placement position when placing the substrate to be exposed C on the stage 12 is canceled.

  As described above, in the exposure drawing apparatus 10 according to the present embodiment, the position coordinates of the reference mark M measured in the process of step S107 are based on the rotation amount, the offset amount, and the expansion / contraction magnification of the substrate C to be exposed. However, it is not limited to this. For example, conversion may be performed based on any one of the rotation amount, the offset amount, and the expansion / contraction magnification of the substrate C to be exposed, or may be performed based on a plurality of combinations.

  In the next step S113, a pure correction amount is derived based on the position coordinates of each of the reference marks M whose coordinates have been converted in the process of step S111. Hereinafter, the pure correction amounts of the reference marks M1, M2, M3, and M4 are respectively represented as (dx0, dy0), (dx1, dy1), (dx2, dy2), and (dx3, dy3).

  In the next step S114, based on the position information acquired in step S103 and the position coordinates of the reference mark M coordinate-converted in the process of step S111, the physical quantity (in this embodiment, the reference mark M The maximum value of the deviation amount of each of (1) is derived.

  In the next step S115, the reduction information 50 is read from the HDD 40A of the system control unit 40.

  In the next step S117, whether or not the processing content indicated by the processing content information associated with the physical quantity information indicating the physical quantity derived in the processing of step S114 in the read reduction information 50 is the exposure drawing process. judge.

  If the determination in step S117 is affirmative, the process proceeds to step S119. On the other hand, if a negative determination is made in step S117, the process proceeds to step S135, and as error processing, the stage 12 is moved to a position where the substrate to be exposed C is removed from the stage 12, and the execution of this exposure control processing program is completed. To do. In this case, the exposed substrate C is removed from the stage 12 without being subjected to the exposure drawing process, and is discharged to the outside of the exposure drawing apparatus 10.

  On the other hand, in step S119, in the read reduction information 50, the net correction amount is reduced by using the reduction rate N indicated by the reduction rate information associated with the physical quantity information indicating the physical quantity derived in the process of step S114. Thus, a reduction correction amount is derived. Hereinafter, the reduction correction amounts of the reference marks M1, M2, M3, M4 are respectively (dx0 ′, dy0 ′), (dx1 ′, dy1 ′), (dx2 ′, dy2 ′), (dx3 ′, dy3 ′). It expresses.

  In the exposure drawing apparatus 10 according to the present embodiment, the reduction correction amounts (dx0 ′, dy0 ′) to (dx3 ′, dy3 ′) are base rates relative to the pure correction amounts (dx0, dy0) to (dx3, dy3). It is obtained by multiplying N and is expressed by the following equation (2).

  In the next step S127, coordinate conversion of each coordinate in the target area 64 of the target image 62 is performed using the reduction correction amount (dx ', dy') obtained by the process of step S119.

  Here, a method of coordinate conversion of each coordinate in the target area 64 of the target image 62 in the exposure drawing apparatus 10 according to the present embodiment will be described. First, as shown in FIG. 13 as an example, the system control unit 40 divides the target image 62 into a plurality of (four in this embodiment) regions based on the coordinates to be subjected to coordinate transformation, The areas SA0 to SA3 of the divided regions are derived. At this time, as shown in the figure, the target image 62 is divided into four regions by drawing a straight line inside the target image 62 that is parallel to each side and passes through the coordinates to be converted.

  For each of the divided regions, the area of the lower right region in front view of FIG. 10 that is a region facing the reference mark M1 (that is, a region including the reference mark M4) is represented as SA0. Further, the area of the lower left region, which is a region facing the reference mark M2 (that is, a region including the reference mark M3), is represented as SA1. Further, the area of the upper right region, which is a region facing the reference mark M3 (that is, a region including the reference mark M2), is represented as SA2. Further, the area of the upper left region, which is a region facing the reference mark M4 (that is, a region including the reference mark M1), is represented as SA3.

  Further, the system control unit 40 obtains the areas of the divided areas SA0 to SA3 obtained in this way and the reduction correction amounts (dx0 ′, dy0 ′) to (dx3 ′, dy3 ′) obtained by the process of step S115. Are substituted into the following equation (3). The value obtained as a result is the correction amount (ddx, ddy) for the distortion of the substrate C to be exposed at the coordinates to be subjected to the coordinate conversion.

  For example, as shown in the figure, dx0 ′ = 1, dx1 ′ = 2, dx2 ′ = 5, dx3 ′ = 10, SA0 = 3, SA1 = 9, SA2 = 3, SA3 = 1, and SS = 16. In this case, ddx = (3 × 1 + 9 × 2 + 3 × 5 + 1 × 10) /16≈2.9.

  Note that the method of deriving the correction amount (ddx, ddy) for the distortion of the exposed substrate C is not limited to this. That is, each side of the target image 62 is internally divided by drawing a perpendicular to each side of the target image 62 from the position A (x, y) that is a predetermined position of the target image 62 before coordinate conversion. Thereby, the internal division ratio of each side of the target image 62 with respect to the position A is obtained. The position B corresponding to the internal ratio in the target image 62 after the coordinate conversion may be determined, and the deviation amount between the position A and the position B may be determined as a correction amount (ddx, ddy).

  Further, the system control unit 40 adjusts the correction amount (ddx, ddy) of each coordinate in the target image 62, the offset amount ofsx in the x direction, the offset amount ofsy in the y direction, the scaling factor kx in the x direction, and the scaling factor in the y direction. The ky and the rotation amount θ are substituted into the following equation (4). From this equation (4), coordinates (xm, ym) after coordinate conversion for each coordinate (xl, yl) to be subjected to coordinate conversion are obtained.

  In the next step S129, the stage drive unit 42 is controlled to move the stage 12 to a position where the upper surface of the substrate C to be exposed is exposed by the light beam emitted from the exposure unit 22.

  In the next step S131, the exposure head 22a is controlled via the light source unit 24 and the image processing unit 28 so that the target image 62 is drawn on the substrate C to be exposed using the coordinates (xm, ym) after the coordinate conversion. At this time, the system control unit 40 draws the target image 62 on the exposed substrate C while moving the exposed substrate C by controlling the stage driving unit 42 so as to move the stage 12 at a predetermined speed. Then, the exposure head 22a is controlled.

  In the next step S133, the stage 12 is moved to a position where the substrate C to be exposed is removed from the stage 12, and the execution of this exposure control processing program is terminated.

  As described above, in the exposure drawing apparatus 10 according to the present embodiment, as shown in FIG. 14A as an example, when the reduction rate is 0% (N = 0), the system control unit 40 determines the substrate C to be exposed. The target image 62 is drawn without reducing the correction amount for the distortion of the image.

  On the other hand, as shown in FIG. 14B as an example, when the reduction rate is larger than 0% (N> 0), the system control unit 40 reduces the correction amount for the distortion of the exposed substrate C according to the reduction rate. The target image 62 is deformed and drawn above. 14A and 14B, the land 66 is provided at the position of the reference mark M of the layer to be drawn so that the drawing pattern to be drawn can easily understand the positional relationship between the land 66 and the conductive via 68. The conductive via 68 is provided at the position of the reference mark M on the other layer.

  In a general exposure drawing apparatus, for example, as shown in FIG. 15, when drawing a plurality of layers (for example, four layers) of drawing patterns 62 </ b> A to 62 </ b> D in order from the lower side, as shown in FIG. Every time drawing is completed, chemical processing such as development, etching, and peeling is performed. Further, in a general exposure drawing apparatus, in order to further overlap layers, prepreg layer lamination, conductive via processing, filled via plating, roughening treatment, DFR (Dry Film photoResist) lamination, and the like are performed. Therefore, as shown in FIG. 16, the first layer drawing pattern 62A, the second layer drawing pattern 62B, the third layer drawing pattern 62C, the fourth layer drawing pattern 62D, and the substrate to be exposed each time the layers are stacked. It is assumed that the distortion of C increases.

  However, in the exposure drawing apparatus 10 according to the present embodiment, when drawing a drawing pattern, the amount of correction for distortion of the substrate C to be exposed is reduced while the amount of reduction increases as the physical quantity increases for each layer. Let Thereby, an electronic component can be mounted on a substrate with high accuracy.

  In the exposure drawing apparatus 10 according to the present embodiment, the net correction amount is reduced by multiplying each correction amount of the reference mark M by a positive value (reduction rate) smaller than 1. It is not limited. That is, the pure correction amount may be reduced by dividing the pure correction amount by a value exceeding 1 or by subtracting a positive value from the pure correction amount. Alternatively, the pure correction amount may be reduced by combining a plurality of multiplications, divisions, and subtractions.

  Further, when drawing a plurality of drawing patterns on the substrate to be exposed C and drawing a drawing pattern on the lowest layer of the substrate to be exposed C, the distortion of the substrate to be exposed C need not be corrected. good.

  In the exposure drawing apparatus 10 according to the present embodiment, the case where the present invention is applied to the exposure drawing apparatus 10 that draws a drawing pattern by exposing a substrate C to a light beam has been described. However, the present invention is not limited to this. . That is, the present invention can be applied to an arbitrary drawing apparatus that draws an image to be drawn based on the position of the reference mark M provided on the drawing object. In addition, the present invention may be applied to a laser processing apparatus and a drill processing apparatus that form conductive vias or the like that electrically connect layers of each drawing pattern. Further, the present invention may be applied to an exposure drawing apparatus and a processing apparatus for forming a component mounting hole in a solder resist layer for protecting a drawing pattern on a substrate. Thereby, an electronic component can be mounted on a substrate with high accuracy.

[Second Embodiment]
The exposure drawing apparatus 10 according to the second embodiment of the present invention will be described below.

  Since the exposure drawing apparatus 10 according to the second embodiment has the same configuration as the exposure drawing apparatus 10 according to the first embodiment, description of each configuration is omitted.

  In the exposure drawing apparatus 10 according to the second embodiment, when the correction is performed according to the distortion of the substrate C to be exposed, the reduction correction amount (dx ′, dy ′) is limited according to the value of the annular ring. . As shown in FIG. 17, the annular ring is an annular region surrounding the entire circumference of the conductive via 68 when the conductive via 68 is opened inside the land 66, where the land diameter is D and the hole diameter is d. The width L of the annular ring which is the width of the annular region in this case is represented by L = (D−d) / 2.

  In the exposure drawing apparatus 10 according to the present embodiment, information indicating the land diameter D of the land 66 and the hole diameter d of the conductive via 68 is stored in advance in the HDD 40 </ b> A of the system control unit 40.

  Next, with reference to FIG. 18, the operation of the exposure drawing apparatus 10 according to the present embodiment will be described. FIG. 18 is a flowchart showing the flow of processing of an exposure control processing program executed by the system control unit 40 of the exposure drawing apparatus 10 according to the second embodiment when an execution instruction is input via the operation device 44. It is. The program is stored in advance in a predetermined area of the ROM of the system control unit 40. Further, steps in FIG. 18 that perform the same processing as in FIG. 12 are denoted by the same step numbers as in FIG. 12, and description thereof is omitted as much as possible.

  In the exposure drawing apparatus 10 according to the second embodiment, after performing the process of step S119, the process proceeds to step S121.

  In step S121, information indicating the width L of the annular ring is acquired. In the exposure drawing apparatus 10 according to the present embodiment, information indicating the land diameter D of the land 66 and the hole diameter d of the conductive via 68 is read from the HDD 40A of the system control unit 40, and the values of the land diameter D and the hole diameter d are as follows. By substituting into the equation (5), the width L of the annular ring is derived.

  The land diameter D and the hole diameter d may be input by the user via the operation device 44 based on the type of the substrate C to be exposed and the design value of the drawing pattern.

  The method for obtaining the annular ring width L is not limited to this. The acquisition method may be, for example, a method of inputting via an external input / output unit 48 from an information processing apparatus connected to the outside. In addition, the acquisition method may be a method in which information indicating the annular ring width L (for example, 30 μm) is stored in advance in a storage unit such as the RAM or the HDD 40A of the system control unit 40 and is read out from the storage unit. . Further, the conductive via 68 does not protrude from the land 66 by considering the error of the placement position of the substrate C to be exposed, the error of the drawing position, etc., and making the value of the width L of the annular ring narrower than the actual one. You may make it have a margin.

  In the next step S123, the value obtained by subtracting the reduction correction amounts (dx0 ′, dy0 ′) to (dx3 ′, dy3 ′) from the pure correction amounts (dx0, dy0) to (dx3, dy3) is the width L of the annular ring. Determine if greater than. At this time, the determination is made for each of the reference marks M, and an affirmative determination is made when even one of the conditions is satisfied. If the determination in step S123 is negative, the process proceeds to step S127. If the determination is affirmative, the process proceeds to step S126.

  In step S126, reduction correction amounts (dx0 ', dy0') to (dx3 ', dy3') are avoided in order to avoid the occurrence of misalignment between the land 66 and the conductive via 68 due to the correction of the distortion of the substrate C to be exposed. ). At this time, the values obtained by substituting the pure correction amounts (dx0, dy0) to (dx3, dy3) and the annular ring width L into the following equation (6) are used as the reduction correction amounts (dx0 ′, dy0 ′). To (dx3 ′, dy3 ′).

  In the above equation (6), the shift amount obtained by limiting the reduction correction amounts (dx0 ′, dy0 ′) to (dx3 ′, dy3 ′) as described above is set as the shift amount de ′.

  As a result, as shown in FIG. 19, the correction amount for the distortion of the exposed substrate C is reduced so that the conductive via 68 is accommodated in the land 66 while ensuring the minimum correction amount for the exposed substrate C. In addition, the image is deformed. Thereby, the conductive via 68 is accommodated in the land 66, and the electronic component can be mounted on the substrate C to be exposed with high accuracy.

  As an example, as shown in the left diagram of FIG. 20, when the target image 62 is deformed by deriving the reduction correction amount with the reduction rate N being 40%, the positions of the land 66 and the conductive via 68 are shifted. To do. In this case, as shown in the right diagram of FIG. 20, the conduction via 68 can be accommodated in the land 66 by limiting the reduction correction amount based on the width L of the annular ring. In FIG. 20, a land 66 is provided at the position of the reference mark M of the layer to be drawn so that the positional relationship between the land 66 and the conductive via 68 can be easily understood in the drawing pattern to be drawn. A conductive via 68 is provided at the position of the reference mark M.

  Various processes for realizing the exposure control process by the exposure drawing apparatus 10 configured as described above may be realized by a software configuration using a computer by executing a program. However, it is not limited to realization by software configuration, and it goes without saying that it may be realized by hardware configuration or a combination of hardware configuration and software configuration.

DESCRIPTION OF SYMBOLS 10 Exposure drawing apparatus 12 Stage 22 Exposure part 22a Exposure head 34 Shooting part 40 System control part 40A HDD
62 Target image C Substrate to be exposed M, M1 to M4 Reference mark

Claims (13)

Coordinate data indicating a first position, which is a design position of a plurality of fiducial marks provided on the substrate to be exposed, and coordinates indicating a drawing pattern to be drawn on the substrate to be exposed, which is determined based on the first position An acquisition unit that acquires data and coordinate data indicating a second position that is an actual position of each of the plurality of reference marks;
A physical quantity indicating the magnitude of distortion of the substrate to be exposed is derived based on the first position and the second position, and for each of the plurality of reference marks, the first position and the second position are derived. A deriving unit for deriving a correction amount with respect to the position shift of
From each of the correction amounts derived by the derivation unit, a reduction unit that reduces a larger amount as the physical quantity increases,
A correction unit that corrects coordinate data indicating the drawing pattern based on a correction amount reduced by the reduction unit, when the drawing pattern is drawn on the substrate to be exposed with the second position as a reference;
A drawing apparatus comprising: The derivation unit, as the physical quantity, includes a maximum value of the deviation amount of the first position and the second position for each of the plurality of reference marks, an average value of the deviation amount, and an amount of the deviation amount. The drawing apparatus according to claim 1, wherein at least one of the integrated values is derived. The derivation unit, as the physical quantity, has a mutual distance between the plurality of reference marks obtained based on the first position and a mutual relationship between the plurality of reference marks obtained based on the corresponding second position. The drawing apparatus according to claim 1, wherein at least one of a maximum value of a difference from a distance between the distances, an average value of each of the differences, and an integrated value of each of the differences is derived. The reduction means multiplies each of the correction amounts derived by the deriving unit by a positive value less than 1 as the physical quantity increases, and divides by a value greater than 1 as the physical quantity increases. In addition, by performing at least one of subtracting a positive value that is larger as the physical quantity is larger and smaller than the correction quantity, a larger quantity is obtained as the physical quantity is larger from each of the correction quantities derived by the derivation unit. The drawing apparatus according to any one of claims 1 to 3. The drawing pattern is a circuit pattern indicating electronic wiring,
The correction unit is based on the first correction amount when the correction amount reduced by the reduction unit is larger than a first correction amount that is determined so that conductive vias are accommodated inside lands in the drawing pattern. The drawing apparatus according to claim 1, wherein the coordinate data indicating the drawing pattern is corrected. The drawing pattern is a solder resist pattern showing an opening hole for component mounting of the solder resist layer,
When the correction amount reduced by the reduction unit is greater than a second correction amount that is determined to fit inside the conductor pad for joining the opening hole to a component, the second correction unit The drawing apparatus according to claim 1, wherein the coordinate data indicating the drawing pattern is corrected based on a correction amount. The deriving means is based on a shift amount obtained by subtracting at least one of a shift due to parallel movement of the substrate to be exposed, a shift due to rotation, and a shift due to expansion / contraction from the shift amount between the first position and the second position. The drawing apparatus according to any one of claims 1 to 6, wherein the correction amount is derived. A reception unit that receives input of reduction information in which the physical quantity and the reduction rate of the correction amount are associated with each other;
The reduction unit reduces the correction amount derived by the deriving unit using a reduction rate associated with the physical quantity derived by the deriving unit in the reduction information received by the receiving unit. 8. The drawing apparatus according to any one of items 7 to 7. The drawing apparatus according to any one of claims 1 to 8,
An exposure unit that exposes and draws the drawing pattern on the exposed substrate based on the coordinate data corrected by the correction unit of the drawing apparatus;
An exposure drawing apparatus comprising: When drawing a plurality of layers of drawing patterns on the substrate to be exposed, the acquisition unit, the derivation unit, the reduction unit, the correction unit, and the exposure unit are controlled, and each of the plurality of layers is controlled. The exposure drawing according to claim 9, further comprising: a control unit that performs each of acquisition by the acquisition unit, derivation by the derivation unit, reduction by the reduction unit, correction by the correction unit, and exposure by the exposure unit. apparatus. A storage unit for storing allowable amount information indicating a maximum allowable amount of the physical amount that is an upper limit allowable as a magnitude of distortion of the exposed substrate;
The exposure drawing apparatus according to claim 10, wherein when the physical quantity derived by the deriving unit is larger than a maximum allowable amount indicated by the allowable amount information, the control unit prohibits the exposure unit from exposing the substrate to be exposed. . Computer
Coordinate data indicating a first position, which is a design position of a plurality of fiducial marks provided on the substrate to be exposed, and coordinates indicating a drawing pattern to be drawn on the substrate to be exposed, which is determined based on the first position An acquisition unit that acquires data and coordinate data indicating a second position that is an actual position of each of the plurality of reference marks;
A physical quantity indicating the magnitude of distortion of the substrate to be exposed is derived based on the first position and the second position, and for each of the plurality of reference marks, the first position and the second position are derived. A deriving unit for deriving a correction amount with respect to the position shift of
From each of the correction amounts derived by the derivation unit, a reduction unit that reduces a larger amount as the physical quantity increases,
A correction unit that corrects coordinate data indicating the drawing pattern based on a correction amount reduced by the reduction unit, when the drawing pattern is drawn on the substrate to be exposed with the second position as a reference;
Program to function as. Coordinate data indicating a first position, which is a design position of a plurality of fiducial marks provided on the substrate to be exposed, and coordinates indicating a drawing pattern to be drawn on the substrate to be exposed, which is determined based on the first position An acquisition step of acquiring data and coordinate data indicating a second position that is an actual position of each of the plurality of reference marks;
A physical quantity indicating the magnitude of distortion of the substrate to be exposed is derived based on the first position and the second position, and for each of the plurality of reference marks, the first position and the second position are derived. A derivation step for deriving a correction amount for the position shift of
From each of the correction amounts derived in the derivation step, a reduction step of reducing a larger amount as the physical amount becomes larger;
When drawing the drawing pattern on the substrate to be exposed with the second position as a reference, a correction step for correcting coordinate data indicating the drawing pattern based on the correction amount reduced in the reduction step;
A drawing method.

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