CN105141271B - For the processing method for the crystal substrate for manufacturing quartz-crystal resonator - Google Patents
For the processing method for the crystal substrate for manufacturing quartz-crystal resonator Download PDFInfo
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- CN105141271B CN105141271B CN201510620846.XA CN201510620846A CN105141271B CN 105141271 B CN105141271 B CN 105141271B CN 201510620846 A CN201510620846 A CN 201510620846A CN 105141271 B CN105141271 B CN 105141271B
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Abstract
The present invention discloses a kind of processing method for being used to manufacture the crystal substrate of quartz-crystal resonator, this method utilizes chemical solvent, and process etched crystal substrate according to predetermined erosion areas size, erosion time, so as to realize that crystal substrate designated area thickness is changed by predetermined design form, the bevelling effect of chemical attack is realized, then crystal resonator is made；Described chemical solvent hydrogen fluoride ammonia NH4HF2Solution.The processing method can use segmentation and regionalization to corrode, and have the characteristics that cost is low, the time is short, superficial injury is controllable, work damage is few, be a kind of new quartz crystal process technology and method, can lift the unit for electrical property parameters of resonator.Its advantage is due to that this method can change material property parameter, designed crystal plate thickness or the AD HOC of rigidity is caused to change, realize that the energy of crystal resonator falls into performance, ensure edge very little of the scissoring vibration in crystal slab, diffusion of the energy to outside is reduced with this, realizes the target for strengthening scissoring vibration.
Description
Technical field
The present invention relates to a kind of shearing-type quartz-crystal resonator, more particularly to one kind to realize quartz using chemical erosion method
The processing method of the crystal substrate bevelling effect of crystal resonator.
Background technology
In the design and manufacture of quartz-crystal resonator, in order to obtain preferable resonator quality factor, suppress resonance
The negative effect that bending and other nuisance vibrations in device are brought to electrical characteristic, generally requires the edge for changing quartz crystal plate
Thickness, parasitic vibration interference is reduced so as to realize, and then strengthen thickness-shear oscillation and " can fall into (energy trapping) " spy
The target of property.Common high-performance crystal resonator is required for reducing bending and other parasitism vibrations, particularly quartz as far as possible
The vibration at crystal slab edge, deformation energy, also referred to as strain energy caused by guarantee quartz crystal plate elastic deformation, is concentrated as far as possible
In the center of plate, prevent from being diffused into peripheral structure and causing energy dissipation.For this purpose, many resonators consider in design
Thickness reduces towards edge, to obtain the preferable device of performance such as higher quality factor, also brings a processing skill certainly
Challenge in terms of art, i.e., how to realize the optimum thickness change of quartz crystal plate.That is, it would be desirable to which selection and exploration exist
The pattern and method of the thickness change at quartz crystal plate edge achieved above, that is, common " bevelling ", to ensure high quality
Quartz-crystal resonator manufacture.
The bevelling processing of traditional quartz-crystal resonator, is typically utilized in special cylinder machine, is beaten with special sand
The mode of mill is completed, and mainly utilizes that the speed of center and peripheral sand in roller is different, and frictional force is also different, by machine
Tool motion is polished quartz crystal chip, finally realizes the thickness change on Waffer edge.
But the control of traditional bevelling is particle selection by sand, the wetness of sand, diameter of cylinder, drum rotation speed
Complete and optimize with polishing time etc. main process parameter, and because the motion of sand in roller machine is difficult to control,
So wafer thickness changing pattern and degree in fact also can not be just precisely controlled, the limitation of current technology is caused.
In recent decades at present, what the process technology of bevelling also change without, also lacks to accurate model and processing side
The further investigation of formula, constrain the development of resonator technologies.To obtain high-quality quartz-crystal resonator, crystal substrate is designed
Bevelling processing is extremely important step.
Practical experience and theoretical research all show, any type of thickness change, in fact namely any change of rigidity
Change, can all play and parasitism is vibrated, particularly the inhibitory action of flexural vibrations, that is, resonator can fall into significantly changing for characteristic
It is kind.Therefore, control of the traditional handicraft to bevelling effect is also just principally limited to appropriate thickness change, if properties of product meet
It is required that typically do strict regulations also without to thickness change pattern.But with the miniaturization of quartz-crystal resonator, Gao Ke
By the continuous demand of performance, how to increase new processing mode in terms of bevelling processing, more easily controllable pattern essence can be used
Really processing, and the important content of product technology innovation.
The content of the invention
The technical problems to be solved by the invention are the deficiencies for existing bevelling technology, there is provided one kind is used to manufacture quartz
The processing method of the crystal substrate of crystal resonator, this method complete the bevelling of resonator crystal substrate using chemical corrosion method
Processing, substitutes current roller frosted process technology, so as to shorten process time, reduce processing cost, finally realizes quartz-crystal
The thickness change of body plate, it is obviously improved the unit for electrical property parameters of quartz-crystal resonator.
The technical problems to be solved by the invention are realized by following technical scheme.The present invention is that one kind is used for
The processing method for manufacturing the crystal substrate of quartz-crystal resonator, is characterized in：This method utilizes chemical solvent, and according to predetermined
Erosion areas size, erosion time process etched crystal substrate, so as to realize crystal substrate designated area thickness by predetermined
Design form change, realize the bevelling effect of chemical attack, then crystal resonator is made；Described chemical solvent hydrogen fluoride ammonia
NH4HF2The aqueous solution.
The technical problems to be solved by the invention can also further be realized by following technical scheme.It is described above
The processing method for being used to manufacture the crystal substrate of quartz-crystal resonator, further preferred technical scheme is：Described crystalline substance
Structure base board is quartz crystal substrate or other crystalline material substrates.
The technical problems to be solved by the invention can also further be realized by following technical scheme.It is described above
The processing method for being used to manufacture the crystal substrate of quartz-crystal resonator, further preferred technical scheme is：Described fluorine
Change hydrogen ammonia NH4HF2The aqueous solution is the hydrogen fluoride ammonia that the mass concentration for dissolving to obtain under the conditions of 40 DEG C~70 DEG C is 45-70%
NH4HF2The aqueous solution.
The technical problems to be solved by the invention can also further be realized by following technical scheme.It is described above
The processing method for being used to manufacture the crystal substrate of quartz-crystal resonator, further preferred technical scheme is：During processing, protect
Hold hydrogen fluoride ammonia NH4HF2The temperature of the aqueous solution is at 40 DEG C~70 DEG C.
The technical problems to be solved by the invention can also further be realized by following technical scheme.It is described above
The processing method for being used to manufacture the crystal substrate of quartz-crystal resonator, further preferred technical scheme is：Described crystalline substance
Structure base board is rectangle or circle.
The technical problems to be solved by the invention can also further be realized by following technical scheme.It is described above
The processing method for being used to manufacture the crystal substrate of quartz-crystal resonator, further preferred technical scheme is：Chemical solvent
Corrosion method is by controlling erosion time, chemical solvent concentration to realize changing for the thickness of crystal substrate segmentation and regionalization and rigidity
Become；Pass through segmental machining, it would be desirable to which the length for changing thickness is divided into some deciles, then from edge to middle part, during corrosion
Between successively decrease paragraph by paragraph, realize thickness change paragraph by paragraph reduce, formed thickness gradient change processing effect.
The technical problems to be solved by the invention can also further be realized by following technical scheme.It is described above
The processing method for being used to manufacture the crystal substrate of quartz-crystal resonator, further preferred technical scheme is：Pass through chemistry
The elastic properties of materials constant for changing its plate surface of crystal is corroded, so as to change thickness-shear oscillation frequency, changes scissoring vibration and its
The coupling of its parasitic mode state, the final resonant resistance index for improving resonator.
The technical problems to be solved by the invention can also further be realized by following technical scheme.It is described above
The processing method for being used to manufacture the crystal substrate of quartz-crystal resonator, further preferred technical scheme is：It is specifically walked
It is rapid as follows：
（1）Prepare the chip with certain design shape；Dissolving obtains mass concentration and is under the conditions of 40 DEG C~70 DEG C
45-70% hydrogen fluoride ammonia NH4HF2The aqueous solution, it is fitted into container, the temperature for making chemical solvent in container using oven heat is protected
Hold at 40 DEG C~70 DEG C；Prepare mask clamping fixture, fixture should hide middle wafer as principle to block, avoid solvent from corroding；It is accurate
Standby instrument record segmentation erosion areas crystal frequency and process time；
（2）According to the bevelling scheme requirement designed, the length end that will erode the crystal substrate of processing immerses
In chemical solvent, time erosion performance of the needs according to solution and the corrosive effect to crystal substrate are immersed to determine, corrodes effect
Fruit judges according to control resonant frequency of a crystal height change, that is, carries out corrosion processing, test, corrosion processing, the circulation of test
Processing test reaches predetermined bevelling scheme requirement.
The technical problems to be solved by the invention can also further be realized by following technical scheme.It is described above
The processing method for being used to manufacture the crystal substrate of quartz-crystal resonator, further preferred technical scheme is：Step（2）
In, the mode for taking segmentation to corrode is processed, and causes less in middle erosion amount, and end is corroded most, realizes that effect is sanded is the same
Bevelling effect.
Inventor has found, in the product with bevelling, the reinforcing that can fall into performance is typically to change the approach of thickness
Realize.Bevelling is exactly the edge thickness for reducing crystal slab, so as to improve the scissoring vibration frequency of this part, is eventually caused in thickness
Spending changing section can not possibly be in low-frequency excitation thickness-shear oscillation, that is, reduces the amplitude and phase of design thickness scissoring vibration
The energy answered.In essence, we can also regard the increase of the shearing rigidity of quartz crystal plate as, and be cut with this to improve
The frequency of vibration is cut, ensures the larger scissoring vibration difference on the frequency in the centre of plate and edge, realizes the localization of scissoring vibration.
Follow this thinking, technical solution of the present invention from the principle of the scissoring vibration frequency for changing crystal slab edge,
Consider to seek other processing modes for having similar effect with bevelling.For example, change the rigidity of crystal slab merely, particularly shear
Rigidity, either reduce and increase, can all cause the difference of the scissoring vibration frequency of the different zones of plate, so as to reduce by place
Manage the thickness-shear oscillation of part plate.Certain difference on the frequency is only kept, when particularly marginal portion frequency is higher, could be realized
Reduce the target of edge shearing vibration.That is, we can realize me by the approach for the edge stiffness for changing crystal slab
Traditionally utilize to change thickness and fall into the energy completed and strengthen target.
In the chip process of quartz-crystal resonator, except common machining mode has cutting, grinding, throwing
Outside light, chemical erosion is also a more method of use, is mainly used in divesting for excessive crystalline material, realizes size and volume
Quick change.It is known that chemical attack can change crystal structure by dissolving molecular structure, crystalline material is ultimately caused
Volume, pattern and surface portion material property change.
Fundamentally, chemical attack can cause three kinds of consequences in crystal slab：
1）Change the thickness of quartz crystal plate, and then change the rigidity of plate, the shearing of the final different zones for changing plate is shaken
Dynamic frequency, strengthen the scissoring vibration of center section, realize that the energy on ordinary meaning falls into characteristic and improved；
2）Change quartz crystal internal cell structure, especially thereby result in the increase of the shearing rigidity of quartz crystal or subtract
It is few, finally also change its scissoring vibration frequency, it may be possible to which the complex effect that thickness reduces and rigidity reduces, specific change will
See the influence degree of two kinds of effects.
3）The Gradient Effect of the material property of plate is caused, material parameter is had significance difference in the mid-depth of plate and surface
Not, so as to also result in the change of the vibration frequency of the plate of erosion areas and non-erosion areas, the bevelling effect that we expect is realized.
It can realize with machining process the bevelling process and effect completed, reach by using the method for chemical erosion
The target of characteristic can be fallen into reinforcing.It is obvious that this is one and traditional dramatically different processing method of being polished using sand, but
It relatively can relatively rapid carry out chip processing, cost also relative moderate.In effect, because chemical attack is in quartz-crystal
Using more in body processing, have wide experience to control whole process and crudy, preferable performance can be obtained.
The core of this technology is the suitable chemical mordant of selection, can both realize divested by chemical attack it is unnecessary
Quartz crystal materials, and can ensure the surface of quartz crystal plate uniformly, it is smooth, clean, it is ensured that follow-up processing request and
Basic performance.
Inventor is by researching and developing discovery, chemical solvent hydrogen fluoride ammonia（ammonium bifluoride, NH4HF2）Can be real
The requirement of the existing present invention, meanwhile, it typically can also again be processed by the plane of crystal of chemical erosion, such as cleaned and polished
Deng further improving wafer quality.Can be according to parameters such as processing temperatures when concentration, the corrosion of solvent to the extent of corrosion of chip
Change, realize preferable corrosion processing effect, realize reliable accurate erosion process control.
Processing method of the present invention can use segmentation and regionalization to corrode, with cost is low, the time is short, superficial injury is controllable, work
The features such as damage is few, is a kind of new quartz crystal process technology and method, can lift the unit for electrical property parameters of resonator.Its advantage
It is due to that this method can change material property parameter, causes designed crystal plate thickness or the AD HOC of rigidity to become
Change, realize that the energy of crystal resonator falls into performance, ensure that in the edge very little of crystal slab, energy is reduced to outside with this for scissoring vibration
Diffusion, realize strengthen scissoring vibration target；The effect of this method subtracts as the processing method that traditional roller is sanded
Small crystals substrate edges thickness.
Embodiment
The present invention is further detailed explanation with reference to embodiments, so that those skilled in the art further manage
The solution present invention, without forming the limitation to right of the present invention.
Embodiment 1, a kind of processing method for being used to manufacture the crystal substrate of quartz-crystal resonator：This method utilizes chemistry
Solvent, and etched crystal substrate is processed according to predetermined erosion areas size, erosion time, so as to realize that crystal substrate is specified
Area thickness is changed by predetermined design form, realizes the bevelling effect of chemical attack, then crystal resonator is made；Described change
Learn solvent hydrogen fluoride ammonia NH4HF2The aqueous solution.
Embodiment 2, a kind of processing method for being used to manufacture the crystal substrate of quartz-crystal resonator described in embodiment 1
In：Described crystal substrate is quartz crystal substrate or other crystalline material substrates.
Embodiment 3, a kind of processing side for being used to manufacture the crystal substrate of quartz-crystal resonator described in embodiment 1 or 2
In method：Described hydrogen fluoride ammonia NH4HF2The aqueous solution is the hydrogen fluoride ammonia that the mass concentration for dissolving to obtain under the conditions of 40 DEG C is 45%
NH4HF2The aqueous solution.
Embodiment 4, a kind of processing side for being used to manufacture the crystal substrate of quartz-crystal resonator described in embodiment 1 or 2
In method：Described hydrogen fluoride ammonia NH4HF2The aqueous solution is the hydrogen fluoride ammonia that the mass concentration for dissolving to obtain under the conditions of 70 DEG C is 70%
NH4HF2The aqueous solution.
Embodiment 5, a kind of processing side for being used to manufacture the crystal substrate of quartz-crystal resonator described in embodiment 1 or 2
In method：Described hydrogen fluoride ammonia NH4HF2The aqueous solution is the hydrogen fluoride ammonia that the mass concentration for dissolving to obtain under the conditions of 55 DEG C is 50%
NH4HF2The aqueous solution.
Embodiment 6, a kind of crystal substrate for being used to manufacture quartz-crystal resonator described in embodiment 1-6 any one
Processing method in：During processing, hydrogen fluoride ammonia NH is kept4HF2The temperature of the aqueous solution is at 40 DEG C~70 DEG C.
Embodiment 7, a kind of processing method for being used to manufacture the crystal substrate of quartz-crystal resonator described in embodiment 3
In：During processing, during processing, hydrogen fluoride ammonia NH is kept4HF2The temperature of the aqueous solution is at 40 DEG C.
Embodiment 8, a kind of processing method for being used to manufacture the crystal substrate of quartz-crystal resonator described in embodiment 4
In：During processing, during processing, hydrogen fluoride ammonia NH is kept4HF2The temperature of the aqueous solution is at 70 DEG C.
Embodiment 9, a kind of processing method for being used to manufacture the crystal substrate of quartz-crystal resonator described in embodiment 5
In：During processing, during processing, hydrogen fluoride ammonia NH is kept4HF2The temperature of the aqueous solution is at 55 DEG C.
Embodiment 10, a kind of crystal substrate for being used to manufacture quartz-crystal resonator described in embodiment 1-9 any one
Processing method in：Described crystal substrate is rectangle or circle.
Embodiment 11, a kind of crystal base for being used to manufacture quartz-crystal resonator described in embodiment 1-10 any one
In the processing method of plate：Chemical solvent corrosion method is by controlling erosion time, chemical solvent concentration to realize crystal substrate
The thickness of segmentation and regionalization and the change of rigidity；Pass through segmental machining, it would be desirable to which the length for changing thickness is divided into some deciles, then
From edge to middle part, etching time successively decreases paragraph by paragraph, realizes that thickness changes and reduces paragraph by paragraph, forms the processing of thickness gradient change
Effect.
Embodiment 12, a kind of crystal base for being used to manufacture quartz-crystal resonator described in embodiment 1-11 any one
In the processing method of plate：Change the elastic properties of materials constant of its plate surface of crystal by chemical erosion, shaken so as to change thickness shear
Dynamic frequency, change scissoring vibration and the coupling of other parasitic mode states, the final resonant resistance index for improving resonator.
Embodiment 13, a kind of processing method for being used to manufacture the crystal substrate of quartz-crystal resonator described in embodiment 1
In：It is comprised the following steps that：
（1）Prepare the chip with certain design shape；Dissolving obtains mass concentration and is under the conditions of 40 DEG C~70 DEG C
45-70% hydrogen fluoride ammonia NH4HF2The aqueous solution, it is fitted into container, the temperature for making chemical solvent in container using oven heat is protected
Hold at 40 DEG C~70 DEG C；Prepare mask clamping fixture, fixture should hide middle wafer as principle to block, avoid solvent from corroding；It is accurate
Standby instrument record segmentation erosion areas crystal frequency and process time；
（2）According to the bevelling scheme requirement designed, the length end that will erode the crystal substrate of processing immerses
In chemical solvent, time erosion performance of the needs according to solution and the corrosive effect to crystal substrate are immersed to determine, corrodes effect
Fruit judges according to control resonant frequency of a crystal height change, that is, carries out corrosion processing, test, corrosion processing, the circulation of test
Processing test reaches predetermined bevelling scheme requirement.
Embodiment 14, a kind of processing method for being used to manufacture the crystal substrate of quartz-crystal resonator described in embodiment 13
In：In step（2）In, the mode for taking segmentation to corrode is processed, and causes less in middle erosion amount, and end is corroded most, realizes
The same bevelling effect of effect is sanded.
Embodiment 15, contrast experiment：
Experiment one, the present invention are used for the processing method experiment for manufacturing the crystal substrate of quartz-crystal resonator, including following
Step：
1. preparing 12MHz 2*8.02mm rectangle quartz crystal chips, frequency has reached product standard requirement, and root
Suitable bevelling design is selected according to the performance requirement of product；
2. prepare the chemical agent hydrogen fluoride ammonia corroded for quartz crystal chip（ammonium bifluoride,
NH4HF2）, the hydrogen fluoride ammonia spirit that mass concentration is 70% is made at 70 DEG C, uses oven heat and keeping temperature is 70
℃；
3. it is length direction to design bevelling pattern according to the erosion feature of the vibration analysis of resonator theory and chemical solvent
Center wafer to end is 4 deciles, corrodes chip and uses mask clamping fixture, is put into chip and covers centre and avoids solvent from corroding；It is and accurate
Standby necessary chemical solvent container, ensure the segmentation important parameter index such as erosion areas and process time；
4. the bevelling scheme that basis has designed, it will be ready for corroding the designated length 1/ of the quartz crystal chip of processing
8 end is 1mm or according to scheme, designs end size, immerses hydrogen fluoride ammonia solution；Immersing the time needs invading according to solution
Erosion characteristic and the corrosive effect of quartz crystal is determined；Erosion effect judges according to resonant frequency change, that is, is corroded
Processing, test, the process of corrosion processing again, until reaching design standard by control time and erosion amount；
5. in order to obtain preferable erosion effect, by causing the thickness and stiffness change process of a gradual change, we adopt
Take 1/4 end to repeat the mode that 4 work steps corrode to process, cause less in middle erosion amount, end is corroded most, realizes almost
Bevelling effect as effect is sanded；
6. the other end of pair quartz wafer takes same processing mode, symmetrical bevelling effect is realized；
This method can carry out bevelling processing to rectangle and circular chip；It can be used for other crystal slabs and device
Bevelling pattern processing.
Experiment two, contrast experiment：
Same above-mentioned chip 12MHz 2*8.02mm rectangle quartz crystal chips, add according to traditional roller bevelling mode
Work（Process is omited）, complete bevelling process.
The chip of above-mentioned experiment one and experiment two is respectively adopted, under equal ambient, does not have to according to load, then by multiple
Manufacturing procedure is such as cleaned, processed by silver, amendment, fine setting, dispensing, soldering and sealing, aging, and HC-49/S quartz-crystal resonators are made,
It is as follows to test electrical parameter average result：
It may be concluded that being rolled using the crystal resonator resistance target after chemical erosion than tradition from Experimental comparison's table
The crystal resonator resistance value that cylinder bevelling makes is low；The obvious chip light than experiment two of viewing test one under magnifying glass simultaneously
Sliding, outward appearance is good.
Claims (8)
- A kind of 1. processing method for being used to manufacture the crystal substrate of quartz-crystal resonator, it is characterised in that：This method utilizationization Solvent is learned, and etched crystal substrate is processed according to predetermined erosion areas size, erosion time, so as to realize that crystal substrate refers to Determine area thickness by predetermined design form to change, realize the bevelling effect of chemical attack, then crystal resonator is made；Described Chemical solvent hydrogen fluoride ammonia NH4HF2The aqueous solution；Chemical solvent corrosion method is by controlling erosion time, chemical solvent concentration to realize the thickness of crystal substrate segmentation and regionalization The change of degree and rigidity；Pass through segmental machining, it would be desirable to which the length for changing thickness is divided into some deciles, then from edge to centre Position, etching time successively decrease paragraph by paragraph, realize that thickness changes and reduce paragraph by paragraph, form the processing effect of thickness gradient change.
- 2. the processing method according to claim 1 for being used to manufacture the crystal substrate of quartz-crystal resonator, its feature exist In：Described crystal substrate is quartz crystal substrate or other crystalline material substrates.
- 3. the processing method according to claim 1 for being used to manufacture the crystal substrate of quartz-crystal resonator, its feature exist In：Described hydrogen fluoride ammonia NH4HF2The aqueous solution is that the mass concentration for dissolving to obtain under the conditions of 40 DEG C~70 DEG C is 45-70%'s Hydrogen fluoride ammonia NH4HF2The aqueous solution.
- 4. the processing method according to claim 1 for being used to manufacture the crystal substrate of quartz-crystal resonator, its feature exist In：During processing, hydrogen fluoride ammonia NH is kept4HF2The temperature of the aqueous solution is at 40 DEG C~70 DEG C.
- 5. the processing method according to claim 1 for being used to manufacture the crystal substrate of quartz-crystal resonator, its feature exist In：Described crystal substrate is rectangle or circle.
- 6. the processing method according to claim 1 for being used to manufacture the crystal substrate of quartz-crystal resonator, its feature exist In：Change the elastic properties of materials constant of its plate surface of crystal by chemical erosion, so as to change thickness-shear oscillation frequency, change is cut Cut vibration and the coupling of other parasitic mode states, the final resonant resistance index for improving resonator.
- 7. the processing method according to claim 1 for being used to manufacture the crystal substrate of quartz-crystal resonator, its feature exist In：It is comprised the following steps that：（1）Prepare the chip with certain design shape；It is 45- that dissolving, which obtains mass concentration, under the conditions of 40 DEG C~70 DEG C 70% hydrogen fluoride ammonia NH4HF2The aqueous solution, it is fitted into container, the temperature for making chemical solvent in container using oven heat is kept At 40 DEG C~70 DEG C；Prepare mask clamping fixture, fixture should hide middle wafer as principle to block, avoid solvent from corroding；Prepare Instrument record is segmented erosion areas crystal frequency and process time；（2）According to the bevelling scheme requirement designed, the length end that will erode the crystal substrate of processing immerses chemistry In solvent, time erosion performance of the needs according to solution and the corrosive effect to crystal substrate are immersed to determine, erosion effect root Judge according to control resonant frequency of a crystal height change, that is, carry out corrosion processing, test, corrosion processing, the cyclic process of test Test reaches predetermined bevelling scheme requirement.
- 8. the processing method according to claim 7 for being used to manufacture the crystal substrate of quartz-crystal resonator, its feature exist In：Step（2）In, the mode for taking segmentation to corrode is processed, and causes less in middle erosion amount, and end is corroded most, realizes sand Grind the same bevelling effect of effect.
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Address after: 222300, Jiangsu, Lianyungang province Donghai County hump township industrial concentration area Patentee after: Jiangsu Haifeng Technology Co., Ltd Address before: 222300, Jiangsu, Lianyungang province Donghai County hump township industrial concentration area Patentee before: JIANGSU HAIFENG ELECTRONICS Co.,Ltd. |
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