CN105101722B - 用于安装印刷电路板的设备 - Google Patents

用于安装印刷电路板的设备 Download PDF

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CN105101722B
CN105101722B CN201510097932.7A CN201510097932A CN105101722B CN 105101722 B CN105101722 B CN 105101722B CN 201510097932 A CN201510097932 A CN 201510097932A CN 105101722 B CN105101722 B CN 105101722B
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circuit board
bushing
external component
mounting arrangement
internal part
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CN105101722A (zh
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小N·G·莫里
M·拉姆齐
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ZF Active Safety and Electronics US LLC
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TRW Automotive US LLC
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1407—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by turn-bolt or screw member
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0073—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having specific features for mounting the housing on an external structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0078—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for acceleration sensors, e.g. crash sensors, airbag sensors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H05K5/0221—Locks; Latches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H05K7/08—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses on perforated boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00—Joints and connections
    • Y10T403/47—Molded joint
    • Y10T403/471—And independent connection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00—Joints and connections
    • Y10T403/47—Molded joint
    • Y10T403/472—Molded joint including mechanical interlock
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00—Joints and connections
    • Y10T403/49—Member deformed in situ

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multi-Conductor Connections (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

本发明提供一种电路板安装装置，其包括电路板和压配合安装衬套，该压配合安装衬套包括圆柱形内部部件和固定到内部部件的外部部件。外部部件具有多个径向突出的可变形元件，电路板具有圆柱形开口，该圆柱形开口的直径小于径向突出的可变形元件的外径。当安装衬套被推入到电路板的圆柱形开口中时可变形元件变形，以将安装衬套保持到电路板。然后，电路板和压配合衬套进行包覆成型。

Description

用于安装印刷电路板的设备
技术领域
本发明涉及用于将印刷电路板(“PCB”)安装到一结构的设备，具体地，本发明涉及用于PCB的压配合衬套，以用于将PCB安装到一结构。
背景技术
PCB是用以将作为较大电气系统的一部分的电路元件保持和相互连接的基底。PCB通常安装到壳体结构中，该壳体结构被设计成用以保持并保护PCB及相关的电路。将PCB安装在壳体中的多种方式是已知的，例如通过利用螺钉或其它附接构件。在这样的安装装置中，螺钉直接穿过PCB中的安装孔而被接纳，并且固定到壳体的相关螺钉支撑结构。然后，壳体继而通常固定到另一个结构，例如车辆中的安装位置。
发明内容
根据本发明的一个实施例，提供一种电路板安装装置，其包括电路板和压配合安装衬套，该压配合安装衬套包括圆柱形内部部件和固定到内部部件的外部部件。外部部件具有多个径向突出的可变形元件，电路板具有圆柱形开口，该圆柱形开口的直径小于径向突出的可变形元件的外径。当安装衬套被推入到电路板的圆柱形开口中时可变形元件变形，以将安装衬套保持到电路板。然后，电路板和压配合衬套进行包覆成型。
附图说明
通过阅读以下参考附图的说明，本发明的前述和其它特征和优点对本发明涉及的领域中的技术人员而言将变得显而易见，其中：
图1为根据本发明的一个示例性实施例制成的压配合安装衬套的透视图，该压配合安装衬套用于将印刷电路板安装到安装结构；
图2为图1的安装衬套的侧正视图；
图3为图1的安装衬套的俯视平面图；
图4为图3的衬套沿着线4-4截取的横截面图；
图5为图1的衬套压配合到印刷电路板中的透视图；
图6为图5的衬套沿着线6-6截取的横截面图；
图7为本发明的使用图1的衬套的印刷电路板安装装置的横截面图，该图示出了安装在壳体内的电路板；以及
图8为根据本发明的另一个实施例的压配合安装衬套的侧横截面图。
具体实施方式
参考图1-6，示出了两件式压配合安装衬套20，其用于将印刷电路板(“PCB”)22安装到一结构。两件式安装衬套20包括具有通孔28的圆柱形内部部件26。根据本发明的一个示例性实施例，圆柱形内部部件26由金属制成。内部部件26的外壁32的一部分30具有滚花表面，或者至少具有带粗糙纹理的表面。内部部件26可以通过机加工、冷成型或者其它金属成形工艺而形成有滚花表面。
两件式安装衬套20还包括外部部件36，该外部部件沿周向至少覆盖圆柱形内部部件26的与滚花表面等大的轴向部分。根据本发明的一个示例性实施例，外部部件36由塑料制成，并且被模制到外壁32且与滚花部分30接触，以便附着并固定到内部部件26。内部部件的滚花表面或者纹理表面在外部部件36和内部部件26之间提供机械保持。由塑料制成的外部部件将内部部件与印刷电路板22电气地隔离开。
两件式衬套20的外部部件36包括主体部分40和多个径向延伸的保持构件42，这些保持构件绕主体部分40沿周向等距地间隔开。径向延伸的保持构件42的横截面大致为V形，但是也可以采用其它形状。保持环50从主体部分40沿径向向外延伸。
两件式安装衬套20的第一端部52插入(即压配合)到PCB 22的开口56中。径向延伸的保持构件42的外侧径向直径稍稍大于PCB22的开口56的直径，使得衬套20必须在对端部58施加足够的力的情况下压配合到开口中。力将持续地施加，直到保持环50接触PCB22。在将衬套20插入到PCB 22中的过程期间，径向延伸的保持构件42稍稍变形并与PCB 22形成紧密压配合接合(即过盈配合)。然后，可以将螺栓穿过开口28插入，以便经由螺栓的端部上的螺母而将PCB22固定到安装结构。
如果压配合安装衬套完全由金属制成，那么这样的衬套在插入到PCB中时将在PCB板中引起应力。
另外，如果PCB包括多个全金属衬套，那么由金属衬套引起的累积的应力将导致PCB的翘曲。
参考图7，示出了根据本发明一个实施例的用于PCB 22的完整的安装装置60。PCB22包括安装到PCB 22的电路64。在车辆应用中，电路64可以包括车辆碰撞传感器，例如加速度计或压力传感器。如以上参考图1-6所述的，衬套20安装到PCB 22。如上所述，在包覆成型过程之前，两件式衬套20压配合到电路板22中。首先，软塑性材料68模制到电路64上，并模制到PCB 22的一部分上。然后，硬塑性材料72包覆成型到软塑性材料68，并包覆成型到PCB22和两件式衬套20的暴露部分。硬塑性材料形成刚性安装外壳74，该刚性安装外壳形成(即模制)为任何期望的形状。然后，刚性安装外壳74继而利用穿过两件式衬套20的螺栓82和相关的螺母84而固定到安装结构80，例如固定到车辆中的安装梁。
美国专利申请公开US2011/0107835A1中示出和描述了包覆成型过程，该包覆成型过程示出了用于车辆膨胀传感器装置的软内层和硬外层，该专利申请公开由此全文以引用方式并入本文中。
参考图8，示出了本发明的另一个示例性实施例，其采用修改的用于安装到PCB 22的两件式压配合衬套20'。衬套20'具有由金属制成的内部构件26'和由塑料制成的外部构件36'，该外部构件以与上述类似的方式固定到内部构件的滚花部分。对于该实施例，内部构件26'包括阶梯状的凸缘部分90，该凸缘部分提供额外的接触表面，以加强两件式衬套20'的内部构件26'和外部构件36'之间的保持特性。
从以上本发明的说明中，本领域技术人员将会认识到改进、变化和修改。例如，根据一个示例性实施例，保持构件已经被描述为具有V形横截面。但是，也可以采用其它的形状或样式。本领域技术人员认识到的这些改进、变化和修改将被所附权利要求覆盖。

Claims (10)

1.一种电路板安装装置，其包括：
电路板；以及
压配合安装衬套，所述压配合安装衬套包括外部部件和圆柱形的内部部件，所述外部部件固定到所述内部部件，所述外部部件具有多个径向突出的可变形元件，所述电路板具有圆柱形开口，所述圆柱形开口的直径小于所述外部部件的所述径向突出的可变形元件的外径，当所述安装衬套被推入到所述电路板的所述圆柱形开口中时所述可变形元件变形，以将所述安装衬套保持到所述电路板，其中，每个所述可变形元件沿轴向延伸而穿过所述电路板中的整个所述圆柱形开口。
2.根据权利要求1所述的电路板安装装置，其中所述圆柱形的内部部件由金属制成并具有滚花外表面，并且其中所述外部部件是塑料的并固定到所述圆柱形内部部件的所述滚花外表面。
3.根据权利要求2所述的电路板安装装置，其中所述电路板和所述压配合安装衬套包覆成型有塑性材料，以保护所述安装板上的任何电路并提供壳体。
4.根据权利要求3所述的电路板安装装置，其中所述壳体利用螺纹紧固件安装到一结构。
5.根据权利要求2所述的电路板安装装置，其中所述外部部件模制到所述内部部件。
6.根据权利要求1所述的电路板安装装置，其中所述可变形元件的横截面为大致V形。
7.一种电路板安装装置，其包括：
电路板；以及
压配合安装衬套，所述压配合安装衬套包括外部部件和圆柱形的内部部件，所述外部部件固定到所述内部部件，所述外部部件具有多个径向突出的可变形元件，所述电路板具有圆柱形开口，所述圆柱形开口的直径小于所述外部部件的所述径向突出的可变形元件的外径，当所述安装衬套被推入到所述电路板的所述圆柱形开口中时所述可变形元件变形，以将所述安装衬套保持到所述电路板，其中，每个所述可变形元件沿轴向延伸而穿过所述电路板中的整个所述圆柱形开口，其中所述圆柱形内部部件由金属制成并具有滚花外表面和阶梯状表面，并且其中所述外部部件是塑料的并固定到所述圆柱形的内部部件的所述滚花表面和所述阶梯状表面。
8.根据权利要求7所述的电路板安装装置，其中所述圆柱形的内部部件由金属制成，并且所述外部部件是塑料的。
9.根据权利要求8所述的电路板安装装置，其中所述外部部件模制到所述内部部件。
10.根据权利要求7所述的电路板安装装置，其中所述可变形元件的横截面为大致V形。
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US14/199,294 US9648721B2 (en) 2014-03-06 2014-03-06 Apparatus for mounting a printed circuit board
US14/199,294 2014-03-06

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