CN105101622B - A kind of wiring board with shielding construction and preparation method thereof - Google Patents
A kind of wiring board with shielding construction and preparation method thereof Download PDFInfo
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- CN105101622B CN105101622B CN201510522754.8A CN201510522754A CN105101622B CN 105101622 B CN105101622 B CN 105101622B CN 201510522754 A CN201510522754 A CN 201510522754A CN 105101622 B CN105101622 B CN 105101622B
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- insulating barrier
- wiring board
- shielding
- silver
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention provides a kind of wiring board with shielding construction and preparation method thereof, the wiring board includes first screen layer, secondary shielding layer, a line layer and is arranged between first screen layer and secondary shielding layer, first insulating barrier is set between line layer and first screen layer, the second insulating barrier is set between line layer and secondary shielding layer；Secondary shielding layer and the second insulating barrier set on line layer and are slightly less than line layer in size, when secondary shielding layer and the second insulating barrier are covered on line layer, at least while along partial denudation outside secondary shielding layer, multiple metal electrodes for being connected with external circuit are set in the exposed edge portions on line layer.Using technical scheme, screen layer is all set by the two sides in line layer, without carrying out shielding processing to circuit using screening cover；It is directly exposed outside insulating barrier by the metal electrode for being used to connect by line layer, it is to avoid the generation of parasitic capacitance, greatly improve the anti-interference function of circuit board.
Description
Technical field
The present invention relates to printed circuit board technology field, more particularly to a kind of wiring board and its preparation with shielding construction
Method.
Background technology
It is some special application fields of assist side, such as remote sensing satellite, Aero-Space, radar communication, high frequency antenna, micro-
The application scenarios such as wave antenna, the stability and anti-interference requirement to wiring board is extremely harsh, in complexity such as very high temperature, extremely low temperature
Under environment, wiring board will keep stability；Any faint interference signal, is likely to influence the normal work of wiring board,
It is thus typically necessary to carry out shielding processing to wiring board.Prior art is typically employed in welding metal screening cover on wiring board and come
The interference free performance of wiring board is lifted, metallic shield lid needs to weld under high temperature, adds one of process, not only increase
The complexity of processing technology, while easily causing the softening of wiring board material in high-temperature soldering, wiring board can produce certain
Deformation, and screening cover pyroconductivity and electronic circuit board comparing difference are larger, and screening cover heating is very fast, so will result in screen
The leading warpage of lid is covered, so as to influence electronic circuit board contour structures and cause other devices rosin joint.For example, Chinese patent literature
[201110199763.X] discloses the welding method of a kind of screening cover and electronic circuit board, solves wiring board and is crossing reflow ovens
When produce warpage the problem of, can effectively reduce production cost.
Above-mentioned technical proposal, solves the problem of wiring board produces warpage when crossing reflow ovens, improves to a certain extent
Production technology, but still metallic shield lid is needed to use, welding metal screening cover can influence line to a certain extent at high temperature
The performance of component on the plate of road.
Therefore, for drawbacks described above present in currently available technology, it is necessary to be studied in fact, to provide a kind of scheme,
Solve defect present in prior art.
The content of the invention
In view of this, it is an object of the invention to provide a kind of wiring board with shielding construction and preparation method thereof, with
Solve the above problems.
A kind of wiring board with shielding construction, the wiring board includes first screen layer, secondary shielding layer, a line layer and set
Put between the first screen layer and the secondary shielding layer, is set between the line layer and the first screen layer
One insulating barrier, sets the second insulating barrier between the line layer and the secondary shielding layer；
The material of first insulating barrier is ceramic base material, epoxy glass fiber cloth, glass honeycomb core plate, polyimides bubble
Any of foam base material；
The material of second insulating barrier is elastic insulating material；
The secondary shielding layer and second insulating barrier set on the line layer and are slightly less than the circuit in size
Layer, when the secondary shielding layer and second insulating barrier are covered on the line layer, on the line layer at least on one side
Along partial denudation outside the secondary shielding layer, multiple gold for being connected with external circuit are set in the exposed edge portions
Belong to electrode.
Preferably, the circumference of the wiring board is additionally provided with multiple exposed semicircle connection vias, and the connection via is used for
Connect the first screen layer and the secondary shielding layer.
In order to solve the problem of prior art is present, present invention also offers a kind of system of the wiring board with shielding construction
Preparation Method, comprises the following steps：
Step S1：First insulating barrier is provided and first screen layer is formed in the one side of first insulating barrier；
Step S2：One line layer is set in the another side of the first insulating barrier and circuitous pattern is formed on the line layer,
The circuitous pattern includes the main circuit figure for realizing circuit function and the metal electrode for being connected with external circuit；
Step S3：Component is mounted on the circuitous pattern with SMT techniques, intermediate wiring board is formed；
Step S4：Second insulating barrier is provided and secondary shielding layer is formed on the described second insulation is laminated；
Step S5：In the another side of the second insulating barrier, one layer of semi-liquefied resin is set；
Step S6：Treat before the semi-liquefied resin solidification, the intermediate wiring board is had to the one side of line pattern
It is placed on the semi-liquefied resin, and the intermediate wiring board is pressed until the semi-liquefied resin under certain pressure effect
It is fully cured；
Step S7：Being processed by precision optical machinery makes the metal electrode of the circuitous pattern exposed outside and the main circuit diagram
Shape is completely encapsulated between the first screen layer and the secondary shielding layer.
Preferably, in the step S7, the size of first insulating barrier is adapted with the size of the line layer, institute
State the size of the second insulating barrier and the size of the main circuit figure is adapted and the master is completely covered in second insulating barrier
Circuitous pattern, makes on the line layer at least while along partial denudation outside the secondary shielding layer, in the exposed edge portions
Multiple metal electrodes for being connected with external circuit are set.
Preferably, the line layer is copper foil, in the step S2, is further comprised the steps：
Copper foil is printed, etching process, obtain one have circuitous pattern copper foil；
In one side of first insulating barrier away from first screen layer, one layer of semi-solid preparation resin is set；
The copper foil with circuitous pattern is placed in the surface of the semi-solid preparation resin, one is formed and treats laminate structures, by
The temperature that edges up is until the semi-solid preparation tree is melted, and under certain pressure effect, the copper foil is had into being pressed together on for circuitous pattern
The glass ties up the surface of honeycomb core plate, then gradually cools up to the semi-solid preparation resin is fully cured, and makes first insulation
Line layer is formed on layer.
Preferably, the step of circumference for being additionally included in wiring board is additionally provided with multiple semicircle connection vias, and in the company
Taking over hole coating silver paste makes the connection via connect the first screen layer and the secondary shielding layer.
Preferably, use copper foil as the first screen layer and the secondary shielding layer or with the described first insulation
The mode of coating silver-bearing copper composite shielding coating forms the first screen layer and second screen on layer or second insulating barrier
Cover layer.
Preferably, the preparation method of the silver-bearing copper composite shielding coating is：
A graininess copper powder is provided, the diameter of the copper powder particle is less than 50 microns；
Silver-coated layer, which is applied, on the copper powder particle surface forms silver-colored copper-clad particle powder；
Silver-colored copper-clad particle powder is dissolved in resin combination adhesive, the resin combination adhesive includes epoxy
Resin, polyurethane, phenolic aldehyde, polyimides and acrylic resin；
Being stirred continuously makes silver-colored copper-clad particle powder be evenly distributed in resin combination adhesive, forms silver-bearing copper composite shielding
Coating.
Preferably, the volume range of the silver-colored copper-clad particle powder and the resin combination adhesive for 1.1 to
1.8。
Preferably, the silver-bearing copper composite shielding coating by high-pressure spray gun even application in first insulating barrier and described
Second insulating barrier, then processing is dried by thermostatic drying chamber forms the first screen layer and the secondary shielding layer；
In spraying process, do not stop to stir the silver-bearing copper composite shielding coating by magnetic stirrer.
Wiring board of shielding construction provided relative to prior art, the present invention and preparation method thereof, by line layer
Two sides screen layer is all set, without using screening cover to circuit carry out shielding processing, because screen layer is laminated with circuit
Be integrated, it is easy to process and will not because increase shielding process and influence the performance of component on line layer；By by line layer
Metal electrode for connection is directly exposed outside insulating barrier, and metal will will be connected without processing via in assist side
Electrode draws is connected to PCB surface, it is to avoid the generation of parasitic capacitance, greatly improves the anti-interference function of circuit board；Exist simultaneously
Circumferentially disposed multiple exposed connection vias of wiring board, make above and below screen layer turn into equipotentiality body, further lifting wiring board
Shielding properties.
Brief description of the drawings
The structured flowchart for the wiring board with shielding construction that Fig. 1 provides for the present invention.
Fig. 2 faces structured flowchart for the wiring board with shielding construction of the offer of the embodiment of the present invention 1.
Fig. 3 faces structured flowchart for the wiring board with shielding construction of the offer of the embodiment of the present invention 2.
The step of wiring board preparation method with shielding construction that Fig. 4 provides for the present invention, schemes.
Fig. 5 is coating surface when shielding coating amplifies 500 times in the secure execution mode (sem.
Fig. 6 is coating surface when shielding coating amplifies 1000 times in the secure execution mode (sem.
Fig. 7 is the energy spectrum diagram under shielding coating EDS.
In above-mentioned accompanying drawing, wherein, first screen layer 1, the first insulating barrier 2, line layer 3, the second insulating barrier 4, secondary shielding
Layer 5, line layer edge portions 6, metal electrode 7 connects via 8.
Embodiment
The following is specific embodiment of the invention and with reference to accompanying drawing, technical scheme is further described,
But the present invention is not limited to these embodiments.
Fig. 1 and Fig. 2 are referred to, the structured flowchart for the wiring board with shielding construction that the present invention is provided is shown, it is a kind of
Wiring board with shielding construction, including first screen layer 1, secondary shielding layer 5, it is arranged on the first screen layer 1 and described
Line layer 3 between secondary shielding layer 5, is arranged on the first insulating barrier 2 between the line layer 3 and the first screen layer 1,
It is arranged on the second insulating barrier 4 between the line layer 3 and the secondary shielding layer 5；
The secondary shielding layer 5 and second insulating barrier 4 set on the line layer 3 and are slightly less than the line in size
Road floor 3, when the secondary shielding layer 5 and second insulating barrier 4 are covered on the line layer 3, the line layer 3 is up to
Few edge portions 6 are exposed outside the secondary shielding layer 5, and multiple be used for and external circuit is set in the exposed edge portions 6
The metal electrode 7 being connected.
Technical solution of the present invention uses three-decker, by all setting screen layer on the two sides of line layer 3, without adopting
Shielding processing is carried out to circuit with screening cover, screen layer is integrated with line layer, it is easy to process and will not because of increase shielding
The performance of component on technogenic influence line layer.
While wiring board of the prior art, the line layer in intermediate layer will connect with lower circuit thereon or outside line
Connect, be typically employed in the mode that metallic vias is processed on wiring board, because metallic vias is internally formed metal level, can so produce
Parasitic capacitance.The presence of this parasitic capacitance, causes traditional circuit plate can not meet application in the application scenario of some high requests
It is required that.Technical solution of the present invention is directly exposed outside insulating barrier by the metal electrode 7 for being used to connect by line layer 3, so that
Without processing via in assist side connection metal electrode 7 will be drawn and be connected to PCB surface, it is to avoid the generation of parasitic capacitance,
Greatly improve the anti-interference function of circuit board.
In the above-mentioned technical solutions, the material of first insulating barrier 2 is ceramic base material, epoxy glass fiber cloth, glass
Any of honeycomb core plate, polyimide foam base material；Epoxy glass fiber cloth and ceramic base material are what prior art was commonly used
Board substrate, epoxy glass fiber cloth wiring board and ceramic base circuit board are relatively conventional in general circuit application field.One
A little special application scenarios, generally using performance more excellent glass honeycomb core plate and polyimide foam base material.Polyimides steeps
Foam material is resistant to 250 DEG C~300 DEG C of temperature, and 400 DEG C~500 DEG C high temperature are resistant in short-term, and with good mechanicalness
Energy (tensile strength is in more than 100MPa), its modulus of elasticity is usually 3GPa~4GPa, and load structure can be used as in hot environment
Part is used, and meets the demand of the industry such as Aeronautics and Astronautics and electronics.Polyimide foams have very high radioresistance
Can, after 5 × 109rad dose deliveries, intensity still keeps 80% or so, and with good dielectric properties, dielectric constant is
3.4 or so, Polyimide foams dielectric loss is 10-3, and dielectric strength is 100kV/mm~300kV/mm, volume resistance
Rate is the 1017 Ω cm orders of magnitude, and these performances make the copper-clad plate that polyimide foam is prepared for basic unit in broad temperature range
With remain to keep higher level in frequency range, make it in spies such as remote sensing satellite, Aero-Space, microstrip antenna, high frequency antennas
, there is unrivaled performance advantage different application scenario.Glass honeycomb core plate has glass honeycomb sandwich construction, with higher
Strength and stiffness and quality is lighter, compared with epoxy glass-fiber-fabric circuit board, weight saving 80%, it is strong with very high ratio
Degree, specific stiffness, flatness is good, be unlikely to deform, simple in construction, easy for installation.It is preferably carried out in one kind in mode, the first insulation
Layer 2 uses glass honeycomb core plate or polyimide foam base material.
Due to being additionally provided with component on line layer 3, the second insulating barrier 4 need to cover the component on line layer 3, therefore
Two insulating barriers 4 need certain deformation space, from elastic insulating material.Preferably, the second insulating barrier 4 uses elastic insulated rubber
Glue.
Referring to Fig. 3, show the wiring board with shielding construction that the embodiment of the present invention 2 is provided faces structured flowchart,
The circumference of the wiring board is additionally provided with multiple exposed semicircle connection vias 8, and the connection via 8 is used to connect first screen
Cover layer 1 and the secondary shielding layer 5, make above and below screen layer turn into equipotentiality body, further lifting wiring board shielding properties.Simultaneously
Because connection via 8 is exposed outside, without forming connection via 8 in assist side, it is to avoid the generation of parasitic capacitance, further
Improve the anti-interference function of circuit board.
In a preferred embodiment, line layer 3 uses copper foil, further, is formed on copper foil after circuitous pattern,
It is adhered by the first insulating barrier 2.
In a preferred embodiment, line layer 3 is indium tin oxide films layer, and the effect of indium tin oxide films layer is similar
Copper foil, circuitous pattern is formed on by photoresist mask etch technique.Indium tin oxide films layer has electricity conduction simultaneously
Characteristic and good shielding properties, the conduction plated film shielded in the prior art as EMI is widely used.In the present invention, directly
Using indium tin oxide films layer formation circuitous pattern, the shielding properties of wiring board is further lifted.
Further, in some special dimensions, in order to ensure the stability of wiring board, in the circuitous pattern of line layer 3
It is upper directly to form resistive element.Such as in microstrip circuit or high frequency antenna, the resistive element of use is more, using prior art
Resistive element, uniformity and stability it is difficult to ensure that, while minor variations can also occur for its resistance of resistance welding procedures.At this
In inventive embodiments, because using indium tin oxide material formation line layer 3, the resistivity of tin indium oxide is much larger than the metals such as copper,
Therefore resistance can be set on direct-on-line road floor 3 when circuitous pattern is formed.Actual resistance figure can be according to indium oxide
The resistivity of tin material is calculated.I.e. in the resistive element position of line pattern, sunk in the preparation according to the size of its resistance
The product resistance pattern corresponding with its resistance.
In a preferred embodiment, first screen layer 1 and secondary shielding layer 5 use copper foil, and metal is natural screen
Cover body, by line layer 3 be wrapped in above and below in copper foil layer, shield effectiveness can be played.
But because the copper atom of these high activities of copper foil surface is easily oxidised with air to Cu2O and CuO film, especially
The big oxidization of copper powder speed of its surface area faster, greatly reduces shielding properties.In a preferred embodiment, using
The mode of one insulating barrier 2 and the surface spraying silver-bearing copper composite shielding coating of the second insulating barrier 4 forms first screen layer 1 and secondary shielding
Layer 5.Silver is to be used as conductive filler in all metals earliest, it is conductive can good (ρv=1.62 × 10-6Ω cm), it is anti-
Oxidability is strong, steady performance, but silver is under Dc bias effect, or under wet heat condition, easily occurs migration and lead
Short circuit is caused, the safety coefficient of application is substantially reduced.In addition, the price of silver is expensive compared with copper a lot, it will be made as screen layer using silver
Cost is greatly improved.Due in silver-bearing copper composite shielding coating formed silver-coated copper powder after be blended in resin, therefore copper powder not with outside
Boundary is directly contacted, and improves the antioxygenic property of copper powder, at the same obtain close to silver electric conductivity, and in cost with use
Copper foil is similar.
In order to solve the problem of prior art is present, present invention also offers a kind of system of the wiring board with shielding construction
Preparation Method, referring to Fig. 4, the step of showing the wiring board preparation method with shielding construction provided for the present invention is schemed, including
Following steps：
Step S1：First insulating barrier 2 is provided and first screen layer 1 is formed in the one side of the first insulating barrier 2；
Step S2：One line layer 3 is set in the another side of the first insulating barrier 2 and circuitous pattern is formed on the line layer 3,
The circuitous pattern includes the main circuit figure for realizing circuit function and the metal electrode for being connected with external circuit
7；
Step S3：Component is mounted on the circuitous pattern with SMT techniques, intermediate wiring board is formed；
Step S4：Second insulating barrier 4 is provided and secondary shielding layer 5 is formed in the one side of the second insulating barrier 4；
Step S5：In the another side of the second insulating barrier 4, one layer of semi-liquefied resin is set；
Step S6：Treat before the semi-liquefied resin solidification, the intermediate wiring board is had to the one side of line pattern
It is placed on the semi-liquefied resin, and the intermediate wiring board is pressed until the semi-liquefied resin under certain pressure effect
It is fully cured；
Step S7：Being processed by precision optical machinery makes the metal electrode 7 of the circuitous pattern exposed outside and the main circuit
Figure is completely encapsulated between the first screen layer 1 and the secondary shielding layer 5.
The wiring board prepared using the above method, due to all setting screen layer on the two sides of line layer 3, without using
Screening cover carries out shielding processing to circuit, simplifies preparation technology and will not be influenceed because of increase shielding process on line layer 3
The performance of component；By by line layer 3 be used for connect metal electrode 7 directly it is exposed outside insulating barrier, without
Via will be processed in wiring board to draw by connection metal electrode 7 and be connected to PCB surface, it is to avoid the generation of parasitic capacitance, be carried significantly
The anti-interference function of circuit board is risen；
In above-mentioned steps S1 and step S4, the first screen layer 1 and the secondary shielding layer 5 are used as using copper foil.But
Because the copper atom of these high activities of copper foil surface is easily oxidised with air to Cu2O and CuO film, especially surface area are big
Oxidization of copper powder speed faster, greatly reduce shielding properties.In a preferred embodiment, by the described first insulation
The mode of coating silver-bearing copper composite shielding coating forms the first screen layer 1 and described second on 2 or described second insulating barrier 4 of layer
Screen layer 5.
Further, the preparation method of above-mentioned silver-bearing copper composite shielding coating is：
A graininess copper powder is provided, the diameter of the copper powder particle is less than 50 microns；
Silver-coated layer, which is applied, on the copper powder particle surface forms silver-colored copper-clad particle powder；
Silver-colored copper-clad particle powder is dissolved in resin combination adhesive；
Being stirred continuously makes silver-colored copper-clad particle powder be evenly distributed in resin combination adhesive, forms silver-bearing copper composite shielding
Coating.
In above-mentioned steps, the resin combination adhesive include epoxy resin, polyurethane, phenolic aldehyde, polyimides and
Acrylic resin；Resin base-material determines most of physical property of coating.Many Fundamental Physical Properties of shielding coating with it is common
Coating is identical, for example：Adhesive force, adherence, wearability and resistance to scraping etc..These performances are main by matrix resin and auxiliary
Resin shared.Coating is applied to surface of insulating layer, it is desirable to which the adhesive strength of coating is high, shielding coating has stronger cohesion
Power.Influenceed based on the coating of thermoplastic resin ester group adhesive unlike two-component coating by construction and baking temperature,
The activation time limit not used.
Further, apply in the step of silver-coated layer forms silver-colored copper-clad particle powder, first use on the copper powder particle surface
Inhibitors On Copper powder is handled, such as with organic acid, organic titanium corrosion inhibiter；Again anti-using silver mirror commonly used in the prior art
Should be silver-plated in Copper Powder Surface, form silver-coated copper powder.
The shielding properties (namely electric conductivity, determined by resistance of coating value height) and silver-coated copper powder of shielding coating are (i.e. following
Conductive filler) itself resistance value it is relevant, and concentration of the conductive filler in shielding coating is similarly important.How to be shielded
The design of formulation for coating material is covered so that shielding coating there should be good electric conductivity, there is good physical property, each material group again
The fixing fabric structure divided is just into the key of formula design, and the volume ratio of especially conductive material and adhesive has relation.Passing through
Repetition test and test, as a result show, when the volume ratio of conductive material and adhesive is less than 1, the surface of conductive particle is complete
Covered entirely by resin binder, almost without good electrical contact between particle, shielding coating can not embody good electric conductivity,
Cause shielding properties not good.When the volume ratio of conductive material in coating is much larger than the volume of adhesive, partially electronically conductive particle
Outside, binder resin is not enough to fill up void among particles surface exposure, causes the compactness of shielding coating is too low (to have air
In the presence of), easy dry linting, surface roughness is excessive, is greatly reduced in terms of easily remaining various dirts, physical property.Pass through reason again below
By the volume ratio for calculating analysis conductive material and adhesive.The volume of conductive material and the volume of coating in coating are represented with P
Than reflecting the proportion relation of coating with P, its formula is expressed as follows：
P=Va/(Va+Vb)
=(ma/ρa)/[(ma/ρa)+(mb/ρb)]
=ma/[ma+mb×(ρa/ρb)]
=1/ [1+ (mb/ma)×(ρa/ρb)]
In formula, Va is the volume of conductive material in formula；VbFor the volume of non-conducting material in formula；maTo be led in formula
The quality of electric material；mbFor the quality of non-conducting material in formula；ρaFor the density of conductive material in formula；ρbTo be non-in formula
The density of conductive material.After determination is formulated, ρ a and ρ b are constant.Make k=ρa/ρb, x=mb/maWherein, k is constant, and x is to become
Amount.Then P expression formula can be reduced to：P=1/ (1+kx)=(1+kx) -1.From the knowledge of exponential function, P exists with x values
Reference axis first quartile has one-to-one relationship, it is possible to the m in formulab/maTo reflect P change.For coating, m is
It is the quality of conductive filler.Influences of the P to conductance can turn to be considered as m in formulab/maInfluence to conductance.When adhesive is
More than one when, Vb、mbAnd ρbThe volume, quality and density of mixed resin are represented respectively.
On the basis of theory analysis, in conjunction with experimental results, in a preferred embodiment, silver-colored copper-clad
During the volume range of grain powder and resin combination adhesive is 1.1 to 1.8, the embodiment of the present invention, the volume ratio used for
1.5。
Referring to Fig. 5, Fig. 6, Fig. 7, the silver when volume for showing silver-colored copper-clad particle powder and resin combination adhesive is 1.5
Copper composite shielding coating observes coating surface figure, Cross Section Morphology figure and energy spectrum diagram under ESEM.Well mixed coating
Even application after solidification to be dried, observes coating surface and Cross Section Morphology, such as on pmma substrate under ESEM
Shown in Fig. 5 and Fig. 6, picture is under 20KV voltages, to be shot when amplifying 500 times and 1000 times respectively.At 1000 times, Ke Yiguan
That examines becomes apparent from.Conduction pattern of the electric charge in shielding coating is that particle contact is conductive, forms logical between particle to be physically contacted
Road.This electrically conducting manner determines two key factors of influence electric conductivity：One is interparticle contact number, actually
It is the number of conductive path；Two be interparticle degree of closeness.It can be seen that being that face connects between the particle of laminated structure
Touch, contact is abundant, and the uneven platy particle of size is more beneficial for the raising of electric conductivity.And the aligning property of flakelike powder
It is good, it is difficult to reunite, there is stronger albedo to light.
During Fig. 7 is energy spectrum diagram of the shielding coating under ESD, figure, transverse axis is X-ray energy, and the longitudinal axis is x-ray photon number
Spectrogram.The species of element is assured that according to its energy value, and containing for each element can be determined by the intensive analysis of spectrum
Amount.For the shielding coating of the embodiment of the present invention, its composition, and each composition institute of quantitative display can be equally determined using energy spectrum diagram
The scale accounted for.The composition included in this kind of coating material can be clearly found out in figure, wherein copper (Cu) is being applied
Content in material is most；Carbon (C) content is higher, be because this paper prepared by coating be using lucite as substrate, it is organic
Contain in glass in substantial amounts of C element, resin based adhesive and organic solvent and also contain C element.Oxygen (O) element is also above-mentioned thing
Contained by matter.
Further, shielding coating is coated uniformly on insulating barrier in order to realize, in a preferred embodiment, will
Silver-bearing copper composite shielding coating, in first insulating barrier 2 and second insulating barrier 4, then is passed through by high-pressure spray gun even application
Thermostatic drying chamber is dried processing and forms the first screen layer 1 and the secondary shielding layer 5；In spraying process, pass through
Magnetic stirrer does not stop to stir the silver-bearing copper composite shielding coating.
During spraying, first shielding coating is not stopped stirring by magnetic stirrer magnetic stirrer and applied as in container for paint
Shielding coating in material container；Recycle the high pressure that air compressor is produced by the shielding coating in container for paint by spray gun,
Even application is on insulating barrier.Spraying rate and spray area can be adjusted freely, but spray pressure is used no more than highest
Pressure.Preferably, the maximum working (operation) pressure (MWP) of shower nozzle is 0.5~1.5MPa.
Further, in order to realize automation large area even application, in a preferred embodiment, spray gun is fixed
In on a movable fixture, the movable fixture uniform motion is driven using stepper motor, spray gun movement is driven, meets large area
Spraying requirement.
Further, in the step S7, when the second insulating barrier 4 is laminated on line layer 3, the second insulating barrier 4 is complete
All standing line layer 3, a part of edge for removing the insulating barrier 4 of secondary shielding layer 5 and second is processed by precision optical machinery, makes circuit
Metal electrode 7 in figure is exposed outside, and main circuit figure is still completely covered under the second insulating barrier 4, and then makes line layer 3
In main circuit figure be completely encapsulated between the first screen layer 1 and the secondary shielding layer 5.
Using aforesaid way, the required precision to machining is higher, once machining accuracy is not high, it is easy to failure line
The electrograph figure of road floor 3.In a preferred embodiment, the first insulating barrier 2 is dimensioned to and the line layer 3
Size is adapted, and the second insulating barrier 4 is dimensioned to be adapted with the size of the main circuit figure, in lamination, is made
Second insulating barrier 4 is completely covered on the main circuit figure, line layer 3 at least while exposed in the secondary shielding along part 6
Outside layer 5, multiple metal electrodes 7 for being connected with external circuit are set in the exposed edge portions 6.In which, first root
Factually dimensioned the first insulating barrier 2 and the second insulating barrier 4 of border line layer 3 and its circuitous pattern, so after lamination
Without being machined again, so that the circuitous pattern of circuit layer will not be destroyed.
Further, line layer 3 is copper foil, in the step S2, is further comprised the steps：
Copper foil is printed, etching process, obtain one have circuitous pattern copper foil；
In one side of first insulating barrier 2 away from first screen layer 1, one layer of semi-solid preparation resin is set；
The copper foil with circuitous pattern is placed in the surface of the semi-solid preparation resin, one is formed and treats laminate structures, by
The temperature that edges up is until the semi-solid preparation tree is melted, and under certain pressure effect, the copper foil is had into being pressed together on for circuitous pattern
The glass ties up the surface of honeycomb core plate, then gradually cools up to the semi-solid preparation resin is fully cured, and makes first insulation
Line layer 3 is formed on layer 2.
In a preferred embodiment, in above-mentioned semi-solid preparation resin curing process, at the uniform velocity to heat up and (be less than 5 DEG C/min)
50 DEG C to 70 DEG C are warming up to, after resin melts completely, then at the uniform velocity cooling (being less than 5 DEG C/min), it is straight under certain pressure effect
It is fully cured to resin.
Further, above-mentioned semi-solid preparation resin or semi-liquefied resin are Epoxy resin composition solution, and its difference is
The difference of the matched proportion density of Epoxy resin composition solution.Further, the Epoxy resin composition solution includes epoxy resin
Composition and the organic solvent that the composition epoxy resin can be dissolved.Composition epoxy resin is by epoxy resin, end amine
The composition of based polyurethanes and inorganic filler composition.
Further, line layer 3 is indium tin oxide films layer, in the step S2, is further comprised the steps：
Indium tin oxide films layer is arranged on the first insulating barrier 2 using the same steps of above-mentioned copper foil setting on the insulating layer
On；Circuitous pattern is formed on by photoresist mask etch technique.
The similar copper foil of effect of indium tin oxide films layer, oxidable indium tin thin film layer have simultaneously the characteristic that electricity conducts and
Good shielding properties, the conduction plated film shielded in the prior art as EMI is widely used.In the present invention, directly using oxidation
Indium tin thin film layer forms circuitous pattern, further the shielding properties of lifting wiring board.
Further, the step of directly forming resistive element is additionally included on the circuitous pattern of line layer 3.It is special at some
In field, in order to ensure the stability of wiring board, such as in microstrip circuit or high frequency antenna, the resistive element of use is more,
Using the resistive element of prior art, uniformity and stability it is difficult to ensure that, while its resistance of resistance welding procedures can also occur
Minor variations.In embodiments of the present invention, because using indium tin oxide material formation line layer 3, the resistivity of tin indium oxide is remote
More than metals such as copper, therefore resistance can be set on direct-on-line road floor 3 when circuitous pattern is formed.Actual resistance figure can
Calculated with the resistivity according to indium tin oxide material.I.e. in the resistive element position of line pattern, according to the big of its resistance
It is small to deposit the resistance pattern corresponding with its resistance in the preparation.Pass through etching and sputtering technology formation phase on the resistance pattern
Answer the resistance of resistance.
In a preferred embodiment, the circumference for being additionally included in wiring board is additionally provided with multiple semicircle connection vias 8
The step of, and the connection via 8 is connected the first screen layer 1 and described second in the connection coating of via 8 silver paste
Screen layer 5.Due to circumferentially disposed multiple exposed connection vias 8 of assist side, make above and below screen layer turn into equipotentiality body, enter one
The shielding properties of step lifting wiring board.
The explanation of above example is only intended to the method and its core concept for helping to understand the present invention.It should be pointed out that pair
, under the premise without departing from the principles of the invention, can also be to present invention progress for those skilled in the art
Some improvement and modification, these are improved and modification is also fallen into the protection domain of the claims in the present invention.To these embodiments
A variety of modifications are it will be apparent that generic principles defined herein can be not for those skilled in the art
Realized in other embodiments in the case of departing from the spirit or scope of the present invention.Therefore, the present invention is not intended to be limited to this
These embodiments shown in text, and it is to fit to the most wide scope consistent with features of novelty with principles disclosed herein.
Claims (6)
1. a kind of preparation method of the wiring board with shielding construction, it is characterised in that comprise the following steps：
Step S1：First insulating barrier (2) is provided and first screen layer (1) is formed in the one side of first insulating barrier (2)；
Step S2：One line layer (3) is set in the another side of the first insulating barrier (2) and circuit is formed on the line layer (3)
Figure, the circuitous pattern includes the main circuit figure for realizing circuit function and the metal for being connected with external circuit
Electrode (7)；
Step S3：Component is mounted on the circuitous pattern with SMT techniques, intermediate wiring board is formed；
Step S4：Second insulating barrier (4) is provided and secondary shielding layer (5) is formed in the second insulating barrier (4) one side；
Step S5：In the another side of the second insulating barrier (4), one layer of semi-liquefied resin is set；
Step S6：Treat before the semi-liquefied resin solidification, the one side that the intermediate wiring board has line pattern is placed in
On the semi-liquefied resin, and the intermediate wiring board is pressed until the semi-liquefied resin is complete under certain pressure effect
Solidification；
Step S7：Being processed by precision optical machinery makes the metal electrode (7) of the circuitous pattern exposed outside and the main circuit diagram
Shape is completely encapsulated between the first screen layer (1) and the secondary shielding layer (5)；
The step of circumference for being additionally included in wiring board is additionally provided with multiple semicircle connection via (8), and in the connection via (8)
Coating silver paste makes the connection via (8) connect the first screen layer (1) and the secondary shielding layer (5)；
The line layer (3) is indium tin oxide films layer, and circuitous pattern is formed on simultaneously by photoresist mask etch technique
Resistive element is directly formed on the circuitous pattern.
2. the preparation method of the wiring board according to claim 1 with shielding construction, it is characterised in that in the step
In S7, the size of first insulating barrier (2) is adapted with the size of the line layer (3), the chi of second insulating barrier (4)
The very little size with the main circuit figure is adapted and the main circuit figure is completely covered in second insulating barrier (4), makes institute
State on line layer (3) at least while along part (6) it is exposed in the secondary shielding layer (5) outside, set in the exposed edge portions (6)
Put multiple metal electrodes (7) for being connected with external circuit.
3. the preparation method of the wiring board according to claim 1 with shielding construction, it is characterised in that made using copper foil
For the first screen layer (1) and the secondary shielding layer (5) or with first insulating barrier (2) or second insulation
The mode of coating silver-bearing copper composite shielding coating forms the first screen layer (1) and the secondary shielding layer (5) on layer (4).
4. the preparation method of the wiring board according to claim 3 with shielding construction, it is characterised in that the silver-bearing copper is answered
Close shielding coating preparation method be：
A graininess copper powder is provided, the diameter of the copper powder particle is less than 50 microns；
Silver-coated layer, which is applied, on the copper powder particle surface forms silver-colored copper-clad particle powder；
Silver-colored copper-clad particle powder is dissolved in resin combination adhesive, the resin combination adhesive includes asphalt mixtures modified by epoxy resin
Fat, polyurethane, phenolic aldehyde, polyimides and acrylic resin；
Being stirred continuously makes silver-colored copper-clad particle powder be evenly distributed in resin combination adhesive, forms silver-bearing copper composite shielding and applies
Material.
5. the preparation method of the wiring board according to claim 4 with shielding construction, it is characterised in that the silver-colored copper-clad
The volume range of particle powder and the resin combination adhesive is 1.1 to 1.8.
6. the preparation method of the wiring board according to claim 4 with shielding construction, it is characterised in that the silver-bearing copper is answered
Shielding coating is closed by high-pressure spray gun even application in first insulating barrier (2) and second insulating barrier (4), then passes through perseverance
Warm drying box is dried processing and forms the first screen layer (1) and the secondary shielding layer (5)；
In spraying process, do not stop to stir the silver-bearing copper composite shielding coating by magnetic stirrer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710683973.3A CN107241855B (en) | 2015-08-24 | 2015-08-24 | A kind of wiring board with shielding construction |
| CN201510522754.8A CN105101622B (en) | 2015-08-24 | 2015-08-24 | A kind of wiring board with shielding construction and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510522754.8A CN105101622B (en) | 2015-08-24 | 2015-08-24 | A kind of wiring board with shielding construction and preparation method thereof |
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| CN201510522754.8A Active CN105101622B (en) | 2015-08-24 | 2015-08-24 | A kind of wiring board with shielding construction and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102215630A (en) * | 2010-04-07 | 2011-10-12 | 株式会社藤仓 | Flexible printed board and method of manufacturing same |
| CN202121860U (en) * | 2011-06-16 | 2012-01-18 | 湖北奕宏精密制造有限公司 | Flexible circuit board used for precision electronic device |
| CN103687459A (en) * | 2012-09-14 | 2014-03-26 | 昆山雅森电子材料科技有限公司 | Electromagnetic wave shielding structure and flexible printed circuit board with same |
| CN203721263U (en) * | 2014-03-04 | 2014-07-16 | 吴晶 | High definition security signal transmission line |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2011018873A (en) * | 2009-05-22 | 2011-01-27 | Sony Ericsson Mobilecommunications Japan Inc | Electromagnetic shielding method and electromagnetic shielding film |
| CN102279678A (en) * | 2010-06-12 | 2011-12-14 | 宸鸿科技(厦门)有限公司 | Touch circuit graphic structure, manufacturing method thereof, touch panel and touch display screen |
| CN102559118B (en) * | 2012-02-16 | 2013-10-16 | 莱芜金鼎电子材料有限公司 | High-temperature-resistant conductive adhesive and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102215630A (en) * | 2010-04-07 | 2011-10-12 | 株式会社藤仓 | Flexible printed board and method of manufacturing same |
| CN202121860U (en) * | 2011-06-16 | 2012-01-18 | 湖北奕宏精密制造有限公司 | Flexible circuit board used for precision electronic device |
| CN103687459A (en) * | 2012-09-14 | 2014-03-26 | 昆山雅森电子材料科技有限公司 | Electromagnetic wave shielding structure and flexible printed circuit board with same |
| CN203721263U (en) * | 2014-03-04 | 2014-07-16 | 吴晶 | High definition security signal transmission line |
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| CN107241855A (en) | 2017-10-10 |
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Denomination of invention: A circuit board with shielding structure and its preparation method Effective date of registration: 20210628 Granted publication date: 20171003 Pledgee: China Minsheng Banking Corp Wenzhou branch Pledgor: ZHEJIANG ZAPON ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021980005254 |
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Granted publication date: 20171003 Pledgee: China Minsheng Banking Corp Wenzhou branch Pledgor: ZHEJIANG ZAPON ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021980005254 |