CN105101622A - Circuit board with shielding structure and preparation method thereof - Google Patents
Circuit board with shielding structure and preparation method thereof Download PDFInfo
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- CN105101622A CN105101622A CN201510522754.8A CN201510522754A CN105101622A CN 105101622 A CN105101622 A CN 105101622A CN 201510522754 A CN201510522754 A CN 201510522754A CN 105101622 A CN105101622 A CN 105101622A
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- insulating barrier
- layer
- wiring board
- shielding
- silver
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention provides a circuit board with a shielding structure and a preparation method thereof. The circuit board includes: a first shielding layer, a second shielding layer, a circuit layer arranged between the first shielding layer and the second shielding layer, a first insulating layer arranged between the circuit layer and the first shielding layer, and a second insulating layer arranged between the circuit layer and the second shielding layer. The second shielding layer and the second insulating layer are arranged on the circuit layer and are smaller than the circuit layer in size. When the second shielding layer and the second insulating layer cover the circuit layer, at least one edge part of the circuit layer is exposed outside the second shielding layer, and the exposed edge part is provided with a plurality of metal electrodes connected to an external circuit board. According to the technical scheme of the present invention, shielding layers are arranged on two sides of the circuit layer so that a shielding processing to a circuit does not require a shielding cover; and the metal electrodes for connection on the circuit layer are exposed outside the insulating layer directly so as to avoid parasitic capacitances, and an anti-interference function of the circuit board is greatly enhanced.
Description
Technical field
The present invention relates to printed circuit board technology field, particularly relate to a kind of wiring board with shielding construction and preparation method thereof.
Background technology
In some special application fields of wiring board, the application scenarios such as such as remote sensing satellite, Aero-Space, radar communication, high frequency antenna, microwave antenna, to stability and the anti-interference requirement very harshness of wiring board, under the complex environments such as very high temperature, pole low temperature, wiring board all will keep stability; Any faint interference signal, all likely affects the normal work of wiring board, therefore, usually needs to carry out shielding processing to wiring board.Prior art to be typically employed on wiring board weld metal screening cover to promote the interference free performance of wiring board, metallic shield lid welds under needing high temperature, add one process, not only increase the complexity of processing technology, easily cause the softening of wiring board material when high-temperature soldering simultaneously, wiring board can produce certain distortion, and screening cover pyroconductivity and electronic circuit board comparing difference larger, screening cover heats up very fast, the leading warpage of screening cover will be caused like this, thus affect electronic circuit board contour structures and cause other device rosin joint.Such as, Chinese patent literature [201110199763.X] discloses the welding method of a kind of screening cover and electronic circuit board, solving wiring board produces warpage problem when crossing reflow ovens, effectively can reduce production cost.
Technique scheme, solve wiring board produces warpage problem when crossing reflow ovens, improvement of production process to a certain extent, but still need to use metallic shield lid, at high temperature weld metal screening cover can affect the performance of components and parts on wiring board to a certain extent.
Therefore, for the above-mentioned defect existed in currently available technology, be necessary to study in fact, to provide a kind of scheme, solve the defect existed in prior art.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of wiring board with shielding construction and preparation method thereof, to solve the problem.
A kind of wiring board with shielding construction, this wiring board comprises the first screen, secondary shielding layer, a line layer are arranged between described first screen and described secondary shielding layer, first insulating barrier is set between described line layer and described first screen, the second insulating barrier is set between described line layer and described secondary shielding layer;
The material of described first insulating barrier is any one in ceramic base material, epoxy glass fiber cloth, glass honeycomb core plate, polyimide foam base material;
The material of described second insulating barrier is elastic insulating material;
Described secondary shielding layer and described second insulating barrier to arrange on described line layer and size are slightly less than described line layer, when described secondary shielding layer and described second insulating barrier cover on described line layer, on described line layer, at least one edge portions is exposed outside described secondary shielding layer, arranges multiple metal electrode for being connected with external circuit at this exposed edge portions.
Preferably, the circumference of this wiring board is also provided with multiple exposed semicircle and connects via hole, and described connection via hole is for being communicated with described first screen and described secondary shielding layer.
In order to solve prior art Problems existing, present invention also offers a kind of preparation method with the wiring board of shielding construction, comprising the following steps:
Step S1: the first insulating barrier is provided and forms the first screen in the one side of described first insulating barrier;
Step S2: one line layer is set at the another side of the first insulating barrier and forms circuitous pattern on described line layer, described circuitous pattern comprises main circuit figure for realizing circuit function and the metal electrode for being connected with external circuit;
Step S3: mount components and parts with SMT technique on described circuitous pattern, forms intermediate wiring board;
Step S4: the second insulating barrier is provided and forms secondary shielding layer in described second insulating barrier one side;
Step S5: one deck half liquefied resin is set at the another side of the second insulating barrier;
Step S6: treat described half liquefied resin solidification before, the one side that described intermediate wiring board has line pattern is placed on described half liquefied resin, and under certain pressure effect intermediate wiring board described in pressing until described half liquefied resin solidifies completely;
Step S7: make the metal electrode of described circuitous pattern outside exposed and described main circuit figure is wrapped between described first screen and described secondary shielding layer completely by precision optical machinery processing.
Preferably, in described step S7, the size of described first insulating barrier and the size of described line layer adapt, the size of described second insulating barrier and the size of described main circuit figure adapts and described second insulating barrier covers described main circuit figure completely, make at least one edge portions on described line layer exposed outside described secondary shielding layer, multiple metal electrode for being connected with external circuit is set at this exposed edge portions.
Preferably, described line layer is Copper Foil, in described step S2, further comprising the steps:
Copper Foil is printed, etch processes, obtain the Copper Foil that has circuitous pattern;
At described first insulating barrier, one deck semi-solid preparation resin is set away from the one side of the first screen;
The described Copper Foil with circuitous pattern is placed in the surface of described semi-solid preparation resin, form one and treat laminate structures, heating direct melts to described semi-solid preparation tree gradually, and under certain pressure effect, described Copper Foil had the surface being pressed together on described glass dimension honeycomb core plate of circuitous pattern, cooling, until described semi-solid preparation resin solidifies completely, makes described first insulating barrier forms line layer gradually again.
Preferably, the circumference being also included in wiring board is also provided with the step of multiple semicircle connection via hole, and makes described connection via hole be communicated with described first screen and described secondary shielding layer at described connection via hole coating silver slurry.
Preferably, adopt Copper Foil as described first screen and described secondary shielding layer or form described first screen and described secondary shielding layer in the mode applying silver-bearing copper composite shielding coating on described first insulating barrier or described second insulating barrier.
Preferably, the preparation method of described silver-bearing copper composite shielding coating is:
There is provided a graininess copper powder, the diameter of described copper powder particle is less than 50 microns;
Silver-colored copper-clad particle powder is formed at described copper powder particle surface-coated silver layer;
Be dissolved in resin combination adhesive by silver-colored copper-clad particle powder, described resin combination adhesive comprises epoxy resin, polyurethane, phenolic aldehyde, polyimides and acrylic resin;
Continuous stirring makes silver-colored copper-clad particle powder be evenly distributed in resin combination adhesive, forms silver-bearing copper composite shielding coating.
Preferably, the volume range of described silver-colored copper-clad particle powder and described resin combination adhesive is 1.1 to 1.8.
Preferably, described silver-bearing copper composite shielding coating at described first insulating barrier and described second insulating barrier by high-pressure spray gun even application, then is carried out dry process by thermostatic drying chamber and forms described first screen and described secondary shielding layer;
In spraying process, do not stop to stir described silver-bearing copper composite shielding coating by magnetic stirrer.
Relative to prior art, wiring board of shielding construction provided by the invention and preparation method thereof, by the two sides at line layer, all screen is set, thus without the need to adopting screening cover to carry out shielding processing to circuit, because screen and line layer are integrated, easy to process and the performance of components and parts on line layer can not be affected because increasing shielding process; Directly exposed outside insulating barrier by the metal electrode that line layer is used for connecting, thus without the need to process in wiring board via hole just connection metal electrode draw and receive PCB surface, avoid the generation of parasitic capacitance, greatly improve the anti-interference function of circuit board; Multiple exposed connection via hole is set in the circumference of wiring board simultaneously, makes upper and lower screen become equipotentiality body, promote the shielding properties of wiring board further.
Accompanying drawing explanation
Fig. 1 is the structured flowchart with the wiring board of shielding construction provided by the invention.
Fig. 2 for the embodiment of the present invention 1 provide there is the wiring board of shielding construction face structured flowchart.
Fig. 3 for the embodiment of the present invention 2 provide there is the wiring board of shielding construction face structured flowchart.
Fig. 4 is the block diagram with the wiring board preparation method of shielding construction provided by the invention.
Fig. 5 is the coating surface of shielding coating when amplifying 500 times in the secure execution mode (sem.
Fig. 6 is the coating surface of shielding coating when amplifying 1000 times in the secure execution mode (sem.
Fig. 7 is the energy spectrogram under shielding coating EDS.
In above-mentioned accompanying drawing, wherein, the first screen 1, first insulating barrier 2, line layer 3, the second insulating barrier 4, secondary shielding layer 5, line layer edge portions 6, metal electrode 7, connects via hole 8.
Embodiment
Be below specific embodiments of the invention and by reference to the accompanying drawings, technical scheme of the present invention is further described, but the present invention be not limited to these embodiments.
Refer to Fig. 1 and Fig. 2, be depicted as the structured flowchart with the wiring board of shielding construction provided by the invention, a kind of wiring board with shielding construction, comprise the first screen 1, secondary shielding layer 5, be arranged on line layer 3 between described first screen 1 and described secondary shielding layer 5, be arranged on the first insulating barrier 2 between described line layer 3 and described first screen 1, be arranged on the second insulating barrier 4 between described line layer 3 and described secondary shielding layer 5;
Described secondary shielding layer 5 and described second insulating barrier 4 to arrange on described line layer 3 and size are slightly less than described line layer 3, when described secondary shielding layer 5 and described second insulating barrier 4 cover on described line layer 3, on described line layer 3, at least one edge portions 6 is exposed outside described secondary shielding layer 5, arranges multiple metal electrode 7 for being connected with external circuit at this exposed edge portions 6.
Technical solution of the present invention adopts three-decker, by all arranging screen on the two sides of line layer 3, thus without the need to adopting screening cover to carry out shielding processing to circuit, screen and line layer are integrated, easy to process and the performance of components and parts on line layer can not be affected because of increasing shielding process.
Wiring board of the prior art simultaneously, the line layer in intermediate layer will be connected with its levels circuit or outside line, is typically employed in the mode of processing metal via hole on wiring board, because metallic vias inside forms metal level, can produce parasitic capacitance like this.The existence of this parasitic capacitance, makes traditional circuit plate cannot meet application requirement in the application scenario of some high requests.Technical solution of the present invention is directly exposed outside insulating barrier by the metal electrode 7 being used for connecting by line layer 3, thus without the need to process in wiring board via hole just connection metal electrode 7 draw and receive PCB surface, avoid the generation of parasitic capacitance, greatly improve the anti-interference function of circuit board.
In technique scheme, the material of described first insulating barrier 2 is any one in ceramic base material, epoxy glass fiber cloth, glass honeycomb core plate, polyimide foam base material; Epoxy glass fiber cloth and ceramic base material are the conventional board substrate of prior art, epoxy glass fiber cloth wiring board and ceramic base wiring board comparatively common in general circuit application.In the application scenario that some are special, the glass honeycomb core plate usually adopting performance more excellent and polyimide foam base material.Polyimide foams for a long time can the temperature of resistance to 250 DEG C ~ 300 DEG C, in short-term can resistance to 400 DEG C ~ 500 DEG C high temperature, and there is good mechanical performance (tensile strength is at more than 100MPa), its modulus of elasticity is generally 3GPa ~ 4GPa, can use as load-carrying member in hot environment, meet the demand of the industry such as Aeronautics and Astronautics and electronics.Polyimide foams has very high radiation-resistant property, after 5 × 109rad dose delivery, intensity still keeps about 80%, and there are good dielectric property, dielectric constant is about 3.4, Polyimide foams dielectric loss is 10-3, dielectric strength is 100kV/mm ~ 300kV/mm, specific insulation is the 1017 Ω cm orders of magnitude, these performances make polyimide foam be that copper-clad plate prepared by basic unit still can keep higher level in the temperature range and frequency range of broadness, make it at remote sensing satellite, Aero-Space, microstrip antenna, the particular application such as high frequency antenna, there is unrivaled performance advantage.Glass honeycomb core plate has glass honeycomb sandwich construction, has higher strength and stiffness and quality is lighter, compares with epoxy glass-fiber-fabric circuit board, weight saving 80%, have very high specific strength, specific stiffness, evenness is good, not yielding, structure is simple, easy for installation.In one preferably execution mode, the first insulating barrier 2 adopts glass honeycomb core plate or polyimide foam base material.
Due to line layer 3 being also provided with components and parts, the second insulating barrier 4 need cover the components and parts on line layer 3, and therefore the second insulating barrier 4 needs certain deformation space, selects elastic insulating material.Preferably, the second insulating barrier 4 adopts elastic insulated rubber.
See Fig. 3, be depicted as that the embodiment of the present invention 2 provides there is the wiring board of shielding construction face structured flowchart, the circumference of this wiring board is also provided with multiple exposed semicircle and connects via hole 8, described connection via hole 8 is for being communicated with described first screen 1 and described secondary shielding layer 5, make upper and lower screen become equipotentiality body, promote the shielding properties of wiring board further.Simultaneously outside exposed owing to connecting via hole 8, connecting via hole 8 without the need to being formed in wiring board, avoiding the generation of parasitic capacitance, improving the anti-interference function of circuit board further.
In a preferred embodiment, line layer 3 adopts Copper Foil, further, after Copper Foil forms circuitous pattern, then is bonded on the first insulating barrier 2.
In a preferred embodiment, line layer 3 is indium tin oxide films layer, and the similar Copper Foil of effect of indium tin oxide films layer, forms circuitous pattern thereon by photoresist mask etch technique.Indium tin oxide films layer has the characteristic of electricity conduction and good shielding properties simultaneously, is widely used in prior art as the conduction plated film of EMI shielding.In the present invention, directly apply indium tin oxide films layer and form circuitous pattern, promote the shielding properties of wiring board further.
Further, in some special dimensions, in order to ensure the stability of wiring board, the circuitous pattern of line layer 3 directly forms resistive element.Such as in microstrip circuit or high frequency antenna, the resistive element of employing is more, adopts the resistive element of prior art, and consistency and stability are difficult to ensure, its resistance of resistance welding procedures also minor variations can occur simultaneously.In embodiments of the present invention, owing to adopting indium tin oxide material to form line layer 3, the resistivity of tin indium oxide much larger than metals such as copper, therefore when formation circuitous pattern, direct-on-line road floor 3 can arrange resistance.Actual resistance pattern can calculate according to the resistivity of indium tin oxide material.Namely in the resistive element position of line pattern, the size according to its resistance deposits the resistance pattern corresponding with its resistance in the preparation.
In a preferred embodiment, the first screen 1 and secondary shielding layer 5 adopt Copper Foil, and metal is natural shield, are wrapped in by line layer 3 in upper and lower copper foil layer, can play shield effectiveness.
But because these highly active copper atoms of copper foil surface are easily oxidised with air to Cu
2the film of O and CuO, the oxidization of copper powder speed that especially surface area is large is faster, greatly reduces shielding properties.In a preferred embodiment, adopt and form the first screen 1 and secondary shielding layer 5 in the mode of the first insulating barrier 2 and the second insulating barrier 4 surface spraying silver-bearing copper composite shielding coating.Silver is used as conductive filler the earliest in all metals, has the good (ρ of electric conductivity
v=1.62 × 10
-6Ω cm), strong, the steady performance of oxidation resistance, but silver is under direct current (DC) bias effect, or under wet heat condition, migration easily occurs and causes short circuit, greatly reduce the coefficient of safety of application.In addition, comparatively copper is much expensive for the price of silver, adopts silver cost will be made greatly to improve as screen.Be blended in resin after forming silver-coated copper powder in silver-bearing copper composite shielding coating, therefore copper powder does not directly contact with the external world, improves the antioxygenic property of copper powder, obtains the electric conductivity close to silver simultaneously, and similar with employing Copper Foil on cost.
In order to solve prior art Problems existing, present invention also offers a kind of preparation method with the wiring board of shielding construction, see Fig. 4, being depicted as the block diagram with the wiring board preparation method of shielding construction provided by the invention, comprising the following steps:
Step S1: the first insulating barrier 2 is provided and forms the first screen 1 in described first insulating barrier 2 one side;
Step S2: one line layer 3 is set at the first insulating barrier 2 another side and forms circuitous pattern on described line layer 3, described circuitous pattern comprises main circuit figure for realizing circuit function and the metal electrode 7 for being connected with external circuit;
Step S3: mount components and parts with SMT technique on described circuitous pattern, forms intermediate wiring board;
Step S4: the second insulating barrier 4 is provided and forms secondary shielding layer 5 in described second insulating barrier 4 one side;
Step S5: one deck half liquefied resin is set at the another side of the second insulating barrier 4;
Step S6: treat described half liquefied resin solidification before, the one side that described intermediate wiring board has line pattern is placed on described half liquefied resin, and under certain pressure effect intermediate wiring board described in pressing until described half liquefied resin solidifies completely;
Step S7: make the metal electrode 7 of described circuitous pattern outside exposed and described main circuit figure is wrapped between described first screen 1 and described secondary shielding layer 5 completely by precision optical machinery processing.
Adopt the wiring board prepared of said method, owing to all arranging screen on the two sides of line layer 3, thus without the need to adopting screening cover to carry out shielding processing to circuit, simplifying preparation technology and the performance of components and parts on line layer 3 can not be affected because increasing shielding process; Directly exposed outside insulating barrier by the metal electrode 7 that line layer 3 is used for connecting, thus without the need to process in wiring board via hole just connection metal electrode 7 draw and receive PCB surface, avoid the generation of parasitic capacitance, greatly improve the anti-interference function of circuit board;
At above-mentioned steps S1 and step S4, adopt Copper Foil as described first screen 1 and described secondary shielding layer 5.But because these highly active copper atoms of copper foil surface are easily oxidised with air to Cu
2the film of O and CuO, the oxidization of copper powder speed that especially surface area is large is faster, greatly reduces shielding properties.In a preferred embodiment, the mode by applying silver-bearing copper composite shielding coating on described first insulating barrier 2 or described second insulating barrier 4 forms described first screen 1 and described secondary shielding layer 5.
Further, the preparation method of above-mentioned silver-bearing copper composite shielding coating is:
There is provided a graininess copper powder, the diameter of described copper powder particle is less than 50 microns;
Silver-colored copper-clad particle powder is formed at described copper powder particle surface-coated silver layer;
Silver-colored copper-clad particle powder is dissolved in resin combination adhesive;
Continuous stirring makes silver-colored copper-clad particle powder be evenly distributed in resin combination adhesive, forms silver-bearing copper composite shielding coating.
In above-mentioned steps, described resin combination adhesive comprises epoxy resin, polyurethane, phenolic aldehyde, polyimides and acrylic resin; Resin base-material determines most of physical property of coating.A lot of Fundamental Physical Properties of shielding coating is identical with common coating, such as: adhesive force, adherence, resistance to wear and resistance to scraping etc.These performances are primarily of matrix resin and assisted resin shared.Application of paints, in surface of insulating layer, requires that the adhesive strength of coating is high, shielding coating has stronger cohesive force.Unlike two-component coating, be subject to the impact of construction and baking temperature based on the coating of thermoplastic resin ester group adhesive, there is no the activation time limit used.
Further, formed in the step of silver-colored copper-clad particle powder at described copper powder particle surface-coated silver layer, first adopt Inhibitors On Copper powder to process, as with the corrosion inhibiter such as organic acid, organic titanium; Again utilizing silver mirror reaction conventional in prior art silver-plated at Copper Powder Surface, form silver-coated copper powder.
The shielding properties (be also conductivity, determined by resistance of coating value height) of shielding coating is relevant with the resistance value of silver-coated copper powder (namely following conductive filler) itself, and the concentration of conductive filler in shielding coating is important too.The design how carrying out shielding coating formula makes shielding coating should have good electric conductivity, has again good physical property, and the fixing fabric structure of each material component has just become the key of formula Design, and especially the volume ratio of electric conducting material and adhesive has relation.By repetition test and test, result shows, when the volume ratio of electric conducting material and adhesive is less than 1, the surface of conductive particle is covered by resin binder completely, almost do not have good electrical contact between particle, shielding coating can not embody good electric conductivity, causes shielding properties not good.When the volume ratio of electric conducting material in coating is much larger than the volume of adhesive, the surface exposure of partially conductive particle outside, binder resin is not enough to fill up void among particles, cause the compactness of shielding coating too low (having the existence of air), easy dry linting, surface roughness is excessive, easily residual various dirt, and physical property aspect declines greatly.Below the volume ratio of theoretical calculation analysis electric conducting material and adhesive is passed through again.Represent the volume of electric conducting material and the volume ratio of coating in coating with P, reflect the proportion relation of coating with P, its formula is expressed as follows:
P＝V
a/(V
a+V
b)
＝(m
a/ρ
a)/[(m
a/ρ
a)+(m
b/ρ
b)]
＝m
a/[m
a+m
b×(ρ
a/ρ
b)]
＝1/[1+(m
b/m
a)×(ρ
a/ρ
b)]
In formula, Va is the volume of electric conducting material in formula; V
bfor the volume of non-conducting material in formula; m
afor the quality of electric conducting material in formula; m
bfor the quality of non-conducting material in formula; ρ
afor the density of electric conducting material in formula; ρ
bfor the density of non-conducting material in formula.After formula is determined, ρ a and ρ b is constant.Make k=ρ
a/ ρ
b, x=m
b/ m
awherein, k is constant, and x is variable.So the expression formula of P can be reduced to: P=1/ (1+kx)=(1+kx)-1.From the knowledge of exponential function, P and x value has one-to-one relationship at reference axis first quartile, so can with the m in formula
b/ m
areflect the change of P.For coating, namely m is the quality of conductive filler.P on the impact of conductance can turn be considered as formula in m
b/ m
aon the impact of conductance.When adhesive is more than one, V
b, m
band ρ
brepresent the volume of mixed resin, quality and density respectively.
On the basis of theory analysis, then Binding experiment test result, in a preferred embodiment, the volume range of silver-colored copper-clad particle powder and resin combination adhesive is 1.1 to 1.8, in the embodiment of the present invention, and the volume ratio of employing is 1.5.
See Fig. 5, Fig. 6, Fig. 7, when the volume being depicted as silver-colored copper-clad particle powder and resin combination adhesive is 1.5, silver-bearing copper composite shielding coating observes coating surface figure, Cross Section Morphology figure and can spectrogram under ESEM.The coating even application mixed on pmma substrate, after solidification to be dried, observe coating surface and Cross Section Morphology under ESEM, as shown in Figure 5 and Figure 6, picture is under 20KV voltage, takes when amplifying 500 times and 1000 times respectively.When 1000 times, that can observe is more clear.The conduction pattern of electric charge in shielding coating is particle contact conduction, forms path between particle with physical contact.This electrically conducting manner determines two key factors affecting electric conductivity: one is interparticle contact number, is in fact exactly the number of conductive path; Two is interparticle degrees of closeness.As can be seen from the figure, be face contact between the particle of laminated structure, fully, and the uneven platy particle of size is more conducive to the raising of conductivity in contact.And the aligning property of flakelike powder is good, not easily reunites, there is stronger albedo to light.
Fig. 7 is the energy spectrogram of shielding coating under ESD, and in figure, transverse axis is X-ray energy, and the longitudinal axis is the spectrogram of x-ray photon number.Just can determine the kind of element according to its energy value, and the content of each element can be determined by the intensive analysis of spectrum.For the shielding coating of the embodiment of the present invention, utilize and can determine its composition equally by spectrogram, and quantitatively show the scale shared by each composition.Can be clear and definite in figure find out the composition comprised in this kind of coating material, wherein copper (Cu) content in coating is maximum; Carbon (C) content is higher, is because the coating herein take polymethyl methacrylate as substrate, containing a large amount of C element in polymethyl methacrylate, also contains C element in resin based adhesive and organic solvent.Oxygen (O) element is also contained in above-mentioned substance.
Further, in order to realize evenly being applied on the insulating layer by shielding coating, in a preferred embodiment, by silver-bearing copper composite shielding coating by high-pressure spray gun even application at described first insulating barrier 2 and described second insulating barrier 4, then carry out dry process by thermostatic drying chamber and form described first screen 1 and described secondary shielding layer 5; In spraying process, do not stop to stir described silver-bearing copper composite shielding coating by magnetic stirrer.
During spraying, first by shielding coating as in container for paint, do not stop to stir the shielding coating in container for paint by magnetic stirrer magnetic stirrer; The high pressure that recycling air compressor produces is by the shielding coating in container for paint by spray gun, and even application is on insulating barrier.Spraying rate and spray area can free adjustment, but spray pressure can not exceed maximum working (operation) pressure (MWP).Preferably, the maximum working (operation) pressure (MWP) of shower nozzle is 0.5 ~ 1.5MPa.
Further, in order to realize the spraying of automation Large-Area-Uniform, in a preferred embodiment, spray gun being fixed on a movable fixture, utilizing stepping motor to drive this movable fixture uniform motion, drive spray gun to move, meet large-area spraying requirement.
Further, in described step S7, when the second insulating barrier 4 is laminated on line layer 3, second insulating barrier 4 covers line layer 3 completely, a part of edge of secondary shielding layer 5 and the second insulating barrier 4 is removed by precision optical machinery processing, make the metal electrode 7 in circuitous pattern outside exposed, and main circuit figure still covers the second insulating barrier 4 times completely, and then the main circuit figure in line layer 3 is wrapped between described first screen 1 and described secondary shielding layer 5 completely.
Adopt aforesaid way, higher to the required precision of machining, once machining accuracy is not high, be easy to the electrograph figure destroying line layer 3.In a preferred embodiment, first insulating barrier 2 is dimensioned to and adapts with the size of described line layer 3, second insulating barrier 4 is dimensioned to and adapts with the size of described main circuit figure, when lamination, the second insulating barrier 4 is made to cover described main circuit figure completely, on line layer 3, at least one edge portions 6 is exposed outside described secondary shielding layer 5, arranges multiple metal electrode 7 for being connected with external circuit at this exposed edge portions 6.In which, first according to dimensioned first insulating barrier 2 and second insulating barrier 4 of actual track layer 3 and circuitous pattern thereof, so after lamination just without the need to carrying out machining again, thus the circuitous pattern of circuit layer can not be destroyed.
Further, line layer 3 is Copper Foil, in described step S2, further comprising the steps:
Copper Foil is printed, etch processes, obtain the Copper Foil that has circuitous pattern;
At described first insulating barrier 2, one deck semi-solid preparation resin is set away from the one side of the first screen 1;
The described Copper Foil with circuitous pattern is placed in the surface of described semi-solid preparation resin, form one and treat laminate structures, heating direct melts to described semi-solid preparation tree gradually, and under certain pressure effect, described Copper Foil had the surface being pressed together on described glass dimension honeycomb core plate of circuitous pattern, cooling, until described semi-solid preparation resin solidifies completely, makes described first insulating barrier 2 forms line layer 3 gradually again.
In a preferred embodiment, in above-mentioned semi-solid preparation resin curing process, at the uniform velocity to heat up, (being less than 5 DEG C/min) is warming up to 50 DEG C to 70 DEG C, after resin melts completely, at the uniform velocity lower the temperature (being less than 5 DEG C/min) again, until resin solidifies completely under certain pressure effect.
Further, above-mentioned semi-solid preparation resin or half liquefied resin are Epoxy resin composition solution, and its difference is the difference of the matched proportion density of Epoxy resin composition solution.Further, this Epoxy resin composition solution comprises composition epoxy resin and can dissolve the organic solvent of this composition epoxy resin.Composition epoxy resin is the composition be made up of epoxy resin, amion-terminated polyurethane and inorganic filler.
Further, line layer 3 is indium tin oxide films layer, in described step S2, further comprising the steps:
Indium tin oxide films layer is arranged on the first insulating barrier 2 by the same steps adopting above-mentioned Copper Foil to arrange on the insulating layer; Circuitous pattern is formed thereon by photoresist mask etch technique.
The similar Copper Foil of effect of indium tin oxide films layer, oxidable indium tin thin film layer has the characteristic of electricity conduction and good shielding properties simultaneously, is widely used in prior art as the conduction plated film of EMI shielding.In the present invention, directly adopt indium tin oxide films layer to form circuitous pattern, promote the shielding properties of wiring board further.
Further, the circuitous pattern being also included in line layer 3 is directly formed the step of resistive element.In some special dimensions, in order to ensure the stability of wiring board, such as in microstrip circuit or high frequency antenna, the resistive element adopted is more, adopt the resistive element of prior art, consistency and stability are difficult to ensure, its resistance of resistance welding procedures also minor variations can occur simultaneously.In embodiments of the present invention, owing to adopting indium tin oxide material to form line layer 3, the resistivity of tin indium oxide much larger than metals such as copper, therefore when formation circuitous pattern, direct-on-line road floor 3 can arrange resistance.Actual resistance pattern can calculate according to the resistivity of indium tin oxide material.Namely in the resistive element position of line pattern, the size according to its resistance deposits the resistance pattern corresponding with its resistance in the preparation.This resistance pattern is formed by etching and sputtering technology the resistance of respective resistance values.
In a preferred embodiment, the circumference being also included in wiring board is also provided with the step that multiple semicircle connects via hole 8, and applies silver slurry at described connection via hole 8 and make described connection via hole 8 be communicated with described first screen 1 and described secondary shielding layer 5.Owing to arranging multiple exposed connection via hole 8 in the circumference of wiring board, make upper and lower screen become equipotentiality body, promote the shielding properties of wiring board further.
The explanation of above embodiment just understands method of the present invention and core concept thereof for helping.It should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention, can also carry out some improvement and modification to the present invention, these improve and modify and also fall in the protection range of the claims in the present invention.Be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can realize without departing from the spirit or scope of the present invention in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (10)
1. one kind has the wiring board of shielding construction, it is characterized in that, this wiring board comprises the first screen (1), secondary shielding layer (5), a line layer (3) are arranged between described first screen (1) and described secondary shielding layer (5), first insulating barrier (2) is set between described line layer (3) and described first screen (1), the second insulating barrier (4) is set between described line layer (3) and described secondary shielding layer (5);
The material of described first insulating barrier (2) is any one in ceramic base material, epoxy glass fiber cloth, glass honeycomb core plate, polyimide foam base material;
The material of described second insulating barrier (4) is elastic insulating material;
Described secondary shielding layer (5) and described second insulating barrier (4) arrange described line layer (3) and go up and size be slightly less than described line layer (3), when described secondary shielding layer (5) and described second insulating barrier (4) cover on described line layer (3), the upper at least one edge portions (6) of described line layer (3) is exposed described secondary shielding layer (5) outward, arranges multiple metal electrode (7) for being connected with external circuit at this exposed edge portions (6).
2. the wiring board with shielding construction according to claim 1, it is characterized in that, the circumference of this wiring board is also provided with multiple exposed semicircle and connects via hole (8), and described connection via hole (8) is for being communicated with described first screen (1) and described secondary shielding layer (5).
3. there is a preparation method for the wiring board of shielding construction, it is characterized in that, comprise the following steps:
Step S1: the first insulating barrier (2) is provided and in the one side of described first insulating barrier (2) formation first screen (1);
Step S2 a: line layer (3) is set at the another side of the first insulating barrier (2) and forms circuitous pattern on described line layer (3), described circuitous pattern comprises for the main circuit figure of realizing circuit function and the metal electrode (7) for being connected with external circuit;
Step S3: mount components and parts with SMT technique on described circuitous pattern, forms intermediate wiring board;
Step S4: the second insulating barrier (4) is provided and forms secondary shielding layer (5) in described second insulating barrier (4) one side;
Step S5: one deck half liquefied resin is set at the another side of the second insulating barrier (4);
Step S6: treat described half liquefied resin solidification before, the one side that described intermediate wiring board has line pattern is placed on described half liquefied resin, and under certain pressure effect intermediate wiring board described in pressing until described half liquefied resin solidifies completely;
Step S7: make the metal electrode of described circuitous pattern (7) outside exposed and described main circuit figure is wrapped between described first screen (1) and described secondary shielding layer (5) completely by precision optical machinery processing.
4. the preparation method with the wiring board of shielding construction according to claim 3, it is characterized in that, in described step S7, the size of described first insulating barrier (2) and the size of described line layer (3) adapt, the size of described second insulating barrier (4) and the size of described main circuit figure adapts and described second insulating barrier (4) covers described main circuit figure completely, make the upper at least one edge portions (6) of described line layer (3) exposed described secondary shielding layer (5) outward, at this exposed edge portions (6), multiple metal electrode (7) for being connected with external circuit is set.
5. the preparation method with the wiring board of shielding construction according to claim 3, is characterized in that, described line layer (3) is Copper Foil, in described step S2, further comprising the steps:
Copper Foil is printed, etch processes, obtain the Copper Foil that has circuitous pattern;
Described first insulating barrier (2), one deck semi-solid preparation resin is set away from the one side of the first screen (1);
The described Copper Foil with circuitous pattern is placed in the surface of described semi-solid preparation resin, form one and treat laminate structures, heating direct melts to described semi-solid preparation tree gradually, and under certain pressure effect, described Copper Foil had the surface being pressed together on described glass dimension honeycomb core plate of circuitous pattern, cooling, until described semi-solid preparation resin solidifies completely, makes described first insulating barrier (2) forms line layer (3) gradually again.
6. the preparation method with the wiring board of shielding construction according to claim 3, it is characterized in that, the circumference being also included in wiring board is also provided with the step of multiple semicircle connection via hole (8), and makes described connection via hole (8) be communicated with described first screen (1) and described secondary shielding layer (5) at described connection via hole (8) coating silver slurry.
7. the preparation method with the wiring board of shielding construction according to claim 6, it is characterized in that, adopt Copper Foil as described first screen (1) and described secondary shielding layer (5) or form described first screen (1) and described secondary shielding layer (5) in the mode above applying silver-bearing copper composite shielding coating described first insulating barrier (2) or described second insulating barrier (4).
8. the preparation method with the wiring board of shielding construction according to claim 7, is characterized in that, the preparation method of described silver-bearing copper composite shielding coating is:
There is provided a graininess copper powder, the diameter of described copper powder particle is less than 50 microns;
Silver-colored copper-clad particle powder is formed at described copper powder particle surface-coated silver layer;
Be dissolved in resin combination adhesive by silver-colored copper-clad particle powder, described resin combination adhesive comprises epoxy resin, polyurethane, phenolic aldehyde, polyimides and acrylic resin;
Continuous stirring makes silver-colored copper-clad particle powder be evenly distributed in resin combination adhesive, forms silver-bearing copper composite shielding coating.
9. the preparation method with the wiring board of shielding construction according to claim 8, is characterized in that, the volume range of described silver-colored copper-clad particle powder and described resin combination adhesive is 1.1 to 1.8.
10. the preparation method with the wiring board of shielding construction according to claim 8, it is characterized in that, described silver-bearing copper composite shielding coating at described first insulating barrier (2) and described second insulating barrier (4) by high-pressure spray gun even application, then is carried out dry process by thermostatic drying chamber and forms described first screen (1) and described secondary shielding layer (5);
In spraying process, do not stop to stir described silver-bearing copper composite shielding coating by magnetic stirrer.
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|---|---|---|---|
| CN201710683973.3A CN107241855B (en) | 2015-08-24 | 2015-08-24 | A kind of wiring board with shielding construction |
| CN201510522754.8A CN105101622B (en) | 2015-08-24 | 2015-08-24 | A kind of wiring board with shielding construction and preparation method thereof |
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| US20100294559A1 (en) * | 2009-05-22 | 2010-11-25 | Koichi Izawa | Electromagnetic shielding method and electromagnetic shielding film |
| CN102215630A (en) * | 2010-04-07 | 2011-10-12 | 株式会社藤仓 | Flexible printed board and method of manufacturing same |
| CN202121860U (en) * | 2011-06-16 | 2012-01-18 | 湖北奕宏精密制造有限公司 | Flexible circuit board used for precision electronic device |
| CN103687459A (en) * | 2012-09-14 | 2014-03-26 | 昆山雅森电子材料科技有限公司 | Electromagnetic wave shielding structure and flexible printed circuit board with same |
| CN203721263U (en) * | 2014-03-04 | 2014-07-16 | 吴晶 | High definition security signal transmission line |
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| CN102279678A (en) * | 2010-06-12 | 2011-12-14 | 宸鸿科技(厦门)有限公司 | Touch circuit graphic structure, manufacturing method thereof, touch panel and touch display screen |
| CN102559118B (en) * | 2012-02-16 | 2013-10-16 | 莱芜金鼎电子材料有限公司 | High-temperature-resistant conductive adhesive and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100294559A1 (en) * | 2009-05-22 | 2010-11-25 | Koichi Izawa | Electromagnetic shielding method and electromagnetic shielding film |
| CN102215630A (en) * | 2010-04-07 | 2011-10-12 | 株式会社藤仓 | Flexible printed board and method of manufacturing same |
| CN202121860U (en) * | 2011-06-16 | 2012-01-18 | 湖北奕宏精密制造有限公司 | Flexible circuit board used for precision electronic device |
| CN103687459A (en) * | 2012-09-14 | 2014-03-26 | 昆山雅森电子材料科技有限公司 | Electromagnetic wave shielding structure and flexible printed circuit board with same |
| CN203721263U (en) * | 2014-03-04 | 2014-07-16 | 吴晶 | High definition security signal transmission line |
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Denomination of invention: A circuit board with shielding structure and its preparation method Effective date of registration: 20210628 Granted publication date: 20171003 Pledgee: China Minsheng Banking Corp Wenzhou branch Pledgor: ZHEJIANG ZAPON ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021980005254 |
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Granted publication date: 20171003 Pledgee: China Minsheng Banking Corp Wenzhou branch Pledgor: ZHEJIANG ZAPON ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021980005254 |